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DESCRIPTION JP2004104667

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DESCRIPTION JP2004104667
An object of the present invention is to produce a matching layer that prevents polishing residue
from adhering to the surface of the matching layer even when the cutting step and the cleaning
step are performed simultaneously, and has predetermined dimensions without post-processing
of the matching layer surface. A matching member 1 fixed to a fixing jig 2 is cut by a rotating
tooth 5 of a cutting device to a predetermined thickness, that is, a thickness corresponding to 1⁄4
wavelength of a resonance frequency of a piezoelectric body, and a matching member 1. Polish
the cut surface of 1. In addition, diamond grains are fixed to both surfaces of the outermost
surface of the rotary tooth (blade) 5 of the cutting device which is at least larger than the cut
thickness of the alignment member 1. In addition, polishing water is discharged to the rotating
teeth 5 so as to cover at least the cutting surface using pure water as flowing water. In this way,
in order to clean the surface of the alignment member 1 during cutting, it is possible to remove
cutting residues adhering to the cutting surface of the alignment layer. [Selected figure] Figure 1
Method of manufacturing matching layer and ultrasonic sensor using the same
TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing a
matching layer of an ultrasonic flowmeter that measures the flow rate of gas or liquid using
ultrasonic waves, and an ultrasonic sensor using the same. It is a thing. A conventional method
for producing a matching layer is disclosed, for example, in Patent Document 1. As shown in FIG.
4A, the matching layer member made of a mixture of the micro balloon 20 and the resin 21 and
the load case made of the cylindrical member 22 are integrally formed. Then, as shown in FIG.
4B, it is cut to a thickness corresponding to 1⁄4 wavelength of the resonance frequency of the
piezoelectric element. Then, using the matching layer 23 created as described above, as shown in
FIG. 4C, the matching layer 23 is placed on the piezoelectric transducer 24 to form an ultrasonic
transducer. Patent Document 1: Japanese Patent Publication No. 6-101880 However, the
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matching layer using this conventional manufacturing method is composed of a matching layer
member and a tubular member. Although the load case is integrally molded and cut to a
thickness corresponding to a quarter wavelength of the resonance frequency, it is difficult to cut
to a predetermined matching layer thickness only by cutting. In addition, after cutting the
matching layer, in order to control the thickness of the matching layer, it is necessary to polish
the surface of the matching layer. Further, when the piezoelectric element is bonded to the
polished matching layer, the residue at the time of cutting adheres to the surface of the matching
layer, so that the piezoelectric element 24 and the matching layer 23 are not uniformly bonded
at the adhesive layer interface. As described above, according to the conventional manufacturing
method of the matching layer, since the surface is polished after cutting from the matching
member, polishing residue dust generated during the polishing adheres to the surface of the
matching layer. After cutting, the surface of the matching layer 23 has a porosity forming a
minute concave due to a crack of a hollow sphere, and polishing residue dust adheres to the
concave surface and the resin surface other than the concave surface. The polishing residue is a
thermosetting resin constituting the matching layer, a single substance such as hollow sphere
fragments, or a composite thereof, with these polishing residues adhering to the surface of the
matching layer. When the matching layer is fixed to the top of the case or the piezoelectric
element after applying or printing an adhesive on the surface of the matching layer, there is a
problem that sufficient adhesive strength can not be obtained. On the other hand, in order to
remove the polishing residue on the surface of the matching layer, there is a method in which the
matching layer is immersed in a solvent or pure water and ultrasonically cleaned. In the surface
where the adhesive layer is in close contact, the polishing residue can not be removed at a time
because the polishing residue can not be removed even by ultrasonic cleaning.
In order to prevent the surfaces of the matching layers 4 from adhering to each other, it is
necessary to create a jig for installing the matching layers one by one in an open state, so the
number of work processes increases and the work content becomes complicated. Also, depending
on the solvent used, there is a risk that the surface of the thermosetting resin, which is a
constituent material of the matching layer, may swell, and further, the polishing residue on the
surface of the matching layer due to air can not be completely removed. The The present
invention solves the above-mentioned conventional problems, and it is an object of the present
invention to provide a method of manufacturing a matching layer which eliminates the need for
the step of polishing the surface of the matching layer and improves the adhesion between the
case top and the surface of the matching layer. To aim. SUMMARY OF THE INVENTION In order
to solve the above-mentioned conventional problems, the method of manufacturing the matching
layer of the present invention comprises cutting the matching member in a step of cutting a
predetermined thickness, that is, a quarter wavelength of the resonance frequency. Therefore, the
post-processing step for adjusting the thickness by polishing the matching layer is not required.
