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DESCRIPTION JP2006110140

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DESCRIPTION JP2006110140
PROBLEM TO BE SOLVED: To provide a compact ultrasonic probe which can be efficiently
connected to signal processing means such as an integrated circuit without depending on the
configuration of a connection pin of an ultrasonic transducer. SOLUTION: A plurality of
ultrasonic vibration elements 16 arranged in a matrix and a plurality of connections provided so
as to project from each of the ultrasonic vibration elements 16 for transmitting electric signals
from the ultrasonic vibration elements 16 A central portion 31 in which a plurality of through
holes 311 for inserting and electrically connecting the leads 22 corresponding to at least a part
of the connecting leads 22 and a connecting lead via the through holes 311 in the central portion
31 And a substrate 30 having an end 32 which can be bent with respect to the central portion 31
for connecting the integrated circuit 22 and the integrated circuit 45 for processing the electric
signal. [Selected figure] Figure 2
Ultrasound probe
[0001]
The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus,
an ultrasonic flaw detector, and the like.
[0002]
Conventionally, an ultrasonic probe used in an ultrasonic diagnostic apparatus has a function to
transmit and receive electrical signals between an ultrasonic sensor (ultrasonic transducer) for
transmitting and receiving ultrasonic waves, an ultrasonic transducer, and an ultrasonic
diagnostic apparatus main body. And an integrated circuit module for controlling an electrical
signal as required.
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[0003]
In recent years, an ultrasonic probe that performs deflection and focusing of an ultrasonic beam
in all directions and is capable of three-dimensional scanning with ultrasonic waves, and a threedimensional object based on ultrasonic information from an object collected by the ultrasonic
probe Examination of the ultrasonic diagnostic apparatus which produces | generates and
displays a (three-dimensional) ultrasonic image is performed.
[0004]
As an ultrasonic probe for realizing omnidirectional focusing and high-speed three-dimensional
scanning of the ultrasonic waves, as shown in FIG. 15, a two-dimensional array in which a large
number of ultrasonic vibration elements constituting an ultrasonic transducer are arranged in a
matrix There is an array ultrasound probe.
Here, FIG. 15 is a schematic view showing a conventional configuration of a two-dimensional
array ultrasonic transducer constituting a two-dimensional array ultrasonic probe, and FIG. 15 (a)
is a perspective view of the two-dimensional array ultrasonic transducer 10. FIG.15 (b) is AA
sectional drawing seen from the arrow direction in FIG. 15 (a).
[0005]
As shown in FIGS. 15 (a) and 15 (b), the two-dimensional array ultrasonic transducer 10 includes
an acoustic matching layer 12, an earth electrode 14, an ultrasonic vibration element
(piezoelectric body) 16, a signal electrode 18, and a backing material 20 The load material phase)
and the connecting leads 22 are provided.
[0006]
The acoustic matching layer 12 is provided so as to be located between a subject (not shown)
and the ultrasonic vibration element 12, and is for matching the acoustic impedance of the
subject and the ultrasonic vibration element 16. is there.
[0007]
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The ground electrode 14 is provided at one end of each ultrasonic transducer 16.
The ground electrode 14 is connected to ground.
[0008]
The ultrasonic vibration element (piezoelectric body) 16 is a piezoelectric element formed of a
two-component or three-component piezoelectric ceramic or the like, and is arranged in a twodimensional matrix.
The two-dimensional arrangement of the ultrasonic transducer elements 16 enables
omnidirectional focusing of ultrasonic waves and high-speed three-dimensional scanning.
[0009]
The signal electrode 18 is provided at the other end (that is, one end different from the ground
electrode 14) of each ultrasonic vibration element 16 and applies electric power for the
piezoelectric effect or electricity based on the ultrasonic wave received from the object. It is an
electrode for inputting a signal.
[0010]
The backing material 20 is provided on the back surface of the ultrasonic vibration element 16
and mechanically supports the ultrasonic vibration element 16.
[0011]
In addition, the backing material 20 damps the movement of the ultrasonic vibration element 16
in order to shorten the ultrasonic pulse.
[0012]
The backing material 20 has a path through which the connection leads 22 can be drawn from
the signal electrodes 18 in the direction perpendicular to the arrangement surface of the
ultrasonic vibration elements 16 so that the ends 221 of the connection leads 22 described later
are two-dimensionally arranged. It is formed.
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[0013]
The connection lead 22 has an end 221 of the connection lead 22 at one end.
The other end is connected to the signal electrode 18 of each ultrasonic transducer 16, and
extends from the signal electrode 18 in the direction perpendicular to the arrangement surface of
the ultrasonic transducer 16, and the path in the backing material 20 , And the end 221 of the
connection lead 22 is pulled out.
Accordingly, the end portions 221 of the connection leads 22 are arranged in a two-dimensional
array on the surface of the backing material 20 opposite to the ultrasonic transducer 16.
[0014]
As described above, when the mounting density of the ultrasonic transducer is increased, the
connection relationship with an integrated circuit or the like for driving the ultrasonic transducer
or processing data from the ultrasonic transducer becomes a problem.
[0015]
A number of proposals have been considered for two-dimensional array ultrasound probes that
solve this problem.
(For example, patent documents 1-patent documents 3).
[0016]
According to Patent Document 1, a structure in which a hole structure is provided in a backing
material to draw out a signal is proposed, and according to Patent Document 2, a substrate
corresponding to the arrangement of ultrasonic transducer elements is stacked to form a signal
extraction portion. The structure to be configured has been proposed.
[0017]
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The structure of the two-dimensional array ultrasonic probe disclosed in these makes it possible
to keep the acoustic characteristics of one element well.
[0018]
Further, according to Patent Document 3, a structure or the like in which a laminated substrate
80 for signal extraction is disposed immediately below an ultrasonic vibration element is
proposed, and a structure capable of extracting a signal relatively easily even if the element pitch
is reduced. Is disclosed.
