close

Вход

Забыли?

вход по аккаунту

?

DESCRIPTION JP2009049686

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2009049686
An object of the present invention is to solve the poor connection between a lead wire extended
from a voice coil in an electro-acoustic transducer and a substrate for connecting the lead wire,
and to improve the quality of the electro-acoustic transducer. When a lead wire extended from a
voice coil is connected to a substrate having at least two lands for each of positive and negative
electrodes, temporary fixing is first performed on the first land. Next, the lead is cut such that the
cut end is located on the second land adjacent to the first land. Then, in the second land, the main
solder bonding is performed so that the cut end of the lead wire is covered with the solder.
[Selected figure] Figure 9
Electro-acoustic transducer and fixing method of lead wire
[0001]
The present invention relates to an electroacoustic transducer and a method of fixing a lead wire
connected to a coil of a magnetic circuit of the electroacoustic transducer.
[0002]
For example, the following Patent Document 1 describes an earphone as an example of the
electroacoustic transducer.
[0003]
Unexamined-Japanese-Patent No. 2003-219498
12-04-2019
1
[0004]
FIG. 1 shows the configuration of the earphone described in Patent Document 1. As shown in FIG.
The earphone 1 includes a magnetic circuit 5 and positions the voice coil 3 fixed on the lower
surface of the diaphragm 4 supported at the outer peripheral edge in the magnetic gap 6 of the
magnetic circuit 5.
In the earphone 1, the voice coil 3 is supplied with an electric signal to move the magnetic flux in
the magnetic gap 6 with the diaphragm 4 to vibrate the diaphragm 4.
Thereby, the electrical signal supplied to the voice coil 3 is converted to sound.
[0005]
The outer peripheral edge of the diaphragm 4 is supported by the frame 2, and the magnetic
circuit 5 comprises a magnet 5a and a yoke 5b. Further, from the voice coil 3, lead wires 3a and
3b are derived from both ends of the voice coil wire constituting the voice coil 3, and the lead
wires 3a and 3b are provided outside the bottom of the frame 2 for relaying It is soldered to the
wiring board 10.
[0006]
As the lead wires 3a and 3b (voice coil wires), a fusible polyurethane copper-coated aluminum
wire (CCAW; Copper-Clad Aluminum Wire) as shown in FIG. 2 is used. The fusible polyurethane
copper-coated aluminum wire was coated with an aluminum (Al) wire 15a with a copper (Cu) film
15b, then with an insulating film 15c1 of fusible polyurethane, and further covered with a fusible
film 15c2 It has a four-layer structure.
[0007]
12-04-2019
2
By making the core material aluminum (Al), the mass of the entire voice coil wire becomes small,
and the response characteristic (frequency characteristic) of the voice coil 3 driven by the
magnetic circuit becomes good. In addition, the copper (Cu) film 15b covers the surface with
copper (Cu) because aluminum is difficult to solder.
[0008]
The fusion film 15c2 has a melting point lower than that of the insulation film 15c1 and is used
to apply heat when winding it as a coil to melt only the outermost fusion film 15c2 and bond the
wires together. In the following description, when the insulating film 15c1 and the fusion film
15c2 are not particularly distinguished from each other, they are referred to as an insulation /
fusion film 15c.
[0009]
As shown in FIG. 3, the wiring substrate 10 is a substantially circular substrate on which
conductor patterns 12 and 13 having the same shape are symmetrically formed. Each conductor
pattern has at least two lands. That is, in the conductor pattern 12, three lands of the land 12a,
the land 12b, and the land 12c are formed, and the lands are connected to each other by the
band-like pattern. Similarly, in the conductive pattern 13, the lands 13a, the lands 13b, and the
lands 13c are connected by a strip pattern.
[0010]
The ends of lead wires 3 a (for example, positive electrode side) drawn from the voice coil 3 are
soldered to the lands 12 a formed on the wiring substrate 10. The end of the lead wire 3b (for
example, the negative electrode side) is soldered to the land 13a. One end of a pair of signal lines
8a and 8b for supplying a drive signal to the voice coil is soldered to the land 12b adjacent to the
land 12a and to the land 13b adjacent to the land 13a. Signal lines 8 a and 8 b are coated with a
covering material 9. A plug (not shown) is provided at the other end of the signal lines 8a and 8b,
and can be connected to the connector of the electronic device.