Furthermore, the matching layer carries out the cleaning step at the time of cutting and cutting
of the matching member, so that no deposit consisting of the material for forming the matching
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layer remains on the surface of the matching layer. Therefore, the matching layer surface is
uniformly bonded to the case top outer wall surface because there is no minute unevenness on
the matching layer surface due to polishing residue on the matching layer surface. Therefore, the
matching layer of the present invention improves the adhesion between the matching layer
surface and the case top outer wall surface. According to the first aspect of the present invention,
the matching layer for efficiently propagating the vibration of the vibrating means into the gas is
a matching comprising the hollow sphere and the bonding material surrounding the hollow
sphere. The member is made to have a predetermined thickness only in the cutting process, and
the step of grinding the conventional alignment member to a predetermined thickness after
cutting is unnecessary. The invention according to claim 2 is characterized in that a fixing jig for
fixing the alignment member is installed in a cutting device and a cutting step of cutting the
alignment member, a residue of the alignment member at the time of cutting is the surface of the
alignment layer It is possible to provide a matching layer that does not adhere to the upper
surface and does not adhere to the polishing residue generated during polishing. In the invention
according to the third aspect, the cutting process simultaneously performs the cutting process of
the aligning member and the polishing process, and after the cutting of the aligning member, the
process of polishing the surface of the aligning layer in post processing is omitted. Since the
process can be simplified, the process can be simplified. The invention according to claim 4 is
that the surface of the cutter used in the cutting device is formed with particles of a material
harder than the alignment member, and the surface for cutting the alignment member has no
slope and is high. The alignment member can be cut while maintaining the flatness.
The invention according to claim 5 provides particles having an abrasive function on both sides
of the cutter used in the cutting device, and the flatness of both the cut surface and back surface
of the matching layer obtained by cutting the matching member is measured. There is no
difference. In the invention according to claim 6, in the cleaning step, cleaning is performed by
bringing the cutting portion of the alignment member into contact with the fluid for cleaning,
and chips generated when cutting the alignment member are removed from the surface of the
alignment layer by the fluid. In order to prevent adhesion to the surface of the matching layer
after cutting. [0015] The invention according to claim 7 is that the cleaning liquid used in the
cleaning step is pure water, and the cutter of the cutting device generated at the same time as the
removal of the chips generated at the time of cutting the aligning member. By the frictional heat
of the matching member, it is possible to prevent the change in physical properties of the cut
portion of the matching layer. The invention according to claim 8 is a cylindrical case having a
top portion and a side wall portion, a piezoelectric body fixed to the inner wall surface of the top
portion, and a top and bottom outer wall surface provided with an adhesive layer. An alignment
layer according to at least one of paragraphs 1 to 7 and a support portion provided on the outer
wall of the side wall portion, wherein the alignment layer surface and the case top surface are
used in order to use an alignment layer free of deposits. The adhesion can be improved, and an
ultrasonic sensor can be provided in which vibration from the piezoelectric body can be
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efficiently transmitted to the matching layer through the case. Embodiments of the present
invention will be described below with reference to the drawings. Example 1 Hereinafter, an
example of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1A, FIG. 1B,
and FIG. 1C are schematic views of a fixing jig and a cutting process of the alignment member in
the first embodiment of the present invention. Reference numeral 1 shown in FIG. 1A is an
alignment member. The alignment member 1 is a mixture of hollow spheres and a thermosetting
resin. Here, the hollow sphere is a hollow glass having a hollow structure. The hollow glass has a
particle size of 10 to 100 um and an average particle size of about 60 um. The hollow glass and
an epoxy resin as a bonding material were mixed to form a cylindrical alignment member 1. The
alignment member 1 is fixed using a fixing jig 2. The alignment member 1 is fixed by sliding the
slide portion 3 of the fixing jig 2. The fixing jig 2 to which the alignment member 1 is fixed is
installed in a cutting device to cut the alignment member 1. The fixing jig 2 has a comb-like
support 4 for fixing the alignment member 1. The material of the fixing jig 2, the slide portion 3
and the support portion 4 was a stainless steel material.