[0019]
U.S. Pat. No. 5,267,221 Japanese Patent Laid-Open No. 62-2799 U.S. Pat. No. 5,311,095
[0020]
However, since the ultrasonic probe basically comprises connecting the ultrasonic transducer
and the ultrasonic diagnostic apparatus main body by a cable assembly, in a two-dimensional
array ultrasonic probe having a minute ultrasonic vibration element, the ultrasonic transducer An
integrated circuit or the like is required in the vicinity of the ultrasonic transducer for efficiently
extracting an ultrasonic signal from the sensor.
[0021]
On the other hand, in the two-dimensional array ultrasonic probe, in the configuration in which
the signal from the ultrasonic vibration element is transmitted to the ultrasonic diagnostic
apparatus main body, the number of ultrasonic vibration elements is huge, so the number of
cable cores in the cable assembly becomes huge. , Does not match the usage of normal
ultrasound diagnostic equipment.
[0022]
For this reason, an integrated circuit or the like that functions to control the ultrasonic signal
from the ultrasonic transducer and to transmit it to the ultrasonic diagnostic apparatus after
performing an operation to reduce the number of signals is required.
[0023]
That is, it is required not only to draw out the signal line but also to mount an integrated circuit
or the like for controlling an electric signal led from the ultrasonic vibration element group by
the signal line in the vicinity of the ultrasonic transducer at high density.
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[0024]
As a technique for meeting this requirement, as disclosed in Japanese Patent Laid-Open No.
2001-292496 by the present inventors, two types of substrates are electrically and mechanically
connected substantially orthogonally using connection leads. A configuration has been proposed.
[0025]
However, even in this configuration, it is impossible to make the pitch of the connection leads to
be made sufficiently small, which limits the mounting of the connection portion between the
ultrasonic transducer and the integrated circuit at high density.
As a result, there is a problem that the external shape of the ultrasonic probe becomes very large.
In addition, it has been very difficult to three-dimensionally assemble a plurality of substrates in
this configuration.
[0026]
The reason for the limitation in mounting integrated circuit 45 at a high density with respect to
the ultrasonic transducer is that, as in the conventional configuration of the ultrasonic probe
shown in FIG. The connection is made by the relay substrate 300 having only through holes (not
shown), and the substrate 40 on which the integrated circuit 45 is mounted is directly installed
in the through holes formed in the relay substrate 300, ie, the substrate 40 It is to be limited by
the pitch of the connection leads formed in the above and the pitch of the through holes formed
in the relay substrate 300.
[0027]
The present invention has been made in view of the above problems, and an object thereof is to
be able to efficiently connect to an integrated circuit or the like without depending on the
configuration of a connection lead of an ultrasonic transducer, and to reduce the size The present
invention is to provide an ultrasonic probe.
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Another object of the present invention is to provide an ultrasonic probe in which an integrated
circuit or the like for controlling an electric signal guided by a signal line from an ultrasonic
vibration element group is mounted at a high density in the vicinity of the ultrasonic transducer.
[0028]
In order to solve the above-mentioned subject, an ultrasonic probe concerning the invention
according to claim 1 has a plurality of ultrasonic vibration elements arranged in a matrix and the
above-mentioned in order to transmit an electric signal from the ultrasonic vibration element
concerned. A central portion in which a plurality of through holes for inserting and electrically
connecting a plurality of connection leads provided to project from each of the ultrasonic
vibration elements are formed corresponding to at least a part of the connection leads, It has a
substrate comprising an end portion which can be bent with respect to the central portion for
connecting the connection lead through the through hole in the central portion and the
integrated circuit for processing the electric signal. Do.
[0029]
Like this configuration, a central portion in which a plurality of through holes are formed
corresponding to at least a portion of the connection lead of the ultrasonic transducer, and a
signal line extended from each through hole and one end of the signal line are integrated Since a
substrate having an end portion on which an electrode pad for connection to a circuit or the like
is formed is provided, an integrated circuit or the like can be efficiently connected without
depending on the configuration of the connection lead, and a small size An ultrasound probe can
be provided.
[0030]
In order to solve the above-mentioned subject, an ultrasonic probe concerning the invention
according to claim 2 has a plurality of ultrasonic vibration elements arranged in a matrix and the
above-mentioned in order to transmit an electric signal from the ultrasonic vibration element
concerned. A first surface in which a plurality of electrodes for inserting and electrically
connecting a plurality of connection leads provided protruding from each of the ultrasonic
vibration elements are formed corresponding to at least a part of the connection leads and
Inserting the second connection lead, and a relay substrate composed of a second surface facing
the first surface and provided with a second connection lead electrically connected to the
electrode; A central portion in which a plurality of through holes for electrical connection are
formed corresponding to at least a part of the second connection leads, a connection lead
through the through holes in the central portion, and the electric signal Do processing And
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having a substrate made of a bendable end portion with respect to said central portion for
connecting the product circuit.
[0031]
Like this configuration, a first connection on which a plurality of electrodes are formed
corresponding to at least a part of the connection leads and a second connection which is
opposed to the first connection and electrically connected to the electrodes A central portion in
which a plurality of through holes are formed corresponding to at least a part of the second
connection leads, and a relay substrate including a second surface on which the leads are
disposed, and the respective through holes Since a substrate having a signal line extended from a
hole and an end on which an electrode pad for connecting to an integrated circuit etc. is formed
at one end of the signal line is provided, integration is not performed depending on the
configuration of the connection lead. A circuit etc. can be connected efficiently and a small
ultrasonic probe can be provided.
In particular, since the degree of freedom of connection between the through holes and the
electrode pads can be secured by the connection mode between the first surface and the second
surface of the relay substrate, high density mounting of the integrated circuit 45 is achieved. It
can be realized.
