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DESCRIPTION JP2017069611

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DESCRIPTION JP2017069611
Abstract: To provide an audio output device capable of obtaining high-quality reproduced sound
even when a plurality of speaker units to be push-pull driven are small. A housing body (H) for
housing the first and second speaker units (8F, 8R) of the back surface open type and the first
and second speaker units (8F, 8R) separately, and a through hole (Wb) And a partition wall (Wa)
provided in the housing body (H) and partitioning a space between the first speaker unit (8F) and
the second speaker unit (8R). The first space (Vf) between the first speaker unit (8F) and the
partition wall (Wa) and the second space (Vr) between the second speaker unit (8R) and the
partition wall (Wa) penetrate The first speaker unit (8F) and the second speaker unit (8R) are
driven in opposite phase to be communicated with the hole (Wb) and to be substantially sealed
with respect to the external space (Vg). [Selected figure] Figure 3
Voice output device
[0001]
The present invention relates to an audio output device, and more particularly to an audio output
device that outputs audio using a plurality of speaker units.
[0002]
Voice output devices such as earphones and speaker devices are known.
For example, Patent Document 1 describes a speaker device having a cabinet and a plurality of
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speaker units attached to the cabinet. Patent Document 1 describes a speaker apparatus provided
with a first cabinet in which two speaker units are attached in a reverse direction, and a second
cabinet surrounding a front surface of one speaker unit. This speaker device is considered to be
able to improve sound quality by performing so-called push-pull driving in which signals of
opposite phase are input to each speaker unit to vibrate the diaphragms in the same direction.
[0003]
Patent No. 3445717 gazette
[0004]
In the speaker device as an audio output device described in Patent Document 1, since two
speaker units are housed in one speaker cabinet (first speaker cabinet), the volume of the space
on the back side of each speaker unit is Relatively large.
However, when the speaker unit is small, such as in an earphone or a portable speaker device,
the air in the first speaker cabinet can not be vibrated sufficiently, and it is difficult to improve
the sound quality of reproduced sound by push-pull driving. Improvement was desired.
[0005]
Therefore, the problem to be solved by the present invention is to provide an audio output device
capable of obtaining high-quality reproduced sound even if the plurality of speaker units to be
push-pull driven are small.
[0006]
In order to solve the above problems, the present invention has the following configuration 1).
1) The first speaker provided with a through hole and a housing body for separating and housing
the first and second speaker units of the back surface release type, the first and second speaker
units, and the through hole A partition wall partitioning a space between the unit and the second
speaker unit; a first space between the first speaker unit and the partition wall; and the second
speaker unit A second space between the partition wall and the second wall is communicated
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with the through hole and is substantially sealed with respect to the external space, and the first
speaker unit and the second speaker unit It is an audio output device characterized in that it is
driven in reverse phase.
[0007]
According to the present invention, high-quality reproduced sound can be obtained even if a
plurality of push-pull driven speaker units are small.
[0008]
FIG. 1 is a longitudinal sectional view for explaining an earphone 51 which is an example of the
audio output device according to the embodiment of the present invention.
FIG. 2 is a figure for demonstrating the speaker unit 8F with which the earphone 51 is equipped,
FIG. 2 (a) is a side view, FIG.2 (b) is a rear view. FIG. 3 is a diagram modeling the structure of the
earphone 51. As shown in FIG. FIG. 4 is a longitudinal sectional view for explaining a speaker
device 51P which is an example of the audio output device according to the embodiment of the
present invention. FIG. 5 is a view for explaining an earphone 52A which is a modified example 1
of the earphone 51. As shown in FIG. FIG. 6 is a view for explaining an earphone 52B which is a
modification 2 of the earphone 51. As shown in FIG. FIG. 7 is a view for explaining an earphone
53 which is a modification 3 of the earphone 51. As shown in FIG. FIG. 8 is a view for explaining
an earphone 54 which is a modification 4 of the earphone 51. As shown in FIG. FIG. 9 is a view
for explaining an earphone 55 which is a modification 5 of the earphone 51. As shown in FIG.
FIG. 10 is a view for explaining an earphone 56 which is a modification 6 of the earphone 51. As
shown in FIG.
