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DESCRIPTION JPS6123791

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DESCRIPTION JPS6123791
[0001]
The present invention relates to an electroplating method of a synthetic resin body, and more
particularly to an electroplating method suitable for producing a synthetic resin molded article
having a metal plating layer on the back surface, such as a housing of an electronic device such
as a computer. In synthetic resin housings of computers and other electronic devices, plating
layers for shielding electromagnetic waves have been formed on the inner surfaces of housings
in order to prevent electromagnetic wave interference. In order to make the back surface
insulative, a beautiful cosmetic plating layer is formed only on the surface. However, in the case
of producing a synthetic resin product in which the plating layer is provided on only one of the
front and back surfaces, the conventional plating method has the following problems. That is, as
a typical example of the conventional plating method, a synthetic resin body containing a
solvent-soluble component such as ABS is roughened by chemical etching, and then this is
treated in a non-electrolytic plating solution (chemical plating solution). There is a method of
forming a conductive layer on the surface of a synthetic resin body by immersing it in a synthetic
resin body, and then forming an electroplated layer on the surface of the conductive layer by an
ordinary method in an electroplating bath. When plating a synthetic resin body in a chemical
plating solution, or when immersing it in an electroplating bath, shield the opposite side of the
synthetic resin body from the unnecessary appearance by any means, and conduct electricity.
Body layer or electroplating layer must be formed only on one side of the synthetic resin body,
and it is difficult to perform single-sided plating efficiently and economically because the
shielding process on the opposite side is troublesome. There is a problem . Moreover, in this
plating method, since it is necessary to roughen the surface of the synthetic resin body by
complicated chemical etching, it is satisfactory whether the chemical resistance of the synthetic
resin body to the chemical solution for etching is too strong or too weak. There is also a problem
that the range of application is narrow since the surface roughening can not be carried out and
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the type of resin of the synthetic resin body is naturally limited. In addition, as another
conventional plating method, the synthetic resin package itself is made conductive by molding a
synthetic resin body from a resin compounded with a conductive material such as carbon, and
this is immersed in an electroplating bath for electroplating In this case, too, in order to
electroplate only one side, it is necessary to shield the other side which does not require plating,
and furthermore, since the synthetic resin body contains a conductive material, the synthetic
resin body is made. There is also a problem that the deterioration of the physical properties of
the material itself is reduced. The present invention has been made in view of the above
problems, and the object of the present invention is that electroplating on only one side can be
easily performed without shielding the opposite side, and the physical properties of the synthetic
resin body deteriorate. It is an object of the present invention to provide an electroplating
method which is widely applied to various synthetic resin products because chemical etching is
not necessary.
That is, in order to achieve the above object, the present invention achieves the above object by
pressing the conductive layer on a part or all of the surface of the synthetic resin body, by twolayer extrusion molding, injection molding, coating molding or laminating. The present invention
relates to a method of electroplating a synthetic resin body which is formed and electroplated on
the surface of the conductor layer, which will be described in detail with reference to the
drawings. FIG. 1 is an explanatory view of an embodiment of the electroplating method according
to the present invention, according to which, as shown in FIG. 1 (a) in the first step, a part of the
surface of the synthetic resin body 1, ie The conductor layer 2 is formed on one surface (upper
surface) of the product 1. Since this embodiment exemplifies the case where only one side of the
synthetic resin body 1 is plated, as shown in FIG. 1 (a), the conductor layer is formed only on one
side (upper surface) of the synthetic resin body 1 In the case where the entire surface is plated,
the conductor layers 2 are formed on the upper and lower surfaces of the synthetic resin body 1,
and when the plating is applied locally, the synthetic resin is formed. Needless to say, the
conductor layer 2 is formed on a desired portion of the surface of the product 1. As the synthetic
resin body 1, for example, those made of various thermoplastic resins such as polyvinyl chloride,
polyethylene, polystyrene, polypropylene, polycarbonate, ABS resin and the like are used, and the
conductor layer 2 is specifically carbon What consists of synthetic resins (for example, various
thermoplastic resins similar to the said synthetic resin body 1) which mixed the other electrically
conductive powder is used. The conductor layer 2 is formed by any of the following means. That
is, a conductive material mixed synthetic resin film or the like is superimposed on the upper
surface of the synthetic resin body 1 and thermocompression bonding is integrally performed by
press molding, or when extrusion is performed on the synthetic resin body 1 The material mixed
synthetic resin is piled up and extruded, or a conductive material mixed synthetic resin liquid is
coated on the upper surface of the synthetic resin made body 1 by a roll coater or the like, or
when injection molding of the synthetic resin made body 1 A conductive material mixed
synthetic resin film is internally installed and laminated integrally on the upper surface of the
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synthetic resin body 1, or a molding resin of the synthetic resin body 1 is injected halfway
through one injection port of the injection molding die. Or the so-called two-shot injection
molding method in which the molding die is inverted and the conductive material mixed
synthetic resin is injected from the other injection port, or a synthetic resin body In the upper
surface coated with the adhesive material is formed by any one of means for laminating a
conductive material mixed synthetic resin film.