[0032]
The ultrasonic probe according to the invention of claim 3 for solving the above-mentioned
problems is characterized in that, in the ultrasonic probe of claim 1 or 2, a plurality of the
substrates are provided.
[0033]
With this configuration, a plurality of the substrates can connect integrated circuits without
depending on the configuration of the connection leads, and the arrangement of the integrated
circuits can be freely provided, thereby providing a compact ultrasonic probe. be able to.
[0034]
In the present invention, for example, all the through holes formed in each substrate are
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connected to all the connection leads provided in the ultrasonic vibration element, and the signal
extraction from the through holes is made different for each substrate. It is
Therefore, drawing out the signal line from the through hole group divided into different areas
for each substrate means drawing out the signal line from the connection lead group divided into
different areas for each substrate.
As described above, since the signal lines drawn from the region constituted by a part of the
connection leads can be selectively drawn out for each substrate, integrated circuits and the like
can be mounted at a high density in the vicinity of the ultrasonic transducers. It becomes.
[0035]
In order to solve the above-mentioned subject, the ultrasonic probe concerning the invention
according to claim 4 is an ultrasonic probe according to claim 3, and as for a plurality of abovementioned substrates, a central part of each substrate is piled up mutually and provided. It is
characterized by
[0036]
As described above, by stacking a plurality of substrates in which through holes electrically
connected corresponding to at least a part of the connection leads are formed, the integrated
circuit or the substrate on which the integrated circuit is mounted can be made with high density.
As it can be connected, a compact ultrasonic probe can be provided.
[0037]
In order to solve the above-mentioned subject, an ultrasonic probe concerning the invention
according to claim 5 is an ultrasonic probe according to any one of claims 1 to 4, wherein an
integrated circuit is mounted at the end. It is characterized by
[0038]
In order to solve the above-mentioned subject, the ultrasonic probe concerning the invention
according to claim 6 is an ultrasonic probe according to any one of claims 1 to 4 in which an
integrated circuit is mounted on the end. A substrate is connected.
[0039]
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The ultrasonic probe according to the invention of claim 7 for solving the above-mentioned
problems is characterized in that, in the ultrasonic probe according to any one of claims 1 to 6,
the substrate is a flexible substrate.
[0040]
According to the present invention, the signal line is drawn from the through hole electrically
connected to the ultrasonic transducer, and connected to an integrated circuit or the like for
controlling the ultrasonic vibration element of the ultrasonic transducer. It becomes easy to
install an integrated circuit etc., without depending on the arrangement of the sonic vibration
elements, and a compact ultrasonic probe can be provided.
[0041]
In addition, since the substrate including the central portion in which the through hole is formed
and the end portion for connecting to the integrated circuit or the like is interposed between the
ultrasonic transducer and the integrated circuit or the like, the signal line formed on the
substrate It is possible to provide an ultrasonic probe in which integrated circuits and the like are
mounted at high density in the vicinity of the ultrasonic transducer because the degree of
freedom in formation is increased.
[0042]
In the present invention, the connection between the signal electrode and the integrated circuit
etc. is realized by using connection leads arranged in a matrix (two-dimensional arrangement)
and inserting and connecting the connection leads into through holes formed in the flexible
substrate.
Furthermore, by overlapping and using flexible substrates, signal lines can be connected to many
integrated circuits and the like.
[0043]
As described above, since the connection pitch can be reduced, the connection portion can be
miniaturized.
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Furthermore, since the substrate 30 is bent to accommodate the substrate on which the
integrated circuit or the like is mounted, the degree of freedom in housing the substrate on which
the integrated circuit or the like is mounted is increased, and the mounting density of the
integrated circuit or the like is improved.
Therefore, the entire ultrasonic probe can be miniaturized.
[0044]
Hereinafter, embodiments of the present invention will be described with reference to the
drawings.
First Embodiment
[0045]
FIG. 1 is a schematic view of a two-dimensional array ultrasonic transducer 10 possessed by a
two-dimensional array ultrasonic probe according to a first embodiment of the present invention.
Fig.1 (a) is a perspective view of the two-dimensional array ultrasonic transducer 10, FIG.1 (b) is
AA sectional drawing seen from the arrow direction in FIG. 1 (a).
[0046]
As shown in FIG. 1A, the two-dimensional array ultrasonic transducer 10 includes an acoustic
matching layer 12, an earth electrode 14, an ultrasonic vibration element (piezoelectric body) 16,
a signal electrode 18, and a backing material 20 (load material phase). And the connection lead
22.
[0047]
The acoustic matching layer 12 is provided so as to be located between a subject (not shown)
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and the ultrasonic vibration element 16, and is for matching the acoustic impedance of the
subject and the ultrasonic vibration element 16. is there.
[0048]
The ground electrode 14 is provided at one end of each ultrasonic transducer 16.
The ground electrode 14 is connected to ground.
[0049]
The ultrasonic vibration element (piezoelectric body) 16 is a piezoelectric element formed of a
two-component or three-component piezoelectric ceramic or the like, and is arranged in a twodimensional matrix.
The two-dimensional arrangement of the ultrasonic transducer elements 16 enables
omnidirectional focusing of ultrasonic waves and high-speed three-dimensional scanning.
[0050]
The signal electrode 18 is provided at the other end (that is, one end different from the ground
electrode 14) of each ultrasonic vibration element 16 and applies electric power for the
piezoelectric effect or electricity based on the ultrasonic wave received from the object. It is an
electrode for inputting a signal.
[0051]
The backing material 20 is provided on the back surface of the ultrasonic vibration element 16
and mechanically supports the ultrasonic vibration element 16.
[0052]
In addition, the backing material 20 damps the movement of the ultrasonic vibration element 16
in order to shorten the ultrasonic pulse.
