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DESCRIPTION JP2006023098

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DESCRIPTION JP2006023098
An object of the present invention is to separate a piezoelectric body from a mounting body and
ensure recovery of a lead-containing piezoelectric body. A piezoelectric body 3 is bonded to a
matching layer 1 as a mounting body via a bonding material 2. The bonding material is formed
by mixing carbon fibers in the pressure-sensitive adhesive in order to exert one electrode
function of the piezoelectric body 3 and has a thickness of about 5 to 30 μm. Then, a sheet-like
pressure-sensitive adhesive is pressurized and attached to the matching layer 1 by a laminator,
and then the sheet substrate is peeled off, and the piezoelectric body 3 is attached and
pressurized. As a result, the lead-containing piezoelectric body 3 can be separated easily and
reliably. [Selected figure] Figure 1
Ultrasonic transducer and ultrasonic flow measurement apparatus using the same
[0001]
The present invention relates to an ultrasonic transducer used to measure the flow rate and flow
rate of fluid.
[0002]
Conventionally, in this type of ultrasonic transducer, an acoustic matching layer is directly
bonded to a piezoelectric body, or, as shown in FIG. 4, the piezoelectric body 22 is formed on the
inner surface of the top wall of a cap-like conductive case 21. It bonded and there also was what
fixed the acoustic matching layer 23 by adhesion to the top wall outer surface.
[0003]
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The lower opening of the case 21 is closed by a conductive base 24.
The other terminal 26 is disposed on the base 24 via the insulating material 27 in a state in
which one of the terminals 25 is electrically connected.
[0004]
That is, the upper surface electrode of the piezoelectric body 22 is connected to one terminal 25
through the case 21 and the base 24, and the lower surface electrode is connected to the other
terminal 26 through the lead wire 28 (see, for example, Patent Document 1). .
Japanese Patent Application Publication No. 2003-270013
[0005]
However, in the conventional configuration, it is difficult to easily and completely separate the
piezoelectric body from the acoustic matching layer or the case at the time of disposal after use,
or when an adhesion failure occurs in a manufacturing process. As is well known, piezoelectrics
contain lead, such as lead zirconate titanate, and so it takes time and effort to separate and
collect them at the time of disposal, etc., and lead to environmental issues regarding the disposal
of lead. I had it.
[0006]
The present invention solves the above-mentioned conventional problems, and an object thereof
is to rationally dispose the piezoelectric body so that it can be easily separated.
[0007]
In order to solve the above-mentioned conventional problems, in the ultrasonic transducer
according to the present invention, a piezoelectric body is bonded to a mounting body via a
bonding material, and the bonding material is made of a material whose bonding strength is
reduced by heat. The separation of the piezoelectric body can be facilitated.
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[0008]
According to the ultrasonic transducer of the present invention, since the mounting body and the
piezoelectric body can be easily separated and disassembled, only the mounting body excluding
the piezoelectric body can be targeted at the time of disposal, and rational disposal becomes
possible. .
Moreover, the lead-containing piezoelectric material can be processed without adversely
affecting the environment.
[0009]
In the embodiment of the present invention, the piezoelectric body is bonded to the mounting
body via a bonding material, and the bonding material is made of a material whose bonding
strength is reduced by a predetermined process.
[0010]
Specifically, it is made of a material whose bonding strength is reduced by heat, a material whose
bonding strength is reduced by light, or a material whose bonding strength is reduced by
chemical treatment.
The present invention can be applied to an ultrasonic flow measurement apparatus in which at
least one pair of ultrasonic transducers is arranged to measure the flow velocity, flow rate, and
the like of a fluid.
[0011]
Hereinafter, specific embodiments of the present invention will be described with reference to
the drawings.
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The present invention is not limited by the present embodiment.
[0012]
Embodiment 1 In FIG. 1, a piezoelectric body 3 is bonded to a matching layer 1 serving as a
mounting body via a bonding material 2, whereby an ultrasonic transducer 4 is configured.
[0013]
The bonding material 2 also serves as one of the electrode portions of the piezoelectric body 3
and is therefore made of a conductive adhesive.
[0014]
The operation of the ultrasonic transducer 4 configured as described above will be described
below.
[0015]
The matching layer 1 to be a mounting body is a mixture of an epoxy resin and a glass balloon.
The conductive pressure-sensitive adhesive to be the bonding material 2 is in the form of a sheet
in which the piezoelectric body 3 and the matching layer 1 are directly bonded, and has a
thickness of about 5 to 30 μm.
The conductive pressure-sensitive adhesive is obtained by mixing carbon fibers in the pressuresensitive adhesive, and a sheet-like pressure-sensitive adhesive is attached to the matching layer
1 by pressure using a laminator.
Next, the sheet substrate of the conductive pressure-sensitive adhesive attached to the matching
layer 1 is peeled off, the piezoelectric body 3 is attached, and pressure is applied.
[0016]
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The ultrasonic transducer 4 is manufactured by the above procedure. However, it is necessary to
separate at the time of disposal, or when a bonding failure occurs in the manufacturing process,
or the like.