[0009]
A voice output device according to an embodiment of the present invention will be described
using a preferred embodiment such as the earphone 51 and the speaker device 51P with
reference to FIGS.
[0010]
FIG. 1 is a longitudinal sectional view for explaining the earphone 51. As shown in FIG.
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Front, rear, upper and lower directions are indicated by arrows for convenience. The front side is
the head direction when the earphone 51 is in use. The left side is the front side of the paper
surface of FIG. 1, and the right side is the back side of the paper surface.
[0011]
The earphone 51 is a so-called canal type (earplug type). The earphone 51 has a main body 1.
The main body portion 1 includes a front main body portion 2 having a sound tube portion 2a to
which the earpiece EP is attached and inserted into the external ear canal, a body portion 3
located on the rear side of the front body portion 2, and a rear side of the body portion 3 And a
rear main body 4 located in The earphone 51 further includes a bushing 5 connected to the body
3 and extending downward, and a cord 6 inserted into the bushing 5 and drawn downward from
the inside of the body 3.
[0012]
The body portion 3 has a front and rear housing accommodation hole 3a which is a through hole
centered on an axis line CL1 extending in the front and rear direction. In the front and rear
housing accommodation holes 3a, bottomed cylindrical front housings 7F and rear housings 7R
are stored side by side in the front-rear direction with bottom walls 7Fa and bottom walls 7Ra
contacting each other. The front main body 2 and the rear main body 4 are attached to the body
3 by bonding or welding, whereby the front housing 7F and the rear housing 7R are sandwiched
between the front main body 2 and the rear main body 4 And is held firmly within the body 3.
[0013]
The earphone 51 has two speaker units 8F and 8R having a cylindrical appearance. The speaker
unit 8F and the speaker unit 8R are the same in this example. A speaker unit 8F is
accommodated in the front housing 7F, for example, in a direction in which the sound emitting
surface 8Fa is on the front side. The housing position of the speaker unit 8F in the front-rear
direction is a position where a substantially cylindrical space Vf is generated with a gap between
the speaker unit 8F and the bottom wall 7Fa of the front housing 7F. The speaker units 8F and
8R are back release types that emit sound also from the back side opposite to the sound emitting
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surfaces 8Fa and 8Ra.
[0014]
The speaker unit 8R is accommodated in the rear housing 7R, for example, in a direction in
which the sound emitting surface 8Ra is on the rear side. The housing position of the speaker
unit 8R in the front-rear direction is a position where a substantially cylindrical space Vr is
generated with a gap between the speaker unit 8R and the bottom wall 7Ra of the rear housing
7R.
[0015]
The sound emitting surfaces 8Fa and 8Ra are surfaces on which the sounds of the diaphragms
8Fb and 8Rb are mainly emitted, and in the speaker units 8F and 8R, the diaphragms 8Fb and
8Rb are disposed closer to the sound emitting surfaces 8Fa and 8Ra. ing.
[0016]
The central axis line CL8f of the speaker unit 8F and the central axis line CL8r of the speaker
unit 8R both coincide with the axis line CL1 in this example.
Bottom wall 7Fa and bottom wall 7Ra have penetration hole 7Fb and penetration hole 7Rb,
respectively. The through holes 7Fb and the through holes 7Rb are formed at positions and
shapes that communicate with each other. The space Vf and the space Vr communicate the
through holes 7Fb and the through holes 7Rb as an air passage, and are shut off from the
external space to be in a sealed state.
[0017]
The through holes 7Fb and the through holes 7Rb are, for example, round holes centered on the
axis line CL1. The through holes 7Fb and the through holes 7Rb are, for example, straight holes
whose cross-sectional areas are constant in the front-rear direction. Also, they have the same
cross-sectional area. The cross-sectional areas of the through holes 7Fb and the through holes
7Rb are set sufficiently smaller than the area of the bottom wall 7Fa and the bottom wall 7Ra
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including it. Specifically, for example, 10% or less. A smaller value is preferable from the
viewpoint of obtaining high sound quality.