[0011]
12-04-2019
3
The frame 2 has notches 2e1 and 2e2 at the outer peripheral edge of the frame member 2b. The
notches 2e1 and 2e2 are provided at radially opposed positions, and the lead wires 3a and 3b
derived from the voice coil 3 pass through one of the notches 2e1 and 2e2, for example, the
notch 2e1 and are used as relay wiring boards Connected to 10 In this case, the lead wires 3a
and 3b are formed along the shape of the frame 2 and fixed by an adhesive (not shown). Thereby,
cutting and damage of lead wires 3a and 3b can be prevented.
[0012]
The connection process of connecting the lead wire 3a to the land 12a will be described with
reference to FIG. The connection process of connecting the lead wire 3b to the land 13a is the
same, and only one lead wire 3a will be described. First, in step S1, the lead wire 3a derived from
the voice coil 3 is temporarily fixed to the jig with an adhesive member such as double-sided
tape.
[0013]
Next, as in step S2, the insulating / fusion film 15c at a position to be connected to the land 12a
is partially removed. The preliminary removal of the insulation / fusion coating 15c is performed,
for example, by bringing a soldering iron of 400 ° C. into contact with the insulation / fusion
coating 15c for about 2 to 3 seconds.
[0014]
In step S3, the land 12a and the lead wire 3a are soldered. The temperature of the soldering iron
is 400 ° C. and applied for about 1.5 seconds.
[0015]
Then, after the land 12a and the lead wire 3a are joined, in step S4, the unnecessary end of the
lead wire 3a exposed outside the solder joint portion is cut.
12-04-2019
4
[0016]
FIG. 5 shows a cross section of a solder joint for explaining the above-mentioned conventional
lead fixing process in more detail.
FIG. 5 is an example in which the preliminary removal of the insulation / fusion film 15c is not
performed.
[0017]
As shown in FIG. 5A, a soldering iron is used to apply thermal energy to the solder 16 in order to
solder bond the lead wire 3a to the land 12a. Then, as shown in FIG. 5B, the thermal energy
applied to the solder 16 melts the insulation / fusion film 15c, and the copper (Cu) film 15b is
exposed.
[0018]
As shown in FIG. 5C, an intermetallic compound is formed on the exposed portion of the copper
(Cu) film 15b by copper (Cu) and tin (Sn) in the solder for soldering. In part, the aluminum (Al)
wire 15a is exposed. Further, the melting of the insulation / fusion film 15c also proceeds.
[0019]
Finally, as shown in FIG. 5D, unnecessary portions of the lead wires 3a that have jumped out of
the solder 16 are cut off. Thus, the lead wire 3 a is connected to the wiring board 10.
[0020]
However, in the conventional lead wire soldering as described above, the temperature of the
soldering iron is increased to shorten the working time. Moreover, when using lead (Pb) free
solder, since the melting point is higher than eutectic solder, work at a higher temperature is
12-04-2019
5
required. In the high temperature soldering operation, there arises a problem that the optimum
width of the soldering operation time (heating time) for achieving good soldering becomes short.
[0021]
If the soldering time is too short, the insulation / fusion film 15c is not sufficiently melted, which
causes a soldering failure, resulting in unstable conduction or no conduction. In addition, when
the soldering time is too long, as shown in FIG. 6, the intermetallic compound formation between
the copper (Cu) film 15b and the tin (Sn) in the solder 16 progresses excessively, and the solder
16 and aluminum ( Al) The wire 15c is in contact with the wire 15c. Since the bondability
between the solder 16 and the aluminum (Al) wire 15a is poor, there is a possibility that
conduction may be unstable.
[0022]
Conventionally, the soldering operation time (step S3 in FIG. 4) is, for example, 1.5 seconds ±
0.2 seconds, and the allowable range of time is extremely short. Therefore, it was necessary for
skilled workers to work.
[0023]
In addition, when the aluminum (Al) wire 15 a protrudes from the solder 16, the mechanical
strength of the exposed portion is reduced because there is no insulation / fusion film 15 c.
Furthermore, since the lead wires 3a and 3b protrude from the solder 16, there is a possibility
that moisture or gas may infiltrate from the gap between the solder and the lead wires 3a and 3b
to deteriorate the bonding stability.
[0024]
Therefore, an object of the present invention is to solve the above-mentioned problems and to
provide an electroacoustic transducer in which the connection between the lead wire and the
wiring board is well made and a method of fixing the lead wire which can easily perform stable
connection of the lead wire. To provide.