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[0053]
The backing material 20 is connected to the connection leads 22 in the direction perpendicular
to the arrangement plane of the ultrasonic vibration elements 16 from the signal electrodes 18
so that the end portions 221 of the connection leads 22 described later have the same
arrangement pitch as the ultrasonic vibration elements 16. The route which can be pulled out is
formed.
[0054]
Such a backing material 20 can be prepared by stacking a thin backing material such that the
thickness of the plate is equal to the arrangement pitch, or the like.
[0055]
Also, the thickness of the backing material 20 should be a thickness (attenuated thickness)
sufficient for the wavelength of the ultrasonic frequency used in order to keep the acoustic
characteristics of the ultrasonic transducer good. Do.
[0056]
The connection lead 22 has an end 221 of the connection lead 22 at one end.
The other end is connected to the signal electrode 18 of each ultrasonic transducer 16, and
extends from the signal electrode 18 in the direction perpendicular to the arrangement surface of
the ultrasonic transducer 16, and the path in the backing material 20 , And the end 221 of the
connection lead 22 is pulled out.
Accordingly, the end portions 221 of the connection leads 22 are arranged in a two-dimensional
array on the surface of the backing material 20 opposite to the ultrasonic transducer 16.
[0057]
In the present embodiment, the end 221 of the connection lead 22 is arranged at the same
arrangement pitch as the ultrasonic transducer 16, that is, arranged in the same manner as the
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electrode arrangement. However, the end of the connection lead 22 is It is also possible to make
the wiring pitch of 221 larger than the element pitch.
For example, in the case where a two-dimensional array of connection leads 22 is formed by
bonding the plate-like backing material and the signal line pattern described above, the pattern
of the connection leads 22 to be bonded is expanded as it proceeds toward the end 221 of the
connection lead 22 It can be realized by using the following pattern.
[0058]
FIG. 2 is a perspective view showing the configuration of the ultrasonic probe according to the
first embodiment of the present invention, FIG. 2 (a) is a perspective view of the ultrasonic
transducer 10, and FIG. 2 (b) is an ultrasonic transducer 10. It is a perspective view which shows
the positional relationship in connecting an electrode and the board | substrate 30. FIG.
As shown in FIG. 2A, the two-dimensionally arranged connection leads 22 are electrically
connected to the connection leads 22 drawn from the ultrasonic transducer of the twodimensional array ultrasonic transducer.
The connection lead 22 is formed of a conductive metal and is connected by soldering to a
substrate 30 described later.
[0059]
Further, as shown in FIG. 2B, the substrate 30 has a central portion 31 having a through hole
311 formed corresponding to the connection lead 22 and a through hole 311 so that the
connection lead 22 can be inserted. It comprises an end 32 formed with a signal line 33 which
extends from each other and is connected to an electrode pad 321 provided at the end.
[0060]
Further, the end portion 32 is configured to bend with respect to the central portion 31 at a
boundary line with the central portion 31 (indicated by “bent portion” in the drawing).
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Therefore, by applying a flexible substrate to the substrate 30 of the present invention, the
material has a central portion 31 and an end 32, and the end 32 can be bent with respect to the
central portion 31 (including a flexible material) The end 32 may be bent relative to the central
portion 31.
[0061]
The boundary line (bent portion) does not necessarily have to be clearly provided.
That is, as described above that the material of the substrate may be flexible, a region (central
portion 31) for ensuring the electrical connection with the connection substrate 22 by the
through hole 311, and bending or bending with respect to the region The substrate may have a
region (end portion 32) in which the electrode pad 321 is formed and a signal line 33 for
electrically connecting the through hole 311 and the electrode pad 321.
[0062]
Here, the electrode pad 321 is provided to be connected directly or indirectly to the integrated
circuit 45 that controls the ultrasonic transducer 10.
[0063]
A mode in which the ultrasonic transducer 10 is connected to the substrate 30 of the present
invention configured in this manner is a perspective view shown in FIG.
Further, FIG. 4 shows a front view and a bottom view showing a connection positional
relationship between the ultrasonic transducer 10, an IC substrate 40 on which integrated
circuits such as ICs are mounted, and the substrate 30 in the present embodiment.
[0064]
As shown in FIG. 4A, the substrate 30 of the present embodiment has through holes 311 formed
corresponding to the arrangement of the connection leads 22 provided in the ultrasonic
transducer 10, and the ultrasonic transducer 10 is formed on the ultrasonic transducer 10. A
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central portion 31 having a surface substantially the same size as the surface (the surface on
which the connection leads 22 are arranged) and three rows of through holes 311 provided at
both ends of the central portion 31 and near the end of the central portion 31 , And two end
portions 32 in which a plurality of electrode pads 321 are formed as one end of a signal line 33
extended from each of the two.
[0065]
Further, as shown in FIG. 4B, each electrode pad 321 is an IC substrate 40 such as a rigid
substrate mounted with an integrated circuit 45 such as an IC for processing (amplifying,
switching, etc.) the received signal. “Other substrate” described in the section is connected.
Here, as a configuration of the ultrasonic probe of the present invention, the end 32 is shown
with respect to the central portion 31 and a boundary portion between the central portion 31
and the end 32 (shown as a “bent portion” in the figure).
) And connect the IC substrate 40.
For example, in the case of employing the substrate 30 in a mode in which the two ends 32 are
provided at both ends of the central portion 31, the two ends in a state where the central portion
31 is fixed to the ultrasonic transducer 10 as shown in FIG. By bending 32, the IC substrate 40 is
connected to the electrode pads 321 formed in the vicinity of the end sides of the two end
portions 32.
