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DESCRIPTION JP2010099245

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DESCRIPTION JP2010099245
An object of the present invention is to prevent connection between an electrode lead connected
to a piezoelectric body in an ultrasonic transducer and an electronic circuit on a relay substrate
from being difficult, and to reliably transmit and receive an electric signal to and from a
piezoelectric element. Provided is an ultrasonic transducer. In an ultrasonic transducer, a flexible
linear wiring lead is disposed on side surfaces of a plurality of two-dimensionally arrayed
piezoelectric members, and is conducted to an electrode of the piezoelectric member, and the
wiring is further conducted. The lead is connected to an electronic circuit that transmits and
receives the piezoelectric body and the electric signal. [Selected figure] Figure 2
Ultrasonic transducer, ultrasonic probe, method of manufacturing ultrasonic transducer
[0001]
The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus,
and more particularly to the technology of an ultrasonic transducer incorporated in the
ultrasonic probe.
[0002]
The ultrasonic diagnostic apparatus transmits (transmits) ultrasonic waves to a desired
diagnostic site of the subject using an ultrasound probe, and the reflected wave from the tissue
boundary in the subject with different acoustic impedance. Receive
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In this manner, ultrasound is scanned by the ultrasound probe to obtain information on the
internal tissue of the subject and make an image, thereby making a diagnosis. The ultrasonic
probe has an ultrasonic transducer in order to transmit ultrasonic waves to a subject or the like
and receive reflected waves.
[0003]
In recent years, a method using rotation and oscillation of a one-dimensional array ultrasonic
transducer in an ultrasonic probe or an electronic scanning ultrasonic wave using a twodimensional array ultrasonic transducer in which piezoelectric elements are arranged in a matrix
Probes are in the process of examining systems for acquiring and displaying ultrasound images
in three dimensions. The three-dimensional ultrasonic image is useful for diagnosis of a site that
is easily missed in the two-dimensional image, and a tomogram suitable for diagnosis and
measurement can be obtained, and improvement in diagnostic accuracy can be expected.
[0004]
However, in the method of using an ultrasonic transducer of an electronic scanning type twodimensional array, the piezoelectric elements are arranged two-dimensionally to increase the
number of elements of the piezoelectric elements (for example, 10 times to 100 times). It will
come with you. The piezoelectric element and the ultrasonic diagnostic apparatus main body are
connected via a relay substrate that performs processing of an electrical signal, transmission /
reception of an electrical signal to the piezoelectric element, and the like, and the number of
piezoelectric elements is increased. The number of electrode leads for electrically connecting the
relay substrate to the piezoelectric element is significantly increased.
[0005]
This large increase in the number of electrode leads leads to a complication of the connection
structure between the piezoelectric element (piezoelectric body) in the ultrasonic probe and the
transmission / reception circuit and the ultrasonic diagnostic apparatus main body in the relay
substrate. The complexity of the connection structure may make it difficult to realize a twodimensional array of ultrasonic transducers. Therefore, without complicating the connection
between the piezoelectric elements arranged on the two-dimensional array and the circuit at the
subsequent stage, for example, the connection structure between the electrode lead and the relay
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substrate, and the connection structure between the piezoelectric element and the electrode lead
A configuration is needed that allows the realization of an array of ultrasound transducers.
[0006]
As an example of the connection structure of each piezoelectric element and the electrode lead
for solving this problem, for example, a structure in which the substrates corresponding to the
piezoelectric element array are stacked to constitute the lead out of the electrode lead is adopted.
A structure has been proposed in which the pitch width of the corresponding electrode lead is
expanded by the pattern wiring formed in each layer of the lead relay substrate, and is drawn out
in alignment with the IC substrate connection side to be a relay circuit (for example, Patent
Document 1) ). According to this structure, a large number of electrode leads can be extracted
from the signal electrodes of the ultrasonic transducer arranged in a two-dimensional array in
the ultrasonic probe, and the acoustic characteristics of the piezoelectric element are maintained,
and the IC is mounted Etc. can be easily realized.
[0007]
However, in the ultrasonic probe described in Patent Document 1, since the pitch of the electrode
lead extracted from the signal electrode or the like is enlarged by the pattern wiring of the relay
substrate connected to the ultrasonic transducer, the connection between the relay substrate and
the ultrasonic transducer There is a possibility that the part will be enlarged.
[0008]
Therefore, the inventors prevent the enlargement of the connection structure with the relay
substrate, can pull out a large number of electrode leads as in the above ultrasonic transducer,
maintain the acoustic characteristics of the piezoelectric element, and mount the IC etc. To devise
an ultrasonic transducer that can be easily realized.
An example of the structure of this ultrasonic transducer is shown in FIG. FIG. 9A is a schematic
perspective view showing a state in which the two-dimensional array of ultrasonic transducers
300 is viewed from the side. FIG. 9B is a schematic exploded perspective view showing the
configuration of the ultrasonic transducer unit 300a before division which constitutes the
ultrasonic transducer 300 of FIG.
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[0009]
As shown in FIG. 9A, stacked piezoelectrics (piezoelectric elements) 314 and 324 for one row of
a two-dimensional array are arranged in parallel on the front and back surfaces of a printed
circuit board 330 in an ultrasonic transducer 300. Furthermore, the acoustic matching layers
310 and 320 are disposed adjacent to each other on one surface (hereinafter referred to as
“front surface”) of the laminated piezoelectric members 314 and 324, and are arranged in
parallel in the same manner as the laminated piezoelectric members 314 and 324. Ru. In
addition, backing materials (load material phases) 318 and 328 are disposed adjacent to each
other (hereinafter referred to as “back side”) on the side opposite to the acoustic matching
layers 310 and 320 in the laminated piezoelectric members 314 and 324. And are arranged in
parallel in the same manner as the laminated piezoelectric body. Wiring patterns 331 are formed
in parallel as conductive electrode leads on the front and back surfaces of the printed circuit
board 330.
[0010]
Further, as shown in FIGS. 9A and 9B, it is formed between the acoustic matching layer and each
laminated piezoelectric body (314, 324) so as to be exposed on each surface of the laminated
piezoelectric body. Front electrodes 312 and 322 are provided. On the opposite side of the front
electrodes 312 and 322, that is, between the backing material and the laminated piezoelectric
body, back electrodes 316 and 326 formed so as to be exposed to the respective surfaces are
disposed. First internal electrodes 312a and 322a and second internal electrodes 316a and 326a
are formed between the stacked piezoelectric elements, respectively.
[0011]
The front electrodes 312 and 322 and the first inner electrodes 312a and 322a are both
configured to be electrodes of the same type (positive electrode or negative electrode). Similarly,
the back electrodes 316, 326 and the second inner electrodes 316a, 326a are both configured to
be the same kind of electrode and to be different from the front electrode and the first inner
electrode. By this configuration, one piezoelectric element is sandwiched between the electrodes
of different polarities, and the piezoelectric element can be driven by an electrical signal.
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[0012]
Further, as shown in FIGS. 9A and 9B, the printed board 330 and the respective laminated
piezoelectric members (314, 324) disposed on both sides of the printed board 330 by the
conductive metal thin film 370. Are bonded by various methods such as sputtering and
evaporation. That is, by using the metal thin film 370, the electrical connection between each of
the electrodes such as the front electrodes 312 and 322 and each of the wiring patterns 331
(electrode leads) on the printed board 330 side is strengthened and Bonding with the substrate
330 and the wiring pattern 331 is performed.
[0013]
As shown in FIGS. 9A and 9B, the metal thin film 370 is formed on the side surfaces of the
laminated piezoelectric members 314 and 324 from the back electrodes 316 and 326 to the
front electrodes 312 and 322. Therefore, the side surface of the laminated piezoelectric member
314 is configured to contact only the front electrode 312 and the first inner electrode 312a or
the back electrode 316 and the second inner electrode 316a when the metal thin film 370 is
formed. It is done. By doing this, one piezoelectric element in the laminated piezoelectric material
can be sandwiched by electrodes of different polarities.
[0014]
Unexamined-Japanese-Patent No. 2001-292496
[0015]
Furthermore, the end of the wiring pattern 331 of the ultrasonic transducer 300 opposite to the
ultrasonic radiation direction is connected to the electronic circuit of the relay substrate.
