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DESCRIPTION JP2008124807

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DESCRIPTION JP2008124807
The present invention provides a speaker device provided with a support having an attachment
structure of a wiring for a speaker device which can be securely attached to a mounting portion
without lowering sensitivity. A speaker device includes a wiring (wiring) for a speaker device, a
magnetic circuit, and a frame (support) for supporting them. The frame has a mounting surface
for mounting the magnetic circuit, and a wire fixing portion for fixing the wire. The wiring fixing
portion is provided on the surface of the frame opposite to the mounting surface. Thus, when the
speaker device is attached to the mounting portion by fitting it into the speaker mounting hole,
the wiring and the wiring fixing portion do not take an extra space at the position of the speaker
mounting hole, and the wiring fixing portion The wiring can be fixed to Therefore, the size in the
radial direction of the magnetic circuit can be made as large as possible, and the sensitivity of the
speaker device can be prevented from decreasing. [Selected figure] Figure 2
Speaker device
[0001]
The present invention relates to a mounting structure of a wiring for a speaker device.
[0002]
In general, the speaker is provided with a speaker terminal electrically connected to the voice
coil, and a speaker device wiring (speaker cable) for electrically connecting the amplifier.
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Usually, this speaker cable is fixed to a frame that supports a magnetic circuit and the like, and is
pulled out from the speaker terminal side (see, for example, Patent Document 1).
[0003]
Patent Document 2 shows the structure of a magnetic circuit for improving the speaker output
sound pressure. Specifically, in this speaker, a groove is provided on the outer periphery on the
magnet side of the plate that constitutes the magnetic circuit. This prevents protrusion of the
adhesive used for adhesively bonding the plate and the magnet to the magnetic gap during
adhesion, eliminates the wrinkles of the plate conventionally used for preventing the adhesive
from protruding, and is restricted by wrinkles. The diameter of the magnet has been expanded,
and the output sound pressure of the speaker has been improved.
[0004]
JP, 2002-142284, A JP, 2003-78991, A
[0005]
The above-mentioned speaker is suitably used for vehicles.
Here, the in-vehicle speaker is attached to the attachment portion in a state of being fitted into a
speaker attachment hole provided in the attachment portion such as a door inner panel or a rear
tray of the vehicle. The size of the speaker mounting hole is determined by the type of vehicle.
For this reason, when using the speaker based on the above-mentioned patent document 1 as
vehicle-mounted, the following subjects may arise.
[0006]
That is, in the speaker cable attachment structure according to Patent Document 1 described
above, the speaker cable is drawn around the side surface of the frame, and is further fixed to the
side surface of the frame or the like by the speaker cable fixing portion. For this reason, the
speaker cable and the speaker cable fixing portion located on the side of the frame take an extra
space at the position of the speaker mounting hole, and depending on the type of vehicle, the
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speaker may be The speaker can not be fitted into the mounting hole, and the speaker can not be
attached to the mounting portion.
[0007]
Therefore, in this case, the overall size of the speaker can be reduced by reducing the size of the
magnetic circuit (the size in the radial direction of the magnetic circuit) of the speaker without
changing the mounting structure of the above speaker cable. For example, it is possible to solve
the problems as described above. In addition, such a subject may arise not only when attaching
to the attachment part of a vehicle but when attaching to attachment parts, such as an electronic
device.
[0008]
However, when such a method is adopted, for example, the Lorentz force (also referred to as
“electromagnetic force”) acting on the voice coil becomes smaller than before reducing the
size of the magnetic circuit, and as a result, the vibration width of the diaphragm is reduced. It
becomes smaller. In other words, a new problem arises in that the sensitivity of the speaker is
reduced by the reduction in size of the magnetic circuit.
[0009]
As problems to be solved by the present invention, the above-mentioned ones can be mentioned
as an example. The present invention provides a support having a mounting structure for a
speaker device wiring that can be reliably attached to a mounting portion of a vehicle or the like
without reducing sensitivity, and a speaker device wiring mounting structure for a speaker device
wiring. It is an object of the present invention to provide a speaker device provided with a
support that can be attached smoothly.