[0066]
In FIG. 2B, FIG. 3 and FIG. 4, of the through holes 311 formed in the central portion 31, the
signal lines 33 are drawn only from the three rows at both ends, and each is connected to each
electrode pad 321 Although such a configuration is shown, the signal lines 33 may be drawn out
of all the through holes 311 formed in the central portion 31 and electrode pads 321
corresponding to them may be formed.
Also, the through holes 311 and the electrode pads 321 do not necessarily have to be connected
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in a one-to-one connection, and the signal lines 33 drawn from the plurality of through holes 311
may be connected to one electrode pad 321, The signal line 33 drawn out from one through hole
311 may be connected to the plurality of electrode pads 321.
[0067]
Further, in the present embodiment, the IC substrate 40 on which the integrated circuit 45 is
mounted is connected to the electrode pad (multipolar connector) 321. However, the IC substrate
40 does not necessarily need to be connected to the electrode pad 321. The integrated circuit 45
may be directly connected to the electrode pad 321.
That is, the integrated circuit 45 may be mounted on the end 32, and the IC substrate 40 and the
integrated circuit 45 may be mixedly connected to the end 32.
With such a configuration, the mounting space of the member mounted on the end 32 can be
reduced, so that the ultrasonic probe can be miniaturized.
[0068]
Furthermore, in the present embodiment, the configuration of the substrate 30 is made up of one
central portion 31 and two end portions 32 provided at both side ends thereof. Three or more
ends 32 may be provided at the side ends of the central portion 31.
With such a configuration, even when the number of connection leads 22 increases, the signal
lines can be drawn out from the connection leads 22 through the through holes 311 formed in
the central portion 31. Therefore, the space in the ultrasonic probe is effective. As a result, the
integrated circuit 45 can be efficiently installed, and as a result, miniaturization of the ultrasonic
probe can be realized.
[0069]
In addition, in the present embodiment, the configuration of the substrate 30 is made up of one
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central portion 31 and two end portions 32 provided on both side ends thereof. One end 32 may
be provided at the side end of the central portion 31.
With such a configuration, the miniaturized signal lines 33 can be drawn from the connection
leads 22 through the through holes 311 without depending on the arrangement of the
connection leads 22, so the space in the ultrasonic probe can be effectively made. The integrated
circuit 45 can be efficiently installed by utilizing it, and as a result, miniaturization of the
ultrasonic probe can be realized.
[0070]
FIG. 6 is a view for explaining a mechanism for connecting the IC substrate 40 and the cable 60
for connecting the ultrasonic probe and the ultrasonic diagnostic apparatus main body in the
first embodiment of the present invention.
[0071]
As shown in FIG. 6, the cable 60 is a cable for electrically connecting the ultrasonic diagnostic
apparatus main body and the IC substrate 40 and the like.
The cable 60 is composed of a cable assembly FPC 601 (flexible printed circuit board) and a
cover 603 covering the cable assembly FPC 601, and has flexibility.
[0072]
The cable connection substrate 50 is a substrate for connecting the IC substrate 40 and the cable
60 described above.
The cable connection substrate 50 is made of a flexible FPC, and one end of the cable connection
substrate 50 is electrically connected to one end of the IC substrate 40 opposite to the one end
provided with the connection pin (not shown). ing.
[0073]
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The connector 62 is provided on the other end of the cable connection substrate 50 and one end
of the cable assembly FPC 601.
The cable connection substrate 50 and the cable assembly FPC 601 are electrically connected by
the connector 62.
[0074]
With this configuration, compared to the configuration using the relay substrate 300 and the
connection pins 401 as in the conventional example shown in FIG. The arrangement of 22) can
be made small, and hence miniaturization of the ultrasound probe can be realized.
[0075]
In addition, since the substrate 30 including the central portion 31 in which the through hole
311 is formed and the end portion 32 for connecting to the integrated circuit etc. is interposed
between the ultrasonic transducer 10 and the integrated circuit 45, it is formed on the substrate
30. Thus, the degree of freedom in forming the signal lines 33 can be increased, and an
ultrasonic probe in which the integrated circuit 45 is mounted at a high density near the
ultrasonic transducer 10 can be provided.
[0076]
Second Embodiment Next, an ultrasonic probe according to a second embodiment of the present
invention will be described with reference to the drawings.
[0077]
The present embodiment is characterized in that a plurality of substrates 30 are provided in the
first embodiment described above.
In the description of the present embodiment, the configuration of the plurality of substrates 30
will be mainly described, and the description of the parts overlapping with the first embodiment
will be omitted.
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[0078]
FIG. 7 is a perspective view showing a configuration of an ultrasonic probe according to a second
embodiment of the present invention.
As shown in FIG. 7, a plurality of substrates (a first substrate 30a, a second substrate 30b, and a
third substrate 30c) provided so as to overlap on the connection lead 22 side of the ultrasonic
transducer 10 are respectively The sizes of the central portions 31a, 31b, 31c, the arrangement
of the through holes 311 to be formed, and the shapes of the end portions 32a, 32b, 32c are
substantially the same.
[0079]
On the other hand, what is different in the first substrate 30 a, the second substrate 30 b, and the
third substrate 30 c is the aspect of the through holes 311 formed in each central portion 31.
Specifically, a through hole 311 as a through hole not electrically connected to the connection
lead 22 is also formed in at least one of the central portions 31a, 31b, 31c, and each substrate
30 is at least a part of the connection lead Each board | substrate 30 is conduct |
electrically_connected with respect to all the connection leads 22 which conduct |
electrically_connect with 22 and were divided into predetermined area | regions (for example, 3
divisions) as needed.
The through holes provided in all the stacked substrates 30 may be electrically connected to all
the connection leads 22 respectively.