The electronic circuit transmits an electrical signal to be applied to the piezoelectric element, and
further receives an electrical signal based on a reflected wave from the object to perform each
process.
[0016]
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Further, the relay substrate is disposed in advance corresponding to the position of the wiring
pattern 331 in the ultrasonic transducer 300, that is, the position of the printed board 330 on
which the wiring pattern is formed. However, when generating an ultrasonic transducer, the
thickness of the piezoelectric body (the length in the direction orthogonal to the radiation
direction of the ultrasonic wave) may vary, or the side surface of the piezoelectric body may not
be flat. Since the ultrasonic transducer as shown in FIG. 9A is formed by stacking the ultrasonic
transducer units 300a as shown in FIG. 9B, the thickness variation of the piezoelectric body and
the surface When the unevenness is generated, when the piezoelectric bodies are stacked, the
positional accuracy of the printed circuit board disposed between the piezoelectric bodies may be
deteriorated.
[0017]
Since the relay substrate is disposed corresponding to the position of the wiring pattern 331, it
becomes difficult to connect the wiring pattern 331 and the electronic circuit in the relay
substrate when the positional accuracy of the printed board 330 is deteriorated. There is a risk of
That is, when the positional accuracy of the printed circuit board 330 is poor, the printed circuit
board 330 must be shifted according to the layout of the relay board to adjust the position of the
end of the wiring pattern 331 so that it can be connected to the electronic circuit. Since the
position of the substrate 330 is fixed as an integral ultrasonic transducer 300 when the
ultrasonic transducer unit 300a is stacked, it is not easy to shift the printed circuit board 330 to
perform such positional adjustment.
[0018]
In particular, although the printed circuit board 330 can be bent in the thickness direction due to
its material configuration, it is difficult to bend the printed circuit board 330 in the planar
direction. Therefore, if the position of the printed circuit board 330 is displaced in the planar
direction of the printed circuit board 330 at the time of laminating the piezoelectric body, it
becomes difficult to connect the wiring pattern 331 and the electronic circuit of the relay board.
As a result, driving of the piezoelectric element may be difficult, and as a result, generation of an
ultrasonic image may be difficult or disturbed.
[0019]
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The present invention has been made in view of the above problems, and an object thereof is to
make it difficult to connect an electrode lead connected to a piezoelectric body in an ultrasonic
transducer and an electronic circuit in a relay substrate. An object of the present invention is to
provide an ultrasonic transducer which can avoid and securely transmit and receive an electric
signal to and from a piezoelectric element.
[0020]
In order to solve the above problems, the invention according to claim 1 is characterized in that
electrodes are provided on the front surface on the radiation direction side of ultrasonic waves
and on the back surface which is the opposite surface of the front surface, and And a substrate
provided with a plurality of piezoelectric bodies arranged in a two-dimensional array in two
dimensions, an electronic circuit for transmitting at least an electric signal applied to the
piezoelectric body, and the electronic circuit, and a front surface of the piezoelectric body And a
flexible linear wiring lead conducted to at least one of the electrodes by being disposed on a side
surface orthogonal to the back surface, and an ultrasonic transducer characterized by: .
In the invention according to claim 7 for solving the above problems, a front electrode is formed
on the front surface on the ultrasonic radiation direction side, and a back electrode is formed on
the back surface on the opposite side, and the front surface and the back surface. A first concave
portion formed on an edge on the front electrode side of the first side orthogonal to the first
electrode toward an edge on the rear electrode side, and a second side opposite to the first side A
plurality of second grooves formed in a side surface from an edge on the front electrode side
toward an edge on the back electrode side, and arranged two-dimensionally in a direction
orthogonal to the radial direction A piezoelectric body and an electronic circuit for transmitting
an electrical signal to be applied to the piezoelectric body and processing the electrical signal
from the piezoelectric body are formed, and one row of the piezoelectric body array twodimensionally arranged on the back surface side Each of the substrates and each of the electronic
circuits and the first of the piezoelectric bodies. By being accommodated in a groove and directly
or indirectly coupled to one of the front electrode and the back electrode of each of the
piezoelectric members, it is conducted with at least one of the electrodes and has flexibility and a
linear shape. A first electrode lead, and the second electrode of the piezoelectric body, which is
accommodated in the second concave groove and which is not coupled to the first electrode lead
among the front electrode and the back electrode of each of the second piezoelectric bodies An
ultrasonic transducer characterized by comprising: a plurality of second electrode leads that are
conductive, flexible, and linear by being directly or indirectly coupled to an electrode. Further,
the invention according to claim 11 for solving the above-mentioned problems comprises: a
plurality of piezoelectric members having electrodes; a substrate provided with an electronic
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circuit for transmitting an electric signal applied to the piezoelectric members; What is claimed
is: 1. A method of manufacturing an ultrasonic transducer, comprising: a flexible, linear wire, and
a wiring lead connecting the electronic circuit and the electrode of the piezoelectric body, the
wiring lead being disposed on the side surface of each of the piezoelectric members. And a step
of connecting the electrode exposed to the side surface and the wiring lead, and arranging the
respective piezoelectric members having the wiring lead disposed on the side surface in parallel
to emit the row of the piezoelectric material by ultrasonic wave radiation. A method of
manufacturing an ultrasonic transducer, comprising the steps of: stacking in a direction
orthogonal to the direction; and connecting a wiring lead connected to the electrode to the
electronic circuit. Further, the invention according to claim 12 for solving the above-mentioned
problems comprises a plurality of piezoelectric bodies having electrodes, an electronic circuit for
transmitting an electric signal applied to the piezoelectric bodies, the electronic circuit and the
piezoelectric body. What is claimed is: 1. A method of manufacturing an ultrasonic transducer
having a wiring lead for connecting a body electrode, comprising: connecting the electronic
circuit and the wiring lead; and connecting the electronic circuit to each side surface of the
piezoelectric body. Arranging a wiring lead, and connecting the wiring lead and the electrode
exposed on the side surface, and arranging each of the piezoelectric bodies having the wiring
lead arranged on the side surface in parallel, And d) stacking in the same direction and in a
direction orthogonal to the radiation direction of the ultrasonic waves.
In the invention according to claim 13 for solving the above problems, a front electrode is
formed on the front surface on the ultrasonic radiation direction side, and a back electrode is
formed on the back surface on the opposite side, and the front surface and the back surface. A
first concave portion formed on an edge on the front electrode side of the first side orthogonal to
the first electrode toward an edge on the rear electrode side, and a second side opposite to the
first side A plurality of second grooves formed in a side surface from an edge on the front
electrode side toward an edge on the back electrode side, and arranged two-dimensionally in a
direction orthogonal to the radial direction A substrate on which a piezoelectric body and an
electronic circuit for transmitting an electrical signal to be applied to the piezoelectric body and
processing the electrical signal from the piezoelectric body are formed, and arranged on the back
side according to the arrangement of the piezoelectric body And conductive with the electronic
circuit and housed in the first concave groove of the piezoelectric body. Directly or indirectly
coupled to one of the front electrode and the back electrode of each of the piezoelectric members
to conduct electricity to at least one of the electrodes and to form a flexible and linear first
electrode And a lead, which is accommodated in the second concave groove of the piezoelectric
body, and directly with one of the front electrode or the back electrode of the second
piezoelectric body which is not coupled to the first electrode lead. And an ultrasonic transducer
provided with a plurality of second electrode leads that are conductive and flexible and are linear
by being coupled indirectly or indirectly. is there.
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[0021]
According to the invention as set forth in claims 1, 7, 8, 11 and 13, in the ultrasonic transducer
in the ultrasonic probe, the linear wiring lead disposed on the side surface of the piezoelectric
body and conducted to the electrode is the wiring The position of the end of the lead can be
matched to any position corresponding to the electronic circuit of the relay substrate by its
flexibility. Therefore, the end of the wiring lead can be connected to the position corresponding
to the relay substrate on which the electronic circuit for transmitting and receiving the electric
signal to and from the piezoelectric body is formed, and as a result, the electric signal to the
piezoelectric body It becomes possible to perform transmission and reception reliably.