12-04-2019
6
[0025]
In order to solve the problems described above, the present invention relates to an electroacoustic transducer in which a conductive wire connected to a coil of a magnetic circuit and
having a thermally fusible insulating coating layer on the outer periphery of a metal wire is
connected to a wiring substrate. Electrically conductive first and second lands formed adjacent to
each other on the substrate, and a part fixed to the first land by a fixing member, and the tip
projecting from the first land is the electricity of the second land Electroacoustic transducer
having a conductor included in the joint member, the conductor and the second land being
electrically connected by the electrical joint member, and the conductor being fixed to the second
land .
[0026]
The present invention relates to a method of fixing a conductive wire connected to a coil of a
magnetic circuit and having a thermally fusible insulating coating layer on the outer periphery of
a metal wire to a wiring substrate. The first and second lands are formed, a part of the lead is
fixed to the first land by the first fixing member, and the lead of the lead is positioned so that the
cut end of the lead is located inside the projection surface of the second land. And a cutting end
of the conducting wire is fixed by the second fixing member in electrical connection with the
second land, and the cutting end is included in the inside of the second fixing member. Is the
fixing method of
[0027]
According to the present invention, since heat can be efficiently applied to the lead wires, the
time required to remove the insulation and fusion coating can be shortened.
This means that the heating temperature can be lowered if the soldering operation time is
comparable.
By lowering the heating temperature, the rate of loss of the copper film can be reduced after the
removal of the insulation / fusion film, and thus the allowable range of the soldering operation
time can be increased.
This has the advantage that the soldering operation does not require a high level of proficiency.
In addition, since the cut end of the lead wire is included in the solder as the fixing material, it is
12-04-2019
7
possible to increase the strength of the soldering and to prevent the entry of moisture from the
gap.
[0028]
Hereinafter, an embodiment of the present invention will be described with reference to the
drawings. FIG. 7 is a cross-sectional view showing the earphone 20 as an example of the electroacoustic transducer according to the embodiment of the present invention in a state of being
disposed upward.
[0029]
As shown in FIG. 7, the earphone 20 is fixed to the lower surface of the magnetic circuit 5
including the magnet 5a and the yoke 5b, the diaphragm 4 and the diaphragm 4 like the
conventional earphone shown in FIG. The voice coil 3 positioned in the magnetic gap 6 of 5 and
the frame 2 supporting the outer peripheral edge of the diaphragm 4 and having the magnetic
circuit 5 fixed thereto. Also, on the relay wiring board 10 provided outside the bottom of the
frame 2, the leads 3 a and 3 b led from the voice coil 3 and plugs for connecting the earphone 20
to the electronic device (shown in FIG. And the signal lines 8a and 8b connected to each other are
soldered.
[0030]
The diaphragm 4 is made of, for example, a polymer resin material, a pulp, a metal material, a
carbon fiber, a fiber material such as aramid fiber, or a material obtained by mixing and molding
these.
[0031]
The frame 2 is made of a metal material or a resin material.
In the frame 2, a frame member 2b is extended in the radial direction of the bottom surface of
the bottomed cylinder from the open end of the bottomed cylinder 2a having a hole 2d at the
bottom. And the support part 2c which supports the diaphragm 4 in the orthogonal | vertical
12-04-2019
8
direction with respect to the frame member 2b is extended from the edge part of the extended
frame member 2b.
[0032]
As shown in FIG. 8, the frame 2 is provided with notches 2e1 and 2e2 at the outer peripheral
edge of the frame member 2b. The notches 2e1 and 2e2 are provided at radially opposed
positions, and the lead wires 3a and 3b derived from the voice coil 3 pass through one of the
notches 2e1 and 2e2, for example, the notch 2e1 and are used as relay wiring boards It is led
onto 10 and soldered to the conductive pattern on the wiring substrate 10. In this case, the lead
wires 3a and 3b are formed along the shape of the frame 2 and fixed by an adhesive (not shown).
Thereby, cutting and damage of lead wires 3a and 3b can be prevented.
[0033]
The voice coil 3 is, for example, a voice coil wire made of a fusible polyurethane copper-coated
aluminum wire (CCAW) wound in a hollow cylindrical shape to form a coil, and the lead wires 3a
and 3b at both ends of the voice coil wire. Are derived and connected to the wiring board 10.