[0080]
For example, as shown in FIGS. 8 (a) to 8 (c), it is composed of a matrix of 12 rows by 12
columns corresponding to connection leads 22 (not shown) composed of a matrix of 12 rows by
12 columns. It is assumed that only a part of the through holes 311 in the through holes 311 of
the central portions 31 a, 31 b and 31 c are extracted by the signal line 33.
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Specifically, as shown in FIG. 8 (a), the first substrate 30a is pulled out from three rows of
through holes 311 near the bent portion of the central portion 31a, and as shown in FIG. 8 (b),
The second substrate 30b is drawn from the bent portion of the central portion 31b from the two
through holes 311 in the fourth and fifth rows, and as shown in FIG. 8C, the third substrate 30c
is This is a case where the first portion of the sixth row is pulled out from the through holes in
the sixth row from the bent portion of the portion 31c.
In this case, the through holes 311 as the through holes formed in the central portion 31a
correspond to the fourth to sixth through holes 311 from the bent portion (indicated by hatching
in the drawing as "non-conductive area").
Further, the through holes 311 as the through holes formed in the central portion 31b
correspond to the through holes 311 in the first to third rows from the bent portion and the
through holes 311 in the sixth row (as a "non-conductive region" in the figure). Show in
hatching).
The through holes 311 as through holes formed in the central portion 31c correspond to the
through holes 311 in the first to fifth rows from the bent portion (indicated by hatching in the
drawing as "non-conductive area").
[0081]
The through holes 311 belonging to the “non-conductive region” in each central portion 31
may be configured as a simple through hole so as not to be electrically connected to the
connection lead 22, or the “non-conductive region” in the central portion 31. The through
holes 311 belonging to the above may not be connected to the electrode pads 321 formed at
each end 32 by the signal line 33.
[0082]
According to the present embodiment, the conduction of the connection leads 22 of the
ultrasonic transducer 10 can be dispersed by the through holes 311, the signal lines 33, and the
electrode pads 321 formed in each of the stacked substrates 30. The arrangement of the
electrode pads 321, that is, the IC substrate 40 can be performed without depending on the
arrangement of the connection leads 22 depending on the method of forming the signal line 33.
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[0083]
The electrode pads 321 electrically connected to the connection leads 22 by being connected to
the through holes 311 formed in the substrates 30a, 30b, and 30c by the signal lines 33 are
shown in FIG. And an IC substrate 40 ("other substrate" in the claims) on which an integrated
circuit 45 such as an IC for processing (amplifying, switching, etc.) processing the received signal
is mounted.
Here, as a configuration of the ultrasonic probe of the present invention, the end portion 32 is
bent with respect to the central portion 31 to connect the IC substrate 40.
For example, when the substrate 30 in a mode in which two end portions 32 are provided at both
ends of the central portion 31 is adopted, the two end portions 32 are bent approximately 90 °
in a state where the central portion 31 is fixed to the ultrasonic transducer 10 Then, the IC
substrate 40 is connected to the electrode pads 321 formed in the vicinity of the end sides of the
two end portions 32, respectively.
[0084]
When a flexible substrate is adopted as the substrate 30, the bent portions of the central portion
31 and the end portion 32 may be bent without being provided intentionally.
At this time, the substrate 40 as the flexible substrate includes the central portion 31 in which
the through hole 311 is formed and the end portion 32 in which the electrode pad 321 is
formed, and the boundary portion between the central portion 31 and the end portion 32 It
suffices to bend at the bent portion ").
[0085]
In the present embodiment, the IC substrate 40 on which the integrated circuit 45 is mounted is
connected to the electrode pad 321. However, the IC substrate 40 does not necessarily have to
be connected to the electrode pad 321. The circuit 45 may be directly connected. That is, the
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integrated circuit 45 may be mounted on the end 32, and the IC substrate 40 and the integrated
circuit 45 may be mixedly connected to the end 32. With such a configuration, the mounting
space of the member mounted on the end 32 can be reduced, so that the ultrasonic probe can be
miniaturized.
[0086]
Furthermore, in the present embodiment, although the configuration of the substrate 30 is made
up of one central portion 31 and two end portions 32 provided at both ends thereof, three for
one central portion 31 The end 32 described above may be provided. With such a configuration,
even when the number of connection leads 22 is increased, the signal lines can be further
distributed from the connection leads 22 through the through holes 311 formed in the central
portion 31, so the space in the ultrasonic probe can be reduced. The integrated circuit 45 can be
efficiently installed with efficient use, and as a result, further miniaturization of the ultrasonic
probe can be realized.
[0087]
FIG. 10 is a view for explaining a mechanism for connecting the IC substrate 40 and the cable 60
for connecting the ultrasonic probe and the ultrasonic diagnostic apparatus main body in the
second embodiment of the present invention.
[0088]
As shown in FIG. 10, the cable 60 is a cable for electrically connecting the ultrasonic diagnostic
apparatus main body and the IC substrate 40 and the like.
The cable 60 is composed of a cable assembly FPC 601 (flexible printed circuit board) and a
cover 603 covering the cable assembly FPC 601, and has flexibility.
[0089]
The cable connection substrate 50 is a substrate for connecting the IC substrate 40 and the cable
60 described above. The cable connection substrate 50 is made of a flexible FPC, and one end of
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the cable connection substrate 50 is electrically connected to one end of the IC substrate 40
opposite to the one end where the connection pin 401 is provided.
[0090]
The connector 62 is provided on the other end of the cable connection substrate 50 and one end
of the cable assembly FPC 601. The cable connection substrate 50 and the cable assembly FPC
601 are electrically connected by the connector 62.
[0091]
As described above, according to the present embodiment, the functions of the substrate on
which the integrated circuit or the like for controlling the ultrasonic transducer is mounted are
dispersed by taking charge of the connection leads which are respectively conducted by the
plurality of superposed substrates. It is possible to increase the degree of freedom of placement
and to increase the mounting density.
