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DESCRIPTION JPH0725694

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DESCRIPTION JPH0725694
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
thin driver unit.
[0002]
2. Description of the Related Art As shown in FIG. 4, a conventional thin driver unit has a unit
body 300 including a baffle 340, a diaphragm 350, a pole piece 370, a voice coil 360, a magnet
380, and a yoke 390; A terminal board 700 and a compensation cloth 200 attached to the back
side of the unit body 300 are provided.
[0003]
The terminal plate 700 is formed in a substantially semicircular shape, and a conductive pattern
(not shown) to which the lead wire 330 from the voice coil 360 is connected is formed.
The terminal plate 700 is attached with an adhesive at the yoke 390, that is, the unit body 300.
The compensation cloth 200 is also formed in a substantially semicircular arc shape, and is
attached to the yoke 390 with an adhesive.
[0004]
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1
As described above, the conventional thin driver unit in which the terminal plate 700 and the
compensation cloth 200 are attached to the unit main body 300 with an adhesive has the
following problems. That is, when the adhesive is applied to the compensation cloth 200 too
much, the adhesive soaks into the compensation cloth 200, causing variations in acoustic
resistance and variations in acoustic characteristics.
[0005]
In addition, the compensation cloth 200 and the terminal plate 700 must be attached to the unit
body 300 in separate steps. Furthermore, as shown in FIG. 5, since the thickness dimension of
the terminal board 700 is usually about 0.5 mm, when the solder piling 800 is formed on the
conductive pattern of the terminal board 700, the solder piling 800 has the entire height of the
unit body 300. And can not take advantage of the thin driver unit.
[0006]
The present invention has been made in view of the above circumstances, and it is possible to
reduce the number of manufacturing processes without causing variations in acoustic
characteristics, and furthermore, to make a thin driver unit in which the solder does not exceed
the entire height of the unit body. It is intended to be provided.
[0007]
SUMMARY OF THE INVENTION A thin driver unit according to the present invention comprises a
flexible substrate on which a conductive pattern is formed, a unit body to which the flexible
substrate is attached with a double-sided tape, and a double-sided tape with the flexible
substrate. And a compensation cloth to be attached.
[0008]
FIG. 1 is a schematic exploded perspective view of a thin driver unit according to one
embodiment of the present invention, and FIG. 2 is a schematic exploded perspective view of a
thin driver unit according to another embodiment of the present invention, FIG. 3 is a side view
of the thin driver unit for explaining the advantages of the thin driver unit.
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2
The same reference numerals are given to parts substantially the same as conventional ones and
the like.
[0009]
The thin driver unit according to the present embodiment comprises a flexible substrate 100 on
which a conductive pattern 120 is formed, a unit body 300 to which the flexible substrate 100 is
attached by a double-sided tape 400, and a double-sided tape 500 on the flexible substrate 100.
And a compensation cloth to be attached.
[0010]
The flexible substrate 100 is formed in a ring shape, and is set to a size corresponding to the unit
main body 300.
The thickness dimension of the flexible substrate 100 is about 0.1 mm, which is thinner than the
conventional terminal plate.
The flexible substrate 100 has a plurality of openings 110 corresponding to the openings 310
formed in the unit body 300. The flexible substrate 100 is formed with a pair of conductive
patterns 120.
[0011]
Both ends of the conductive pattern 120 are formed as soldered parts, lead wires 330 of a voice
coil (not shown) are soldered to one end, and lead wires not shown are soldered to the other end.
It has become so.
[0012]
On the other hand, the compensation cloth 200 is formed in a substantially C shape so as not to
cover the pair of conductive patterns 120 when attached to the flexible substrate 100.
[0013]
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3
A double-sided tape 400 for attaching the flexible substrate 100 to the unit main body 300 is
formed in a ring shape corresponding to the flexible substrate 100.
Further, the double-sided adhesive tape 400 has a plurality of openings 410 corresponding to
the openings of the unit main body 300.
[0014]
On the other hand, the double-sided tape 500 for attaching the compensation cloth 200 to the
flexible substrate 100 is formed in a substantially C shape so as not to cover the pair of
conductive patterns 120 of the flexible substrate 100 like the compensation cloth 200. .
The double-sided adhesive tape 500 also has a plurality of openings 510 corresponding to the
openings 110 of the flexible substrate 100.
[0015]
First, the double-sided adhesive tape 400 is attached to the back side of the unit body 300 in the
manufacturing process of the thin driver unit composed of the parts as described above. In this
case, the opening 310 of the unit body 300 and the opening 410 of the double-sided tape 400
are made to coincide with each other.
[0016]
Next, the remaining peel paper of the double-sided tape 400 is peeled off, and the flexible
substrate 100 is attached to the unit main body 300. In this case, the opening 110 of the flexible
substrate 100 is matched with the opening 410 of the double-sided tape 400, and the conductive
pattern 140 is made close to a lead (not shown) from the unit body 300.
[0017]
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4
The peel paper on one side of the double-sided tape 500 is peeled off and attached to the flexible
substrate 100. In that case, the opening 510 of the double-sided adhesive tape 500 matches the
opening 110 of the flexible substrate 100 and the conductive pattern 120 is not covered by the
double-sided adhesive tape 500.
