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DESCRIPTION JP2018129673

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DESCRIPTION JP2018129673
Abstract: The present invention provides a film surface reception type sound sensor module
which can be used even with a film having no heat resistance, is excellent in resistance to
repeated use involving various deformations, and has high accuracy and stable detection
performance. SOLUTION: An insulating adhesive layer 32 which is elastically deformed is
provided on one surface 31a of a film 31 having flexibility, and a substrate 30 with wiring in
which a conductive pattern 33 is formed on the insulating adhesive layer 32. And a microphone
40 mounted on the wired substrate 30. The terminal 42 of the microphone 40 is in contact with
the conductor pattern 33, and part of the surface on which the terminal 42 of the microphone 40
is not formed and part of the surface on which the conductor pattern 33 of the insulating
adhesive layer 32 is not formed They are attached to each other and mechanically connected.
[Selected figure] Figure 1
Film surface sound receiving type sound sensor module
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
sound sensor module, and more particularly to a film surface sound receiving type sound sensor
module in which a film is placed on the surface of a solid to be detected.
[0002]
FIG. 5A shows a configuration in which the microphone is mounted on the circuit board
described in Patent Document 1, and FIGS. 5B and 5C show the back of the microphone and the
circuit board in an enlarged manner, respectively. .
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[0003]
The microphone 12 mounted on the circuit board 11 has a microphone sound hole 12 a on the
circuit board 11 side.
The board sound hole 11a is opened in the circuit board 11 so as to be aligned with the
microphone sound hole 12a.
A ground land 13a, an output signal line land 13b and a DC bias land 13c are formed on the back
surface of the microphone 12 as the microphone side land 13, and on the circuit board 11, at a
position corresponding to the microphone side land 13. A substrate side land 14 connected to
the microphone side land 13 by solder is formed. The substrate side land 14 comprises a ground
land 14a, an output signal line land 14b, and a DC bias land 14c.
[0004]
The microphone 12 takes in external sound through the board sound hole 11 a and the
microphone sound hole 12 a. In this example, the microphone 12 is a micro-electro mechanical
system (MEMS) microphone that can be surface-mounted on a printed circuit board (PCB) or a
flexible circuit board using solder.
[0005]
6A and 6B show an arrayed sound pickup sensor device described in Patent Document 2. As
shown in FIG.
[0006]
The arrayed sound pickup sensor device 20 has a sheet-like soft support 21, and a small
microphone 23 is fixed to the inner bottom surface of a plurality of cavities 22 formed on one
surface of the sheet-like soft support 21.
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The inner bottom surface is formed by penetrating a hole to be a cavity 22 in a soft resin (for
example, a highly adhesive resin for soft urethane molding resin) 21a in the thickness direction,
and bonding the rubber sheet 21b to one surface of the soft resin 21a It is formed by closing one
of the 22 openings. An amplification circuit IC 24 is fixed to a surface of the rubber sheet 21 b
opposite to the cavity 22 at a position corresponding to each microphone 23 and is electrically
connected to the corresponding microphone 23.
[0007]
This array-like sound pickup sensor device 20 is used in a shunt stenosis diagnosis support
system, and FIG. 6C shows its use state. The sheet-like soft support 21 is oriented so that the
opening of the cavity 22 faces the skin of the subject's forearm. In FIG. 6C, reference numeral 25
denotes a pressing band 25 to which the arrayed sound pickup sensor device 20 is fixed. Surface
fasteners 26 a and 26 b are provided on the presser band 25.
[0008]
JP, 2015-29182, A JP, 2016-209623, A
[0009]
By the way, sound information is complicated not only by the position of the sound source but
also by the propagation path and the propagating medium due to interference, resonance,
Doppler effect, etc., so it is not a point to detect it comprehensively. It is necessary to receive the
[0010]
In order to receive sound emitted from a solid with high sensitivity on the surface, for example, a
system is conceivable in which a microphone is mounted on a base that is in close contact with
the solid surface and the base is in close contact with the solid surface.