[0022]
Furthermore, according to the invention of claim 12, after the electronic circuit and the wiring
lead are connected in the manufacturing process of the ultrasonic transducer, the wiring lead is
arranged on the side surface of the piezoelectric body. Therefore, in the manufacturing process,
even if the positional accuracy of the wiring leads can not be ensured, it is difficult to connect the
electrode leads and the electronic circuits in the relay substrate because the wiring leads are
connected in advance to the electronic circuit. This makes it possible to reliably transmit and
receive electrical signals to and from the piezoelectric body.
[0023]
First Embodiment Hereinafter, an ultrasonic transducer and an ultrasonic probe according to a
first embodiment of the present invention will be described with reference to FIGS.
[0024]
FIG. 1A is a schematic perspective view showing an ultrasonic transducer 100 according to a first
embodiment of the present invention as viewed from the side.
FIG. 1 (B) is a schematic exploded perspective view showing the configuration of an ultrasonic
transducer unit 100a constituting the ultrasonic transducer 100 according to the first
embodiment of the present invention. Hereinafter, the configuration of the ultrasonic transducer
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100 according to the first embodiment will be described.
[0025]
(Schematic Configuration of Ultrasonic Transducer) As shown in FIG. 1A, the ultrasonic
transducer 100 according to this embodiment includes a first laminated piezoelectric body 114
and a second laminated piezoelectric body in which piezoelectric elements are laminated in three
layers. It has 124. Further, as shown in FIG. 1A, in the ultrasonic transducer 100, an acoustic
matching layer 110 is provided adjacent to the lamination direction of the piezoelectric elements
in the first laminated piezoelectric body 114. In addition, a backing material 118 (load material
phase) is provided on the side opposite to the acoustic matching layer 110 side in the first
laminated piezoelectric body 114. The piezoelectric block 101 is configured by a combination of
the acoustic matching layer 110, the first laminated piezoelectric body 114, and the backing
material 118. Similarly, an acoustic matching layer 120 is provided adjacent to the second
laminated piezoelectric body 124 in the stacking direction, and a backing material 128 is
provided on the opposite side of the acoustic matching layer 120. The piezoelectric block 102 is
configured by a combination of the acoustic matching layer 120, the second laminated
piezoelectric body 124, and the backing material 128.
[0026]
Wiring leads 131 are arranged in parallel on the side surfaces of the piezoelectric block 101 and
the piezoelectric block 102 according to the arrangement of the laminated piezoelectric members
(114, 124). Further, as shown in FIG. 1B, the piezoelectric block 101 and the piezoelectric block
102 in which the wiring leads 131 are arranged are alternately stacked with the insulating sheet
130 interposed therebetween, and fixed as an integrated ultrasonic transducer 100. (FIG. 1 (A)).
The piezoelectric block 101 and the piezoelectric block 102 are stacked so that the acoustic
matching layers (110, 120) have the same direction. Hereinafter, the configuration of each part
in the ultrasonic transducer 100 of the present embodiment will be described.
[0027]
Although the ultrasonic transducer 100 according to the present embodiment is configured to
have the laminated piezoelectric material (114, 124), in the ultrasonic transducer of the present
invention, it is also possible to use a piezoelectric material of one piezoelectric element is there.
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In this case, the ultrasonic transducer 100 has only the front electrodes 112 and 122 and the
back electrodes 116 and 126 described later, and the internal electrodes 112a, 116a, 122a and
126a become unnecessary.
[0028]
(Structure of Each Electrode in Laminated Piezoelectric Body) As shown in FIG. 1B, in the first
laminated piezoelectric body 114, a front surface electrode 112 is provided on the front surface
adjacent to the acoustic matching layer 110. Furthermore, a back electrode 116 is provided on
the back side opposite to the front side. Furthermore, internal electrodes are provided between
the piezoelectric elements stacked in the first stacked piezoelectric member 114. That is, among
the piezoelectric elements stacked in three layers, the first inner electrode 112a to which an
electric signal corresponding to the front electrode 112 is applied is provided between the
piezoelectric element on the back side and the piezoelectric element on the middle side. A second
inner electrode 116a to which an electric signal corresponding to the back electrode 116 is
applied is provided between the piezoelectric element on the side and the piezoelectric element
in the middle. In the ultrasonic transducer 100 according to the present embodiment, the first
side surface and the second side surface of the first laminated piezoelectric body 114 and the
second laminated piezoelectric body 124 may have the same structure.
[0029]
(Configuration of Side Surface in Laminated Piezoelectric Body) Only the back surface electrode
116 and the second internal electrode 116 a are in the first side surface (right side surface in
FIG. 1) orthogonal to the front surface and orthogonal to the back surface of the first laminated
piezoelectric member 114. Grooves 111 and 115 are formed to be exposed. That is, the groove
111 is formed on the boundary (on the front electrode 112) between the first laminated
piezoelectric body 114 and the acoustic matching layer 110 on the first side surface of the first
laminated piezoelectric body 114. Therefore, the front electrode 112 is not exposed on the first
side surface. Similarly, the groove 115 is formed substantially parallel to the groove 111 on the
boundary (on the first internal electrode 112 a) of the piezoelectric element on the back side of
the first laminated piezoelectric body 114 and the piezoelectric element in the middle on the first
side surface. . Therefore, the first inner electrode 112 a is not exposed on the first side surface.
[0030]
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Further, as shown in FIG. 1B, in the second side surface opposite to the first side surface of the
first laminated piezoelectric body 114, the front electrode 112 and the first internal electrode
112a are exposed at the second side surface. Is configured. That is, the groove 117 is formed
along the edge on the side of the back electrode 116 in the second side surface of the first
laminated piezoelectric body 114. Furthermore, a groove 113 is formed on the boundary
between the middle piezoelectric element and the front side piezoelectric element (on the second
inner electrode 116 a) on the second side surface. Therefore, in the second side, the back
electrode 116 and the second internal electrode 116 a are not exposed.
[0031]
Thus, the grooves (111, 113, 115, 117) in the first side surface and the second side surface of
the first laminated piezoelectric body 114 are formed every other electrode in the order of the
lamination direction of the piezoelectric element. Therefore, when the wiring lead 131 is
disposed on these side surfaces, it is not conducted to the electrode in the portion where the
groove (111, 113, 115, 117) is formed on the side surface, but conducted only to the electrode
exposed on the side surface Be done. Therefore, since the electric signal transmitted from the IC
205 (see FIG. 4) of the relay substrate 200 is applied only to the electrodes exposed every other
electrode in the stacking direction of the piezoelectric elements, one piezoelectric element has
different polarity. The electrical signal makes it possible to drive the piezoelectric element.
[0032]
Further, with respect to the first laminated piezoelectric body 114, in the second laminated
piezoelectric body 124, as shown in FIG. 1B, the first side surface (the right side surface in FIG. 1)
and the second side surface (FIG. 1) The positions where the grooves are formed in the left
surface) are reversed. That is, the second side surface of the second laminated piezoelectric body
124 is configured to expose the back surface electrode 116 and the second internal electrode
116a, and the front side electrode 112 and the first internal electrode are formed on the opposite
first side surface. It is comprised so that 112a may be exposed.
[0033]
That is, in the second side surface of the second laminated piezoelectric member 124, the groove
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121 is provided at the edge of the piezoelectric element adjacent to the front electrode 122.
Further, a groove 125 is provided at the boundary between the middle piezoelectric element and
the back side piezoelectric element on the second side surface of the second laminated
piezoelectric material 124. Further, on the first side face of the second laminated piezoelectric
member 124, a groove 127 is formed at the end edge on the back electrode 126 side, and a
groove 123 is formed at the boundary between the middle piezoelectric element and the front
side piezoelectric element. Thus, by targeting the positions of the electrodes (112, 122, etc.)
exposed on the side surfaces of the first laminated piezoelectric body 114 and the second
laminated piezoelectric body 124, the same kind of electrodes (front electrode, back electrode,
etc.) The wiring leads 131 connected to each other can be collectively connected to the IC 205 in
the relay substrate 200 in the subsequent stage.
[0034]
Further, the grooves in the first side surface and the second side surface of the second laminated
piezoelectric body 124 are also one electrode in the order of the lamination direction of the
piezoelectric element, similarly to the grooves 111, 115, 113, 117 in the first laminated
piezoelectric body 114. Every so formed.
[0035]
Further, as shown in FIG. 1B, a metal thin film 170 is formed on the first side surface and the
second side surface of the first laminated piezoelectric body 114 and the second laminated
piezoelectric body 124.
