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DESCRIPTION JPS5938800

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DESCRIPTION JPS5938800
[0001]
The present invention relates to an acoustic resistor used in an electroacoustic transducer such
as a micro-bon or a speaker, and a part of a sound 'af resistor constituted by mesh is closed by
forming an acoustic opaque portion. The acoustic impedance can be set to an arbitrary value
according to the denier and mesh number of the mesh fiber and the area of the mesh portion.
Further, the present invention relates to the method for producing the above-mentioned sound
M] 1 (antibody, and by forming the above-mentioned plug using photographic technology, the
variation of the acoustic impedance value is small and f10 can be simply produced. It is The
structure of a single homology dynamic microphone is shown in FIG. 1 as an example of an
electroacoustic transducer. In this figure, the magnet 1 is attached to the bottom yoke 2 and the
whole is centering on the centering 3. The main surface of the centering 3 is covered with the
top yoke 4 -C. Magnets 1> <15σ) The pole piece 5 projects from the centering 3 on which the
diaphragm 7 with the voice coil 6 reduced by 1 is disposed. A force of -8, which doubles as a
high frequency compensation adapter, is placed on the diaphragm 70hi. Further, a terminal plate
10 is fixed to the bottom yoke 2 by a terminal fixing screw 9. A cavity case 14 is disposed at the
F portion of the bottom yoke 2). In the case of 1: n +, the acoustic resistor l] is acoustically coated
with sound holes 32, 12,... Formed in the cavity 14 and the top yoke 4 respectively. ing. The
acoustic resistor 1] is composed of a felt, a woven fabric with a large mesh number, a wire mesh,
etc. In the prior art, these material mats are “curved into a fixed shape and size, and is it as it is?
i: In the nursing room, the sound hole 12 was in contact with the face 9. However, in this type,
since the whole of the acoustic resistor 11 is made to exhibit acoustic resistance, when it is
applied with a bonding agent, the acoustic resistor 1 is configured as shown in FIG. The material
to be treated is impregnated with the squeeze material 13 and the portion (shown by double
slanting) becomes acoustically opaque (does not exhibit acoustic resistance), so the acoustic
impedance originally possessed by the bonding changes. It will In addition, the area and volume
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of the apparent portion contributing to the acoustic resistance are different depending on the
contact speed, and the acoustic impedance after contact is different even if the acoustic resistor
is the same. It will
Therefore, a firm contact is required and the working efficiency will deteriorate. In addition, since
the whole of the acoustic resistor IJ is made of one exhibiting acoustic resistance, the size of the
sound hole 12 is one factor that determines the acoustic impedance, and there is variation in the
sound hole 12σ1 fi'f degree Similarly, the sound and noise impedance become even if they are
bonded in the same way. 2 to 9 ° The present invention was made in view of the abovementioned point. It is an object of the present invention to provide an acoustic resistor capable of
obtaining the same echo impedance. According to the invention, 1! The sound and low resistance
is meshed (a part of which is sealed. According to such an arrangement, the portion other than
the blinded portion is an acoustically resistant star, and the blinded portion “becomes
intellectually opaque, so adhesion is performed on the opaque portion. In this case, the change in
acoustic impedance due to adhesion is eliminated, and the desired acoustic impedance can be
obtained regardless of the adhesion state. In addition, if a portion other than the blinded portion
is included in the range of the opening of the hole, the sound hole does not become four times
that determines the acoustic impedance, and the acoustic resistor itself is a severe seedling It is
possible to realize the acoustic impedance defined in In addition, the present invention further
provides a manufacturing method by which the above-mentioned acoustic resistor can be
manufactured easily with less distortion of the acoustic impedance value. That is, according to
the manufacturing method of the present invention, this is realized by forming the filling pattern
using the copying technology. Here, three methods of direct method, indirect method and direct
method are provided, which will be described in detail later. First, the case of the acoustic resistor
according to the present invention will be described with reference to the attached drawings. FIG.