In the sound sensor module of this type, when considering repeated use for various solids, the
base material can be deformed to correspond to various shapes of various solids, and the sound
sensor module as a whole involves various deformations. It is necessary to be highly resistant to
repeated use and to be able to maintain high accuracy and stable detection performance.
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In addition, it is also important to be able to select a substrate according to the application so as
to be able to cope with various applications.
[0011]
In the configuration in which the microphone 12 is mounted on the circuit board 11 shown in
FIG. 5 as a conventional example and in the configuration in which the microphone 23 is fixed to
the sheet-like soft support 21 shown in FIG. If it is a circuit board, it can be said that the
microphones are mounted on a deformable base material, but in the configuration of FIG. 5,
solder is used to connect the circuit board 11 and the microphone 12. Is disposed on the solid
surface of the object to be detected, a cavity is present in the path from the solid surface to the
microphone 12 (microphone sound hole 12a).
[0012]
On the other hand, also in the configuration of FIG. 6, since the microphone 23 is fixed to the
inner bottom surface of the cavity 22 closed by the detection target, the cavity is present in the
path from the solid surface to be detected to the microphone 23 .
[0013]
In the mounting structure of the microphone on the base material, using the solder connection as
described above requires heat resistance to the base material, so that the usable base material is
limited, and the base material having no heat resistance is used It will not be possible.
[0014]
Further, the connection and fixation using solder can not be said to be strong against the stress
load and the vibration of the sound input which are variously changed due to the repeated use
accompanied by the various deformations, which causes a connection failure.
[0015]
Furthermore, if there is a cavity in the path from the solid surface to be detected to the
microphone, and the cavity is deformed along with the deformation of the base material, it causes
the change of the sound propagation characteristics and the generation of noise, which results in
high accuracy Detection will be inhibited.
[0016]
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In view of such circumstances, the object of the present invention is to make it possible to use,
for example, a film having no heat resistance, as a substrate, to be excellent in resistance to
repeated use involving various deformations, and to depend on shape change It is an object of
the present invention to provide a film surface reception type sound sensor module which can
obtain high accuracy and stable detection performance.
[0017]
According to the invention of claim 1, in the film surface reception type sound sensor module,
the insulating adhesive layer which is elastically deformed is provided on one surface of the
flexible film, and the conductor pattern is formed on the insulating adhesive layer. And a
microphone mounted on the wired substrate, the terminals of the microphone being in contact
with the conductor pattern, and the part of the surface where the microphone terminals are not
formed is insulated A part of the surface on which the conductive pattern of the pressuresensitive adhesive layer is not formed is attached to each other and mechanically coupled.
[0018]
In the invention of claim 2, according to the invention of claim 1, the insulating pressuresensitive adhesive forming the insulating pressure-sensitive adhesive layer has ultraviolet
curability, and the surface of the insulating pressure-sensitive adhesive layer on which the
microphone terminal is not formed. The site mechanically linked to a part is considered to be UVcured.
[0019]
According to the invention of claim 3, in the invention of claim 2, the whole of the insulating
pressure-sensitive adhesive layer is UV-cured.
[0020]
According to the invention of claim 4, in the invention according to any one of claims 1 to 3, the
surface on the side on which the conductor pattern of the substrate with wiring is formed is a
portion where the microphone is located and a connection portion with the outside of the
conductor pattern. It is covered by a flexible cover film except for the above.
[0021]
According to the present invention, since the microphone can be mounted without heat without
using solder, heat resistance is not necessary for the film for surface sound reception, and in that
respect, the limitation of the film material is small, and the application Films of various materials
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can be used depending on the situation.