The metal thin film 170 adheres the wiring leads 131 disposed on the first side and the second
side to the first side and the second side, and the first side and the second side. The electrical
connection between the exposed electrode and the wiring lead 131 is ensured. The metal thin
film 170 corresponds to an example of the “conductive thin film” in the present invention.
[0036]
(Wire lead) In the ultrasonic transducer 100 of the present embodiment, a wire lead as shown in
FIG. 1B is provided on the front surface on the ultrasonic radiation direction side and the side
surface orthogonal to the back surface opposite to the front surface. 131 are arranged in parallel
and at positions corresponding to the laminated piezoelectric members (114, 124). The wiring
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lead 131 is formed of a flexible wire.
[0037]
For example, as the wiring lead 131, it is possible to use a metal wire or a wire obtained by
twisting metal wires. Further, from the viewpoint of flexibility and fatigue resistance, it is possible
to use a wire in which the surface of a resin wire is coated with metal as the wiring lead 131 or a
wire in which a plurality of the wires are twisted.
[0038]
As shown in FIG. 1B, the wiring lead 131 is formed of an acoustic matching layer 110 on the first
side surface and the second side surface of the first laminated piezoelectric body 114 and the
second laminated piezoelectric body 124 by the metal thin film 170. 12) are disposed along the
direction from the backing material 118, 128 to the backing material 118). Furthermore, one end
side of the wiring lead 131 is arranged to be in contact with at least the front electrodes 112 and
122. Further, the other end of the wiring lead 131 extends from the end of the ultrasonic
transducer 100 opposite to the ultrasonic radiation direction toward the relay substrate 200 and
is connected to the IC 205 of the relay substrate 200.
[0039]
In addition, the piezoelectric sheet 101 and the insulating sheet 130 between the piezoelectric
blocks 102 and the wiring leads 131 are partially fixed. That is, in the wiring lead 131, the
insulating sheet 130 is fixed between the laminated piezoelectric material (114, 124) and the
vicinity of the center of the backing materials 118 and 128, while the relay in the wiring lead
131 is The end (rear end) on the substrate 200 side is not fixed. This is to make it possible to
move the rear end side of the wiring lead 131 to an arbitrary position and to easily align the rear
end side with the position of the IC 205 in the relay substrate 200.
[0040]
In the ultrasonic transducer 100 according to the present embodiment, the insulating sheet 130
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and the wiring leads 131 are partially fixed as described above from the viewpoint of facilitating
connection with the relay substrate 200. However, the ultrasonic transducer in the present
invention is not limited to this. For example, from the viewpoint of facilitating the connection
between the ultrasonic transducer 100 and the relay substrate 200, it is possible to adopt a
configuration in which the wiring lead 131 is not fixed to the insulating sheet 130 as a whole as
well as the rear end. However, in this case, it is necessary to securely fix the piezoelectric block
101 and the piezoelectric block 102 so that the position of the wiring lead 131 in the ultrasonic
transducer 100 does not shift.
[0041]
By configuring the wiring leads 131 in this manner, it becomes easy to align the wiring leads 131
in correspondence with the position of the IC 205 of the relay substrate 200. For example, even
if the positional accuracy of the wiring lead 131 connected to the electrodes (112, etc.) in the
laminated piezoelectric material (114, 124) in the ultrasonic transducer 100 can not be ensured,
the position of the end of the wiring lead 131 is at least fixed. Since the flexibility of the wiring
lead 131 is not used, the position of the end of the wiring lead 131 can be aligned with any
position corresponding to the IC 205 of the relay substrate 200. Therefore, transmission and
reception of an electrical signal between the piezoelectric element and the IC 205 can be reliably
performed. Although the ultrasonic transducer 100 in the present embodiment does not include
the electronic circuit connected to the wiring lead 131 and the substrate on which the electronic
circuit is formed, the ultrasonic transducer in the present invention includes the electronic circuit
and the substrate. It is Next, as an example of the electronic circuit and the substrate, the relay
substrate 200, the IC 205, and the like will be described.
[0042]
(Connection of Ultrasonic Transducer and IC Substrate) Next, an example of the connection
configuration of the ultrasonic transducer 100 and the relay substrate 200 according to the
present embodiment will be described with reference to FIG. FIG. 2 shows an example of the
connection method of the ultrasonic transducer 100, and a mechanism for connecting the
ultrasonic transducer 100 and the relay substrate 200 in the present embodiment, and the IC
205 on the relay substrate 200 and the ultrasonic diagnostic apparatus main body FIG. 6 is a
schematic perspective view showing a mechanism for connecting a cable.
[0043]
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As shown in FIG. 2, the relay substrate 200 is disposed adjacent to the rear end (end opposite to
the ultrasonic radiation direction) of the ultrasonic transducer 100, and the IC 205 in the relay
substrate 200 is connected to the wiring lead 131. Ru. The relay substrate 200 corresponds to an
example of the “substrate” in the present invention, and the IC 205 corresponds to an example
of the “electronic circuit” in the present invention.
[0044]
Further, as shown in FIG. 2, the relay substrate 200 is connected via a cable (not shown)
electrically connected to the ultrasonic diagnostic apparatus main body, and the relay substrate
200 and the cable are connected by a cable connection substrate 210. Connected by One end of
the cable connection board 210 is connected to one end of the relay board 200 opposite to the
end provided with the signal lead (not shown).
[0045]
The connector 211 is provided at the other end of the cable connection substrate 210 and at one
end of the cable. The connector 211 connects the cable connection substrate 210 and a cable
connected to the ultrasonic diagnostic apparatus main body.
[0046]
As shown in FIG. 2, an IC 205 is formed on a relay substrate 200 provided between the
ultrasonic transducer 100 and the ultrasonic diagnostic apparatus main body, and the IC 205 is
connected to the wiring lead 131. The IC 205 applies signals to the front electrodes 112 and 122
and the first inner electrodes 112 a and 122 a to be the same type of electrodes, and electrical
signals to the back electrodes 116 and 126 and the second inner electrodes 116 a and 126 a to
the same type of electrodes To drive the first laminated piezoelectric body 114 and the second
laminated piezoelectric body 124. Thus, the IC 205 causes the ultrasonic transducer 100 to
transmit an ultrasonic beam.
[0047]
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Further, the IC 205 processes a signal received by the first laminated piezoelectric body 114 and
the second laminated piezoelectric body 124. With such an arrangement, in the ultrasonic probe
incorporating the ultrasonic transducer 100, the reflected wave received by the first laminated
piezoelectric body 114 and the second laminated piezoelectric body 124 is converted into a
signal, and the signal is transferred onto the relay substrate 200. , And processes the signal
received by the IC 205. Furthermore, the IC 205 transmits the processed signal to the ultrasonic
diagnostic apparatus main body via the cable connection substrate 210.
[0048]
Although the IC 205 is used in this embodiment, it includes an ASIC and other means. Also, the
ultrasonic transducer 100, the relay substrate 200, and the IC 205 in FIG. 2 constitute an
embodiment of the ultrasonic transducer in the present invention. Further, as shown in FIG. 2,
the ultrasonic probe 220 includes the ultrasonic transducer 100, the relay substrate 200, and the
IC 205.
[0049]
Manufacturing Process Next, a manufacturing process of the ultrasonic transducer 100
according to the first embodiment will be described with reference to FIGS. 1, 3 and 4. FIG. 3A is
a schematic perspective view showing a process of forming a metal thin film 170 on the
piezoelectric blocks 101 and 102 in the manufacturing process of the ultrasonic transducer 100
according to the first embodiment of the present invention. FIG. 3B is a schematic perspective
view showing a state in which the metal thin film 170 is formed on the side surfaces of the
piezoelectric blocks 101 and 102 in FIG. 3A. FIG. 3C is a schematic perspective view showing a
state in which grooves are formed on the side surfaces of the piezoelectric blocks 101 and 102 in
FIG. 3B. FIG. 3 (D) is a schematic partial enlarged view of FIG. 3 (C). FIG. 4A is a schematic
perspective view showing a process of arranging the wiring leads 131 on the first side surface
and the second side surface of the piezoelectric block 101, 102. 4B is a schematic perspective
view showing the ultrasonic transducer 100 before being divided after stacking the piezoelectric
blocks 101 and 102 in FIG. 4A.