[0010]
The invention according to claim 1 is a speaker device, comprising: a wire; a magnetic circuit; and
a support for supporting the wire and the magnetic circuit, wherein the support is for attaching
the magnetic circuit. A mounting surface, and a wiring fixing portion for fixing the wiring,
wherein the wiring fixing portion is provided on a surface of the support opposite to the
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mounting surface. Do.
[0011]
In one embodiment of the present invention, a speaker device includes a wire, a magnetic circuit,
and a support for supporting the wire and the magnetic circuit, the support being a mounting
surface for mounting the magnetic circuit. And a wire fixing portion for fixing the wire, wherein
the wire fixing portion is provided on the surface of the support opposite to the mounting
surface.
[0012]
The above speaker device comprises a wire, a magnetic circuit, and a support for supporting the
wire and the magnetic circuit.
The wiring is preferably a wiring that electrically connects the voice coil and the amplifier.
The support has a mounting surface for mounting the magnetic circuit and a wire fixing portion
for fixing the wire. In a preferred example, the mounting surface is a surface located in the
acoustic radiation direction, and the opposite surface is a surface located on the opposite side to
the acoustic radiation direction.
[0013]
In this speaker device, in particular, the wiring fixing portion is provided on the surface of the
support opposite to the mounting surface. Accordingly, when the speaker device is attached to
the mounting portion by fitting the speaker device into the speaker mounting hole, the wiring
and the wiring fixing portion do not take an extra space at the position of the speaker mounting
hole. Therefore, the size in the radial direction of the magnetic circuit can be made as large as
possible, and the sensitivity of the speaker device can be prevented from decreasing. Also, the
wiring can be securely fixed to the wiring fixing portion provided on the opposite surface of the
support.
[0014]
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In a preferred example, one end of the wiring is electrically connected to the speaker terminal
provided on the opposite surface, and the other end of the wiring drawn from the speaker
terminal is the opposite surface. It is preferable that it is inserted in the said penetration hole of
the said wiring fixing | fixed part along with, and it is further pulled out outside.
[0015]
In one aspect of the above speaker device, the wire fixing portion has an insertion hole for
inserting the wire, and has a shape protruding in the opposite direction to the acoustic radiation
direction.
In a preferred example, the wiring fixing portion preferably has a concave cross-sectional shape.
With these structures, the mold structure for forming the wiring fixing portion is simplified, and
the number of steps can be reduced. This also makes it possible to increase the strength of the
support.
[0016]
Furthermore, since the wire fixing portion is formed to cover the wire disposed in the insertion
hole, for example, when the wire is fixed by a claw-like wire fixing portion (not shown), an
external force is applied. As a result, although there is a problem that the wiring is detached,
even if an external force acts on the wiring, it can be prevented from being detached from the
wiring fixing portion.
[0017]
In another aspect of the above speaker device, a groove is formed in the mounting surface at a
position surrounding the wire fixing portion.
As a result, when the magnetic circuit is attached to the mounting surface of the support via the
adhesive, the groove prevents the adhesive from partially sticking out to the wiring fixing portion
side, as an adhesive reservoir. Have a role. Therefore, when a part of the adhesive protrudes to
the insertion hole of the wiring fixing portion, it is possible to prevent hindrance to inserting the
wiring into the insertion hole of the wiring fixing portion, and the wiring is inserted into the
wiring fixing portion It can be inserted smoothly into the hole.
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[0018]
In another aspect of the above speaker device, the insertion hole is formed to penetrate from the
wiring fixing portion to the magnetic circuit. Thereby, the mold structure for forming the wiring
fixing portion can be simplified, and further, if such a mold is used, resin molding of the support
having the wiring fixing portion becomes easy.
[0019]
In another aspect of the above speaker device, the support is formed of a resin material. This
facilitates molding of the support including the wiring fixing portion and the groove.
[0020]
Various preferred embodiments of the present invention will be described below with reference
to the drawings.
[0021]
[Configuration of Speaker Device] FIG. 1 shows a rear view of the speaker device 100 according
to the embodiment of the present invention, which is located on the side opposite to the sound
radiation direction Y1.
