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DESCRIPTION JP2001054194

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DESCRIPTION JP2001054194
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an
assembly substrate attached to an ultrasonic probe for wiring a cable.
[0002]
2. Description of the Related Art It is necessary to use an ultrasonic probe when displaying and
observing an ultrasonic tomogram using echo signals from tissues and tissue boundaries of
internal organs. . This ultrasonic probe generally uses a multicore coaxial cable for electrical
connection with an ultrasonic observation apparatus. The plurality of piezoelectric elements
provided in the ultrasonic probe are excited by signals transmitted from the ultrasonic
observation apparatus by the shield-coated multi-core coaxial cable, so cables corresponding to
the number of piezoelectric elements are required, and the piezoelectric elements and the cables
Is to be implemented one-on-one. In order to mount the piezoelectric element and the cable one
on one, an assembly substrate is usually used. On the assembly board, solder shields individually
covering the core wires of the cable to the GND (ground) of the assembly board, and solder the
core wires to the electrodes provided on the signal lines (connection patterns) of the assembly
board It is supposed to be.
[0003]
[0003] As described in, for example, Japanese Utility Model Laid-Open Publication No. Hei 2123214, such a conventional assembly substrate is soldered to the core substrate of the cable to
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the assembly substrate in order to efficiently carry out the soldering (wiring) operation. What
provided the electrode (land) for attaching and the conductor part as GND (ground) for soldering
the shield wire of a cable, and was able to do wiring work in a short time by using a plurality of
them Proposed.
[0004]
However, in order to solder the core of the cable to the electrode (land) by the above method, it is
necessary to position the electrode (land) and the cable. It is necessary to prepare the tools
separately.
Further, since the soldering surface of the cable and the soldering surface of the shield are on the
front and back, in the soldering process, the process of reversing the assembly substrate
connecting the multi-core coaxial cable is included, and the workability is poor. In addition, since
the electrode (land) is provided on the assembly substrate, the size of the assembly substrate is
determined by the manufacturing limit of the electrode (land) and the number of the electrodes
(land), and the electrode ( It depends on the production limit of land).
[0005]
The present invention has been made in view of these circumstances, and an assembly substrate
capable of soldering the core wire and the shield wire of a cable from the same direction without
requiring a jig for positioning the cable. Intended to provide. Furthermore, another object of the
present invention is to lower the impedance of GND (ground) between assembly boards when a
plurality of assembly boards are attached to an ultrasonic probe so as to suppress noise. To aim.
[0006]
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention
according to claim 1 is an ultrasonic probe comprising a multi-core coaxial cable and a plurality
of piezoelectric elements from which an ultrasonic beam is emitted. And a substrate main body
having a mounting electrode connected to the signal line of the multi-core coaxial cable, and a
signal line of the multi-core coaxial cable positioned and fixed. And a cable fixing portion
provided on the substrate body, and the cable fixing member is fixed to the substrate body with a
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conductive adhesive. The invention according to claim 2 is characterized in that the cable fixing
member is made of a conductive material. Furthermore, the invention according to claim 3 is
characterized in that at least a part of the substrate main body is extended, and at least the
extended part is provided with flexibility. With this configuration, it is possible to realize an
assembly substrate in which the core wire and the shield wire of the cable can be soldered from
the same direction without requiring a jig for positioning the cable.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be
described below with reference to the drawings. (First Embodiment) FIGS. 1 to 5 relate to a first
embodiment of the present invention, and FIG. 1 is an explanatory perspective view showing an
assembly substrate, and FIG. 2 is a multi-core coaxial cable on the assembly substrate of FIG. 3 is
an enlarged perspective view of FIG. 2, and FIG. 4 is a view for explaining the GND line of the
assembly substrate of FIG. 1. FIG. 4 (a) shows the GND line more than the GND electrode. FIG. 4B
is an explanatory view provided at the top, and FIG. 4B is an explanatory view in which the GND
electrode is provided above the GND line, and FIG. 5 is a plurality of assembly boards including
the GND line and the GND electrode It is explanatory drawing at the time of assembling in a
zigzag form.
[0008]
As shown in FIG. 1, an assembly substrate 1 according to the present embodiment is a substrate
electrically connected to an ultrasonic probe provided with a plurality of piezoelectric elements
(not shown), and is a multi-core coaxial cable (described below) A substrate body 3 having a
mounting electrode 2 connected to each cable of the coaxial cable, and a cable fixing portion 5
provided with a cable fixing member 4 for positioning and fixing each cable on the substrate
body 3 Is mainly composed of Incidentally, a plurality of the assembly substrate 1 are attached to
an ultrasonic probe (not shown), and a plurality of coaxial cables are connected to transmit an
electric signal for driving a vibrator composed of a plurality of piezoelectric elements of the
ultrasonic probe. It is to do.