[0050]
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17
(Step 1) First, the piezoelectric elements are stacked in three layers, and internal electrodes are
provided between the piezoelectric elements to form laminated piezoelectric bodies (114, 124)
before division. The front electrodes 112 and 122 are formed on the front surface of the
laminated piezoelectric material (114 and 124), and the back electrodes 116 and 126 are formed
on the rear surface. Furthermore, as shown in FIG. 3A, the acoustic matching layers 110 and 120
are provided on the front surface and the backing materials 118 and 128 are provided on the
back surface of the laminated piezoelectric material (114, 124). Piezoelectric blocks 101 and
102 are formed. The piezoelectric blocks 101 and 102 have the same thickness as the thickness
(the length in the direction orthogonal to the ultrasonic radiation direction) of each of the
laminated piezoelectric materials (114 and 124) of the ultrasonic transducer 100 at the time of
completion. It has the same length as one row of laminated piezoelectric members (114, 124)
arranged two-dimensionally in the ultrasonic transducer 100 at the time of completion as shown
in FIG. 1 (A). The direction of this length is the direction (column direction) orthogonal to the
stacking direction of the piezoelectric elements. Furthermore, as shown in FIG. 3 (B), the
piezoelectric block 101, 102 has a first side orthogonal to the front and back of the laminated
piezoelectric body (114, 124) and the opposite side of the first side. A metal thin film 170 is
formed on the second side. The piezoelectric blocks 101 and 102 are divided in the column
direction from the acoustic matching layers 110 and 120 in a later step. Then, one row of
laminated piezoelectric members (114, 124) in the two-dimensional array ultrasonic transducer
100 constitutes the divided piezoelectric member block. In addition, when the metal thin film
170 is formed with respect to the first side and the second side, all of the respective electrodes in
which the metal thin film 170 is exposed on the first side and the second side In contact with
[0051]
(Step 2) After the metal thin film 170 is formed on the piezoelectric block 101 as shown in FIG. 3
(B), as shown in FIGS. 3 (C) and 3 (D), the first side surface of the piezoelectric block 101 The
grooves (111, 115, 113, 117) are formed at predetermined positions on the second side surface.
That is, the grooves 111 and the like are formed as follows. From the state in which all the
electrodes (112, 116a, 112a, 116) are exposed on the first side surface of the first laminated
piezoelectric body 114, acoustic matching on the exposed portion of the front electrode 112, that
is, the first side surface The boundary between the layer 110 and the first laminated piezoelectric
body 114 is scraped together with the metal thin film 170 in a direction perpendicular to the
laminating direction of the piezoelectric element to form a groove 111 as shown in FIGS. 3 (C)
and 3 (D). Further, on the first side surface of the first laminated piezoelectric body 114, a groove
115 parallel to the groove 111 is formed at the boundary between the back side piezoelectric
element and the middle piezoelectric element. On the other hand, as shown in FIGS. 3C and 3D,
the backing material 118 and the first laminated piezoelectric member 114 are formed on the
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second side surface of the first laminated piezoelectric member 114 (the surface on the left side
in FIG. 3B). The groove 117 as shown in FIG. 3C and FIG. Further, in the second side surface, the
groove 113 parallel to the groove 117 is formed at the boundary between the piezoelectric
element on the front side and the piezoelectric element on the front side.
[0052]
(Step 3) Further, in the second laminated piezoelectric body 124, the positions of the grooves in
the first side surface (the right side surface in FIG. 3B) and the second side surface are the
grooves in the first laminated piezoelectric body 114 ( The grooves (121, 125, 123, 127) are
formed to be symmetrical with respect to the holes 111, 115, 113, 117). That is, on the second
side surface of the second laminated piezoelectric body 124, the boundary between the acoustic
matching layer 120 and the second laminated piezoelectric body 124 is cut together with the
metal thin film 170 to form the groove 121. Furthermore, in the second side surface, a groove
125 parallel to the groove 121 is formed at the boundary between the back side piezoelectric
element and the middle piezoelectric element. Further, on the first side surface of the second
laminated piezoelectric body 124 with respect to the second side surface, the boundary between
the backing material 128 and the second laminated piezoelectric body 124 is cut to form a
groove 127. Furthermore, in the first side surface, a groove 123 parallel to the groove 127 is
formed at the boundary between the piezoelectric element on the front side and the piezoelectric
element on the front side.
[0053]
(Step 4) After the grooves 111 and 121 and the like are respectively formed on the first side
surface and the second side surface of the first laminated piezoelectric body 114 and the second
laminated piezoelectric body 124, the piezoelectric block 101 and the piezoelectric block are
formed. As shown in FIG. 4A, the wiring leads 131 are disposed at positions corresponding to the
laminated piezoelectric members (114, 124), respectively. That is, one end side of the linear
wiring lead 131 is disposed to be in contact with the front electrodes 112 and 122, and the other
end side is disposed to the rear end side of the ultrasonic transducer 100. Further, the metal thin
film 170 and the wiring lead 131 are fixed by a method such as sputtering or vapor deposition.
[0054]
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19
(Step 5) After the wiring leads 131 are respectively disposed on the piezoelectric block 101 and
the piezoelectric block 102, they are further stacked via the insulating sheet 130. That is, after
the wiring leads 131 are disposed on the piezoelectric blocks 101 and 102, the portions of the
wiring leads 131 other than the rear end side are fixed to the insulating sheet 130. Thus, the
piezoelectric block 101 and the piezoelectric block 102 are stacked to form the ultrasonic
transducer 100 before division.
[0055]
(Step 6) As shown in FIG. 1A, after the ultrasonic transducer 100 is formed. The ultrasonic
transducer 100 is divided in a direction parallel to the stacking direction of the piezoelectric
block 101 and the piezoelectric block 102 from the acoustic matching layers 110 and 120 and
orthogonal to the direction of the groove (111 etc.) on the side surface of the piezoelectric The
dividing grooves up to the backing materials 118 and 128 are formed. The division grooves
formed by the division are filled with an insulating resin to form an ultrasonic transducer 100 in
which laminated piezoelectric members (114, 124) as shown in FIG. 1A are two-dimensionally
arranged. The dividing grooves are formed to reach the backing materials 118 and 128 in order
to reliably divide the laminated piezoelectric members (114 and 124) in the piezoelectric blocks
101 and 102.
[0056]
(Step 7) When the ultrasonic transducer 100 as shown in FIG. 1A is formed, the ultrasonic
transducer 100 and the relay substrate 200 arranged corresponding to the arrangement of the
piezoelectric blocks 101 and 102 are connected. Do. That is, the rear end portion of the wiring
lead 131 extended from each of the first side surface and the second side surface of the
laminated piezoelectric members 114 and 124 in the piezoelectric blocks 102 and 102 and the
IC 205 formed on the relay substrate 200 are The connection enables transmission and
reception of electrical signals between the IC 205 and each electrode (112, 126, etc.) of the
laminated piezoelectric members 114, 124.
[0057]
In the present embodiment, as shown in FIG. 3B, after the metal thin film 170 is formed on the
first side and the second side of the laminated piezoelectric members 114 and 124, the grooves
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20
111 and the like are formed at predetermined positions. Although manufactured by the formed
process, the ultrasonic transducer according to the present invention is not limited to this
manufacturing process. For example, after grooves 111 and the like are formed at predetermined
positions on the first side surface and the second side surface of the laminated piezoelectric
members 114 and 124, the grooves are filled with an insulating resin, and then the first side
surface and the second side are formed. It is also possible to form the metal thin film 170 on the
side surface of
[0058]
(Operation and Effect) The operation and effect of the ultrasonic transducer 100 according to the
first embodiment described above will be described.
[0059]
As described above, in the ultrasonic transducer 100 according to the first embodiment, the
wiring corresponding to the position of the IC 205 of the relay substrate 200 by the
configuration of the wiring lead 131 and the fixing method with the laminated piezoelectric
material (114, 124). It becomes easy to align the leads 131.
For example, even when the positional accuracy of the wiring lead 131 connected to the
electrodes (112 and the like) in the laminated piezoelectric material (114 and 124) in the
ultrasonic transducer 100 can not be ensured, the wiring lead 131 has flexibility and Since the
position of the end of the wiring lead 131 is not fixed, the position of the end of the wiring lead
131 can be aligned with any position corresponding to the IC 205 of the relay substrate 200.