[0092]
In addition, by adopting a flexible substrate as the substrate 30, after connecting the flexible
substrate and the substrate on which integrated circuits and the like are mounted in advance,
when connecting with the connection lead, or after connecting the connection lead and the
flexible substrate, the integrated circuit etc. In either case of connection, two connections can be
easily made, and can be connected at high density.
[0093]
On the other hand, only by the operation of inserting the connection lead into the through hole,
by adopting the substrate in which the extended signal line and the through hole are formed for
electrically connecting the connection lead and the electrode pad (IC substrate) As electrical
connection is possible, alignment at the time of connection is not necessary, and connection work
is facilitated. As a result, the mounting size required for connection can be reduced.
[0094]
Furthermore, since it is possible to connect a plurality of flexible substrates simultaneously and
in the same manner by using connection leads, it is possible to connect all the flexible substrates
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in the same operation, which increases the workability.
In addition, since the connection between the connection leads and the integrated circuit is
determined only by the arrangement pitch of the connection leads and the wiring pitch of the
flexible substrate, high density connection is possible.
[0095]
Third Embodiment Next, an ultrasonic probe according to a third embodiment of the present
invention will be described with reference to the drawings.
[0096]
The present embodiment is different from the first and second embodiments described above in
that the plurality of provided substrates 30a, 30b, and 30c are not overlapped at the central
portions 31a, 31b, and 31c, respectively. The substrate 30a, 30b, 30c is characterized in that it
comprises a central portion 31 in which a through hole is provided only in a part of the
connection lead 22, and one end 32 at one side end thereof.
In the description of the present embodiment, the configuration of the plurality of substrates 30
will be mainly described, and the description of portions overlapping with the first embodiment
and the second embodiment will be omitted.
[0097]
FIG. 11 is a perspective view showing a configuration of an ultrasonic probe according to a third
embodiment of the present invention.
As shown in FIG. 11, the sizes of the central portions 31a, 31b, 31c of the respective substrates
(the first substrate 30a, the second substrate 30b, the third substrate 30c) correspond to the
arrangement of the connection leads 22 to be conducted. One end 32a, 32b, 32c is provided at
one side end of each of the central portions 31a, 31b, 31c.
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[0098]
For example, as shown in FIG. 12A, with respect to the connection leads 22 (not shown) formed
of a matrix of 12 rows × 12 columns, the two first substrates 30 a are each of the connection
leads 22. A central portion 31a having only through holes 311 corresponding to three rows from
each end, a signal line 33 drawn from each through hole formed in the central portion 31a, and
an end portion on which an electrode pad 321 is formed And 32a.
[0099]
Further, as shown in FIG. 12B, with respect to the connection leads 22 (not shown) formed of a
matrix of 12 rows × 12 columns, the two second substrates 30 b are each of the connection
leads 22. In order to lead out the signal lines 33 from the through holes 311 corresponding to
the fourth and fifth columns from both ends, the central portion 31 b in which the through holes
311 are formed in a matrix of 12 rows × 6 columns, and the central portion 31 b Among the
respective through holes, the signal line 33 drawn from the through holes 311 corresponding to
the fourth row and the fifth row from both ends of the connection lead 22 and the end 32 b
where the electrode pad 321 is formed Have.
[0100]
Further, as shown in FIG. 12C, with respect to the connection leads 22 (not shown) formed of a
matrix of 12 rows × 12 columns, the two third substrates 30 c are each of the connection leads
22. In order to lead out the signal lines 33 from the through holes 311 corresponding to the
sixth column from both ends, the central portion 31 c in which the through holes 311 are formed
in a matrix of 12 rows × 6 columns, and each through formed in the central portion 31 c Among
the holes, the signal line 33 drawn from the through hole 311 corresponding to the sixth column
from both ends of the connection lead 22 and the end 32 c where the electrode pad 321 is
formed.
[0101]
The through holes 311 not conducted to the connection leads 22 in each central portion 31 may
be configured as a simple through hole so as not to be electrically connected to the connection
leads 22, or the through holes not conducted to the connection leads 22 in the central portion
31. The signal line 33 may not be connected to the electrode pad 321 formed at each end 32.
[0102]
According to the present embodiment, the size of each central portion 31 is changed according
to the arrangement on the side of the connection lead 22 to be made conductive without
depending on the size of the surface on the side of the connection lead 22 of the ultrasonic
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transducer 10. Therefore, the manufacturing cost of the substrate 30 can be reduced, and signal
extraction from the partial connection lead 22 can be effectively realized.
[0103]
Fourth Embodiment Next, an ultrasonic probe according to a fourth embodiment of the present
invention will be described with reference to the drawings.
[0104]
In the present embodiment, as in the first to third embodiments described above, the connection
lead 22 formed on the ultrasonic transducer 10 is not connected to the substrate 30, but the
ultrasonic transducer 10 is connected. It is characterized in that a relay substrate 70 in which the
arrangement interval (pitch) and / or the arrangement order of the connection leads 22 is
changed is interposed between the first and second substrates 30.
In the description of the present embodiment, the configuration of the relay substrate 70 will be
mainly described, and the description of the portions overlapping with the first to third
embodiments will be omitted.
[0105]
13 (a) and 13 (b) are perspective views showing the configuration of the relay substrate 70 in the
present embodiment.
As shown in FIGS. 13A and 13B, the relay substrate 70 faces the first surface on which the
electrode 71 connected to the connection lead 22 of the ultrasonic transducer 10 is formed, and
the first surface. And the second surface on which the second connection lead 72 is disposed.
[0106]
As shown in FIG. 13A, in the first surface of the relay substrate 70, holes 711 for inserting the
connection leads 22 corresponding to the arrangement of the connection leads 22 provided in
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the ultrasonic transducer 10. The bottom of each hole 711 is provided with an electrode (not
shown) for electrically connecting to the inserted connection lead 22.