[0009]
The substrate body 3 is mainly composed of a signal layer 6 and a ground (hereinafter referred
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to as GND) layer 7, and a plurality of the mounting electrodes 2 are provided on the upper
surface of the signal layer 6. A signal line (connection pattern) (not shown) for connecting one-toone with piezoelectric elements of a vibrator (not shown) is formed in the signal layer 6 and is
conducted to the mounting electrode 2. On the other hand, the GND layer 7 solders a shield wire
of a cable to be described later to the cable fixing member 4, thereby enabling conduction with
the shield wire 11d and suppressing the impedance low. The cable fixing member 4 can be
positioned and fixed by sandwiching one coaxial cable with adjacent members. In addition,
although this cable fixing member 4 is formed in a substantially rectangular parallelepiped, it
may be disk-like or spherical as long as one cable can be inserted and positioned and fixed.
[0010]
In this embodiment, the cable fixing member 4 is bonded and fixed to the GND layer 7 with a
conductive adhesive so that the cable fixing member 4 can be conducted to the GND layer 7.
[0011]
As shown in FIG. 2, the cables 11a of the coaxial cable 11 are each connected to the mounting
electrode 2, and transmit pulses between the ultrasonic observation device (not shown) and the
ultrasonic probe (not shown) via the cable 11a. And transmission of the received pulse can be
performed.
Reference numeral 11b denotes a core of the cable 11a to be soldered to the mounting electrode
2, 11c denotes a dielectric of the core 11b, and 11d denotes a shield.
[0012]
As shown in FIG. 3, in the substrate main body 3 of the assembly substrate 1, the cable fixing
member 4 is formed on the GND layer 7 by forming an interval sufficient to sandwich the cables
11 a by the adjacent cable fixing members 4. Are adhesively fixed with the conductive adhesive
12, respectively. Thereby, when the cable fixing member 4 is made of a material of a conductive
material such as copper, for example, electrical conduction between the cable fixing member 4
and the GND layer 7 becomes possible, and the shield wire 11d of the coaxial cable 11 is used as
a cable. Soldering to the fixing member 4 enables conduction between the shield wire 11 d and
the GND layer 7.
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[0013]
The cables 11a of the coaxial cable 11 are connected to the assembly substrate 1 configured as
described above. First, in order to expose the core wire 11b of the cable 11a, the dielectric 11c is
peeled off to a certain extent. Then, the shield wire 11 d is sandwiched and fixed to the cable
fixing member 4. In this state, the shield wire 11 d is soldered to the cable fixing member 4, and
the core wire 11 b from which the dielectric 11 c is peeled is soldered to the mounting electrode
2. In addition, since the shield wire 11d is fixed by the cable fixing member 4, after fixing of all
the cables 11a is complete | finished, you may solder collectively.
[0014]
The mounting electrode 2 is connected to each piezoelectric element by a signal line (connection
pattern) (not shown) of the signal layer 6. Therefore, by soldering the core wire 11b of the cable
11a, the mounting electrode 2 is made of The core wire 11b and each piezoelectric element are
wired in a one-on-one manner to conduct. The cable fixing member 4 is adhered and fixed to the
GND layer 7 of the assembly substrate 1 by the conductive adhesive 12 as described above.
Therefore, the shield wire 11 d of the cable 11 is soldered to the cable fixing member 4.
Conduction with layer 7 is possible.
[0015]
As a result, the coaxial cable 11 can be soldered so that the core wire 11b of the cable and the
shield wire 11d can be soldered from the same direction, as well as preparation of a dedicated jig
for fixing the cable and the assembly substrate 1 Since it is not necessary to position the jig and
the jig, it is possible to reduce the man-hour and cost required for the jig and preparation. In
addition, when the cable fixing member 4 is formed of a conductive material such as copper, the
cable fixing member 4 and the GND layer 7 of the assembly substrate 1 can be electrically
conducted by the conductive adhesive 12, so the cable fixing member By soldering the shield
wire 11 d of the cable 11 a to 4, a shield effect can be obtained and noise can be suppressed.
[0016]
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By the way, when a plurality of assembly boards 1 to which the cable 11a of the coaxial cable 11
is connected in this way is attached to an ultrasonic probe (not shown), the impedance of GND
between the assembly boards becomes high, There is a possibility that noise may be generated in
the transmission pulse and the reception pulse to be transmitted. Therefore, at least a part of the
substrate main body 3 is extended, and each substrate to which flexibility is given at least in the
extended portion is connected by the extended portion so as to suppress the impedance of GND
between each substrate low.
