close

Вход

Забыли?

вход по аккаунту

?

DESCRIPTION JP2007325048

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2007325048
An object of the present invention is to reduce the thickness of a device without losing frequency
characteristics. A speaker back is provided with a groove 16 extending from an opening portion
of a back sound hole 15 to an end of the back of the speaker and attachment is performed so as
to cover the back of the speaker with the contents of an equipment casing such as a circuit board
19 or the like. The sound path 20 for escaping from the side of the speaker the sound that can
not escape from the back sound hole 15 from the back sound hole 15 with the circuit board 19
or the like covering the back of the speaker by the groove 16 is formed. The frequency
characteristics substantially the same as in the case where the attachment is not covered by etc.
are obtained. [Selected figure] Figure 1
スピーカ
[0001]
The present invention relates to a speaker used for a mobile phone or the like.
[0002]
In this type of speaker, a frame provided with terminals for connection to the outside holds a
magnetic circuit consisting of a yoke, a magnet, and a pole piece at the central portion, and an
outer edge portion of the diaphragm and a baffle covering the outer edge portion. A voice coil
which is held and fixed to the central portion of the diaphragm in the magnetic gap of the
magnetic circuit is inserted.
12-04-2019
1
When a sound signal or an alternating current is supplied to the voice coil from the outside
through the terminal, the voice coil vibrates, and the diaphragm vibrates accordingly to emit a
sound. At this time, sound is emitted from the front sound hole provided in the baffle front side
of the diaphragm to the front side of the speaker, but the frame on the back side of the
diaphragm does not interfere with the vibration of the diaphragm. A back sound hole is provided,
and sound (air) is allowed to escape from the back sound hole to the back side of the speaker.
[0003]
In the case of a mobile phone, for example, the speaker configured as described above is
connected to a circuit board whose front sound hole faces the sound hole provided in the case
and whose terminals are built in the case. It is attached in a fixed state, and is used as a receiver
for outputting a receiving sound, and a speaker for outputting a CD music and a broadcast sound
of a radio and a television in addition to a ringing tone and a ringing tone.
[0004]
In the above-mentioned speaker, when mounting is performed so as to cover the back of the
speaker with a circuit board, the acoustic resistance value on the back of the speaker becomes
larger than when it is not attached, and the reproduction of the bass region is impaired. It is
considered not to cover the circuit board.
[0005]
Conventionally, as is known, for example, in Patent Document 1, a plate-like leg is protruded
from the frame to the back side of the speaker, and a gap between the speaker back side and the
circuit board is often used.
JP 2005-260561 A
[0006]
However, the conventional speaker that secures a gap with the circuit board on the rear side of
the speaker can not cope with thinning of the device casing.
12-04-2019
2
Therefore, the circuit board is divided or a hole is made in the circuit board so as not to block the
back sound hole, and the gap with the circuit board on the back side of the speaker is eliminated
to thin the device housing without damaging the frequency characteristics. Although it is possible
to cope with this problem, both do not significantly reduce the degree of freedom in the design of
the device side, and in the case of the former, it causes an increase in the number of assembly
steps and an increase in the manufacturing cost of the device as the number of parts increases. It
is difficult to adopt.
[0007]
Therefore, the problem to be solved by the present invention is that the conventional speaker can
not realize thinning of the device casing without deteriorating the frequency characteristics.
[0008]
The present invention for solving the above problems is characterized in that the rear side of the
diaphragm is provided with a terminal for connection to the outside and holds a vibration system
comprising a diaphragm and a voice coil and a magnetic circuit for driving the vibration system.
A speaker provided with a back sound hole in the frame, and a groove extending from the
opening portion of the back sound hole to an end of the frame surface is provided on the frame
surface on the back side of the speaker.
[0009]
In the present invention, it is desirable that the grooves extend in two directions from the back
sound hole opening to reach two different ends of the frame surface.