FIG. 1 (b) shows a side view of the support 4 in a comb-like shape sandwiching the alignment
member 1. In order for the support portion 4 to be fixed along the outer peripheral shape of the
alignment member 1, the side of the alignment member 1 is not damaged by holding. Here, a
circular shape is used for the cross section of the alignment member 1, but the shape is not
limited as long as it can be fixed by the fixing jig 2. The alignment member 1 is cut by moving the
teeth of the cutting device between the support portions 4 of the fixing jig 2. By adjusting the
thickness of the comb teeth of the support portion 4, the thickness of the alignment layer formed
by cutting the alignment member 1 with a cutting device is controlled. In addition, the fixing jig 2
can fix the alignment layer 1 which has been cut by the cutting device so that the alignment layer
which is cut does not scatter by having the support portion 4. As a result, the cut alignment layer
can be held in the fixing jig without being damaged. FIG. 1C shows a cutting process of the
alignment member by the cutting device. The alignment member 1 fixed to the fixing jig 2 is cut
by the rotating teeth 5 of the cutting device to a predetermined thickness, that is, a thickness
corresponding to 1⁄4 wavelength of the resonance frequency of the piezoelectric body and the
cut surface of the alignment member 1 Polish. The tooth which fixed the diamond grain was used
for both sides of the outermost circumference larger than the cutting thickness of at least
alignment member 1 of rotation tooth 5 (blade) of a cutting device here. The diamond grains are
fixed to the rotating teeth 5 because the rotating teeth 5 of this specification have a high
hardness capable of cutting out a silicon wafer. If the alignment member 1 is cut with a rotary
tooth having a hardness lower than the hardness of the alignment member 1, the cross section of
the alignment member 1 is cut with an inclination, so that the alignment layer having a
predetermined thickness can not be taken out. The material is not limited to diamond particles as
long as the material has a hardness higher than that of the alignment member 1. Further, since
the diamond particles are fixed to both surfaces of the rotary tooth 5, the cutting speed of both
surfaces of the rotary tooth is constant, so that the rotary tooth 5 is not bent and the alignment
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member 1 is not cut. Further, when the aligning member 1 is cut, polishing water is discharged
to the rotating teeth 5 so as to cover at least the cutting surface using pure water as flowing
water. In this way, in order to clean the surface of the alignment member 1 during cutting, it is
possible to remove cutting residues adhering to the cutting surface of the alignment layer.
Furthermore, the adhesive layer can be formed uniformly on the adhesive surface of the
matching layer. In this example, the cutting device used was a product number DAD 321 which is
a dicing device manufactured by DISCO Corporation, and the rotating teeth (blades) used were
rotating teeth to which diamond grains are adhered in the cutting circumferential portion.
However, if the object is achieved as a means for solving the problem, it is not limited to the
above-mentioned device. Moreover, although the jig having the comb-like support 4 is described
as the fixing jig 2, the movement of the rotary teeth 5 of the cutting device is very precise and
movement corresponding to the thickness of the matching layer is possible. In addition, as long
as the alignment member 1 can be fixed without moving during cutting, the fixing jig 7 that fixes
the outer periphery of the alignment member 1 with the electron wax 6 as shown in FIG. Here, a
thermosetting epoxy resin material was used as the fixing jig 7. As shown in FIG. 2B, in order to
cut the entire cross section of the aligning member 1, the fixing jig 7 is preferably made of a
material such as a plastic material or the like which has a lighter cutting load on the rotating
teeth 5 than the aligning member 1. In the present invention, the surface state of the matching
layer prepared by controlling to a predetermined thickness corresponding to 1⁄4 wavelength of
the resonance frequency of the piezoelectric body, and the surface state of the matching layer
controlled to the same thickness by conventional polishing The electron micrographs were
compared. The matching layer surface prepared by the conventional method is completed with
the polishing residue adhering to the concave hollow glass surface. On the other hand, in the
case of the matching layer surface prepared according to the present invention, it was found that
the cutting and holding residue generated from the matching member was not adhered to the
epoxy resin surface and the surface hollow glass and was removed cleanly. From this, on the
surface of the alignment layer cut in the present invention, no residue due to the constituent
material of the alignment member, which is generated when the alignment member is cut, is
attached. Therefore, by applying or printing an adhesive on the surface of the matching layer, the
component material surface of the ultrasonic transducer can be uniformly bonded, and the
bonding strength of the matching layer can be improved. Second Embodiment FIG. 3A is a crosssectional view of an ultrasonic sensor according to a second embodiment of the present
invention. 8 is an ultrasonic sensor, 9 is a case, 10 is a top portion of the case 9, and 11 is a
matching layer fixed to the top portion 10 and manufactured by the manufacturing method of
the present invention. The reference numeral 12 denotes a piezoelectric body disposed on the
inner wall surface of the top portion 10 of the case 9, and the reference numeral 13 denotes a
support for fixing the case 9. 14 is a conductor, 15 is a terminal plate fixed to the support
portion 13, 16a and 16b are terminals fixed to the terminal plate 15, and 17 is an insulating
portion for insulating the terminal 16a from the terminal 16b. Reference numeral 18 denotes a
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groove provided in the piezoelectric body 13. When a voltage is applied to the piezoelectric body
11 from the terminals 16a and 16b via the conductor 14, the piezoelectric body 12 vibrates by
the piezoelectric phenomenon. FIG. 3B is an enlarged view of the top 10 of the case 9 of FIG. 3A
and the matching layer 11 fixed to the top 10, in particular.