[0034]
The magnetic circuit unit 5 is composed of a magnet 5a and a yoke 5b which are substantially in
the form of a perforated disk made of a magnetic material.
The magnet 5a and the yoke 5b are mounted on the bottom surface of the bottomed cylinder 2a
of the frame 2 in this order so as to be concentric with each other. Then, the magnet 5 a and the
yoke 5 b are fixed to the frame 2 by the rivet 7 in the shape of an eyelet. Thus, the magnetic gap
6 is formed in the space where the inner periphery of the frame 2 and the outer periphery of the
magnet 5a and the yoke 5b face each other.
[0035]
As shown in FIG. 9A, in the wiring board 10, conductor patterns 12 and 13 having the same
shape are formed symmetrically on a substantially circular substrate. Each conductor pattern has
12-04-2019
9
at least adjacent first and second lands. That is, in the conductor pattern 12, three lands of a land
12a as a first land, a land 12b as a second land, and a land 12c as a third land are formed, and
the lands are connected by a strip pattern. There is. Similarly, in the conductive pattern 13, the
first lands 13a, the second lands 13b and the third lands 13c are connected by a strip pattern. As
these strip-like patterns, those having high thermal resistance are preferable so that the heat at
the time of soldering does not affect other lands.
[0036]
In addition, notches 10a and 10b are provided at positions facing in the radial direction of the
outer peripheral edge portion of the wiring substrate 10. Although one notch is required, it is
preferable to provide two not at opposite positions in order to ensure the symmetry of the parts.
In addition, the positions of the notches 10a and 10b of the wiring substrate 10 and the positions
of the notches 2e1 and 2e2 of the frame 2 substantially coincide with each other. This is because
the lead wires 3 a and 3 b drawn out from the notch 2 e 1 of the frame 2 are soldered on the
wiring substrate via the notch 10 a of the wiring substrate 10.
[0037]
Parts of the lead wires 3a and 3b are fixed to the first lands 12a and 13a by solders 16a and 17a,
respectively. The cut ends (tips) of the leads 3a and 3b protruding from the solders 16a and 17a
of the first lands 12a and 13a are included in the solders 16b and 17b of the second lands 12b
and 13b. Leads 3a and 3b are electrically connected to lands 12b and 13b, respectively, by
solders 16b and 17b, and leades 3a and 3b are fixed to lands 12b and 13b, respectively.
[0038]
Further, one end of a pair of signal lines 8a and 8b for supplying a drive signal to the voice coil is
soldered to the land 12b and the land 13b, respectively. Signal lines 8 a and 8 b are coated with a
covering material 9. A plug (not shown) is provided at the other end of the signal lines 8a and 8b,
and can be connected to the connector of the electronic device.
[0039]
12-04-2019
10
In the embodiment of the present invention, since three lands are electrically connected to each
other in each conductive pattern, one end of signal lines 8a and 8b may be connected to lands
12a and 13a, As shown in FIG. 9B, it may be connected to the lands 12c and 13c. When one end
of the signal lines 8a and 8b is connected to the lands 12a and 13a, the signal lines 8a and 8b
can be fixed without affecting the solder for fixing the lead lines 3a and 3b. Since the lands are
connected in a strip pattern, the degree of freedom of the method of connecting the signal lines
8a and 8b can be increased.
[0040]
As will be described later, in one embodiment of the present invention, a part of each of the lead
wires 3a and 3b is fixed to the first lands 12a and 13a respectively by the solder as the first
fixing member. Next, the lead wires 3a and 3b are cut such that the cut ends of the lead wires 3a
and 3b are located inside the projection surface of the second lands 12b and 13b. Then, the cut
ends of the lead wires 3a and 3b are fixed with solder as a second fixing member in a state of
being electrically connected to the second lands 12b and 13b, and the cut ends of the lead wires
3a and 3b are inside the solder. Made to be included.
[0041]
FIG. 10 schematically shows a state in which the tip of the lead wire 3a is soldered to the land
12b. A part of the lead wire 3a is fixed by the solder 16a at the position of the land 12a. This
fixing is a positioning operation for the next stage of soldering, as long as the lead wire 3a can be
fixed, and electrical connection between the lead wire 3a and the land 12a is unnecessary. Then,
the cut end of the lead wire 3a is cut to a length located inside the projection plane of the land
12b. It is soldered so that the cut end is contained inside the solder 16b of the land 12b.