[0010]
According to the present invention, even if attachment is performed to cover the back of the
speaker with the contents of the device casing such as a circuit board, the groove provided on
the frame surface on the back of the speaker is the back A sound path is formed that allows the
sound that can not escape from the sound hole to the rear side of the speaker to escape from the
side of the speaker, so the frequency characteristics substantially the same as when the speaker
rear is not covered with a circuit board etc. You can get it.
Therefore, thinning of the device housing can be realized without losing the frequency
12-04-2019
3
characteristics.
Moreover, it can be used to mount various speakers on the device side, and the degree of
freedom in designing the device side is not lost,
[0011]
Also, even if the groove is extended in two directions from the back sound hole opening portion
and reaches two different ends of the frame surface, even if attachment is performed such that
one sound path will not function. Since the other sound path can be made to function to allow the
sound to escape from the back sound hole to the side of the speaker, the above-mentioned effects
can be promoted and made reliable.
This is effective in the case of a speaker which is disposed at an end inside the device housing
and the housing side wall is often close to one side of the speaker.
[0012]
Hereinafter, embodiments of the present invention will be described in detail based on the
drawings. FIG. 1 is a cross-sectional view showing a speaker structure according to an
embodiment of the present invention, and FIG. 2 is an external perspective view of the entire
speaker.
[0013]
In the figure, reference numeral 1 denotes a frame made of insulating resin whose outer shape is
formed in a substantially rectangular parallelepiped shape, and the upper surface (upper surface)
of the substantially flat frame 1 on the front side of the speaker (right side in FIG. 1 and FIG. 2). A
wall 1a is erected from the outer edge excluding the left and right two corners, and an oval
diaphragm accommodating portion 1b surrounded by the wall 1a is formed, and the bottom
(upper surface of frame 1) center of the diaphragm accommodating portion 1b. A circular
magnetic circuit housing portion 1c is formed in the central portion of the lower surface (lower
surface) of the substantially flat frame 1 on the rear side of the speaker (FIG. 1, left side in FIG.
2).
12-04-2019
4
[0014]
The frame 1 is integrally provided with two conductive metal terminals 2 for connection to the
outside and a disk-shaped yoke 3 made of a magnetic material constituting a magnetic circuit 7
described later by insert molding. ing.
[0015]
The two terminals 2 are embedded in the left and right ends of the frame 1 (the lower and upper
sides in FIG. 1 and FIG. 2 of the drawing) and one end of each terminal 2 is a frame in which the
wall 1a around the diaphragm accommodating portion 1b does not rise The other end of each
terminal 2 is exposed substantially flush with the left and right end portions of the lower surface
of the frame 1 (speaker rear surface).
[0016]
The yoke 3 is embedded in the central lower portion of the frame 1 so as to close the opening on
the lower surface side of the frame 1 of the magnetic circuit housing portion 1c, and the outer
surface of the yoke 3 is exposed substantially flush with the central portion of the lower surface
of the frame 1.
A cylindrical center pole 4 is integrally formed on the yoke 3.
The center pole 4 is integrally raised from the central portion of the inner surface of the yoke 3
facing the magnetic circuit housing portion 1c, and is raised from below to the central portion of
the magnetic circuit housing portion 1c.
[0017]
It is inserted from above into the yoke 3, the center pole 4, and the magnetic circuit housing
portion 1 c and is stacked and fixed on the outer edge portion of the inner surface of the yoke 3
and arranged with a gap around the center pole 4. A vibration system is made of a doughnutshaped magnet 5 and a ring-shaped pole piece 6 made of a magnetic material which is stacked
on and fixed to the magnet 5 and provided with a gap around the upper end of the center pole 4.
A magnetic circuit 7 for driving is configured.
12-04-2019
5
The magnetic circuit 7 forms a circular magnetic gap 8 between the top end of the center pole 4
and the pole piece 6. Moreover, it is an external magnet type which arrange | positions the
magnet 5 in the outer side of the magnetic gap 8. FIG.
