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DESCRIPTION JP2000244996

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DESCRIPTION JP2000244996
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
mounting structure of a conductive damper for supporting a voice coil of a speaker and
supplying power to the voice coil. Relates to the mounting structure of the conductive damper to
be used.
[0002]
2. Description of the Related Art The voice coil of a speaker is supported by a damper which is
concentrically corrugated. A conductive damper for feeding power to a voice coil by a tinsel wire
attached to the damper has been conventionally used. An example of a conventional mounting
structure of a conductive damper for a speaker is shown in FIG. The tinsel cord 3 is attached to
the damper base material 2 shown in the figure.
[0003]
The conductive damper thus configured is supported by the frame at its periphery and supports
the voice coil at its inner periphery. The voice coil is externally connected by the tinsel wire 3 of
the conductive damper. The tinsel wire 3 is crimped by a lug 4 attached to a terminal plate 1
supported by the frame. The lug 4 and the tinsel wire 3 are soldered, and the lug 4 connects the
tinsel wire 3 to the outside.
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1
[0004]
As shown in FIG. 8, when the tinsel wire 3 and the lug 4 are in close contact with each other, the
solder 7 can be put in complete contact with the tinsel wire 3 and the lug 4, and a good
conduction state is obtained. Soldering is possible. However, even if the lugs are strongly
crimped, a gap 8 is generated between the tinsel cord 3 and the lugs 4 as shown in FIG.
[0005]
If soldering is performed in this state, as shown in FIG. 9 (b), the solder 7 hangs down, so that socalled solder is formed between the tinsel wire 3 and there is a possibility that conduction failure
occurs. Furthermore, even when the unit is completed, even if it is in conduction, there is a
possibility that the conduction will fail due to vibration of the car.
[0006]
SUMMARY OF THE INVENTION The present invention has been made in view of the abovedescribed point, and the object of the present invention is to provide a conductive damper in
which the lug and the tinsel wire come in close contact with each other when the lug is crimped.
Providing a mounting structure for the
[0007]
According to the mounting structure of the conductive damper of the present invention, the
tinsel wire is connected to the speaker input wire in a mounting structure of the conductive
damper in which a tinsel wire is attached to a damper base and power is supplied to a voice coil.
The tinsel wire is pressed against the lug by the elastic force of the conductive damper.
[0008]
DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting structure of a conductive
damper which is an embodiment of the present invention will be described based on the
drawings.
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2
FIG. 1 is a sectional view showing a portion of the mounting structure of the conductive damper
according to the first embodiment, and FIG. 1 (a) shows a state before the lugs are crimped, and
FIG. 1 (b) is a lug Show the condition after the
[0009]
As shown in FIG. 1A, in the natural state, the damper base 2 and the tinsel cord 3 are formed in a
trapezoidal shape so as to be raised apart from the terminal board 1 partially.
As shown in FIG. 1 (b), the raised portions of the damper base material 2 and the tinsel wire 3 are
suppressed by the lugs 4 and displaced below the natural state.
[0010]
Thus, since it is displaced from the natural state, the tinsel wire 3 is brought into pressure
contact with the lug 4 by elasticity. Even if the lug 4 is spring-backed, if the position is lower than
the position of the tinsel cord 3 in the natural state, the pressure contact state is secured. Since
the tinsel wire 3 is in pressure contact with the lug 4, the tinsel wire 3 and the lug 4 do not have
conduction defects. Also, even if soldered, it will not become solder as described in FIG.
[0011]
FIG. 3 is a cross-sectional view showing a mounting structure of a conductive damper according
to a second embodiment of the present invention. In this example, a mountain 3 a is provided on
the pasting surface 2 a of the damper base 2 to the frame 5. The reason for providing the
mountain 3a will be described with reference to FIG. In the production line of the speaker, the
attachment of the damper base 2 to the frame 5 and the caulking of the lug 4 to the terminal
plate 1 are performed in the following steps. Adhesive applied to the speaker frame 5 The
damper base 2 is placed on the speaker frame 5. ラグをかしめる。 These steps are performed in
about 30 seconds in the order of.
[0012]
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3
The adhesive takes at least 30 minutes to harden so that it does not move with the rubber
system. For this reason, the process for caulking the lug 4 is usually performed without the frame
5 and the damper base 2 being completely fixed. In the caulking of the lug 4, a force in the A
direction (radial direction of the speaker) in FIG. 2 is applied, and there is a possibility that a
deviation in the A direction may occur in the bonding surface 2 a.
[0013]
When the damper base 2 is displaced in the A direction, the position of the voice coil 6 is
displaced, the gap with the magnetic circuit becomes nonuniform, and there is a possibility that
abnormal noise may occur due to rubbing. If the peaks 3a are provided on the pasting surface 2a
as in the second embodiment, the displacement in the radial direction of the damper base
material 2 is absorbed by the peaks 3a and the positional displacement of the voice coil 6
disappears.
[0014]
FIG. 4 shows a portion of a mounting structure of a conductive damper according to a third
embodiment of the present invention. In this example, the joined body of the damper base
material 2 and the tinsel wire 3 is bent in a Z shape and is sandwiched between the crimped lug
4 and the terminal plate 1 so as to be elastically deformed. Also with such a configuration, the
tinsel cord 3 is resiliently pressed against the lug.
[0015]
FIG. 5 shows a portion of a mounting structure of a conductive damper according to a fourth
embodiment of the present invention. In this example, the joined body of the damper base
material 2 and the tinsel wire 3 is formed in an arc shape so that the central portion is separated
from the terminal plate 1. Then, it is sandwiched between the crimped lug 4 and the terminal
plate 1 so as to be elastically deformed. Also with such a configuration, the tinsel cord 3 is
resiliently pressed against the lug. Further, since the damper base material 2 and the frame 5 are
separated at the portion bonded to the tinsel wire 3, even when a part of the tinsel wire 3 is
inserted through the damper base material 2, short circuit is prevented.
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[0016]
According to the mounting structure of the conductive damper of the present invention, since the
tinsel wire is pressed against the lug by elasticity, even if the lug is spring-backed by caulking the
lug, the tinsel wire and the lug are reliably made. The possibility of contact failure and
conduction failure is reduced, and the reliability is improved.
[0017]
Since there is no gap when soldering the lug and the tinsel wire, the workability is improved and
the solder disappears.
In addition, since it is not necessary to fill the gap with solder, the amount of solder used can be
saved. Moreover, since the conventional process can be used as it is, there is also an effect that
the cost accompanying the design change is low.
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