[0042]
As shown enlarged in FIG. 11, the cut end of the lead wire 3a is included in the inside of the
solder 16b. At the time of soldering, as indicated by the arrows, thermal energy is applied not
only to the periphery of the lead wire 3a but also from the aluminum (Al) wire 15a and the
copper (Cu) film 15b of the cut end surface. More thermal energy is transmitted to the lead wire
3a as compared to the conventional application of thermal energy from the circumferential
12-04-2019
11
surface. Therefore, it is possible to remove and solder the insulation / fusion film 15c in a short
time. This means that the heating temperature can be lowered if the working time is the same as
the conventional length. As a result, the intermetallic compound formation between the copper
(Cu) film 15b and the tin (Sn) in the solder 16 is less likely to progress, and as a result, the
allowable time width of the soldering operation time can be expanded compared to the prior art.
[0043]
Furthermore, since the end face of the lead wire 3a is included in the solder 16b, it is possible to
prevent the entry of moisture from the bonding boundary between the lead wire 3a and the
solder 16b, and aluminum not protected by the insulation / fusion film 15c. It is possible to
prevent the reduction in strength due to the exposure of the (Al) wire 15a. In addition, the effect
regarding fixation of the lead wire 3a mentioned above is an effect that holds similarly about
fixation of the lead wire 3b.
[0044]
The connection process of connecting the lead wire 3a to the land 12a will be described with
reference to FIGS. 12 and 13. FIG. 13 shows a cross section of a solder joint for explaining the
above-mentioned conventional lead wire fixing process in more detail. Moreover, the connection
process of connecting the lead wire 3b to the land 13a is the same, and only one lead wire 3a will
be described. First, in step S11, the lead wire 3a derived from the voice coil 3 is temporarily fixed
to the jig with an adhesive member such as a double-sided tape.
[0045]
Next, in step S12, the lead wire 3a is temporarily fixed to the land 12a. Temporary fixing is
performed using a solder. Since it is only necessary to fix the lead wire 3a, the soldering
operation at the time of temporary fixing is, for example, adding heat of 400 ° C., for example,
for about 0.6 seconds ± 0.5 seconds. The temporary fixing may be performed using a generally
used adhesive containing an ultraviolet curing resin, a thermosetting resin, or the like.
[0046]
12-04-2019
12
As shown in FIG. 13A, in the temporary fixing portion (solder 16a) on the land 12a, since the
heating time is short, the degree of melting of the insulation / fusion film 15c is smaller than that
in the conventional case. In addition, the intermetallic compound of the copper (Cu) film 15b and
the tin (Sn) in the solder 16a hardly occurs.
[0047]
Subsequently, in step S13, the lead wire 3a is cut by a length such that the cut end of the lead
wire 3a is located inside the projection plane of the land 12b.
[0048]
Then, in step S14, the land 12b is soldered in such a manner that the cut end of the lead wire 3a
is covered.
The soldering operation is performed, for example, at a soldering iron temperature of 350 ° C.
and a working time of about 1.5 seconds ± 0.7 seconds.
[0049]
As shown in FIGS. 13B and 13C, the cut end of the lead wire 3a is located in the solder 16b, and
the insulation / fusion film 15c is melted to expose the copper (Cu) film 15b. An intermetallic
compound is formed on the exposed portion of the copper (Cu) film 15b by copper (Cu) and tin
(Sn) in the solder, and soldering is performed. In part, the aluminum (Al) wire 15a is exposed.
Further, the melting of the insulation / fusion film 15c also proceeds.
[0050]
Thereafter, the signal line 8a connected to the plug is soldered to the land 12b. The signal line 8a
is electrically connected to the lead 3a.
[0051]
12-04-2019
13
In the case of the embodiment of the present invention described above, the soldering operation
time is 1.5 seconds, which is equal to the conventional soldering operation time. However, since
the soldering temperature can be lowered, the allowable soldering operation time, which was
about 0.4 seconds in the conventional method, can be greatly extended to 1.4 seconds.
[0052]
After connecting the lead wires 3a and 3b and the signal wires 8a and 8b to the wiring substrate
10 in this manner, the earphone 20 is housed in a cover (not shown) formed by molding a resin
material, for example. Such an earphone 20 can easily perform stable connection of the lead
wires 3a and 3b derived from the voice coil 3, and the quality of the product is improved.