[0022]
Also, the microphone is attached to the insulating adhesive layer of the wired substrate and
mechanically coupled, and the terminals of the microphone and the conductor pattern of the
wired substrate are pressed together by the elastic restoring force of the insulating adhesive
layer. The connection is strong and stable compared to solder connection with respect to stress
load and sound input vibration that changes variously due to repeated use involving various
deformations of the wiring base material. You can get the status.
[0023]
Furthermore, there is no cavity in the path from the film installed on the surface of the solid to be
detected to the microphone to the microphone, which causes changes in the sound propagation
characteristics and noise as the shape changes, so high accuracy And, stable detection
performance can be obtained.
[0024]
A is a plan view showing an embodiment of a film surface reception type sound sensor module
according to the present invention, B is a front view thereof, and C is a partially enlarged
sectional view thereof.
A is a plan view of the wired base in FIG. 1, and B is a front view thereof.
A is a front view of the microphone in FIG. 1, B is its bottom view, and C is its perspective view.
FIG. 6 is a view for explaining the assembly of the film surface reception type sound sensor
module shown in FIG. 1.
A is a perspective view showing a conventional configuration in which a microphone is mounted
on a circuit board, B is a perspective view of the microphone in A, and C is a partially enlarged
perspective view of the circuit board in A. FIG.
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A is a perspective view which shows the conventional array-like sound-collecting sensor
apparatus, B is the partial expanded sectional view, C shows the use condition of the array-like
sound-collecting sensor apparatus shown to A. FIG.
[0025]
Embodiments of the present invention will be described by way of example with reference to the
drawings.
[0026]
FIG. 1 shows an embodiment of a film surface reception type sound sensor module according to
the present invention, and the film surface reception type sound sensor module 100 in this
example is a substrate 30 with wiring and a substrate 30 with wiring. It is comprised by the
microphone 40 and the cover film 50 mounted on the top.
2 and 3 show the details of the wiring substrate 30 and the microphone 40, respectively.
[0027]
As shown in FIG. 2, the wiring substrate 30 is configured such that the insulating adhesive layer
32 is provided on one surface 31 a of the film 31, and the conductive pattern 33 is formed on
the insulating adhesive layer 32. .
The film 31 has flexibility, and in this example, has a large (large area) rectangular shape as
compared to the microphone 40.
The insulating adhesive layer 32 is elastically deformed by pressure, and is provided on the
entire surface 31 a of the film 31.
[0028]
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Four conductor patterns 33 are arranged in this example, and lands 33a for the microphone 40
are formed at one end of each of the four conductor patterns 33, and each other end is formed
with an external circuit (external circuit). Lands 33b for connection are formed.
The four lands 33a for the microphone 40 are located at the center of the wired substrate 30,
and the lands 33b for external connection are arranged along the short side at the central
portion of one short side of the wired substrate 30. positioned.
[0029]
In the configuration as described above, polyethylene terephthalate (PET) or the like can be used
as the material of the film 31, for example.
[0030]
The insulating adhesive constituting the insulating adhesive layer 32 is, for example, polyester,
polyurethane, acrylic, epoxy, phenol, silicone, polyolefin, polyimide, vinyl, natural polymer based
polymer Etc.
The above polymers may be used alone or in combination.
[0031]
Moreover, in order to improve adhesiveness and mechanical properties, for example, polyester
type, polyurethane type, acrylic type, epoxy type, phenol type, silicone type, polyolefin type,
polyimide type, vinyl type monomer, oligomer to the above-mentioned polymer You may mix and
use.
[0032]
The conductor pattern 33 is formed by printing using, for example, silver paste (silver ink).
[0033]
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In this example, the microphone 40 is a MEMS microphone manufactured using MEMS
technology, and as shown in FIG. 3, the bottom surface 40a is provided with a sound hole 41, and
further, in this example, four terminals 42 are provided. There is.
The four terminals 42 are terminals for output, ground, power supply, and gain adjustment.