3 shows one real h1! Of the acoustic resistor according to the present invention. An example is
shown, Ial is a top view, lbl is a 1111 x-1H view. This acoustic resistor is made of whole rubber,
natural European fibers such as silk, polyester, nylon etc θ) synthetic fibers, gold i m km such as
stainless steel, metal gR fibers coated with nickel on stainless steel etc, etc. 2) A weft 2 (1b and,
for example, a plain carpet with mesh + 1 1 [and 1 ° 4 sigma sigma tunyu is that '! The part that
appears in 1 'is a part that is acoustically translucent and that surpasses the resistance of 8 trials
(hereinafter referred to as a sound pipe resistance part). The mesh is synthesized as shown in
FIG. 6 in which the portion enclosed by a single point 411111 of gI 4: 3 FIG. Stop Iv) The agent
21 forms a closed portion 2tlr3.
This part B is an acoustically small transparent part (hereinafter referred to as "io" rvh and i3
light part). Therefore, the overall acoustic impedance of the f'll resistor W is determined by the
fiber denier and mesh number to the acoustic resistance 21) and its area-these deniers, mesh
edges, changing area Acoustic impedance can be set arbitrarily. Further, if bonding with the FitJ
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1x hole 12 is performed in the acoustic opaque portion 2011, as shown in FIG. 7, the adhesive J3
does not transmit through the acoustic resistance portion zuhVcv, so the change in acoustic
impedance due to the adhesion is It can prevent. Further, as shown in FIG. 7, the sounding hole
12 determines the echo impedance so that the inside of the range of the opening of the sound
hole 12 + 'l'i sounding machine 11 (mint force) A is included 9 El-low paper [1: body 2 (+
determined by + 1 can also be realized acoustic impedance, because it is not a factor. Fig. i'l '8
shows another example of the acoustic resistor according to the invention VC according to the
invention VCi, in which taJ is in the plane, and (1) j is Ial at the level of If-11 °. is there. This
sound "" 74! In the antibody chamber, the mesh in the acoustic resistance it5 zu A is partially
closed by f + lIi to make this portion a new sound 4s opaque portion 21JC. Next, a direct method,
an interval j and a method, and an open method from 1 to 1 will be described as a method of
making 4 q of the acoustic resistor described above using photo technology. [1] Direct Method
The direct method is a photosensitive emulsion directly on mesh screen (chromate emulsion,
diazo emulsion? (ilJ, etc.) 'r Coating is performed to form a photosensitive solution 11Q, and
exposure and water phenomena are performed to form a pattern of a tone Q resistance portion
and an acoustic opaque portion [7]. This is done in the next step. ■ Apply a photosensitive
emulsion on mesh screen. ■ Apply a photosensitive solution to a mesh screen coated with a
photosensitive emulsion. ■ Skin 9 as shown in the figure, for a light tiger 30, a glass plate, (l,
positive with a pattern drawn, 12 (: (2a: filno, pace, 32b: IIr, ^ 而), mesh screen 33) Black sheet
for preventing har- mentation; 34, the flange 35, and the back plate 3 for densed storage in the
order shown in the figure, so that the positive J 2 and the photosensitive film 33a of the mesh
screen 33 are in close contact with each other. Do. ■J+4. E Xf & light after exposure if the
water present 1 elephant, photosensitive 33 m is not exposed part of the valley valley mesh
screen 33 appears naked, the exposed part remains, eyes IJ1 and rl, rectangle Create
This state is shown in FIG. [2] Indirect method In general, the film (or paper) pace V is coated
with a light-sensitive emulsion, which is exposed, baked, developed and then transferred to mesh
screen. . This is done in the next step. ■ As shown in the tgo diagram, for the light source 40, a
positive 42 (42a is a film base, / 12b is one pattern) with a drawn glass plate 41, / e-turn, a film
43 (43 g is a film base, 43b is Hg 而), black paper for preventing noration 44, back plate for
close contact · 15 arranged in the order shown in the drawing M, L, and X) vfjtt and expose the
film 43. After being made proper, after water development, the unexposed portions of the
photosensitive 11 @ 43b of the film 43 melt and the exposed portions remain. (4) The waterdeveloped film 43 is adhered to a mesh screen, and after drying, the film base 43 a 'l is peeled
off. The developed pattern is transferred to the mesh screen and completed. This situation is
shown in FIG. Reference numeral 46 is a mesh screen, and 4: 3b is a closure formed. [3] The
direct method The direct method by which the coating of the emulsion is directly applied to the
mesh screen is prepared by coating the emulsion in a film-like pace in a manner similar to that of
the direct method. Is transferred to a mesh screen, then transferred, and then exposed and baked
as in the direct method. This is done in the next step. ■ Apply a light-sensitive emulsion to a film
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base. ■ Transfer to the emulsion emulsion mesh screen of ■ ■. ■ As in the direct method, as
shown in FIG. 9, a light source: J) O, a glass plate: one 11. e-turn drawn positive ', 32 (32a is film
base; 32b is 11' = i-face 7-screen 3; 3; black paper for preventing haration; (4, sponge 35, skin
for adhesion 36) arranged in the order: positive: 32 and the sensitivity IILA 33 a of mesh screen
33, 'Ig *' f I, Y to fill. (1) If water development is carried out after proper exposure, the
photosensitive film IIa is melted and the mesh screen 33 appears naked, and the exposed portion
remains and closed. The completed acoustic resistor looks like silk 13 gang. In the embodiment
described above, the present invention is applied to the acoustic resistor of the microphone and
the method of manufacturing the same, but other '#IL acoustic transducer, 1 ull is the acoustic
resistor of the speaker and the method of manufacturing the same Also, I can use it to get rid of
it.
