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DESCRIPTION JPS5994491

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DESCRIPTION JPS5994491
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
method of manufacturing a printed circuit board used in various electronic devices. The structure
of the prior art and the problems thereof As shown in FIG. 1, fixation of the leadless parts 4 and
5 to the copper foil patterns 2 and 3 of the print having the copper foil patterns 2 and 3 formed
on both sides of the insulating substrate 1 When electrically connecting both leadless parts 4 and
5, electrodes 4a at both ends of leadless part 40 fixed to the upper surface copper foil pattern 2
are located as shown in FIGS. A pair of through holes 6 and 7 are provided in the part, leadless
parts 4 are arranged in these through holes 6 and 7 so that a part of each electrode 4 & is
desired, and adhesive 8 together with leadless parts 6 on the lower side. Temporary fixing is
performed respectively, while through holes 9 are applied to the through holes 6 and 7, and
soldering is performed by flow soldering using surface tension by the solder of the through hole
plating holes 6.7, and the lower surface copper Foil pattern 3 and top There is solder wicking
system performing soldering of each leadless component 4,5 to foil pattern 2. In FIG. 2, 10 is a
solder. However, since this method solders the leadless component 4 on the upper surface
through the through-hole plating holes 6 and 7 to solder using the capillary phenomenon and the
surface tension of the solder, the leadless to the upper surface copper foil pattern 2 There is a
drawback that the soldering of the component 4 is unreliable, and there is also a drawback that
the cost is high because the through-hole plating is required. As another conventional method, as
shown in FIGS. 3 and 4, there are methods using reflow and flow soldering. This uses a printed
circuit board on which through-hole plating 13 is applied for electrical connection between
upper surface silver foil pattern 11 and lower surface copper foil pattern 12, and temporarily
fixed by leadless parts 14 ░ 150 adhesive 16 to each silver foil pattern 11.12. In the upper
surface copper foil pattern 11, the upper surface silver foil pattern 11 is formed by performing
soldering using a cream solder and a tunnel furnace or soldering by the flow-through type and
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for the lower surface copper foil pattern 12 by flow soldering. Soldering of leadless component
14 to the lower surface copper foil pattern 12 and soldering of upper and lower surface steel foil
pattern 11.12 by soldering the leadless component 15 to the lower surface copper foil pattern
12 simultaneously perform connection . According to this method, although the reliability of
soldering is high, reflow and flow soldering use a method and require through-hole plating, and
there is a drawback that the process is complicated and the conut becomes expensive.
In FIG. 4, 17 indicates solder. SUMMARY OF THE INVENTION In view of the above-described
conventional disadvantages, the present invention has an object to provide a method of
manufacturing a printed circuit board device which is low in cost, easy to mass-produce, and has
high reliability of soldering. The present invention mechanically connects the upper surface
silver foil pattern and the lower surface copper foil pattern mechanically without using expensive
through-hole plating to form an electrical circuit configuration, and each process is performed by
two flow solderings. Soldering of leadless parts to copper foil hatan and electrical connection
between upper and lower copper foil patterns are planned. DESCRIPTION OF THE PREFERRED
EMBODIMENTS An embodiment of the present invention will be described below with reference
to FIGS. FIG. 5 & b show the arrangement of the copper foil pattern of the printed circuit board
and the arrangement of the leadless component in the present invention. The upper surface
copper foil pattern 21 and the lower surface copper foil pattern 22 of the insulating plate 1 are
disposed such that one end faces each other, and at the end of each of the copper foil patterns 21
and 22, A pair of through holes 23 ░ 24 are provided to be in contact with each other. In the
above configuration, first, the leadless part 25 ░ 26 is temporarily fixed with the adhesive 27 so
that each of the electrodes [j 2 sa, 26 a is positioned on the copper foil pattern 21. 22], and
plated into a substantially U shape A conductor 28 such as a wire is inserted into the through
hole 23.24 and temporarily fixed by bending its tips inward on the lower surface copper foil
pattern 22 side. From this state, the electrodes 26a at both ends of the leadless component 26
and the conducting wires 28 are then soldered to the respective lower surface silver foil patterns
22 on the lower surface silver foil pattern 22 side in the first flow solder process. This state is
shown in FIG. Here, 29 indicates a solder. Next, the printed circuit board is inverted, and a second
flow solder is applied to the top silver foil pattern 21 side. As a result, the electrodes 25a at both
ends of the leadless component 250 and the leads 28 are soldered to the top copper foil patterns
21 and the top copper foil patterns 21 and the bottom silver foil patterns 22 are electrically
connected through the leads 28. This state is shown in FIG. Here, 30 indicates a solder. As
described in detail in the invention, according to the present invention, parts and conductors can
be soldered only with two flow solders without through-hole plating, and the mass productivity is
high and the cost is low at a printed circuit board Can be manufactured.
[0002]
Brief description of the drawings
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[0003]
1 and 2 are cross-sectional views of the prior art for explaining the conventional method of
manufacturing a printed circuit board device, and FIG.
FIG. 4 is a cross-sectional view of a conventional method of manufacturing a printed circuit board
device, and FIGS. 5a and 5b are cross-sectional views of the present invention illustrating
respective steps of the method. 1
иииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииии
ииииииииииииии Through hole, 25.26 иииииии Leadless parts, 27 иииии Adhesives, 28 ииииии Leads, 29.30 иии Solder.
Name of Agent Attorney Nakao Toshio Other 1 person Figure 1 Figure 2 Figure 3 Figure 4 Figure
6
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