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DESCRIPTION JP2006303829

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DESCRIPTION JP2006303829
PROBLEM TO BE SOLVED: To make a product thick with a height of a solder fillet of lead wire
soldering being a neck. SOLUTION: A yoke 2 is insert-molded in a case 1, and a magnet and a top
plate are laminated / joined on the upper surface of the yoke 2 to constitute a magnetic circuit.
The voice coil is located in the magnetic gap formed between the inner periphery of the side wall
of the yoke 2 and the outer periphery of the top plate. An electrodynamic speaker in which the
outer periphery of the diaphragm is fixed on the upper surface of the case 1, the voice coil is held
on the lower surface, and the protector 7 having a plurality of sound emitting holes covering the
diaphragm is fixed on the upper part of the case 1 The double-sided board 8 is fixed to the lower
surface of the connector 1. The connecting terminal pattern 9 is disposed on the outer surface of
the outer periphery of the speaker on the protector 7 side of the outer periphery of the speaker.
Do. The solder fillet can be suppressed within the thickness of the speaker, making it possible to
make the speaker thinner. [Selected figure] Figure 1
Electrodynamic speaker
[0001]
The present invention relates to an electrodynamic speaker that is incorporated in a mobile
communication device such as a mobile phone and used to acoustically notify a user of an
incoming call.
[0002]
2. Description of the Related Art Conventionally, speakers for voice output of various information
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are provided in various electronic devices such as personal computers and mobile phones.
Recently, with the miniaturization of these electronic devices, it is necessary to miniaturize and
increase the efficiency of the speakers attached to the electronic devices. Such an electrodynamic
speaker has been proposed. (See, for example, Patent Document 1) JP-A-2002-152882 (Page 2,
FIG. 9)
[0003]
In the structure of the electrodynamic speaker disclosed in Patent Document 1 described above,
as shown in FIGS. 5 and 6, a yoke 22 made of a magnetic material and having a wedge shape
made of a magnetic material is insert-molded in a plastic case 21. A magnet 23 is fixed to the
upper surface of the yoke 22, and a top plate 24 made of a magnetic material is joined to the
upper surface of the magnet 23. Thus, a magnetic circuit is formed, and a magnetic gap is
generated between the inner peripheral portion of the side wall of the yoke 22 and the outer
peripheral portion of the top plate 24.
[0004]
The outer periphery of the diaphragm 26 is fixed to the upper portion of the case 21, and the
voice coil 25 is fixed to the lower surface of the diaphragm 26. The voice coil 25 is located in the
magnetic circuit formed by the top plate 24 and the yoke 22. A protector 27 such as a light metal
is fixed to the upper portion of the case 21 so as to cover the diaphragm 26. The case 21 and the
protector 27 are respectively provided with a plurality of sound release holes.
[0005]
The two winding terminals 29 of the voice coil 25 are bonded along the lower surface of the
diaphragm 26 and attached to the outside of the case 21 and pulled out to the outside of the case
21. Is leading to A substrate 28 made of glass epoxy resin or the like is adhered to the lower
surface of the case 21, and two connection terminal patterns 30 are provided on the substrate
28, as shown in FIG. It is connected by solder 31. The connection terminal pattern 30 has a
branched shape, and the winding terminal 29 is soldered to one branch 30a, and a lead wire (not
shown) for connecting the speaker to a device is soldered to the other branch 30b.
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[0006]
7 and 8 show a state in which the lead wire 32 is connected to the connection terminal pattern
30 with the solder 33, and two connection terminal patterns 30 are provided, and one pattern of
the connection terminal pattern 30 is provided. A winding terminal (not shown) is soldered to
30a, and a lead wire 32 for connecting the speaker to a device is connected to the other pattern
30b with a solder 33.
[0007]
In the operation of such an electrodynamic speaker, when a signal current is allowed to flow
through the voice coil, the voice coil and the diaphragm integrated therewith are vibrated by the
electromagnetic action of the current and the magnetic flux generated in the magnetic gap.
Generate sound.
[0008]
The problem to be solved is that, in the structure of the electrodynamic speaker disclosed in the
above-mentioned Patent Document 1, when the lead wire is soldered to the connection terminal
pattern, the height of the solder fillet and the lead wire protection portion becomes a neck , The
thickness of the product becomes thicker.
As shown in FIG. 7, the height of the solder 33 protrudes from the lower surface of the yoke 22,
and the solder fillet can not be suppressed within the thickness of the speaker.
It is difficult to make products thinner. There was a problem.
[0009]
The present invention solves the above-mentioned drawbacks, and its object is to arrange the
connection terminal pattern surface on the surface on the protector side, thereby utilizing the
space up to the thickness of the speaker to obtain the solder fillet and the lead wire. It is an
object of the present invention to provide an electrodynamic speaker in which the interference
with the height of the protective portion is eliminated, the solder fillet is suppressed within the
thickness of the speaker, and the product can be thinned.