Therefore, transmission and reception of an electrical signal between the piezoelectric element
and the IC 205 can be reliably performed.
[0060]
Second Embodiment Next, an ultrasonic transducer 100 according to a second embodiment of
the present invention will be described with reference to FIGS. 5 to 7. FIG. 5 is a schematic
exploded perspective view showing the configuration of an ultrasonic transducer unit 100a
constituting an ultrasonic transducer 100 according to a second embodiment of the present
invention.
14-04-2019
21
[0061]
The outline of the second embodiment will be described below. In the ultrasonic transducer 100
as described in the first embodiment, the wiring lead 131 intervenes between the piezoelectric
block 101 and the piezoelectric block 102. Further, when forming such a two-dimensional array
of ultrasonic transducers 100, after the wiring leads 131 are arranged in parallel on the side
surfaces of the laminated piezoelectric material (114, 124), the piezoelectrics in which the wiring
leads 131 are arranged in parallel. The two-dimensional array of the ultrasonic transducers 100
is formed by stacking the body block 101 and the piezoelectric block 102, that is, a plurality of
ultrasonic transducers for one row.
[0062]
However, the piezoelectric body block 101 and the piezoelectric body block 102 are not in close
contact with each other by the thickness of the wiring lead 131 due to the wiring lead 131
interposed between the planar side surfaces of the piezoelectric body. That is, there is no
problem as long as the piezoelectric block 101 and the piezoelectric block 102 can be securely
fixed when stacking a plurality of piezoelectric blocks (101, 102) for one row, but if the fixing is
weak, piezoelectric There is a possibility that the positions of the body blocks 101 and 102 may
be shifted. In addition, the piezoelectric block (101, 102) may be displaced with respect to the
wiring lead 131.
[0063]
If such positional deviation occurs, there is a possibility that the connection between the wiring
lead 131 and the IC 205 in the relay substrate 200 may be difficult. Furthermore, due to this
positional deviation, when the respective piezoelectric bodies of the ultrasonic transducer 100
are driven, the ultrasonic waves emitted from the respective piezoelectric bodies whose positions
are deviated are the shape of the ultrasonic beam emitted from the entire ultrasonic wave
transducer There is a risk of causing a deviation in the radiation direction of the ultrasonic
waves. As a result, the ultrasound image generated by the ultrasound diagnostic apparatus may
be disturbed.
[0064]
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22
The ultrasonic transducer 100 according to the second embodiment is made in view of the above
problems. The outline is that, in the first side and the second side of the piezoelectric body
orthogonal to the front and back sides of the piezoelectric body, the concave grooves 119 and
129 of the size in which the wiring lead 131 is accommodated are in the ultrasonic radiation
direction. And an ultrasonic transducer 100 formed along the same. In the ultrasonic transducer
100, when the piezoelectric block 101 and the piezoelectric block 102 are stacked, the wiring
lead 131 on the side surface of the piezoelectric is accommodated in the concave groove 119,
129.
[0065]
That is, the gap between the piezoelectric body block 101 and the piezoelectric body block 102
for the wiring lead 131 is significantly reduced. As a result, by bringing the piezoelectric blocks
(101, 102) into close contact with or close to each other, it is possible to prevent the situation in
which the positions of the piezoelectric block 101 and the piezoelectric block 102 are shifted.
Furthermore, since the wiring lead 131 is accommodated in the concave groove 119, 12), even if
a force is applied in such a direction that the piezoelectric block 101 and the piezoelectric block
102 are displaced, the positional deviation can be avoided. It becomes. In addition, as a result of
preventing such positional deviation, the piezoelectric element arrangement in the ultrasonic
transducer and the positional accuracy on the rear end side of the wiring lead are secured, and
the connection between the wiring lead 131 and the electronic circuit (IC 205) of the relay
substrate 200 is difficult. Can be prevented. Furthermore, it is possible to ensure the shape and
the radiation direction of the ultrasonic beam emitted from the ultrasonic probe.
[0066]
Hereinafter, the configuration of the ultrasonic transducer 100 according to the second
embodiment will be described.
[0067]
(Outline of Overall Configuration of Ultrasonic Transducer) The ultrasonic transducer 100
according to the second embodiment is the same as the first embodiment, a first laminated
piezoelectric body 114 in which piezoelectric elements are laminated in three layers, and a
second laminated piezoelectric body The acoustic matching layers 110 and 120 are provided on
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23
the front surface of the laminated piezoelectric body (114 and 124) in the stacking direction, and
the backing materials 118 and 128 are provided on the back surface opposite to the front
surface.
The acoustic matching layer 110, the first laminated piezoelectric body 114, and the backing
material 118 constitute a piezoelectric body block 101. The acoustic matching layer 120, the
second laminated piezoelectric body 124 and the backing material 128 constitute a piezoelectric
body block 102. Furthermore, front electrodes 112 and 122 are provided on the front surface of
the laminated piezoelectric material (114 and 124), and back electrodes 116 and 126 are
provided on the rear surface. Further, internal electrodes (112a, 122a, 116a, 126a) are provided
between the piezoelectric elements in the laminated piezoelectric material (114, 124). The
functions of the respective components of the ultrasonic transducer and the positional
relationship between the components are the same as those of the ultrasonic transducer
according to the first embodiment, and thus the description thereof will be omitted.
[0068]
In addition, as shown in FIG. 5, the first side surface and the first side surface of the piezoelectric
laminate block (114, 124) in the piezoelectric body block 101 and the piezoelectric body block
102 in the ultrasonic transducer 100 according to the second embodiment as in the first
embodiment. The wiring leads 131 are arranged in parallel on the side surfaces of the two,
respectively.
[0069]
Further, as shown in FIG. 5, the first laminated piezoelectric body 114 and the second laminated
piezoelectric body 124 and the wiring lead 131 are connected by the metal thin film 170.
Thus, the wiring leads 131 are arranged in parallel to the piezoelectric blocks 101 and 102, and
the piezoelectric blocks 101 and 102 are stacked with the insulating sheet 130 interposed
therebetween, whereby the ultrasonic transducer 100 is formed. As described above, the
directions of the piezoelectric blocks 101 and 102 stacked via the insulating sheet 130 are the
same.
[0070]
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24
(Configuration of Side Surface in Laminated Piezoelectric Body) Next, the configuration of the
side surface of the first multilayer piezoelectric body 114, the second multilayer piezoelectric
body 124, and the backing members 118 and 128 according to the second embodiment will be
described with reference to FIG. As shown in FIG. 5, in the first laminated piezoelectric body 114
of the ultrasonic transducer 100 according to the second embodiment, the first side face
orthogonal to the front and back surfaces and on which the wiring lead 131 is disposed is
concaved. A shaped groove 119 is provided.
[0071]
The recessed groove 119 passes from the front electrode 112 on the first side surface of the first
laminated piezoelectric body 114 to the back electrode 116 in the piezoelectric block 101, and
the back electronic circuit side (the relay substrate 200 side) in the backing material 128
Leading up to Further, the width of the recessed groove 119 (the length in the direction
orthogonal to the stacking direction of the piezoelectric elements of the first laminated
piezoelectric member 114) is substantially the same as the width of the wiring lead 131 or
slightly longer than the width of the wiring lead 131 Formed as. By forming the recessed groove
119 in this manner, when the wiring lead 131 is disposed on the first laminated piezoelectric
body 114, the wiring lead 131 is accommodated in the recessed groove 119.
[0072]
Further, the depth (the length from the first side surface of the first laminated piezoelectric
member 114 to the bottom surface of the concave groove 119) of the concave groove 119 may
be formed longer than the width (or diameter) of the wiring lead 131 desirable. When laminating
the piezoelectric block 101 and the piezoelectric block 102 with the insulating sheet 130
interposed therebetween, the positions of the wiring lead 131, the first laminated piezoelectric
body 114 and the second laminated piezoelectric body 124 with respect to the entire ultrasonic
transducer 100 are This is to prevent deviation. By thus forming the recessed groove 119, the
positional accuracy of the wiring lead 131 and the positional accuracy of the laminated
piezoelectric material (114, 124) can be secured. Although the width (or diameter) of the wiring
lead 131 is shown to be higher than the depth of the recessed grooves 119 and 129 depending
on the view of FIG. 7A, the wiring lead 131 is actually more The shorter one is preferable. From
another point of view, the wiring leads 131 are formed slightly higher than the depths of the
recessed grooves 119 and 129, and the piezoelectric blocks are stacked and fixed to each other,
thereby forming the wiring leads 131 and the electrodes (112 etc.) It is also possible to make the
14-04-2019
25
connection tighter by making the contact more intimate.