[0018]
An air chamber R1 having a space V1 is formed together with the front housing 7F and the front
main body 2 on the front side of the speaker unit 8F. As a result, the sound emitted from the
sound emission surface 8Fa of the speaker unit 8F is emitted from the tip of the sound tube 2a to
the outside through the space V1. An air chamber R4 having a space V4 between the rear main
body 4 and the rear side with respect to the speaker unit 8R is formed. In this example, the air
chamber R4 is sealed, and the internal space V4 is substantially shut off from the external space.
The sound emitted from the sound emission surface 8Ra of the speaker unit 8R is emitted into
the space V4.
[0019]
Pads 8Fe and 8Re (see FIG. 2), which are terminals, are provided on the back surface of the
speaker unit 8F (the opposite surface of the sound emitting surface 8Fa) and the back surface of
the speaker unit 8R (the opposite surface of the sound emitting surface 8Ra). Leads 6 f and 6 r
drawn from the cord 6 are connected to the pads 8 Fe and 8 Re by solder (see FIG. 1). Holes 7Fd
and 7Rd for passing the leads 6f and 6r are provided in the front housings 7F and 7R,
respectively. The clearances between the holes 7Fd and 7Rd and the leads 6f and 6r are
extremely small, and do not affect the tightness of the air chamber R2 and the air chamber R3.
[0020]
Next, the speaker units 8F and 8R will be described with reference to FIG. In this example, since
the speaker unit 8F and the speaker unit 8R are the same, the speaker unit 8F will be mainly
described in detail. 2 (a) is a side view of the speaker unit 8F, and FIG. 2 (b) is a rear view. The
back surface is the surface opposite to the sound emitting surface 8Fa as described above.
[0021]
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The speaker unit 8F has a cup-shaped case 8Fc whose back side is released. The case 8Fc is
formed by drawing of a thin metal sheet or the like. The outer diameter of case 8Fc is, for
example, 6 mm. The sound emitting surface 8Fa of the case 8Fc is formed with a plurality of
holes (not shown) for emitting the sound from the diaphragm 8Fb.
[0022]
In the rear view of the speaker unit 8F, the substrate 8Fd housed in the rearmost side of the case
8Fc is visually recognized. On the substrate 8Fd, four quarter circular pads 8Fe filled with solder
are provided at intervals of 90 ° in the circumferential direction. On the substrate 8Fd, the pads
8Fe are circumferentially separated from each other, and in the gap, a cross-shaped isolator 8Ff
is attached as a wall for more reliably separating the pads 8Fe.
[0023]
The substrate 8Fd is provided with a pair of vent holes 8Fg spaced apart in the vertical direction
of FIG. 2 (b). The vent 8Fg is a vent that communicates the space on the back side of the
diaphragm 8Fb inside the case 8Fc with the external space. In the isolator 8Ff, an opening 8Ff1 is
formed at a position corresponding to the vent hole 8Fg.
[0024]
In this configuration, the pad 8Fe and the speaker unit 8F are electrically connected in a
predetermined manner. Thereby, the leads 6f, 6r inserted into the cord 6 into the pads 8Fe and
drawn out into the body portion 3 are soldered with the predetermined wiring, thereby
responding to the audio signal received from the outside through the cord 6 Sound is output
from the speaker unit 8F. Since the speaker unit 8F includes the isolator 8Ff, there is no
possibility that solder may block the vent hole 8Fg when connecting the lead to the pad 8Fe. As a
result, the sound quality of the speaker unit 8F is maintained at a predetermined quality with less
variation.
[0025]
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With the above-described configuration, the speaker unit 8F emits sound from the sound
emitting surface 8Fa by the vibration of the diaphragm 8Fb, and also emits sound from the vent
hole 8Fg to the back side. The speaker unit 8R also has the same structure as the speaker unit
8F, and outputs sound with the same sound quality and volume as the speaker unit 8F.
[0026]
Returning to FIG. 1, among the sounds generated by the vibration of the diaphragm 8Fb of the
speaker unit 8F, the sound emitted to the back side is emitted into the space Vf through the vent
8Fg. Of the sounds generated by the vibration of the diaphragm 8Rb of the speaker unit 8R, the
sound emitted to the back side is emitted into the space Vr through the vent 8Rg.