[0017]
The means for separating the piezoelectric body 3 and the matching layer 1 is performed, for
example, by heat. The conductive adhesive used as the bonding material 2 uses, for example, a
conductive adhesive tape to which a thermal foaming agent is added. The conductive adhesive
tape to which the thermal foaming agent is added generates a gas by the thermal reaction of the
foaming agent upon heating to generate a gas, and the bonding portion between the conductive
adhesive tape and the matching layer 1 or the conductive adhesive tape The bonding area of the
bonding portion with the piezoelectric body 3 is reduced, and the bonding strength is reduced, so
that it can be easily and completely separated by a weak tensile stress of about 5 kgf / cm2. The
heating method is performed in an oven at a heating temperature of about 100.degree.
[0018]
Other predetermined means may use ultraviolet light. The bonding material 2 in this case is, for
example, an ultraviolet curing adhesive. The UV curing adhesive cures and shrinks the adhesive
by irradiating the bonding portion with ultraviolet light at the time of peeling, the adhesive force
is reduced due to the stress, and the piezoelectric 3 and the matching layer 1 are easily and
completely made by a weak force. It can be separated.
[0019]
The premise of this example is that the matching layer 1 be transparent to ultraviolet light. As
described above, in the case where the matching layer 1 is a mixture of an epoxy resin and a
glass balloon, it is conceivable that ultraviolet light is transmitted through the glass balloon.
[0020]
The other predetermined means are chemical treatments. The adhesive which is the bonding
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material 2 uses, for example, polyvinyl alcohol. Chemical treatment is performed by immersion in
a solvent such as water or alcohol. The polyvinyl alcohol-based pressure-sensitive adhesive can
be dissolved by immersion in water, and the piezoelectric body 3 and the matching layer 1 can
be separated easily and completely.
[0021]
As described above, in the present embodiment, by using a conductive adhesive as the bonding
material 2 between the piezoelectric body 3 and the matching layer 1, the piezoelectric body 3
can be separated easily and reliably, and lead is discarded. Environmental issues can be solved.
[0022]
By the way, in bonding by the conventional adhesive, it is difficult for the piezoelectric body to be
broken and to be completely separated from the matching layer at the time of separation because
they are bonded with very high strength of 100 to 400 kgf / cm <2>. The
[0023]
The example shown in FIG. 2 is an example in which the electrodes 5 and 6 are formed on the
upper and lower surfaces of the piezoelectric body 3, and the upper electrode 5 and the
matching layer 1 are bonded by the bonding material 2.
[0024]
In this case, heat and chemical treatment means are suitable as means for reducing the bonding
strength of the bonding material 2.
[0025]
The predetermined means may simultaneously perform a plurality of heat, light and chemical
treatments.
Further, in the present embodiment, bonding of the matching layer and the piezoelectric material
has been described, but the same applies to an ultrasonic transducer in which the piezoelectric
material is bonded to the inner surface of the top wall of the case as in the conventional example
shown in FIG. It can be said.
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[0026]
Second Embodiment FIG. 3 is an example adopted for a fluid flow measurement apparatus, in
which a pair of ultrasonic transducers 4 is disposed on the upper side and the lower side in the
flow direction of the fluid passage 11.
Specifically, ultrasonic wave propagation is performed so as to diagonally cross the fluid flowing
through the fluid passage 11, and the sealing material 14, 15 is inserted into the spaces 12, 13
obliquely opened to the fluid passage 11. The ultrasonic transducer 4 is housed airtightly.
[0027]
When the fluid is LP gas, nitrile butyl (NBR) or the like having resistance to the LP gas is used as
the sealing material 14.
[0028]
In the ultrasonic waves, the ultrasonic waves transmitted from the ultrasonic transducer 4 on the
upstream side flow in the fluid and propagate in the forward direction and are received by the
ultrasonic transducer 4 on the downstream side, and then from the ultrasonic transducer 4 on
the downstream side The transmitted ultrasonic wave flows in the fluid and propagates in the
reverse direction and is received by the ultrasonic transducer 4 on the upstream side, and the
measuring means 16 measures the propagation time difference.
[0029]
From the above time difference, the computing means 17 computes the fluid flow velocity from
time to time, and if necessary, multiplies the cross-sectional area of the fluid passage 11 and the
coefficient to calculate the flow rate.
[0030]
As described above, according to the ultrasonic transducer according to the present invention,
since the mounting body and the piezoelectric body can be easily separated and disassembled,
only the mounting body excluding the piezoelectric body at the time of disposal can be targeted,
which is rational. Disposal is possible, and the development to not only fluid flow measurement
devices but also multiple uses is possible.
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[0031]
Ultrasonic transducer cross-sectional view in the embodiment of the present invention Ultrasonic
transducer cross-sectional view in the other embodiment of the present invention Cross-sectional
view of an ultrasonic flow measurement apparatus used for the ultrasonic transducer of the
present invention Cross section of the transducer
Explanation of sign
[0032]
1 Mounting body (matching layer) 2 Bonding material 3 Piezoelectric
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