An epoxy-based adhesive 19 is used to bond and fix the top 10 and the matching layer 11 of the
case 9. The piezoelectric body of FIG. 3A vibrates at about 500 KHz, and the vibration is
transmitted to the case 9 and further transmitted to the matching layer 11 through the epoxy
adhesive 19 shown in FIG. 3B. The vibration of the matching layer 11 propagates to the gas as a
sound wave. When the matching layer prepared by the conventional polishing manufacturing
method is similarly adhered to the case 9, the polishing residue adheres to the surface of the
matching layer 11, so the epoxy is formed between the matching layer surface and the top 10
surface of the case 9. An uneven layer portion of the adhesive layer results. As a result, the
adhesion between the matching layer and the case is reduced, and the vibration from the
piezoelectric body can not be efficiently transmitted from the case to the matching layer, which
causes the characteristics of the ultrasonic sensor to be degraded. On the other hand, since the
residue generated at the time of cutting the matching member is not attached to the surface of
the matching layer 11 of the ultrasonic sensor 8 of the present invention, the epoxy adhesive 19
is printed on the surface of the matching layer 11 When fixed by pressure to the surface of the
top portion 10 of the case 9 and thermally cured, an epoxy adhesive layer 19 is uniformly
formed between the surface of the matching layer 11 and the surface of the top portion 10.
Therefore, the adhesion between the matching layers 11 and the case 9 is stably improved. Then,
the vibration of the piezoelectric body 12 can be efficiently propagated to the matching layer 12
through the case 9. As described above, according to the first aspect of the present invention, the
matching layer has a predetermined thickness from the matching member, that is, the matching
layer having a thickness corresponding to 1⁄4 wavelength of the resonance frequency of the
piezoelectric body. Since the alignment layer surface is provided in the cutting step without
polishing, the polishing step for adjusting the thickness can be omitted. According to the present
invention as set forth in claims 2 and 3, since the cutting process, the polishing process and the
cleaning process can be simultaneously advanced in one process, the process can be simplified.
Furthermore, since the polishing residue is not attached to the surface of the cut matching layer,
the adhesion by bonding of the matching layer can be improved. According to the fourth and
fifth aspects of the present invention, it is possible to provide a matching layer with high
thickness accuracy because the matching layer surface does not have a slope and there is no
difference in the flatness of the matching layer. According to the sixth and seventh aspects of the
present invention, the surface of the matching layer has no adhesion of polishing residue, and
there is no change in the material of the surface of the matching layer, so that the vibration from
the piezoelectric body is efficiently received. Further, it can be propagated from the matching
layer to the gas without reducing the vibration. According to the eighth aspect of the present
invention, since the matching layer according to any of the first to seventh aspects is used, an
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ultrasonic sensor capable of efficiently performing ultrasonic oscillation and reception can be
provided.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a plan view showing a fixing jig of a matching
member in a method of manufacturing a matching layer according to a first embodiment of the
present invention. The side view which shows (c) The side view which shows the cutting process
of the alignment member in the same method. (FIG. 2) (a) The perspective view which shows
another fixing method of the alignment member in the method (b) Another invention of this
invention in the method A side view showing a cutting process of the alignment member. (FIG. 3)
(a) A cross sectional view showing an ultrasonic sensor in Example 2 of the present invention (b)
A partial cross sectional view showing adhesion between the alignment layer of the same sensor
and the top of the case. 4A is a cross-sectional view showing the integral molding of a
conventional matching layer member and a cylindrical member, and FIG. 4B is a cross-sectional
view showing the matching layer after cutting. [Description of the code] 1 Alignment member 2
Fixing jig 3 Slide part 4 Support part 5 Rotating teeth 8 Ultrasonic sensor 9 Case 10 Top part 11
Matching layer 12 Piezoelectric element 19 Epoxy resin layer 20 Glass balloon 21 Resin 22 Load
case
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