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DESCRIPTION JP2008211642

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DESCRIPTION JP2008211642
An object of the present invention is to prevent acoustic leakage from the headphone device to
the outside. A so-called inner type headphone device to which the present invention is applied
has a cylindrical case 1 inserted into a human ear, and the open end of the cylindrical case 1 in
the insertion direction is provided. A small speaker 2 having a shape substantially along the inner
diameter of the housing 1 is provided. A ring-shaped piezoelectric element (e.g., a piezoelectric
element) 3 having a shape substantially along the inner diameter of the housing 1 is provided on
the back side of the small speaker 2, that is, the side opposite to the insertion direction of the
housing 1 into the ears. The film material 4 is attached to the piezoelectric element 3. By driving
this film material 4 in reverse phase with respect to the small speaker 2, the sound wave emitted
from the small speaker 2 is offset, and the sound leakage to the back side (the outside) of the
small speaker 2 which is the outside is prevented Do. [Selected figure] Figure 1
Headphone device
[0001]
The present invention relates to a headphone device suitable for use, for example, with a portable
audio device. Specifically, a diaphragm is provided between the built-in speaker and the outside,
and the diaphragm is driven in reverse phase to the built-in speaker so that sound emitted from
the built-in speaker does not leak to the outside.
[0002]
For example, in a headphone device used together with a portable audio device, there is a
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problem that the sound emitted from the built-in speaker leaks to the outside conventionally.
[0003]
On the other hand, as a device for reducing sound leakage to the outside when headphones are
worn, it has been proposed to estimate in advance the frequency band in which the sound leaks
and to provide an attenuation filter for attenuating the sound leakage frequency band. (See, for
example, Patent Document 1).
Although the invention described in the patent document 1 prevents the sound leaking sound
itself from being emitted from the speaker, this causes a problem such as deterioration of the
quality of the emitted sound itself.
[0004]
On the other hand, in a headphone device, surrounding sound is picked up by a microphone
provided in the vicinity of a visceral speaker, and signals of the opposite phase to the picked-up
sound are supplied to the built-in speaker to offset the surrounding sound. (See, for example,
Patent Document 2). In the invention of Patent Document 2, the ambient sound is offset, so the
sound emitted from the speaker can be clearly heard, but no consideration is given to the sound
leakage to the outside.
[0005]
Japanese Patent No. 2745753 Japanese Patent Application Laid-Open No. 5-145985
[0006]
Thus, for example, in a headphone device used together with a portable audio device, it has been
conventionally considered that the sound emitted from the built-in speaker leaks to the outside.
However, in the prior art, only negative measures are realized, for example, the expected
frequency band is attenuated, and no active prevention of sound leakage to the outside has been
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performed. .
[0007]
The present invention has been made in view of the above-described problems, and an object of
the present invention is to provide a headphone device by providing a function to offset the
sound emitted from the built-in speaker to the outside. , Sound leakage to the outside does not
occur.
[0008]
In order to solve the above-mentioned problems and achieve the object of the present invention,
the invention described in claim 1 has a cylindrical rod inserted into a human ear, and one of the
cylindrical rods is used. A speaker having a shape substantially along the cylindrical inner
diameter provided toward the open end, a ring-shaped piezoelectric element provided on the
back side of the speaker and having a shape substantially along the cylindrical inner diameter,
and the piezoelectric element The headphone device comprises a vibration generating means
made of a film material, and drives the film material attached to the piezoelectric element of the
vibration generating means in reverse phase to the speaker.
[0009]
The headphone device according to claim 2 is characterized in that the film material attached to
the piezoelectric element of the vibration generating means is provided with a through hole
through which a sound wave passes.
[0010]
In the headphone device according to claim 3, driving of the film material attached to the
piezoelectric element of the vibration generating means is performed by supplying a driving
signal supplied to the speaker to the piezoelectric element. is there.
[0011]
In the headphone device according to the fourth aspect of the present invention, an on / off
switch is provided in the supply path of the drive signal to the piezoelectric element.
[0012]
According to the headphone device of the present invention described in the first to fourth
aspects, with respect to the sound emitted to the outside from the built-in speaker, the sound
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generating unit cancels the sound generated by the vibration generating means. Sound leakage
can be prevented.
[0013]
Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 is a
cross-sectional view showing a configuration of an embodiment of a headphone device to which
the present invention is applied.
[0014]
In FIG. 1, the so-called inner type headphone device to which the present invention is applied has
a cylindrical case 1 inserted into the human ear, and the open end of the cylindrical case 1 in the
insertion direction is provided. A small speaker 2 having a shape substantially along the inner
diameter of the housing 1 is provided.
Therefore, sound is emitted mainly from the small speaker 2 in the insertion direction of the
housing 1 into the ear.
[0015]
A ring-shaped piezoelectric element (e.g., a piezoelectric element) 3 having a shape substantially
along the inner diameter of the housing 1 is provided on the back side of the small speaker 2,
that is, the side opposite to the insertion direction of the housing 1 into the ears. The film
material 4 is attached to the piezoelectric element 3.