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[0010]
In order to achieve the above object, in the electrodynamic speaker according to the present
invention, a plastic case made of a magnetic material and a wedge-shaped yoke made of a
magnetic material is insert-molded, and a magnet fixed on the upper surface of the yoke; And a
voice coil located in a magnetic gap formed between an inner peripheral portion of a side wall of
the yoke of the magnetic circuit and an outer peripheral portion of the top plate. And an outer
periphery of a diaphragm fixed to the upper surface of the case, a voice coil held on the lower
surface of the diaphragm, and a protector having a plurality of sound emitting holes covering the
diaphragm on the upper portion of the case. In the speaker, a double-sided substrate made of
glass epoxy resin or the like is fixed to the lower surface of the case, and the side of the protector
on the outer side of the outer periphery of the speaker is on the substrate. Connected to the
surface terminal pattern is disposed, is characterized in that the soldered lead wires to the
connection terminal pattern.
[0011]
Further, the frame of the case in the vicinity of the substrate on which the connection terminal
pattern is disposed is extended, and a groove is disposed in the extended portion, and the lead
wire is fixed to the groove.
[0012]
The electrodynamic speaker according to the present invention can provide an electrodynamic
speaker capable of suppressing a solder fillet within the thickness of the speaker and making the
product thinner.
[0013]
An electrodynamic speaker of the present invention will be described based on the drawings.
[0014]
1 and 2 relate to Example 1 of the present invention, and FIG. 1 is a cross-sectional view of an
essential part of an electrodynamic speaker, and FIG. 2 is a plan view of FIG.
In FIGS. 1 and 2, as in the prior art, a yoke 2 in the shape of a wedge made of a magnetic material
is insert-molded in a plastic case 1 and a top plate made of a magnet and a magnetic material not
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shown on the upper surface of the yoke 2 Are joined to form a magnetic circuit.
A magnetic gap is generated between the inner periphery of the side wall of the yoke 2 and the
outer periphery of the top plate.
[0015]
The outer periphery of the diaphragm is fixed to the upper portion of the case 1 as in the prior
art, and the voice coil is fixed to the lower surface of the diaphragm.
The voice coil is located in the magnetic circuit formed by the top plate and the yoke 2.
A protector 7 such as a light metal is fixed to the upper portion of the case 1 so as to cover the
diaphragm.
The case 1 and the protector 7 are respectively provided with a plurality of sound emission
holes.
[0016]
On the lower surface of the case 1, a double-sided substrate 8 made of glass epoxy resin or the
like is caulked and fixed at a caulking portion 8a. A part of the substrate 8 is exposed to the
outside of the case 1. Two connection terminal patterns 9 are provided on the surface of the
substrate 8 on the side of the protector 7, and the connection terminal pattern 9 has a winding
end (not shown) at one end 9a and the other end 9b. The lead wire 10 connecting the speaker to
the device is soldered with a solder 11.
[0017]
The operation and effects of the electrodynamic speaker having the above-described
configuration will be described. In the electrodynamic speaker of the present invention, the
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connection terminal pattern 9 is disposed on the protector 7 side of the outer periphery of the
speaker, and the lead wire 10 is soldered with the solder 11 to suppress the solder fillet within
the thickness of the speaker It will be possible to make the speaker thinner.
[0018]
3 and 4 relate to Example 2 of the present invention, and FIG. 3 is a cross-sectional view of a
main part of an electrodynamic speaker, and FIG. 4 is a plan view of FIG. 3 and 4, the difference
from the above-described first embodiment is that the frame 1 a of the case 1 in the vicinity of
the substrate 8 on which the connection terminal pattern 9 is disposed is extended, and the
groove 1 b is disposed in the extension. , Fixing the lead wire 10 to the groove 1b. The
connection terminal pattern 9 is soldered at one end 9 a with a winding terminal (not shown),
and at the other end 9 b with a solder 11, a lead wire 10 connecting the speaker to a device.
[0019]
The operation and effects of the electrodynamic speaker having the above-described
configuration will be described. As in the first embodiment described above, the connection
terminal pattern 9 is disposed on the protector 7 side of the outer periphery of the speaker, and
the lead wire 10 is soldered with the solder 11 to suppress the solder fillet within the thickness
of the speaker. At the same time, the lead wire 11 can be further fixed to the groove 1 a formed
in the case 1 to prevent the lead wire 11 from being broken.
[0020]
As described above, by arranging the connection terminal pattern on the protector side of the
outer periphery of the speaker and soldering the lead wires, it becomes possible to suppress the
solder fillet within the thickness of the speaker, and the speaker can be made thinner It is
possible. Moreover, it is also possible to prevent the disconnection of the lead wire.
[0021]
It is principal part sectional drawing of the electrodynamic-type speaker concerning Example 1 of
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this invention. It is a top view of FIG. It is principal part sectional drawing of the electrodynamictype speaker concerning Example 2 of this invention. It is a top view of FIG. It is sectional
drawing of the conventional electrodynamic-type speaker. It is a bottom view of FIG. It is
sectional drawing of the other conventional electrodynamic-type speaker. It is a bottom view of
FIG.
[0022]
1 Case 1b Groove 2 Yoke 7 Protector 8 Substrate 9 Connection Terminal Pattern 10 Lead Wire
11 Solder
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