FIG. 2 shows a cross-sectional view along a cutting line A-A 'passing through the central axis L1
of the speaker device 100 shown in FIG.
[0022]
The speaker device 100 mainly includes an inner magnetic type magnetic circuit 30 having a
yoke 1, a magnet 2 and a plate 3, a voice coil bobbin 4, a voice coil 5, a diaphragm 6 and an edge
7. And a support (hereinafter, also referred to as a "frame") 8 for supporting the magnetic circuit
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30 and the vibrator 31, and other elements. Here, the other elements include the sound
absorbing material 9, the terminal 10 for the speaker device, the spacer 11, the wiring 50 for the
speaker device, and the like.
[0023]
(Configuration of Magnetic Circuit) The configuration of the magnetic circuit 30 is as follows.
[0024]
The yoke 1 has a cylindrical shape with a bottom, and is attached to an attachment surface 8 a of
a frame 8 described later via an adhesive (not shown).
The magnet 2 has a disk shape and is attached to the bottom of the yoke 1. The plate 3 has an
annular shape and is mounted on the magnet 2. Between the outer peripheral surface of the plate
3 and the inner peripheral surface of the upper end portion of the yoke 1, a magnetic gap 32 in
which the magnetic flux of the magnet 2 is concentrated is formed. A sound absorbing material 9
formed of a breathable material is provided on the plate 3.
[0025]
(Frame Configuration) The frame 8 has a shape surrounding the magnetic circuit 30. The frame 8
has a mounting surface 8a for mounting the yoke 1 via an adhesive (not shown). The attachment
surface 8 a is a bottom surface of the frame 8 located in the acoustic radiation direction Y1. The
characteristic configuration of the frame 8 will be described later.
[0026]
(Structure of Vibrator) The vibrator 31 has the diaphragm 6, the edge 7, the voice coil bobbin 4
and the voice coil 5 as its constituent members, and the constituent members are as follows.
[0027]
The voice coil bobbin 4 has a cylindrical shape.
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The lower end of the voice coil bobbin 4 is located in the magnetic gap 32. In the present
invention, in particular, the position of the lower end of the voice coil bobbin 4 does not have to
be in the magnetic gap 32 and may be in the vicinity of the magnet 2.
[0028]
The voice coil 5 is wound around the outer peripheral surface of the lower end portion of the
voice coil bobbin 4 and is located in the magnetic gap 32. The voice coil 5 has a pair of plus /
minus lead wires (not shown). The positive lead wire is an input wiring of an L (or R) channel
signal, and the negative lead wire is an input wiring of a ground (GND: ground) signal. Although
not shown, the pair of positive / negative lead wires are electrically connected to the speaker
device terminals 10 provided on the back surface 8b of the frame 8 located on the opposite side
to the acoustic radiation direction Y1. There is. Further, one end side of the pair of plus / minus
speaker device wires 50 is electrically connected to the speaker device terminal 10, and the other
end side of the pair of plus / minus speaker device wires 50 is It is electrically connected to the
amplifier side (not shown).
[0029]
The diaphragm 6 has a dome shape, and the outer periphery thereof is attached to the upper end
of the voice coil bobbin 4. The edge 7 has a semicircular cross-sectional shape. The inner
peripheral edge of the edge 7 is attached to the outer peripheral surface of the upper end of the
voice coil bobbin 4, and the outer peripheral portion of the edge 7 is attached on an annular
spacer 11 provided on the upper end of the frame 8 .
[0030]
In the speaker device 100 having the above configuration, the audio current output from the
amplifier side is a pair of plus / minus speaker wire 50, a speaker device terminal 10, and a pair
of plus / minus lead wires of the voice coil 5. Are input to the voice coil 5. Thereby, based on
Fleming's left-hand rule, an electromagnetic force (Lorentz force) acts on the voice coil 5 in the
magnetic gap 32, and the diaphragm 6 moves with the voice coil 5 in the acoustic radiation
direction Y1 and the opposite direction. Sound waves are emitted through the diaphragm 6 in the
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acoustic radiation direction Y1.
[0031]
[Mounting Structure of Wiring for Speaker Device] Next, the mounting structure of the wiring 50
for the speaker device will be described with reference to FIGS. 1 to 3.