[0018]
As described above, the frame 1 is provided with the terminals 2 for connecting to the outside at
the left and right end portions, and the magnetic circuit accommodating portion 1 c at the central
portion holds the magnetic circuit 7.
[0019]
In the figure, 9 is an oval diaphragm made of a resin film or metal film, 10 is a cylindrical voice
coil 10 formed by spirally winding a conducting wire, and the voice coil 10 is disposed at the
center of the lower surface of the diaphragm 9. The vibration system 11 driven by the magnetic
circuit 7 is configured by vertically fixing and integrating one end.
[0020]
A frame member 9 a is attached to the outer edge portion of the diaphragm 9 which is the upper
outer edge portion of the vibration system 11 from the lower surface side.
The vibration system 11 is inserted from above into the diaphragm accommodating portion 1b,
the outer edge of the diaphragm 9 is supported from below by the bottom outer edge of the
diaphragm accommodating portion 1b via the frame member 9a, and the diaphragm 9 is the
diaphragm A voice coil 10 which is held in a state of being separated upward from the bottom
surface in the housing portion 1 b and suspended from the center of the lower surface of the
diaphragm 9 is inserted from above into the magnetic gap 8 of the magnetic circuit 7.
[0021]
As described above, the frame 1 holds the vibration system 11 including the diaphragm 9 and
the voice coil 10 by the diaphragm accommodating portion 1 b on the upper surface.
[0022]
12-04-2019
6
The two voice coil lead wires (not shown) drawn from the voice coil 10 are the left and right
sides of the upper surface of the frame 1 where the wall 1a around the diaphragm housing
portion 1b does not rise from between the bottom surface of the diaphragm housing portion 1b
and the frame member 12. It is fixed and connected by soldering to the terminal 2 which is
drawn out to two corners and exposed substantially flush at each of the corners.
[0023]
Further, in the figure, reference numeral 12 denotes an oblong baffle made of a flat metal plate,
and an edge wall 12a is raised from the outer edge portion to the lower surface side of the baffle
12.
The baffle 12 is inserted from above into the diaphragm accommodating portion 1b after the
vibration system 11 is attached, and the edge wall 12a sandwiches the outer periphery of the
diaphragm 9 with the bottom outer periphery of the diaphragm accommodating portion 1b. 9 is
supported from below at the bottom outer edge of the diaphragm housing portion 1b via the
outer rim portion, held at a top end of the diaphragm housing portion 1b at a distance from the
lower diaphragm 9 at the upper end, the diaphragm housing portion The open top surface 1b is
closed to cover and protect the diaphragm 9 from above.
[0024]
As described above, the frame 1 holds the baffle 12 which covers the diaphragm 9 from above by
the diaphragm accommodating portion 1 b on the upper surface.
[0025]
The outer edge of the diaphragm 9 and the outer edge of the baffle 12 are integrally fixed to the
frame 1 by an adhesive or the like.
[0026]
Then, the upper end surface of the wall 1a around the diaphragm accommodating portion 1b on
the upper surface of the frame 1 and the outer surface of the baffle 12 substantially flush with
the upper end surface of the wall 1a constitute a substantially rectangular flat front of the
speaker The baffle 9 on the front side of the plate 9 is provided with a plurality of front sound
12-04-2019
7
holes 13 which are small holes penetrating from the inner surface to the outer surface of the
baffle 9 and which emits sound on the front side of the speaker.
The plurality of front sound holes 13 are provided in a concentrated manner at a central portion
of the baffle 9 opposed to the central portion of the diaphragm 9.
A compensating cloth 14 having sound permeability is attached to the front of the speaker
having the plurality of front sound holes 13.
The compensation cloth 14 covers the front sound hole 13 from the top and suppresses the
excessive vibration of the diaphragm 9 and the excessive sound leakage to improve the acoustic
performance, and the inside of the speaker from the front sound hole 13. Demonstrates a
dustproof function to prevent the entry of foreign matter such as dust.