[0027]
Here, in the speaker unit 8F and the speaker unit 8R, audio signals from the outside are supplied
in parallel in reverse phase. Therefore, the vibration directions of the diaphragm 8Fb and the
diaphragm 8Rb coincide with each other, and synchronously vibrate in the front-rear direction.
Further, as described above, the space Vf and the space Vr communicate with each other through
the through holes 7Fb and the through holes 7Rb. Thereby, the earphone 51 outputs sound by
so-called push-pull driving.
[0028]
As described above, in the earphone 51, the ventilation cross-sectional area which is the crosssectional area of the through holes 7Fb and 7Rb is set sufficiently smaller than the area of the
bottom walls 7Fa and 7Ra. Specifically, it is desirable to be 10% or less as described above, and in
the example shown in FIG. 1, it is 0.1% or less.
[0029]
That is, as described above, the outer diameter of the case 8Fc (8Rc) of the speaker unit 8F (8R)
is 6 mm, and the bottom of the case 8Fc (7Rc) provided for positioning in the front-rear direction
is reduced. The diameter of the wall 7Fa (7Ra) is 5 mm. Further, the through hole 7Fb (7Rb) is a
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round hole with an inner diameter of 0.2 mm. In this case, the inner diameter of the through hole
7Fb (7Rb) is preferably about 1.6 mm or less. In this example, the inner diameter is 0.2 mm, and
the ventilation cross-sectional area is set to 0.16% of the area of the bottom wall 7Fa (7Ra). The
distance between the back surface of the speaker unit 8R and the bottom wall 7Ra of the rear
housing 7R and the distance between the back surface of the speaker unit 8F and the bottom
wall 7Fa of the front housing 7F are about 1 to 2 mm. In addition, the lengths of the through
holes 7Fb and the through holes 7Rb as vents are respectively about 0.3 to 0.4 mm (total about
0.6 to 0.8 mm in total).
[0030]
FIG. 3 is a diagram in which the structure of the above-described earphone 51 is generally
modeled. As shown in FIG. 3, the structural model of the earphone 51 is such that a housing body
H is configured by a front housing 7F and a rear housing 7R. The housing body H has two air
chambers Rf and Rr aligned in the front-rear direction by the partition wall Wa. The partition wall
Wa is formed at the center of the housing body H in the front-rear direction (corresponding to
the bottom walls 7Fb and 7Rb).
[0031]
The speaker unit 8F is accommodated in the air chamber Rf on the front side of the housing body
H in a posture in which the sound emitting surface 8Fa faces the front. Thus, an air chamber R2
having a space Vf is formed between the speaker unit 8F and the section wall Wa. The speaker
unit 8R is accommodated in the air chamber Rr on the rear side of the housing body H in a
posture in which the sound emitting surface 8Ra of the speaker unit 8R faces the rear. Thus, an
air chamber R3 having a space Vr is formed between the speaker unit 8R and the partition wall
Wa.
[0032]
The front side of the speaker unit 8F is an air chamber R1 having a space V1 communicated with
the external space through the sound tube 2a to which the earpiece EP is attached. The rear side
of the speaker unit 8R is an air chamber R4 having a sealed space V4. In the section wall Wa, a
through hole Wb is formed to ventilate the space Vf and the space Vr. In this configuration, the
volume Vft of the space Vf and the volume Vrt of the space Vr are set equal (Vft = Vrt). Further,
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the cross-sectional area Swb of the through hole Wb is 0.1% or less of the area Swa of the
partition wall Wa including the through hole Wb.
[0033]
FIG. 4 is a longitudinal sectional view for explaining a speaker device 51P which is an example of
the speaker device according to the embodiment of the present invention. The speaker device
51P has an enclosure HP having a plurality of (three) air chambers RP1 to RP3 in the front-rear
direction. Inside the enclosure HP, there are provided a partition wall WaP and a partition wall
WcP, which are two partition walls that partition the inner space into three in the front-rear
direction. A through hole WbP is formed in the section wall WaP that divides the air chamber
RP1 and the air chamber RP2. A sound emission hole WcP1 is formed in a section wall WcP that
divides the air chamber RR2 and the air chamber RP3.