In that case, it is desirable to adjust the thickness of the conductor layer 2 to be several microns
or more and the surface resistance value to be 100 or less. If the thickness is extremely small,
there is a possibility that a defect may occur in the conductor layer 2, and if the surface
resistance value is too large, electroplating will not be successful. The synthetic resin body 1
having the conductor layer 2 formed on one side (upper surface) in this manner is then shaped
into a desired shape as shown in FIG. 1 (b). For example, in the case of manufacturing a housing
of an electronic device, as shown in FIG. 2B, the conductor layer 2 is heat-formed by a press
machine or the like so as to be the inner surface side. This forming step needs to be separately
performed after the forming step of the conductor layer 2 in the case of forming the conductor
layer 2 by any means of two-layer extrusion molding, application molding, and lamination. When
2 is formed by means of press molding or injection molding, the shaping step is unnecessary, and
a synthetic resin body of a desired shape having the conductor layer 2 in a single step with a
press or an injection molding machine You can get one. That is, taking the case where the
conductor layer 2 is formed by means of press molding as an example, a plate-like synthetic resin
body and a conductive material mixed resin film are overlapped and disposed in the female die of
the press, When the male mold is pressed under heating, the synthetic resin body is shaped
appropriately to the amount of the press, and at the same time the conductive material mixed
resin film is thermocompression-bonded and integrated on the inner surface of the synthetic
resin body. The synthetic resin body 1 having the conductor layer 2 on the inner surface as
shown in FIG. 1 (b) can be obtained by the process. Similarly, also in the case of injection
molding, a conductive material mixed resin film is disposed in a split mold of an injection
molding machine, and a synthetic resin is injected from an injection port to make a synthetic
resin body 1 having a conductor layer 2 on one side. Can be obtained in a single step. In
particular, the former means by the press machine is suitable for producing the housing etc. of
the electronic device having the plating layer on the inner surface, and the latter means by the
injection molding machine produces the channel knob etc. having the plating layer on the outer
surface In some cases it is suitable. The synthetic resin body 1 in which the conductor layer 2 is
formed and shaped into the desired shape as described above is finally immersed in the
electroplating bath as usual, and an electrode is connected to the conductor N2 to conduct
electricity. Be done. Then, the metal ions dissociated in the plating bath are drawn to the
conductor layer 2 of the synthetic resin body 1, and as shown in FIG. 1 (c), the single plating
layer 3 is formed only on the surface of the conductor layer 2. It is formed. As can be understood
from the above description, according to the electroplating method of the present invention, the
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conductor layer 2 is formed by pressing, two-layer extrusion on part or all of the synthetic resin
article 1 requiring electroplating on the surface thereof. As it is formed by any means of molding,
injection molding, coating molding or lamination, the conventional plating method does not
require any roughening treatment of the synthetic resin body by chemical processing and
notching, and electroplating is necessary. The conductor layer 2 can be easily formed only in the
portion where
Therefore, the plating method of the present invention has an effect that it can be widely applied
to electroplating of various synthetic resin bodies without considering the suitability of the
synthetic resin body 1 for the chemical resistance to the chemical solution for processing and
notching. Moreover, when single-sided plating or partial plating is performed, there is an effect
that electroplating can be performed efficiently and economically without shielding unnecessary
portions of the synthetic resin body as in the conventional plating method. is there. Further, in
the plating method of the present invention, since the conductive material is not mixed in the
synthetic resin body 1), the conventional synthetic resin body itself may be deteriorated in
physical properties as seen in the plating method in which the conductive material is mixed.
There is no harm. As described above, the electroplating method of the present invention is
particularly effective, and in particular, the electronic device A that requires a plating layer for
shielding electromagnetic waves on its inner surface, or a channel knob or switch that requires a
cosmetic plating layer on its outer surface. It is suitable as an electroplating method in the case
of producing a metal etc.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is an explanatory view of an embodiment of the present invention.
1 ... synthetic resin body, 2 ... conductor layer, 3 ... electroplating layer.
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