[0027]
Further, the lower surface of the frame 1 in which the other ends of the two terminals 2 are
exposed substantially flush to the left and right end portions and the outer surface of the yoke 3
is exposed substantially flush to the central portion In the frame 1 on the back side of the
diaphragm 9, there is a small hole that penetrates from the upper surface (inner surface) to the
lower surface (outer surface) of the frame 1, and a back sound hole 15 that allows sound to
escape to the speaker It is provided.
The rear sound holes 15 are provided at two places between the yoke 3 (magnetic circuit 7) at
the center of the frame 1 and the terminals 2 at the left and right ends of the frame 1.
[0028]
Further, the lower surface of the frame 1 is provided with a groove 16 extending vertically from
the opening of the rear sound holes 15 on the lower surface of the frame 1 with respect to the
speaker axis to reach the end of the lower surface of the frame 1. The groove 16 is extended
straight from the opening of each rear sound hole 15 on the lower surface of the frame 1 to the
front of the speaker to form a front end of the lower surface of the frame 1 (a substantially
12-04-2019
8
rectangular flat side surface of the speaker The rear end of the lower surface of the frame 1 is
extended straight from the opening of each rear sound hole 15 on the lower surface of the frame
1 to the rear of the speaker 1 One is provided to reach the rear side of the frame 1 that
constitutes the side lateral side.
[0029]
The shape of the groove 16 can be appropriately selected, such as a U-shape, a U-shape, or a Vshape.
[0030]
As described above, the groove 16 extending from the opening of the rear sound hole 15 to the
end of the lower surface of the frame 1 is provided on the lower surface of the frame 1 on the
speaker rear side, and this groove 16 extends in two directions from the opening of the rear
sound hole 15 And reaches two different ends of the lower surface of the frame 1.
[0031]
The lower surface of the frame 1 is provided with a recess 17 around the opening of each rear
sound hole 15 on the lower surface of the frame 1 with a shape slightly larger than the hole
shape of the rear sound hole 15 and approximately the same depth as the groove 16. The two
grooves 16 are continuously extended from the recess 17.
A sound absorbing compensation cloth 18 is attached to the bottom of the recess 17.
The compensation cloth 18 covers the back sound hole 15 opened at the central portion of the
bottom of the recess 17, and has a braking function for improving the acoustic performance by
suppressing excessive vibration and excessive sound leakage of the diaphragm 9, and It exerts a
dustproof function to prevent the entry of foreign matter such as dust and the like from the
sound hole 15 into the inside of the speaker.
[0032]
As shown in FIG. 2, the speaker configured as described above is surface mounted on a circuit
12-04-2019
9
board 19 such as a PCB or FPC incorporated in the housing of a mobile phone (an example of a
device to which the speaker is attached). The front sound hole 13 on the front of the speaker
faces the sound hole provided in the housing, and the two terminals 2 on the lower surface of the
frame 1 (hereinafter referred to as “speaker rear”) are fixed to the wiring pattern of the circuit
board 19 It is attached in a connected state, and is used as a receiver for outputting a receiving
sound, and a speaker for outputting a CD music, a radio sound of a radio or a television in
addition to a ringing tone and a ringing tone. When this speaker supplies a voice signal or an
alternating current such as a reception sound or ringing tone or ringing tone, CD music,
broadcast sound of radio or television to the voice coil 10 from the circuit board 19 through the
two terminals 2, The voice coil 12 vibrates, the diaphragm 9 vibrates accordingly, and sound (air)
escapes from the back sound hole 15, and the received sound or ring tone or ringing tone from
the front sound hole 13 to the front of the speaker It emits CD music, broadcast sound of radio
and television, etc., and emits it from the sound hole of the cabinet to the outside.
[0033]
By the way, when the above speaker attachment is performed, the circuit board 19 substantially
adheres to the back of the speaker, and the back of the speaker is covered with the circuit board
19 so that the sound is released from the back sound hole 15 to the back of the speaker.