[0034]
FIG. 4 shows how the microphone 40 is mounted on the wiring substrate 30. The microphone 40
has four terminals 42 formed of the four conductive patterns 33 on the insulating adhesive layer
32. Each of the lands 33 a is aligned and pressed, and the insulating adhesive layer 32 is
mounted by being pressed.
[0035]
As shown in FIG. 1C, the terminal 42 of the microphone 40 is directly and electrically connected
to the land 33a, and the portion of the bottom surface 40a of the microphone 40 where the
terminal 42 is not formed is the insulating adhesive layer 32. It is adhered to and mechanically
bonded.
That is, in this example, the mechanical bond between the insulating adhesive layer 32 on which
the conductor pattern 33 is formed and the microphone 40 is a part of the surface on which the
terminal 42 of the microphone 40 is not formed, and the insulating adhesive layer 32. The
conductive pattern 33 is not attached to a part of the surface where the conductive pattern 33 is
formed.
[0036]
The insulating adhesive layer 32 elastically deforms and adheres when pressed, and its elastic
restoring force contributes as a load in a direction to press the terminal 42 of the microphone 40
and the land 33 a of the conductor pattern 33. Good connection with the land 33a can be
obtained.
[0037]
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The cover film 50 is disposed on the surface of the wiring substrate 30 on which the conductor
pattern 33 is formed.
In the cover film 50, windows 51 and notches 52 are provided as shown in FIG. 1A,
corresponding to the portion where the microphone 40 is located and the portion where the
lands 33b for external connection of the conductor pattern 33 are located, The surface of the
wiring substrate 30 on which the conductor pattern 33 is formed is covered by the cover film 50
as shown in FIG. 1 except for the portion where the microphone 40 is located and the portion
where the four lands 33b are located. .
[0038]
The cover film 50 is made flexible as with the film 31 forming the base of the wired substrate 30
and is made of the same material as the film 31.
[0039]
In the film surface reception type sound sensor module 100 having the above-described
configuration, the insulating adhesive layer 32 of the film 31 is provided on the side of the wiring
substrate 30 on which the microphone 40 is not mounted. The surface 31b opposite to the one
surface 31a is used by being placed on the surface of the solid to be detected.
The film 31 may simply be placed if it adheres closely to the surface of the solid.
On the other hand, when the solid surface does not have a monotonous shape, is not in close
contact, or is difficult to be in close contact, an adhesive or the like is used to be in close contact
with the solid surface.
[0040]
According to the film surface reception type sound sensor module 100 described above, the
mounting of the microphone 40 on the wiring-attached substrate 30 is performed without using
solder, that is, it is performed without heat, so that the film does not have heat resistance. It can
be used as the material of 31, and films of various materials can be used according to the
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application.
The shape and size of the film 31 are appropriately selected according to the application.
[0041]
In addition, the connection and fixation (mechanical coupling) by pasting the substrate with
wiring 30 and the microphone 40 is a stress load that changes in various ways due to repeated
use involving various deformations of the substrate with wiring 30 as compared to connection
and fixation by solder. The resistance to vibration of the sound input is strong, so that connection
failure does not occur, and a stable connection state can be obtained.
[0042]
Furthermore, by bringing the film 31 into close contact with the surface of the solid to be
detected with sound, no cavity exists in the path from the solid surface to be detected to the
microphone 40, that is, deformation occurs with deformation of the wiring substrate 30. By
doing this, since there is no cavity that causes changes in sound propagation characteristics and
noise, it is possible to perform highly accurate and stable sound detection without depending on
the shape change.
[0043]
The insulating pressure-sensitive adhesive forming the insulating pressure-sensitive adhesive
layer 32 may have ultraviolet curability.
In this case, ultraviolet rays are irradiated from the direction indicated by the arrow a in FIG. 1C,
and the insulating adhesive in the portion surrounded by the broken line b is ultraviolet-cured.
Thus, the insulating adhesive is made of an ultraviolet curable material, and is an insulating
adhesive layer mechanically coupled to a portion (a portion of the bottom surface 40 a) of the
surface of the microphone 40 where the terminal 42 is not formed. It is also possible to adopt a
configuration in which the 32 portions are locally UV-cured.