[0053]
A wiring substrate 30 having a shape as shown in FIG. 14 may be used. The wiring substrate 30
has a horizontally elongated shape in which one notch 30 a protrudes in the radial direction, and
the arrangement of lands is changed along the outer shape of the wiring substrate 30. The
configuration other than this is the same as that of the wiring substrate 10 described above.
[0054]
As shown in FIG. 15, the notch 30a provided in the portion in which the wiring substrate 30
overhangs is located below the notch 2e1 of the frame 2. As shown in FIG. At this time, it is
preferable that the left end position X of the wiring substrate 30 be on the outer peripheral side
than the inside position Y of the notch 2 e 1 of the frame 2.
[0055]
By using such a wiring board 30, while the distance between the notch 2e1 from which the lead
wires 3a and 3b are led out and the notch 30a to be introduced is shortest, the lead wires 3a and
3b are provided on the outer surface of the frame 2. No work for forming along the Further,
12-04-2019
14
along with this, since the protection by the adhesive of the lead wires 3a and 3b formed can be
made unnecessary, the number of working processes can be reduced.
[0056]
Also, the wiring substrate 50 having a shape as shown in FIG. 16 may be used. The wiring
substrate 50 has a laterally elongated shape in which one notch 50a is protruded in the radial
direction. The configuration other than this is the same as that of the wiring substrate 10
described above.
[0057]
A notch 50a provided in a portion where the wiring substrate 50 is overhanging is located below
the notch 2e1 of the frame 2 as shown in FIG. At this time, it is preferable that the left end
position X ′ of the wiring substrate 50 be on the outer peripheral side than the inner portion
position Y of the notch 2 e 1 of the frame 2 as in the wiring substrate 30 of FIG. The wiring
board 50 can suppress the occurrence of a contact accident by a worker, as compared with the
wiring board 30.
[0058]
As mentioned above, although embodiment of this invention was described concretely, this
invention is not limited to the above-mentioned embodiment, Various deformation |
transformation based on the technical idea of this invention are possible. For example, the
numerical values listed in the above-described embodiment are merely examples, and different
numerical values may be used as needed.
[0059]
Moreover, although the above-mentioned embodiment is an example which applied this
invention to an earphone, this invention can also be used for a microphone apparatus.
[0060]
12-04-2019
15
It is sectional drawing of the conventional earphone.
It is sectional drawing of the lead wire used for the conventional earphone. It is a top view of the
wiring board used for the conventional earphone. It is a flowchart for demonstrating the
conventional lead wire fixing process. It is sectional drawing for demonstrating the conventional
lead wire fixing process. It is sectional drawing for demonstrating the problem in the
conventional lead wire fixing process. It is a sectional view of the earphone concerning one
embodiment of this invention. It is a top view of the earphone concerning one embodiment of
this invention. It is a top view of the wiring board in one embodiment of this invention. It is an
enlarged plan view of a junction of a lead in one embodiment of this invention. It is an expanded
sectional view of a joined part of a lead in one embodiment of this invention. It is a flowchart for
demonstrating the lead wire fixing process in one Embodiment of this invention. It is sectional
drawing for demonstrating the lead wire fixing process in one Embodiment of this invention. It is
a top view which shows the other example of the wiring board which can be applied to this
invention. FIG. 8 is a cross sectional view showing another embodiment of the present invention,
and is a cross sectional view showing another embodiment of the present invention. FIG. 10 is a
cross sectional view showing another embodiment of the present invention.
Explanation of sign
[0061]
Reference Signs List 1 earphone 2 frame 2 e 1 2 e 2 notch 3 voice coil 3 a 3 b lead wire 4
diaphragm 5 magnetic circuit 5 a magnet 5 b ... Yoke 6 ... Magnetic gap 7 ... Rivet 8a, 8b ... Signal
line 9 ... Coating material 10, 30 ... Wiring board 10a, 10b ... Notch 12 ... Positive electrode
Conductor pattern 12a. 12b, 12c ... land 13 ... negative electrode conductor pattern 13a. 13b,
13c: Land 14: Opening 15a: Aluminum (Al) wire 15b: Copper (Cu) film 15c: Insulating / fusion
film 16: Solder 20, 40 earphone
12-04-2019
16
Документ
Категория
Без категории
Просмотров
0
Размер файла
27 Кб
Теги
description, jp2009049686
1/--страниц
Пожаловаться на содержимое документа