However, as shown in FIG. 2, each groove 16 provided on the back of the speaker is provided
between the speaker and the circuit board 19, from the back sound hole 15 to the speaker axis
(the magnetic circuit 7 around this axis The sound path 20 extending in a direction
perpendicular to the direction in which the vibration system 11 is configured to reach the side
surface of the speaker (surface on the side surface of the speaker) is formed. The sound that can
not escape from the hole 15 to the rear side of the speaker can be escaped from the side of the
speaker through the sound path 20.
[0034]
Thereby, there is almost no difference in the acoustic resistance value on the back side of the
speaker between when the back of the speaker is covered by the circuit board 19 and when it is
not so, and even when the back of the speaker is covered by the circuit board 19 If not, it is
possible to obtain substantially the same frequency characteristics.
That is, the frequency characteristics are hardly influenced by the conditions on the rear side of
the speaker when the speaker is attached. Therefore, the contents of the device casing such as
the circuit board 19 can be packed without gaps on the back side of the speaker without
deteriorating the frequency characteristics, and the thickness reduction of the device casing can
12-04-2019
10
be realized. Moreover, it can cope with various speakers attached on the device side, and the
degree of freedom in design of the device side is not lost.
[0035]
Moreover, in this type of speaker, it is disposed at the end inside the device housing, and in many
cases the housing side wall approaches to the lateral side of the speaker, and in some cases, it is
almost in close contact. The mounting is performed such that the lateral side is covered with the
side wall of the housing, and it is formed by one groove 16 extending straight from the opening
of each rear sound hole 15 on the rear of the speaker to the rear of the speaker and reaching the
rear end of the rear of the speaker The sound formed by the other groove 16 that extends
straight from the opening of each back sound hole 15 on the back of the speaker to the front of
the speaker and reaches the front end of the back of the speaker even if the sound path 20 By
means of the road 20, a sound which can not escape from the back sound hole 15 to the back
side of the speaker can be released from the front side of the speaker by the circuit board 19
covering the back of the speaker.
[0036]
As mentioned above, although this embodiment showed one embodiment of this invention, this
invention can be variously deformed and implemented within the range which does not deviate
from the summary, without being limited to it.
[0037]
For example, in the present embodiment, an external magnet type is shown as the magnetic
circuit, but an internal magnetic type magnetic circuit can also be used.
An internal-magnet type magnetic circuit arranges a magnet inside the magnetic gap, and a cupshaped yoke made of a magnetic material and the yoke are inserted from above into the yoke,
superimposed and fixed on the inner bottom surface of the yoke, From a columnar magnet
arranged in a state in which a peripheral wall and a gap are provided inside, and a magnetic
material which is stacked and fixed on the magnet and is arranged in a yoke with a clearance
from the upper end of the peripheral wall A circular magnetic gap is formed by the gap between
the upper end of the peripheral wall of the yoke and the pole piece.
[0038]
12-04-2019
11
Further, as shown in FIG. 3, in order to increase the positioning and soldering strength with
respect to the circuit board 19 at the time of mounting the speaker, the pin-like protrusion 2a
may be integrally raised from the terminal 2 on the rear surface of the speaker.
In this case, although the holes 19a for fitting the protrusions 2a into the circuit board 19 are
required, since they are in the electrodes, the degree of freedom in design of the circuit board 19
is not impaired.
[0039]
1 is a cross-sectional view of a loudspeaker structure according to an embodiment of the present
invention. It is an external appearance perspective view of the whole said speaker. It is the whole
appearance perspective view showing the modification structure of the speaker.
Explanation of sign
[0040]
1 frame 2 terminal 7 magnetic circuit 9 diaphragm 10 voice coil 11 vibration system 15 back
sound hole 16 groove 20 sound path
12-04-2019
12
Документ
Категория
Без категории
Просмотров
0
Размер файла
22 Кб
Теги
jp2007325048, description
1/--страниц
Пожаловаться на содержимое документа