[0044]
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Alternatively, as a configuration that can be further adopted, while the insulating adhesive of the
insulating adhesive layer 32 is also made of an ultraviolet curable material, the entire insulating
adhesive layer 32 is irradiated with ultraviolet rays. May be UV cured.
Here, the entire UV-cured insulating adhesive layer 32 maintains flexibility and is elastically
deformable, and the surface tackiness is not lost either.
In this configuration, since the step of ultraviolet curing can be easily completed using a surface
irradiation type ultraviolet irradiation device, the fabrication is easier than the above-described
configuration in which ultraviolet curing is performed locally.
In addition, if ultraviolet curing is performed in a state where the cover film 50 is disposed, the
cover film 50 is in a state of being adhered to the wiring-attached base 30 over the entire surface
in contact with the insulating adhesive layer 32.
[0045]
The insulating pressure-sensitive adhesive having ultraviolet curing properties is obtained by
incorporating a polymerizable compound in the polymer used as the insulating pressure-sensitive
adhesive described above.
Examples of the polymerizable compound include radically polymerizable compounds having a
radically polymerizable functional group such as monofunctional and polyfunctional acrylates,
maleimide, thiol and vinyl ether.
[0046]
Examples of the radical polymerization initiator include a radical polymerization initiator which
generates an initiating radical with one molecule, and a radical polymerization initiator which
generates a radical by a reaction between two molecules. Examples of the polymerization
initiator that generates an initiation radical in one molecule include compounds such as
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acetophenone, acyl phosphine, titanocene, thiroazine, bisimidazole and the like. Moreover, as a
polymerization initiator which produces | generates a radical by reaction between 2 molecules,
compounds, such as benzophenone, an amine, thioxanthone, are mentioned, for example.
[0047]
On the other hand, the film 31 may be stretchable in addition to flexibility. If the film 31 has
stretchability, the film 31 can be brought into close contact with the surface of the solid to be
detected with sound regardless of its shape. In this case, the cover film 50 and the conductor
pattern 33 also have stretchability.
[0048]
The material of the stretchable film 31 and the cover film 50 may be polyurethane, styrene,
olefin, polyester, polyamide, silicone or other elastomer, or ethylene propylene, nitrile butadiene,
silicone, or acrylic. And fluorine-based or urethane-based synthetic rubbers can be used.
[0049]
Further, as the material of the stretchable conductor pattern 33, a material obtained by
dispersing a metal material such as silver or copper or a conductive material such as carbon in
the stretchable elastomer can be used.
[0050]
The film surface reception type sound sensor module according to the present invention can be
used for status recognition by sounds of various solids such as human bodies, devices, and
structures.
As a specific example, it can be used for nondestructive inspection by tapping sound, diagnosis
by auscultation, etc., and can be used in place of human perception and diagnosis.
[0051]
Further, by changing the film characteristics, various sound signals can be obtained, and by
analyzing the correlation between the film characteristics and the sound data, it becomes
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possible to grasp the solid state by more useful sounds.
[0052]
11 circuit board 11a board sound hole 12 microphone 12a microphone sound hole 13 ground
side 13a ground land 13b land for output signal line 13c land for DC bias 14 board side land 14a
ground land 14b land for output signal line 14c land for DC bias 20 Array-like sound pickup
sensor device 21 sheet-like soft support 21a soft resin 21b rubber sheet 22 cavity 23
microphone 24 amplification circuit IC 25 presser band 26a, 26b surface fastener 30 base
material with wiring 31 film 31a one side 31b side 32 insulating adhesive Layer 33 conductor
pattern 33a, 33b land 40 microphone 40a bottom surface 41 sound hole 42 terminal 50 cover
film 51 window 52 notch 100 film surface sound receiving type sound sensor module Lumpur
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