[0032]
FIG. 3A shows a front view of the frame 8 in FIG. 2 (a diagram for explaining the inside of the
frame).
FIG.3 (b) shows sectional drawing which passes along central-axis L1 of the flame | frame 8
along cutting-plane line B-B 'of Fig.3 (a). FIG.3 (c) shows the principal part sectional view of the
flame | frame 8 along cutting-plane line CC 'of Fig.3 (a).
[0033]
First, the characteristic configuration of the frame 8 is as follows. The basic configuration of the
frame 8 is as described above, and the frame 8 further includes a wire fixing portion 8d for fixing
the pair of plus / minus speaker device wires 50, and a concave groove 8ab. Have.
[0034]
The wiring fixing portion 8 d is provided on the surface 8 b (surface opposite to the sound
radiation direction Y 1) opposite to the mounting surface 8 a in the frame 8. The wiring fixing
portion 8 d is provided so as to project from the surface 8 b on the opposite side to the opposite
side to the acoustic radiation direction Y 1. The wire fixing portion 8d has an insertion hole 8da
for inserting the pair of plus / minus speaker device wires 50, and has a shape protruding in the
opposite direction with respect to the sound radiation direction Y1. In the present example, the
wiring fixing portion 8d has a concave cross-sectional shape. In addition, the insertion hole 8da is
formed to penetrate from the wiring fixing portion 8d to the acoustic radiation direction Y1 side,
in other words, from the wiring fixing portion 8d to the magnetic circuit 30.
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[0035]
The groove 8ab is formed at a position surrounding the wiring fixing portion 8d in the mounting
surface 8a. Although the groove 8ab has a U-shaped planar shape in this example, the present
invention is not limited to this, and the groove 8ab may have an annular planar shape. The
groove 8ab serves as an adhesive reservoir for preventing a part of the adhesive from protruding
to the side of the wiring fixing portion 8d when the yoke 1 is attached to the mounting surface
8a of the frame 8 via the adhesive. Have.
[0036]
Next, the attachment structure of the pair of plus / minus speaker device wires 50 to the wire
fixing portion 8d of the frame 8 is as follows.
[0037]
One end sides of the pair of plus / minus speaker device wires 50 are electrically connected to
the speaker device terminals 10 provided on the opposite surface 8 b of the frame 8 and are
further drawn out from the speaker device terminals 10. The other end sides of the pair of plus /
minus speaker device wires 50 are inserted along the opposite surface 8b of the frame 8 into the
insertion holes 8da of the wire fixing portion 8d and further pulled out to the outside ing.
Thus, the pair of plus / minus speaker device wires 50 is fixed to the wire fixing portion 8 d and
attached to the opposite surface 8 b of the frame 8.
[0038]
Next, characteristic points of the mounting structure of the wiring for a speaker device according
to the present embodiment will be described.
[0039]
The speaker device 100 can be suitably used for on-vehicle use.
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In this case, as schematically shown in FIG. 1 and FIG. 2, the speaker device 100 is inserted into a
speaker mounting hole 40 a provided in an attached portion 40 such as a door inner panel or a
rear tray of a vehicle. It is attached to the attaching part 40. The size d1 of the speaker mounting
hole 40a is determined by the type of vehicle.
[0040]
Therefore, if it is assumed that the wiring fixing portion 8 d is provided on the outer side surface
8 c of the frame 8 (comparative example) in the speaker device 100, the speaker device 100 is
located on the outer side surface 8 c of the frame 8. The pair of plus / minus speaker device
wiring 50 and the wiring fixing portion 8d take an extra space at the position of the speaker
mounting hole 40a, and depending on the type of vehicle, the size d1 of the speaker mounting
hole 40a is restricted. The speaker device 100 can not be fitted into the speaker attachment hole
40 a, and the speaker device 100 can not be attached to the mounting portion 40.
[0041]
Therefore, in this case, if the size of the magnetic circuit 30 (the size in the radial direction of the
magnetic circuit 30) is reduced without changing the mounting structure of the speaker device
wiring, the size of the entire speaker device can be reduced. , It is possible to solve the above
problems.