[0017]
As shown in FIG. 4, a part of the GND layer of the assembly substrate 1 is extended to form a
flexible GND line 21 having extension portions, and the GND line of the adjacent assembly
substrate 1 is formed. 21 is formed on the exposed portion of the GND layer 7 of the assembly
substrate 1.
[0018]
As shown in FIG. 4A, the GND lines 21 and the GND electrodes 22 are connected to each other,
for example, as shown in FIG. Is provided above the GND electrode 22, and conversely, the GND
electrode 22 is provided above the GND line 21 in FIG. 4B.
Reference numeral 21 a denotes a soldered portion of the GND line 7, which is used for
connection with the adjacent assembly substrate 1.
[0019]
A plurality of assembly substrates 1 configured as described above are assembled as shown in
FIG. The soldered portion 21 a of the GND line 7 of each assembly substrate 1 is soldered to the
GND electrode 22 of the adjacent assembly substrate 1. At this time, the GND lines 21 are bent
and soldered so that the lead-out ports of the GND lines 21 of the assembly substrate 1 are
arranged in a staggered manner on the adjacent assembly substrates 1. A connector may be used
to connect the GND line 21 and the GND electrode 22. Reference numeral 23 denotes an edge
connector attached to the assembly substrate 1 and is adapted to be attached to an ultrasonic
probe (not shown) via the edge connector.
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[0020]
As a result, when a plurality of assembly substrates 1 are attached to the ultrasonic probe, the
GNDs of the assembly substrates 1 can be easily connected to each other, and the impedance of
the GND of each assembly substrate 1 can be reduced. Noise can be suppressed.
[0021]
The present invention is not limited to the embodiment described above, and various
modifications can be made without departing from the scope of the invention.
[0022]
Second Embodiment FIGS. 6 and 7 relate to a second embodiment of the present invention, FIG. 6
is an explanatory perspective view showing an assembly substrate, and FIG. It is an expansion
perspective view at the time of mounting a core coaxial cable.
[0023]
In the first embodiment, the cable fixing portion 5 provided with the cable fixing member 4 is
provided on the substrate body 3 and the cable fixing member 4 is adhered and fixed to the
substrate body 3 with the conductive adhesive 12. The cables 11 a of the coaxial cable 11 can be
positioned and fixed, and electrical continuity between the cable fixing member 4 and the GND
layer 7 is enabled, and the shield wire 11 d of the cable 11 a can be used as the cable fixing
member 4. By soldering, it is configured to enable conduction with the GND layer 7, but in the
present embodiment, instead of the cable fixing member 4, a groove for sandwiching the cable
11a in the substrate body 3 is formed. The cable fixing portion is provided to position and fix the
cables 11 a of the coaxial cable 11.
The other configuration is the same as that of FIGS. 1 to 3, so the description will be omitted, and
the same configuration will be described with the same reference numerals.
[0024]
As shown in FIG. 6, the assembly substrate 31 according to the present embodiment has a
plurality of grooves stepped down one step at a position opposite to a signal line (connection
pattern) (not shown) formed at the edge of the substrate body 32. A cable fixing portion 34 in
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which 33 is formed is provided.
The GND layer 7 is exposed at the bottom of the groove 33.
The respective cables 11 a of the coaxial cable 11 are positioned and fixed in the grooves 33 of
the cable fixing portion 34. Thereby, the cables 11a of the coaxial cable 11 fixed to the groove
portion 33 are drawn out flush with the surface of the substrate main body 32 with the
respective core wires 11b as shown in FIG. 7, and the shield wires 11d of the respective cables
11a are It is soldered to the GND layer 7 exposed at the bottom of the groove 33.
[0025]
The cables 11a of the coaxial cable 11 are connected to the assembly substrate 31 configured as
described above. The respective shield wires 11 d are sandwiched and fixed in the groove 33. In
this state, the shield wire 11d is soldered to the GND layer 7 exposed at the bottom of the groove
33, and the core 11b from which the dielectric 11c is peeled is soldered to the mounting
electrode 2. The mounting electrode 2 is connected to each piezoelectric element by a signal line
(connection pattern) (not shown) of the signal layer 6, so that the core 11b of each cable 11a can
be soldered by soldering the core 11b of the cable 11a. Each piezoelectric element is wired in a
one-on-one manner to conduct. By soldering the shield wire 11 d of the cable 11 a to the GND
layer 7 exposed in the groove portion 33, conduction with the GND layer 7 becomes possible.
[0026]
As a result, the coaxial cable 11 can be soldered so that the core wire 11b of the cable and the
shield wire 11d can be soldered from the same direction, and a dedicated jig for fixing the cable
and the assembly substrate 31 Since it is not necessary to align the position with the jig, it is
possible to reduce the number of steps and costs required for the jig and preparation. Also, by
soldering the shielding wire 11d of the cable 11a to the groove 33 of the cable fixing portion 34,
a shielding effect can be obtained and noise can be suppressed.