[0018]
The remaining peel paper of the double-sided tape 500 is peeled off, and the compensation cloth
200 is attached to the flexible substrate 100. In this case, the compensation cloth 200 does not
cover the conductive pattern 120 of the flexible substrate 100.
[0019]
Thus, when the flexible substrate 100 and the compensation cloth 200 are completely attached
to the unit body 300, the lead wire 330 drawn out from the lead wire lead-out portion 320 on
the outer peripheral portion of the unit body 300 is conducted. While soldering to the soldered
portion at one end of the pattern 120, a lead wire not shown is soldered to the soldered portion
at the other end of the conductive pattern 120.
[0020]
As shown in FIG. 3, the thin driver unit configured in this way has the merits of the thin driver
unit without the solder bumps 800 of the conductive pattern 120 of the flexible substrate 100
exceeding the entire height of the unit body 300. Can be demonstrated.
[0021]
Next, a thin driver unit according to another embodiment of the present invention will be
described with reference to FIG.
The thin driver unit includes a flexible substrate 150 on which a pair of conductive patterns 120
are formed, a unit body 300 to which the flexible substrate 150 is attached by a double-sided
tape 600, and a compensating cloth attached to the unit body 300 by the double-sided tape 600.
The compensation cloth 200 is formed in a substantially C-shape, and the flexible substrate 150
is attached to the unit main body 300 so as not to overlap the compensation cloth 200.
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[0022]
The thin driver unit according to this embodiment differs from the thin driver unit described
above in that the flexible substrate 150 and the compensation cloth 200 are attached to the unit
body 300 with a single double-sided tape 600.
[0023]
First, the double-sided adhesive tape 600 is formed in a ring shape, and a plurality of openings
610 corresponding to the openings 310 formed in the unit main body 300 are opened.
As such a double-sided tape 600, one provided with an adhesive layer on both sides of a PET
substrate having a thickness dimension of about 0.1 mm is used.
[0024]
If such a PET-based double-sided tape 600 is used, it can be attached to the unit body 300 while
keeping the compensation fabric 200 flat.
If a double-sided tape without a PET substrate is used, it becomes difficult to keep the
compensation cloth 200 on a flat surface, which causes a variation in acoustic resistance.
Further, in the above-described embodiment, two double-sided tapes 400 and 5000 are used.
However, since only one double-sided tape 600 is required, it is possible to further reduce the
thickness.
[0025]
On the other hand, the compensation cloth 200 is formed in a shape in which a part of a ring is
cut off, that is, in a C-shape. This point is the same as the embodiment described above.
[0026]
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6
Further, the flexible substrate 150 is not shaped like a ring as in the above-mentioned
embodiment, but is formed in such a shape as to be fitted into the cut portion of the
compensation cloth 200. Therefore, it is possible to arrange the compensation cloth 200 and the
flexible substrate 150 so as not to overlap each other. Further, since the flexible substrate 150 is
expensive, it is not formed in a ring shape as in the above-described embodiment, which
contributes to cost reduction.
[0027]
First, the peel paper on one side of the double-sided tape 600 is peeled off and attached to the
unit main body 300. In this case, the opening 610 of the double-sided tape 600 and the opening
310 of the unit body 300 are made to coincide with each other.
[0028]
Next, the remaining peel paper of the double-sided tape 600 is peeled off, and the compensating
cloth 200 is attached. The flexible substrate 150 may be attached first, but in order to prevent
unnecessary dust and the like from adhering to the double-sided adhesive tape 600, the wide
compensating cloth 200 is attached to the double-sided adhesive tape 600. In addition, the
compensation cloth 200 is made not to be in the vicinity of the lead wire lead-out portion 320 of
the unit main body 300.
[0029]
The flexible substrate 150 is attached to the double-sided tape 600. Then, the lead wire 330 is
positioned near the flexible substrate 150. The lead wire 330 is soldered to the soldered portion
at one end of the conductive pattern 120, and a lead wire not shown is soldered to the soldered
portion at the other end.
[0030]
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7
The thin driver unit according to the present invention comprises a flexible substrate on which a
conductive pattern is formed, a unit body to which the flexible substrate is attached with a
double-sided tape, and a compensation capable of being attached to the flexible substrate with a
double-sided tape. Have a cloth and. Since no adhesive is used to attach the compensation fabric,
there is no variation in acoustic properties. In addition, since the step of applying the adhesive
can be performed in a shorter time than the step of attaching the double-sided tape, the entire
manufacturing time can be shortened. Furthermore, since a thin flexible substrate is used instead
of the terminal board, the solder buildup in the conductive pattern does not exceed the entire
height of the unit body, and the merits of the thin driver unit can be sufficiently exhibited.
[0031]
The flexible cloth has a flexible substrate on which a conductive pattern is formed, a unit body to
which the flexible substrate is attached with a double-sided tape, and a compensation cloth
attached to the unit body with the double-sided tape. In the thin driver unit which is formed in a
substantially C shape and attached to the unit main body so that the flexible substrate does not
overlap the compensation cloth, the thickness can be further reduced, and the amount of use of
the expensive flexible substrate is small. Thus, the cost can be reduced. Moreover, the reduction
of the manufacturing process can be shortened. In addition, the point which does not have the
dispersion | variation in acoustic characteristics, and being able to fully exhibit the merit of a thin
driver unit are the same.
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