The film material 4 is provided with a through hole through which the sound emitted from the
small speaker 2 passes.
[0016]
Furthermore, the signal circuit is as shown in FIG.
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In FIG. 2, an acoustic signal supplied from, for example, a portable acoustic device (not shown) to
the terminal 10 is supplied to the small speaker 2 through the attenuator 11 and the forward
rotation amplifier 12.
Further, the acoustic signal supplied to the terminal 10 is supplied to the piezoelectric element 3
through the switch 13, the attenuator 14 and the inverting amplifier 15.
[0017]
In the headphone device having such a configuration, the acoustic signal supplied to the terminal
10 is brought to a predetermined level by the attenuator 11 and the non-inverting amplifier 12
and supplied to the small speaker 2, for example, an acoustic wave as schematically shown in
FIG. And emitted from the small speaker 2.
Although shown as a sine wave for convenience in the drawing, actually it is a more complicated
waveform.
[0018]
At the same time, an acoustic signal supplied to the terminal 10 is supplied to the piezoelectric
element 3 through the attenuator 14 and the inverting amplifier 15.
As a result, the piezoelectric element 3 expands and contracts in accordance with the supplied
signal, and the film material 4 is vibrated according to the expansion and contraction.
Then, the attenuator 14 and the amplifier 15 are adjusted such that the vibration of the film
material 4 is in reverse phase with the sound wave emitted from the small speaker 2.
[0019]
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By this, for example, as indicated by a broken line in FIG. 3, the film material 4 generates a
vibration in the opposite phase to the sound wave emitted from the small speaker 2, and the
sound wave emitted from the small speaker 2 is offset. Therefore, the sound emitted from the
built-in speaker of the headphone device can be prevented from leaking to the outside.
[0020]
In the circuit configuration of FIG. 2, the vibration of the film material 4 is made to be in the
opposite phase to the sound wave emitted from the small speaker 2 by using the normal rotation
amplifier 12 and the inversion amplifier 15. It is appropriately determined according to the
configuration, such as whether the material 4 is provided outside or inside the piezoelectric
element 3.
[0021]
Further, in the circuit configuration of FIG. 2, signal levels are adjusted using the attenuators 11
and 14, but these adjust the difference between the characteristics of the small speaker 2 and the
piezoelectric element 3 used. If the characteristics of the small speaker 2 and the piezoelectric
element 3 are determined, they can be fixed.
[0022]
By the way, in the drive of the film material 4 by the piezoelectric element 3, the response to a
low frequency signal may be insufficient due to the characteristics of the piezoelectric element 3.
However, acoustic leakage to the outside in the headphone device is generally considered to
cause no practical problem because the problem at high frequencies is large.
[0023]
On the other hand, the vibration of the film material 4 has some influence on the sound emitted
from the small speaker 2 in the direction of insertion into the ear, but since this is also only the
influence at high frequencies, practical problems occur. It is not considered.
However, as shown in the circuit configuration of FIG. 2, a switch 13 may be provided to enable
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or disable the function as needed.
[0024]
Furthermore, by providing the through holes in the film material 4, it is possible to prevent the
deterioration of the acoustic characteristics due to the back surface of the speaker being sealed.
At the same time, the vibration of the film material 4 can offset the acoustic leakage to the
outside.
[0025]
Further, in the present invention, although the configuration added to the conventional
headphone device is mainly the piezoelectric element 3, since the driving of the piezoelectric
element such as the piezoelectric element is performed by voltage, power consumption is small.
The sound leakage prevention function can be realized with very little power.
[0026]
As described above, in the present invention, by providing the headphone device with a function
to offset the sound emitted from the built-in speaker to the outside, it is possible to prevent the
sound from leaking to the outside.
This makes it possible to prevent acoustic leakage from the headphone device, which has
conventionally been considered as a problem, for example, used with a portable audio device.
[0027]
Further, the configuration of the present invention is extremely simple as shown in FIG. 1, and no
special circuit configuration or the like is required. Therefore, by adopting the present invention,
it is possible to achieve extremely significant practical effects that sound leakage from the
headphone device is drastically reduced.
[0028]
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Furthermore, it goes without saying that the present invention is not limited to the embodiment
described above, and includes various modifications and applications without departing from the
scope of the present invention described in the claims.
[0029]
It is a sectional view showing the composition of one embodiment of the headphone device to
which the present invention is applied.
It is a circuit block diagram for the explanation. It is a figure for demonstrating the operation |
movement.
Explanation of sign
[0030]
DESCRIPTION OF SYMBOLS 1 ... Body, 2 ... Small-sized speaker, 3 ... Piezoelectric element, 4 ...
Film material, 10 ... Terminal, 11, 14 ... Attenuator, 12 ... Normal rotation amplifier, 13 ... Switch,
15 ... Inversion amplifier
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