[0027]
Although not shown, the assembly substrate 31 is provided with the GND line 21 and the GND
electrode 22 described with reference to FIG. 4 so that a plurality of assembly substrates 31 are
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attached to the ultrasonic probe. The GNDs can be easily connected to each other, and the
impedance of the GND of each assembly substrate 31 can be reduced to suppress noise.
[0028]
The present invention is not limited to the embodiment described above, and various
modifications can be made without departing from the scope of the invention.
[0029]
[Appendix] (Appendix 1) A substrate for electrically connecting a multi-core coaxial cable to a
transducer of an ultrasonic probe provided with a plurality of piezoelectric elements to which an
ultrasonic beam is radiated, A substrate body having a mounting electrode connected to a signal
line of a core coaxial cable, and a cable fixing portion provided on the substrate body with a cable
fixing member for positioning and fixing the signal line of the multicore coaxial cable; An
assembly substrate characterized in that the cable fixing member is fixed to the substrate body
with a conductive adhesive.
[0030]
(Appendix 2) The assembly substrate according to appendix 1, wherein the cable fixing member
is made of a conductive material.
[0031]
(Additional Item 3) The assembly substrate according to Additional Item 1, characterized in that
at least a part of the substrate main body is extended, and at least the extended part is provided
with flexibility.
[0032]
(Additional Item 4) The assembly substrate according to Additional Item 3, characterized in that
the extension outlets of the extension portions are staggered in a staggered manner between
adjacent other assembly substrates.
[0033]
(Additional Item 5) The assembly substrate according to Additional Item 4, wherein a soldered
portion is provided at the tip of the extended portion.
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[0034]
(Additional Item 6) The soldered part provided at the tip of the extension part is connected to the
soldered part arranged on the side of the extended outlet of the adjacent assembly substrate.
Assembly substrate.
[0035]
(Additional Item 7) A substrate for electrically connecting a multi-core coaxial cable to a
transducer of an ultrasonic probe provided with a plurality of piezoelectric elements from which
an ultrasonic beam is emitted, the multi-core coaxial cable And a cable fixing portion provided on
the substrate body with a groove portion for positioning and fixing the signal wire of the multicore coaxial cable, and a substrate main body having a mounting electrode connected to the
signal line of Characteristic assembly board.
[0036]
(Additional Item 8) The assembly substrate according to Additional Item 7, characterized in that
at least a part of the substrate main body is extended, and at least the extended part is provided
with flexibility.
[0037]
(Appendix 9) The assembly substrate according to appendix 8, wherein the extension outlets of
the extension portions are staggered in the form of a zigzag between the other assembly
substrates adjacent to each other.
[0038]
(Additional Item 10) The assembly substrate according to Additional Item 9, characterized in that
a soldered portion is provided at the tip of the extended portion.
[0039]
(Additional Item 11) The soldered portion provided at the tip of the extended portion is
connected to the soldered portion arranged on the side of the extended outlet of the adjacent
assembly substrate. Assembly substrate.
[0040]
As described above, according to the present invention, an assembly substrate in which the core
wire and the shield wire of the cable can be soldered from the same direction without requiring a
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jig for positioning the cable. Can be realized.
[0041]
Brief description of the drawings
[0042]
1 to 5 relate to a first embodiment of the present invention, and FIG. 1 is an explanatory
perspective view showing an assembly substrate.
[0043]
2 is a perspective view of the multi-core coaxial cable mounted on the assembly substrate in FIG.
[0044]
3 is an enlarged perspective view of FIG.
[0045]
4 is a diagram for explaining the GND line of the assembly substrate in FIG. 1, FIG. 4 (a) is an
explanatory view in which the GND line is provided above the GND electrode, FIG. 4 (b) is the
GND electrode oppositely. Explanatory drawing in which is provided above the GND line.
[0046]
5 is an explanatory view when assembling the plurality of assembly substrates in a zigzag form
with the GND line and the GND electrode.
[0047]
6 is an explanatory perspective view showing an assembly substrate according to a second
embodiment of the present invention.
[0048]
7 is an enlarged perspective view of the multi-core coaxial cable mounted on the assembly
substrate in FIG.
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[0049]
Explanation of sign
[0050]
1, 31 ... assembly substrate 2 ... mounting electrode 3, 32 ... substrate main body 4, 34 ... cable
fixing member 5 ... cable fixing portion 6 ... signal layer 7 ... GND layer 11 ... coaxial cable (multicore coaxial cable) 11 a ... cable 11b Core wire 11c Dielectric 11d Shield wire 12 Conductive
adhesive 21 GND line 22 GND electrode 33 Grooved portion
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