[0034]
The speaker unit 8PF is attached to the front wall HPf of the enclosure HP so that the diaphragm
8PFb is located on the front side. A sound emission hole HPf1 is formed in the front wall HPf to
allow the sound output from the speaker unit 8PF to the front to pass through. In air room RP1,
space VPf which excluded the space which speaker unit 8PF occupies from space between front
wall HPf and section wall WaP is formed. The space VPf is substantially sealed at portions other
than the through holes WbP.
[0035]
The speaker unit 8PR is attached to the partition wall WcP, for example, so that the diaphragm
8PRb is located on the rear side. That is, in this example, the speaker unit 8PF and the speaker
unit 8PR are attached in opposite directions in the front-rear direction. In air room RP2, space
VPr which removed the space which speaker unit 8PR occupies from space between division wall
WcP and division wall WaP is formed. In the space VPr, parts other than the through holes WbP
are substantially sealed.
[0036]
The sound output rearward from the speaker unit 8PR is emitted through the sound release hole
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WcP1 into the enclosed space VP4 between the rear wall HPr of the enclosure HP and the
partition wall WcP.
[0037]
The volume VPft of the space VPf and the volume VPrt of the space VPr are set equal (VPft =
VPrt).
Further, the cross-sectional area SwbP of the through hole WbP is 0.1% or less of the area SwaP
of the partition wall WaP including the through hole WbP.
[0038]
In the above-described earphone 51 (speaker device 51P), the speaker units 8F (8PF) and 8R
(8PR) face the air chamber Rf (RP1) and the air chamber Rr (RP2) arranged in parallel in the
front-rear direction. And are housed separately from each other toward the outside of each air
chamber. Between the speaker unit 8F (8PF) and the speaker unit 8R (8PR), there is a partition
wall Wa (WaP) that partitions the air chamber Rf (RP1) and the air chamber Rr (RP2), and the
partition wall Wa (WaP) A through hole Wb (WbP) is provided in WaP) as an air passage having
a sufficiently small cross-sectional area with respect to the partition wall Wa (WaP).
[0039]
As shown in FIGS. 3 and 4, the space Vf (VPf) on the back side of the speaker unit 8F (8PF) and
the space Vr (VPr) on the back side of the speaker unit 8R (8PR) are through holes Wb (WbP). )
And is substantially sealed to the external space Vg (Vg). The space V1 on the front side of the
speaker unit 8F is in communication with the external space. The space on the front side of the
speaker unit 8PF is an external space Vg. The space V4 (VP4) on the front side of the speaker
unit 8R (8PR) is substantially sealed.
[0040]
An external audio signal is input to the speaker unit 8F (8PF) and the speaker unit 8R (8PR) in
reverse phase, and the diaphragms 8Fb (8PFb) and 8Rb (8PRb) vibrate in the same direction, so-
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called It is designed to perform push-pull drive.
[0041]
Furthermore, the earphones 51 and the speaker device 51P have a sufficiently small volume in
the space Vf (VPf) and the space Vr (VPr) on the back side of each of the two speaker units, and
as a vent having a small flow path cross-sectional area. The through holes Wb (WPb)
communicate with each other.
As a result, even if the speaker units 8F (8PF) and 8R (8PR) are small, the amount of air to be
vibrated can be small, and a push-pull operation is possible. Therefore, even if the earphone unit
51 and the speaker device 51P have a small speaker unit, the reproduction level of bass is high,
and high-quality reproduced sound with little distortion can be obtained.
[0042]
Further, the area of the through hole Wb (WPb), that is, the flow passage cross-sectional area
SWb (SWPb) of the gas passing through the through hole Wb (WPb), is the area SWa of the
partition wall Wa (WaP) including the through hole Wb (WPb). It is set sufficiently smaller than
(SWPa). For example, in the case of using a small speaker unit having an outer diameter of 10
mm or less, by providing the partition wall Wa (WaP), the reproduction level of the bass region
becomes high and the sound quality is improved. Further, as the value α of SWb (SWPb) / SWa
(SWPa) is decreased, the reproduction level in the middle low tone range is increased, and the
sound quality is improved. As described above, it is preferable to set α to 0.1 or less (10% or
less), and it is more preferable to set α to 0.02 or less to improve the sound quality of the
midrange.