[0073]
Further, it is desirable that the shape of the recessed groove 119 be configured to correspond to
the shape of the wiring lead 131. That is, with this configuration, it is possible to prevent
positional deviation of the laminated piezoelectric body in the direction orthogonal to the
laminating direction of the piezoelectric element, which is likely to occur when laminating the
piezoelectric body block 101 and the piezoelectric body block 102. Become.
[0074]
Further, similarly to the first side surface of the first laminated piezoelectric body 114, the
concave groove 119 is provided also on the second side surface (not shown). Furthermore, as
shown in FIG. 5, even on the first side surface and the second side surface of the second
laminated piezoelectric body 124 in the piezoelectric body block 102, up to the backing material
128 similarly to the concave groove 119 of the first laminated piezoelectric body 114. A
recessed groove 129 is formed so as to extend to the end. These concave grooves 119 and 129
correspond to an example of the "first concave groove" and the "second concave groove" in the
present invention.
[0075]
Also in the ultrasonic transducer according to the second embodiment, the insulating process
between the metal thin film 170 and each electrode on the side surface of the first laminated
piezoelectric body 114 and the second laminated piezoelectric body 124 is configured in the
same manner as in the first embodiment. It is also possible. However, in this case, the depths of
the respective recessed grooves 119 are formed shallower than the depths of the grooves 111,
113, 115, and 117. Furthermore, the depth of each recessed groove 129 is shallower than the
depth of the grooves 121, 123, 125, 127. If the recessed grooves 119 and 129 are deeper, the
metal thin film 170 is in contact with the electrodes of the laminated piezoelectric material (114
and 124) to be insulated.
[0076]
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26
(Manufacturing process) Next, the outline of the manufacturing process of the ultrasonic
transducer 100 in this embodiment is demonstrated using FIGS. 5-7. FIG. 6A shows a state before
the concave grooves 119 and 129 and the metal thin film 170 are formed on the piezoelectric
blocks 101 and 102 in the manufacturing process of the ultrasonic transducer 100 according to
the second embodiment of the present invention. It is a schematic perspective view. FIG. 6B is a
schematic perspective view showing a process of forming the concave grooves 119 and 129 in
the piezoelectric blocks 101 and 102 of FIG. 6A and forming the metal thin film 170. FIG. 6C is a
schematic perspective view showing a state in which the metal thin film 170 is formed on the
piezoelectric blocks 101 and 102 after the steps of FIGS. 6A and 6B. FIG. 6 (D) is a schematic
partial enlarged view of FIG. 6 (C). FIG. 7A shows a process of arranging the wiring leads 131 on
the laminated piezoelectric material (114, 124) on which the metal thin film 170 is formed in the
manufacturing process of the ultrasonic transducer 100 according to the second embodiment of
the present invention. It is a schematic perspective view shown. FIG. 7B is a schematic
perspective view showing the ultrasonic transducer 100 before being divided after the
piezoelectric block 101 and the piezoelectric block 102 in FIG. 7A are stacked.
[0077]
The steps up to forming the piezoelectric blocks 101 and 102 are the same as the steps of
manufacturing the ultrasonic transducer according to the first embodiment, and thus the
description thereof will be omitted.
[0078]
(Step 10) As shown in FIG. 6 (B), first and second side surfaces of the piezoelectric block 101,
102 before the concave grooves 119, 129 as shown in FIG. 6 (A) are formed. On the other hand,
recessed grooves 119 and 129 are formed from the portion where the front electrodes 112 and
122 are formed to the end on the opposite side to the boundary portion with the laminated
piezoelectric material (114 and 124) in the backing material 118 and 128. .
The recessed grooves 119 and 129 are formed in substantially the same direction as the
lamination direction of the piezoelectric elements in the laminated piezoelectric members (114
and 124).
[0079]
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27
(Step 11) Next, as shown in FIG. 6 (B), the first side surface and the second side surface of the
laminated piezoelectric material (114, 124) in the piezoelectric block 101, 102 in which the
concave grooves 119, 129 are formed. In contrast, the metal thin film 170 is formed. The
piezoelectric blocks 101 and 102 are divided in the subsequent steps, and constitute one row of
laminated piezoelectric members (114 and 124) in the two-dimensional array ultrasonic
transducer 100.
[0080]
(Step 12) As shown in FIG. 7A, after the metal thin film 170 is formed on the first side surface
and the second side surface of the first laminated piezoelectric body 114 and the second
laminated piezoelectric body 124, respectively. Wiring leads 131 are disposed in the concave
grooves 119 and 129 in the first and second side surfaces of the laminated piezoelectric body
114 and the second laminated piezoelectric body 124, and the electrodes (112, 122, etc.) and the
wiring leads 131 are made of metal. The thin film 170 fixes and conducts.
[0081]
(Step 13) When the wiring leads 131 are disposed on the first side surface and the second side
surface of the first laminated piezoelectric body 114 and the second laminated piezoelectric body
124, the insulating sheet 130 is sandwiched as in the first embodiment. Stack these at.
Thus, the ultrasonic transducer 100 before division as shown in FIG. 7 (B) is formed.
[0082]
(Step 14) After the ultrasonic transducer 100 is formed, as shown in FIG. 1A, from the side of the
acoustic matching layers 110 and 120, parallel to the stacking direction of the ultrasonic
transducer unit 100a, and on the side of the piezoelectric body The ultrasonic transducer 100 is
divided in the direction orthogonal to the direction of the grooves 111 and the like. The division
grooves formed by the division are filled with an insulating resin to form the ultrasonic
transducer 100 shown in FIG. 1 (A).
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28
[0083]
The connection between the ultrasonic transducer 100 and the relay substrate 200 in the second
embodiment is the same as that of the ultrasonic transducer according to the first embodiment,
and thus the description thereof will be omitted.
[0084]
(Operation and Effect) The operation and effect of the ultrasonic transducer 100 according to the
second embodiment described above and an ultrasonic probe (not shown) using the same will be
described.
[0085]
The ultrasonic transducer 100 according to the second embodiment and the ultrasonic probe
220 using the same are provided with the backing material 118 from the first side and the
second side orthogonal to the front and back of the laminated piezoelectric material (114, 124). ,
128 continuously form concave grooves 119, 129.
The recessed grooves 119 and 129 are formed in the same direction as the stacking direction of
the piezoelectric elements from the edge on the front electrode side in the first side, and from the
edge on the side of the front electrodes 112 and 122 via the back electrode 116 and 126 Then, it
is formed so as to extend to the back end electronic circuit (IC 205) side of the backing material
118, 128.
Further, the depth of the recessed grooves 119 and 129 is formed to be substantially the same
width (or diameter) as the wiring lead 131 or a slightly larger width.
[0086]
Therefore, when the wiring lead 131 is disposed on the side surface of the laminated
piezoelectric material (114, 124), the wiring lead 131 is accommodated in the recessed groove
119, 129. That is, the gap between the piezoelectric blocks 101 and 102 can be significantly
reduced. As a result, the side surfaces of the piezoelectric blocks 101 and 102 can be brought
into close contact or close to each other, and the situation in which the positions of the
piezoelectric blocks 101 and 102 shift can be prevented.
14-04-2019
29
[0087]
Furthermore, since the wiring leads 131 are accommodated in the recessed grooves 119 and
129, even when a force is applied in such a direction that the piezoelectric blocks are displaced
when laminating the piezoelectric blocks 101 and 102, the positional deviation is avoided. It is
possible to In addition, as a result of preventing such positional deviation, the positional accuracy
of the piezoelectric element arrangement in the ultrasonic transducer 100 and the positional
accuracy of the wiring lead 131 are secured, and the connection between the wiring lead 131
and the IC 205 of the relay substrate 200 becomes difficult. It is possible to prevent the situation
that Furthermore, it is possible to ensure the shape and the radiation direction of the ultrasonic
beam emitted from the ultrasonic probe.
