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DESCRIPTION JPS55165568

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DESCRIPTION JPS55165568
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a half sectional view of a conventional
headphone, FIG. 2 is a half sectional side view showing one embodiment of the headphone
according to the present invention, and FIG. Fig. 4 is a perspective view of the main part, Fig. 5 is
a cross-sectional view of the main part of another embodiment, Fig. 6 is a cross-sectional view
showing measurement of sound pressure frequency characteristics of the same headphone, and
Fig. 7 is the same. An equivalent circuit diagram of the headphone, and FIG. 8 are sound pressure
frequency characteristics of the headphone according to the prior art and the present invention.
15 иииииии L16 и и и и и и и и Housing и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и
и и и и и и speakers и 22 и и и magnetic circuit, 23 и и и и и и и и и и и 24 иииии Diaphragm, 25 и и и и и и и и и
Magnetic gap, и и и и и и Voice coil, 27 и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и
и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и voice coil, 27 и и и through hole, 28 и
и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и diaphragm, 25 и и и magnetic gap, 26 и и и voice coil и и и и и и
и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и Sound tube, 31 и и
и и и и и и и и и и и и и.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a headphone
having sound pressure frequency characteristics emphasizing low and high frequencies. The
conventional headphone was configured as shown in FIG. That is, the buckle plate 3 is attached
to the front opening of the housing 2 having the through hole 1 on the back surface, and the
speaker 4 is fixed to the back surface of the baffle plate 3. The speaker 4 has a frame 10 having a
through hole 9 on the back thereof coupled to a magnetic circuit 8 constituted by a yaw 5, a
magnet 6, and a pole piece 7, and is fitted into the magnetic gap 11 of the magnetic circuit 8 in
this frame 1o. The diaphragm 13 incorporating the voice coil 12 is incorporated. An ear pad 14
is attached to the front of the baffle plate 3. Sound pressure frequency characteristics are
controlled by housing the sound absorbing material in the through holes 9 of the frame 1o in
such a configuration, and the flat characteristics as shown by the broken line in FIG. It had
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become. Such headphones can only provide extremely gentle reproduction and do not feel the
force, and the present invention eliminates the above-mentioned conventional drawbacks. An
embodiment of the present invention will be described below with reference to FIGS. First, in the
embodiment shown in FIGS. 2 to 4, the baffle plate 17 is incorporated in the front opening of the
housing 16 in which the plurality of through holes 16 are formed on the back surface. A speaker
18 is coupled to the inner surface of the baffle plate 17. In the speaker 18, a frame 23 made of a
synthetic resin or the like is coupled to a magnetic circuit 22 configured by incorporating a
columnar magnet 2o and a pole piece 21 in a yoke 19, and a diaphragm 24 is incorporated in the
frame 23. The magnetic gear knobs of the magnetic circuit 22; ?, r / l / 1.25 which are fitted to
the diaphragm 24 are connected with each other to form a coupling 1 '. The frame 23 is formed
with a through hole 27 for adjusting the air pressure on the back surface of the moving plate 24.
On the back surface of the frame 23, two projected strips 28 and the projected strip are formed
continuously with the through hole 27. An acoustic pipe 3o is formed of a sealing material 29
attached between 28. That is, one end of the acoustic tube 30 is connected to the through hole
27 and the other end is open. An ear pad 31 is attached to the front of the baffle plate 17.
Further, in the embodiment shown in FIG. 5, a tube 32 made of silicon rubber or the like is
connected to the through hole 27 of the frame 23, and the tube 32 is an acoustic tube 3o.
These acoustic tubes 30 are determined in length and size so as to have a predetermined mass.
Next, FIG. 7 shows an equal node circuit when the headphones of the embodiment shown in FIG.
6 are attached to the measurement coupler 34 provided with the microphone 33 as shown in
FIG. 6 and 7, CF indicates compliance by the cavity on the front side of the diaphragm, CB
indicates compliance by the cavity on the back of the diaphragm, 5MB indicates the mass by the
acoustic tube 3o, and MD indicates the mass of the vibration system of the speaker such as the
diaphragm. , CD is the compliance of the vibration system, and RD is the acoustic radiation
resistance of the vibration system. By thus selecting the mass of the acoustic tube 3o so as to
resonate in parallel in the acoustic system between the frequencies 50o and 1 KHz, the low and
high frequencies are enhanced as shown by the solid line in the sound pressure frequency
characteristic diagram of FIG. Can have the Therefore, even a headphone formed by the small
housing 16 can obtain a remarkable force for its reproduction. The characteristics shown in FIG.
8 are measured by the measurement coupler 34 shown in FIG. As described above, since the
headphones of the present invention are configured, it is possible to reduce the sound pressure
of the mid range and emphasize the low range and the high range only by providing a simple
sound tube, and the playback is extremely powerful. Is possible, and the practical value) \ value is
large. :)
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