[0043]
The embodiment of the present invention is not limited to the above-described configuration, and
may be modified within the scope of the present invention.
[0044]
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FIG. 5 is a view for explaining an earphone 52A which is a modified example 1 of the earphone
51. As shown in FIG.
The earphone 52A has a housing body H2 instead of the housing body H of the earphone 51.
The housing body H2 differs from the housing body H in having a through hole H2a in the rear
wall H2r. The through hole H2a communicates the space V4 with the external space. This
structure can also be used for the speaker device 51P. As a result, the load on the speaker unit
8R is reduced and the operation efficiency is increased. Therefore, the modification 1 is suitable
when the speaker unit 8R is smaller. In addition, since the filter can be inserted into the through
hole H2a, the sound quality adjustment according to the type of the filter can be facilitated.
[0045]
FIG. 6 is a view for explaining an earphone 52B which is a modification 2 of the earphone 51. As
shown in FIG. The earphone 52 </ b> B is provided with a pipe 11 communicating the space V
<b> 4 and the space V <b> 1 with respect to the earphone 51. This structure can also be used for
the speaker device 51P. Similar to the first modification, the second modification is also an aspect
in which the load on the speaker unit 8R is reduced and the operation efficiency is enhanced, and
in addition, the sound quality adjustment can be facilitated according to the type and shape of
the pipe 11. .
[0046]
So far, the structure having the two speaker units disposed in opposite directions in the frontrear direction has been described, but a plurality of speaker units facing the front or speaker
units facing the rear may be provided.
[0047]
FIG. 7 is a view for explaining an earphone 53 which is a modification 3 of the earphone 51. As
shown in FIG.
The earphone 53 has a plurality of (four) air chambers R31 to R34 partitioned in the front-rear
direction. That is, the housing body H3 has three partition walls H3b to H3d between the front
wall H3a and the rear wall H3e to form four air chambers R31 to R34. A sound cylinder H3a1 to
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which the earpiece EP is mounted is formed on the front wall H3a, and a space V31 in the air
chamber R31 communicates with the external space Vg.
[0048]
Rear opening type speaker units 8F1 and 8F2 are attached to the partition wall H3b in a posture
in which the front of the housing body H3 is a sound emitting direction. Rear opening type
speaker units 8R1 and 8R2 are attached to the partition wall H3d in a posture in which the rear
is a sound emission direction, that is, in the front-rear direction opposite to the speaker units 8F1
and 8F2. In the partition wall H3c, a through hole H3c1 is formed as a vent for communicating
the space V32 with the space V33. A sound cylinder H3a1 is formed on the front wall H3a, and a
space V31 in the air chamber R31 communicates with the external space. The space V32 and the
space V33 are sealed from the outside except that they communicate with each other through
the through holes H3c1. The volume V32t of the space V32 in the air chamber R32 and the
volume V33t of the space V33 in the air chamber R33 are equal. The passage cross-sectional
area of the through hole H3c1 is 0.1% or less of the area of the partition wall H3c including the
passage cross-sectional area of the through hole H3c1.
[0049]
Each of the speaker units 8F1 to 8R2 is wired such that it vibrates as follows with respect to an
external audio signal. The speaker unit 8F1 and the speaker unit 8F2 vibrate in phase. The
speaker unit 8R1 and the speaker unit 8R2 vibrate in phase. The speaker unit 8F1 and the
speaker unit 8F2, and the speaker unit 8R1 and the speaker unit 8R2 vibrate in opposite phase.
Thus, the earphone 53 is configured to include a first speaker unit configured of a set including
the speaker unit 8F1 and a speaker unit 8F2 with respect to an audio signal, and a second set
including the speaker unit 8R1 and the speaker unit 8R2. The four diaphragms in the speaker
unit vibrate in the same direction in the front-rear direction to perform a push-pull operation.
[0050]
The earphone 53 has two sets of two or more speaker units. Each group may be constituted of,
for example, two speaker units, and the total reproduction sound can be improved by using two
speaker units having different characteristics. For example, if one of the speaker units in the set
is excellent in bass range reproduction and the other is excellent in middle range reproduction,
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the reproduction sound as the earphone 53 can be made excellent in the mid low range.