[0042]
However, when such a method is adopted, for example, the Lorentz force (also referred to as
“electromagnetic force”) acting on the voice coil becomes smaller than before the size of the
magnetic circuit 30 is reduced, and as a result, the vibration width of the diaphragm Becomes
smaller.
In other words, a new problem arises in that the sensitivity of the speaker device is reduced by
the amount by which the magnetic circuit 30 is reduced.
[0043]
In this respect, in the speaker device wiring mounting structure according to the present
embodiment, the wiring fixing portion 8 d for fixing the pair of plus / minus speaker device
wiring 50 is opposite to the mounting surface 8 a in the frame 8. It is provided on the side
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surface (surface located on the opposite side to the acoustic radiation direction Y1) 8b.
[0044]
Therefore, when the speaker device 100 is attached to the mounting portion 40, the pair of plus
/ minus speaker device wiring 50 and the wiring fixing portion 8d take an extra space at the
position of the speaker mounting hole 40a. It disappears.
Therefore, the size in the radial direction of the magnetic circuit 30 can be made as large as
possible as compared with the above-described comparative example, and the sensitivity of the
speaker device 100 can be prevented from decreasing.
In addition, the pair of plus / minus speaker device wires 50 can be reliably fixed to the wire
fixing portion 8 d provided on the surface 8 b on the opposite side of the frame 8.
[0045]
Further, in the present embodiment, the wire fixing portion 8d of the frame 8 has the insertion
hole 8da for inserting the pair of plus / minus speaker device wires 50, and protrudes in the
opposite side to the sound radiation direction Y1. Have the following shape. In the present
example, the wiring fixing portion 8d has a concave cross-sectional shape. As a result, the mold
structure for forming the wiring fixing portion 8d becomes simple, and the number of steps can
be reduced. Also, this makes it possible to increase the strength of the frame 8. Furthermore,
since the wire fixing portion 8d is formed to cover the pair of plus / minus speaker device wires
50 disposed in the insertion hole 8da, for example, the wire fixing portion (not shown) in the
form of a nail is provided. When the speaker device wiring 50 is fixed, there is a problem that the
speaker device wiring 50 is detached by an external force, but even if the external force acts on
the speaker device wiring 50, it is detached from the wiring fixing portion 8d Can be prevented.
[0046]
Further, in the present embodiment, a groove 8ab is formed at a position surrounding the wiring
fixing portion 8d on the mounting surface 8a of the frame 8. Thus, when the yoke 1 is attached
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to the mounting surface 8a of the frame 8 via the adhesive, the groove 8ab prevents the adhesive
from partially protruding toward the wiring fixing portion 8d. It has a role as a reservoir.
Therefore, a part of the adhesive sticks out to the insertion hole 8da of the wiring fixing portion
8d, which hinders the insertion of the pair of plus / minus speaker device wires 50 into the
insertion hole 8da of the wiring fixing portion 8d. This can prevent the pair of plus / minus
speaker device wires 50 from being smoothly inserted into the insertion holes 8da of the wire
fixing portion 8d.
[0047]
Further, in the present embodiment, the insertion hole 8da is formed to penetrate from the
wiring fixing portion 8d to the magnetic circuit 30. Thereby, the mold structure for forming the
wiring fixing portion 8d can be simplified, and further, if such a mold is used, resin molding of
the frame 8 having the wiring fixing portion 8d becomes easy.
[0048]
In a preferred example, the frame 8 is preferably made of a resin material. This facilitates the
molding process of the frame 8 including the wiring fixing portion 8d and the groove 8ab.
[0049]
The back view of the speaker apparatus which concerns on the Example of this invention.
Sectional drawing cut in the position which passes along the central axis of the speaker
apparatus which concerns on a present Example. The front view and various sectional drawings
of the flame | frame which concerns on a present Example.
Explanation of sign
[0050]
Reference Signs List 8 frame (support) 8a mounting surface 8ab groove 8b rear surface 8d
wiring fixing portion 8da insertion hole 10 terminal for speaker device 40 mounted portion 40a
speaker mounting hole 50 wiring for speaker device 100 speaker device
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