In the present embodiment, the hole 711 and the electrode are collectively described as the
electrode 71.
[0107]
As shown in FIG. 13B, the second connection leads 72 electrically connected to the electrodes 71
are two-dimensionally arranged on the second surface of the relay substrate 70.
The second connection leads 72 are formed of a conductive metal, and are connected by brazing
on the second surface of the relay substrate 70.
[0108]
Then, as shown in FIG. 14, the electrode 71 of the relay substrate 70 is connected to the
connection lead 22 of the ultrasonic transducer 10, and the second connection lead 72 of the
relay substrate is inserted into and connected to the through hole 311 of the substrate 30. As a
result, the integrated circuit 45 mounted on the substrate 40 connected to the electrode pad 321
of the substrate 30 is electrically connected to the ultrasonic transducer 10.
[0109]
The IC substrate 40 referred to in the present embodiment is also a rigid substrate on which the
integrated circuit 45 for processing (amplifying, switching, etc.) processing transmission /
reception signals as in the above-described embodiments is mounted.
The IC substrate 40 has, at one end thereof, connection pins 401 corresponding to the
arrangement interval (pitch) of the electrode pads 321 of the substrate 30 connected via the
relay substrate 70.
[0110]
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Here, although not shown in FIG. 14, a cable for electrically connecting the ultrasonic probe and
the ultrasonic diagnostic apparatus main body and a cable for connecting the cable to the IC
substrate 40 as in the embodiment described above The cable connection board of is also
provided in the present embodiment.
[0111]
According to the relay substrate 70 having such a configuration, the arrangement interval (pitch)
and arrangement order of the second connection leads 72 arranged on the second surface are
influenced by the arrangement interval and arrangement order of the connection leads 22. It is
possible to freely select the wiring between the electrode 71 and the second connection lead 72
without the need for making the arrangement interval (pitch) and the arrangement order of the
connection leads 22 the same.
[0112]
For example, a pattern in which the relay substrate 70 is formed of a multilayer substrate and the
arrangement interval (pitch) and wiring order are changed in the middle layer thereof (the
connection between the connection lead 22 and the connection pin 401 of the IC substrate 40 is
one to one connection or By providing a many-to-one or one-to-many connection pattern), it is
possible to secure the connection mode between the through hole 311 and the electrode pad
321 formed in the substrate 30 in the above-described embodiment.
[0113]
Therefore, in addition to the function of the substrate 30 of the present invention provided to
improve the degree of freedom of housing the IC substrate 40 on which the integrated circuit 45
is mounted, the connection lead 22 and the integrated circuit 45 have freedom in connection.
Therefore, high density mounting of the integrated circuit 45 can be realized.
[0114]
Each embodiment described above is an example of the present invention, and the present
invention is not limited to each embodiment.
In each of the above-described embodiments, the substrate used for the ultrasonic probe has
been described. However, the integrated circuit or another substrate on which the integrated
circuit is mounted is connected to the connection lead projecting in a matrix shape via the
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substrate. If the configuration is the same, the same effects can be obtained as the effects
obtained by the present invention.
In addition, even if it is other than this, various changes are possible according to design etc. if it
is a range which does not deviate from the technical idea concerning the present invention.
[0115]
BRIEF DESCRIPTION OF THE DRAWINGS The perspective view and sectional drawing which
show the structure of the ultrasonic transducer in 1st Embodiment of the ultrasonic probe which
concerns on this invention.
The perspective view showing the composition of the substrate connected to the ultrasonic
transducer in the 1st embodiment of the ultrasonic probe concerning the present invention, and
an ultrasonic transducer.
BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows the structure which
connected the ultrasonic transducer and board | substrate in 1st Embodiment of the ultrasonic
probe which concerns on this invention.
FIG. 1 is a front view and a bottom view showing the positional relationship between an
ultrasonic transducer and an IC substrate and a substrate in a first embodiment of an ultrasonic
probe according to the present invention.
FIG. 1 is a perspective view showing a configuration of an ultrasound probe according to a first
embodiment of the present invention.
FIG. 1 is a perspective view showing a configuration of an ultrasound probe according to a first
embodiment of the present invention. FIG. 7 is a perspective view showing the configuration of
an ultrasonic transducer and a substrate connected to the ultrasonic transducer in a second
embodiment of the ultrasonic probe according to the present invention. The top view which
shows the structure on each board | substrate in 2nd Embodiment of the ultrasonic probe which
concerns on this invention. The perspective view which shows the structure in 2nd Embodiment
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of the ultrasound probe which concerns on this invention. The perspective view which shows the
structure in 2nd Embodiment of the ultrasound probe which concerns on this invention. FIG. 13
is a perspective view showing the configuration of an ultrasonic transducer and a substrate
connected to the ultrasonic transducer in a third embodiment of the ultrasonic probe according
to the present invention. The top view which shows the structure on each board | substrate in
3rd Embodiment of the ultrasonic probe which concerns on this invention. The perspective view
which shows the structure of the relay substrate in 4th Embodiment of the ultrasonic probe
which concerns on this invention. The perspective view which shows the structure in 4th
Embodiment of the ultrasonic probe which concerns on this invention. The perspective view
which shows the structure of the ultrasonic transducer in the past. FIG. 8 is a perspective view
showing the configuration of a conventional ultrasonic probe.
Explanation of sign
[0116]
DESCRIPTION OF SYMBOLS 10 ultrasonic transducer 12 acoustic matching layer 14 earth
electrode 16 ultrasonic vibration element 18 signal electrode 22 connection lead 30 board 31
center part 32 end part 33 signal wire 311 through hole 321 electrode pad 40 IC board 45
integrated circuit 50 cable connection board 60 Cable 62 connector 70 relay board
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