[0051]
FIG. 8 is a view for explaining an earphone 54 of Modification 4 in which the earphone 53 which
is Modification 3 of the earphone 51 is further modified. The earphone 54 has a front housing
body H3F having an air chamber R41 and an air chamber R42 obtained by dividing the housing
body H3 in the earphone 53, and a rear housing body H3R having an air chamber R43 and an air
chamber R44. Furthermore, the earphone 54 connects the through hole 12a corresponding to
the through hole H3c1 so that the front housing body H3F and the rear housing body H3R
communicate the space V42 in the air chamber R42 and the space V43 in the air chamber R43.
It has connected by the ventilation pipe 12 which has. Thereby, the sound quality adjustment
according to the length of the ventilation pipe 12 and the thickness of the through hole 12a
becomes possible.
[0052]
FIG. 9 is a view for explaining an earphone 55 of Modification 5 in which the earphone 53 which
is a modification of the earphone 51 is further modified. The earphone 55 is obtained by
replacing the two speaker units 8R1 and 8R2 in the earphone 53 with one speaker unit 8R3. The
speaker unit 8R3 is a back surface open type, and is disposed such that the sound emitting
surface 8R3a of the speaker unit 8R3 is in a posture facing rearward. This replacement may be
performed on the speaker units 8F1 and 8F2. That is, the number of speaker units arranged so
that the sound emitting surface faces forward and the number of the speaker units arranged so
that the sound emitting surface faces backward do not have to match, and the number of each is
also limited. I will not. As a result, it is possible to output reproduction sound that makes use of
the characteristics of the adopted speaker unit.
[0053]
FIG. 10 is a view for explaining an earphone 56 of the modified example 6 in which the earphone
51 is further modified, and corresponds to FIG. As shown in FIG. 10, the earphone 56 comprises
a front housing 7F and a rear housing 7R, and a front main body 2, a body 3 and a rear main
body 4 which are members in contact with either of the earphones 51. Between the front
housing 7F and the rear housing 7R, the damping member 13 is interposed. As a result, the
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resonance between the front housing 7F and the rear housing 7R can be prevented, and
reproduced sound with less distortion can be output.
[0054]
The audio output device is not limited to an earphone or a speaker device, and may be a device
having a speaker unit and outputting audio based on the input electric signal.
[0055]
Further, it is desirable that the audio output device be a dynamic type audio output device.
[0056]
In addition, the two speaker units 8F and 8R (8PF and 8PR) may be disposed inside the housing
body H (enclosure HP) in such a direction that the respective back surfaces do not face each
other.
The same applies to each variation.
As described above, since the orientation of the speaker unit is free (normal back and forth), the
degree of freedom in designing the housing body and the enclosure is high.
[0057]
DESCRIPTION OF SYMBOLS 1 body part 2 front body part, 2a sound cylinder part 3 body part,
3a front and rear housing accommodation hole 4 back body part 5 bushing 6 code, 6f, 6r lead 7F
front housing 7R rear housing 7Fa, 7Ra bottom wall, 7Fb, 7Rb penetration Hole 7Fc, 7Rc Step,
7Fd, 7Rd Hole 8F, 8R, 8PF, 8PR Speaker unit 8Fa, 8Ra Sound emitting surface 8Fb, 8Rb, 8PFb,
8PRb Diaphragm, 8Fc Case 8Fd substrate, 8Fe, 8Re pad, 8Ff Isolator 8Ff1 , 8Fg, 8Rg vent 51,
52A, 52B, 53-56 earphones, 51P speaker device CL1, CL8f, CL8r axis EP earpiece, H housing
body, HP enclosure HPf front wall, HPf1 sound emission hole, HPr rear wall R1 R4, Rf, Rr, RP1 to
R 3, R31~34, R41~R44 air chamber Vf, Vr, V1, V4, Vf, Vr, VPf, VPr, VP4 space Vg external space
Wa, WaP, WcP partition wall Wb, WBP through hole, WCP1 sound emission hole
16-04-2019
16
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