[0088]
Further, the ultrasonic transducer 100 according to the present embodiment described above
can significantly reduce the gap between the piezoelectric blocks 101 and 102, so that the
laminated thickness can be reduced. It is possible to miniaturize an ultrasonic probe having an
ultrasonic transducer.
[0089]
Third Embodiment Next, an ultrasonic transducer 100 according to a third embodiment of the
present invention will be described with reference to FIG.
FIG. 8 is a schematic exploded perspective view showing the configuration of an ultrasonic
transducer 100 according to a third embodiment of the present invention.
[0090]
The ultrasonic transducer 100 according to the third embodiment is manufactured by
manufacturing steps different from those of the first and second embodiments. In addition, the
configuration of the wiring lead 131 may be different. The configuration of the other
components in the ultrasonic transducer 100 is the same as in the first and second embodiments.
14-04-2019
30
The third embodiment will be described below.
[0091]
(Manufacturing process) The manufacturing process of the ultrasonic transducer 100 concerning
3rd Embodiment is as follows. The steps of forming the piezoelectric blocks 101 and 102 are the
same as the steps of manufacturing the ultrasonic transducer according to the first embodiment,
and thus the description thereof will be omitted.
[0092]
As shown in FIG. 8, in the manufacturing process of the ultrasonic transducer 100 according to
the present embodiment, before arranging the wiring leads 131 with respect to the first side
surface and the second side surface of the laminated piezoelectric material (114, 124) Then, one
end of each of the wiring leads 131 is connected to the IC 205 of the relay substrate 200.
[0093]
Next, a metal thin film 170 is provided on the first side surface and the second side surface of the
laminated piezoelectric material (114, 124) by a method such as sputtering or vapor deposition.
[0094]
Next, with respect to the first and second side surfaces on which the metal thin film 170 is
formed, the wiring lead 131 whose one end is connected to the IC 205 is a first side surface of
the laminated piezoelectric material (114, 124) and It is disposed on the second side, and the
metal thin film 170 adheres the wiring lead 131 to the first side and the second side of the
laminated piezoelectric material (114, 124).
By this adhesion, the first and second side surfaces are fixed to the wiring lead 131, and the
electrodes (112, 122, etc.) exposed to the first and second side surfaces are electrically
connected to the wiring lead 131. Ru.
[0095]
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31
When the wiring leads 131 are disposed on the first side surface and the second side surface of
the first laminated piezoelectric body 114 and the second laminated piezoelectric body 124, they
are laminated with the insulating sheet 130 interposed therebetween, as in the first embodiment.
Do.
Thus, the ultrasonic transducer 100 before division is formed, and as shown in FIG. 1A, a division
groove is formed from the side of the acoustic matching layers 110 and 120 and filled with an
insulating resin, as shown in FIG. An ultrasonic transducer 100 as shown in FIG. 1 (A) is formed.
[0096]
According to the method of manufacturing the ultrasonic transducer 100 in the present
embodiment, the wiring lead 131 and the IC 205 are connected in advance before the
piezoelectric block 101 and the piezoelectric block 102 are laminated, and then the laminated
piezoelectric members (114, 124) are formed. Wiring leads 131 are disposed on the first side
and the second side. Therefore, in the manufacturing process of the ultrasonic transducer 100,
even if the positional accuracy can not be ensured when the piezoelectric block 101 and the
piezoelectric block 102 are stacked, the connection between the wiring lead 131 and the IC 205
of the relay substrate 200 becomes difficult. Since it does not exist, the connection process is
easy, and it is possible to reliably perform the connection.
[0097]
In the present embodiment, since the wiring leads 131 and the IC 205 are connected in advance,
it is not necessary to take account of the difficulty in the connection. As a result, the wiring lead
131 may not have flexibility, and the rear end portion of the wiring lead 131 may be fixed to the
insulating sheet 130.
[0098]
Further, in the present embodiment, the wiring leads 131 are disposed on the first side surface
and the second side surface of the laminated piezoelectric material (114, 124), but the present
invention is not limited to this, as shown in FIG. You may use the printed circuit board 330 in
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which the wiring pattern 331 was formed. That is, after the IC 205 in the relay substrate 200
and the wiring pattern 331 are connected in advance, the piezoelectric blocks 101 and 102 may
be disposed on the front and back surfaces of the printed substrate 330.
[0099]
(A) It is a schematic perspective view which shows the state which looked at the ultrasonic
transducer concerning 1st Embodiment of this invention from the side. (B) It is an example of the
connection method of the ultrasonic transducer which is a schematic disassembled perspective
view which shows the structure of the ultrasonic transducer unit which comprises the ultrasonic
transducer concerning 1st Embodiment of this invention, The ultrasonic transducer in this
embodiment FIG. 16 is a schematic perspective view showing a mechanism for connecting the
relay board and the relay board, and a mechanism for connecting an IC on the relay board and a
cable connected to the ultrasonic diagnostic apparatus main body. (A) It is a schematic
perspective view which shows the process in which a metal thin film is formed in a piezoelectric
material block in the manufacturing process of the ultrasonic transducer concerning 1st
Embodiment of this invention. (B) It is a schematic perspective view which shows the state in
which the metal thin film was formed in the side of the piezoelectric material block of FIG. 3 (A).
(C) It is a schematic perspective view which shows the state in which the groove | channel was
formed in the side of the piezoelectric material block of FIG.3 (B). (D) It is a schematic partial
enlarged view of FIG.3 (C). (A) It is a schematic perspective view which shows the process in
which the piezoelectric material block of FIG. 2 (B) is arrange | positioned on a printed circuit
board. (B) It is a schematic perspective view which shows the ultrasonic transducer before
dividing | segmenting, after laminating | stacking the ultrasonic transducer unit in FIG. 3 (A). (A)
It is a schematic perspective view which shows the process in which a wiring lead is arrange |
positioned to the side surface of a piezoelectric material block. (B) It is a schematic perspective
view which shows the ultrasonic transducer before dividing | segmenting after piling up the
piezoelectric material block in FIG. 4 (A). It is a schematic disassembled perspective view which
shows the structure of the ultrasonic transducer unit which comprises the ultrasonic transducer
concerning 2nd Embodiment of this invention. (A) It is a schematic perspective view which shows
the state before a ditch | groove and a metal thin film are formed in a piezoelectric material block
in the manufacturing process of the ultrasonic transducer concerning 2nd Embodiment of this
invention. (B) It is a schematic perspective view which shows the process in which a ditch |
groove is formed with respect to the piezoelectric material block of FIG. 6 (A), and a metal thin
film is formed. (C) It is a schematic perspective view which shows the state in which the metal
thin film was formed in the piezoelectric material block through the process of FIG. 6 (A) and (B).
FIG. 6D is a schematic partial enlarged view of FIG. 6C. (A) It is a schematic perspective view
which shows the process in which a wiring lead is arrange | positioned at the laminated
piezoelectric material in which the metal thin film was formed in the manufacturing process of
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33
the ultrasonic transducer concerning 2nd Embodiment of this invention. (B) It is a schematic
perspective view which shows the ultrasonic transducer before dividing | segmenting, after piling
up the piezoelectric material block in FIG. 7 (A).
It is a schematic disassembled perspective view which shows the structure of the ultrasonic
transducer concerning 3rd Embodiment of this invention. (A) It is a schematic perspective view
which shows the state which looked at the ultrasonic transducer of a two-dimensional array from
the side. (B) It is a schematic disassembled perspective view which shows the structure of the
ultrasonic transducer unit before division | segmentation which comprises the ultrasonic
transducer of FIG. 9 (A).
Explanation of sign
[0100]
Reference Signs List 100 ultrasonic transducer 100a ultrasonic transducer unit 101, 102
piezoelectric block 110, 120 acoustic matching layer 111, 113, 115, 117, 121, 123, 125, groove
112, 122 front electrode 112a, 122a first inner electrode 114 First laminated piezoelectric body
124 Second laminated piezoelectric body 116, 126 Back electrode 116a, 126a Second internal
electrode 118, 128 Backing material 119, 129 Groove 130 Insulation sheet 131 Wiring lead 170
Metal thin film 200 Relay board 210 Cable connection board 211 Connector 220 ultrasonic
probe
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