As described above, according to the acoustic resistor according to the present invention, the
mesh 1 mesh (I-echo opaque portion) is formed as a ridge 1 (as it is fixed, bonding with the
sound hole takes 1111 minutes of sealing) 2) There is no change in t eye + ql impedance due to
174 K. It is possible to make the sound 1 and the impedance as per F'Jr period regardless of the
C's and the anchored condition. In addition, if the part other than the one that is closed (i.e., the
acoustic resistance part) is included within the tlt α range of the sound hole, the sound hole
becomes a factor that determines the acoustic impedance. The acoustic impedance of the bud can
be 'fX-f. Therefore, there may be variations in the production of the sound hole I · L, which
facilitates the production. First, according to the method of manufacturing an acoustic resistor
according to the present invention, the acoustic resistor can be manufactured with n *! ZIL with
less distortion of the acoustic impedance value by using a photographic technique.
[0002]
Brief description of the drawings
[0003]
Fig. 1 does not show 4f 'tin of a unidirectional dynamic microphone 11 "" view, Fig. 2 is a crosssectional view of a conventional L low paper antibody l] FIG. 3A is a plan view showing an
embodiment of the acoustic resistor according to the present invention, FIG. 243 (bJ is a r-t rur
view of FIG. 181 in FIG. 181, and 454 is surrounded by one-dot chain A in FIG. 5 is an enlarged
view of a portion surrounded by one-dot chain l1jIC in FIG. 3b, and FIG. 6 is an enlarged view of a
portion surrounded by one-dot chain #MB in FIG. Fig. 7 is a drawing showing the cap in which
the it-echo low resistance body 2J in Fig. 3 is in contact with the sound hole 12. 稟 8 Fig. 1 n +
shows another example of the sound resistance body according to the present invention. Fig. 8
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(b) is a plan view of Fig. 8 (1-11 V of r in al) and (b) is a plan view of Fig. 53. According to the 4
77 Shin 4: 1 bet,: lt 47'i!
It's Fig. 1 Fig. 10 Fig. 9 θ) Fig. 9 θ) Method σ) 9) 1 θ The cross section of the acoustic resistor
made by contact method Fig. 411 is an indirect view We thrive on this invention by law! Figure 1
shows an example of a method of manufacturing a 'f' fil 'resistor; Figure 012 is a cross-sectional
view of an acoustic resistor made according to the method of Figure 1J; Figure 13 is a view of the
method of Figure 9 Among them, 17 is an “opening” that shows one body of pine wood made
from the method V. II, addition, aJ '· · · Todo 謹 resistor, 12 · · · sound hole, 1: (· · · expanded layer
rill, 2tJA, ZIIC · · · I-sound opaque portion, Z ■ 3 · · · Reverberation resistance 1-1-132, 42 ... n + 5
di; (... Screen 3: (a... Photosensitive C .omega. 43a... Film base... 13b... Film 1 good quality. Figure
1 Figure 2 Figure 3 Figure 4 Figure 1-5 Figure 6 Figure 1 Figure 7 n Figure 8 Figure 9 Figure 10
Figure 11 Figure 12 Figure 13
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