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BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing one embodiment of a
headphone according to the present invention, FIG. 2 is an equivalent circuit diagram of FIG. 1,
FIG. 3 is a sectional view of FIG. FIG. 4 is a curved line diagram showing the characteristics on the
low frequency side in comparison with the conventional characteristics, and FIGS. 4 and 5 are
sectional views showing other embodiments and equivalent circuit diagrams thereof. 11 ... ear
band, 121, 122 ... opening, 12 ... 3 ... folded part, 12 ... case, 13 ... speaker, 131 ... front pamphle,
132 ... circumference side Section, 133 ... diaphragm, 134 ... through hole, 14 ... acoustic tube (4
or sound transmission hole) ?
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a headphone
pressed to expand the low frequency side as much as possible. Conventionally, the low-pass side
of the headphone could be expanded only to the resonance frequency of the speaker itself used
for the headphone. In view of the above, the present invention has been made in view of the
above points, and it is an object of the present invention to provide a speaker capable of
extending the low frequency side to a low 1 + 'h musical piece sufficiently lower than the
resonance frequency of the speaker itself with a simple configuration -T, y - 1 cN ? "for the
purpose of providing extremely good headphones. DETAILED DESCRIPTION OF THE PREFERRED
EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail
with reference to the accompanying drawings, that is, FIG. 1 shows that it is applied to a semiopen type Q. In FIG. 1, the one end of the ear pad 11 On the case 12 in which the opening cloths
121, 122 are formed on the side portion and the folding v-shaped portion 123 close to the other
end inside the opening portions 121, 122 is formed, a speaker 3 is stored. Here, the speaker 13
is disposed such that the peripheral side portion 132 formed by extending the front baffle 131
toward the rear side faces the folded-back portion 123 in the case 12 so as to form the toneculture pipe 14 therebetween And a through hole 134 is formed in the vibration (cone) film 133
behind it. # 12 shows the equivalent gA circuit when the equivalent number of each part of the
semi-open type headphone as described above is expressed as m и 1 ml иии as shown in the
drawing. Here, the main equivalence constants are explained as follows: mo и и и и и и и и и и и и и и и и и и и
и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и Compliance at the back of the speaker, m 2 p 12
и и и Inertance of the front baffle hole, Cx и и Compliance at the back of the diaphragm, ms, rms и и
compliance of the vibration and membrane rear opening, cM и и Compliance, m4 + Mr, rx ...
acoustic '- inertance. In the semi-open type headphone in which the leakage portion is formed in
the front face as described above, an acoustic tube 14 of an excessive size (which may be simply
a sound transmission hole) is formed in the # 1 face baffle 131 As shown in its equivalent circuit,
the sum of the added '? storage 1114' by sound tube 41 (or sound transmission hole) 14 and
the mass Mr 'of air and the compliance eM in the front baffle 131 If the resonance frequency f
01 is set lower than the resonance frequency f 0 of the speaker Js itself, if the rx and nine are
chosen excessively, the striking pressure after the ? speaker 3 in the high-frequency range
becomes the acoustic tube Or the sound transmission hole) 14, the phase is reversed to be
substantially in phase with the sound pressure at the front of the diaphragm 133, as shown in
So that it can be spread to a sufficiently low frequency range. In FIG. 3, the one indicated by the
broken line is the characteristic of the lower band side of the conventional headphone, and in
comparison with this, the low band side characteristic (shown in the drawing) of the so-called
bass reflex Takefumi open type headphone according to the present invention is sufficiently
expanded It is obvious that there is. FIG. 4 shows a case where the present invention is applied to
an ordinary sealed type .sigma.] As another embodiment, and the M5 diagram shows an
equivalent circuit thereof. In this case, there is an opening which leaks to the front and the other
It is the same as in the previous example, and its action and effect can also be explained
according to the preceding example. As described above in detail, according to the present
invention (okay, simply by forming an excessively large sound writing tube or sound
transmission hole in the front baffle portion of the speaker, it is easy to make mj easier and more
surely the resonance of the speaker itself It is a basket to provide extremely good headphones
which are made by spreading the lower side to the range sufficiently lower than the family wave
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description, jps53138822
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