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DESCRIPTION JP2010119846

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DESCRIPTION JP2010119846
The present invention provides a probe for an ultrasonic diagnostic apparatus and a method of
manufacturing the same. A probe includes a sound absorbing layer, a piezoelectric body bonded
to the sound absorbing layer, and a unidirectional conductive portion bonded to at least one of
the sound absorbing layer and the piezoelectric body. According to the present invention, the
probe can be easily manufactured by connecting the piezoelectric body and the printed circuit
board by using the unidirectional conductive portion instead of the difficult and laborious
soldering operation in the manufacturing process. And the manufacturing time is shortened.
[Selected figure] Figure 1
Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
[0001]
The present invention relates to a probe, and more particularly, to a probe for an ultrasonic
diagnostic apparatus for generating an image of the inside of a target using ultrasonic waves and
a method of manufacturing the same.
[0002]
The ultrasound diagnostic apparatus irradiates an ultrasound signal from the body surface of the
object toward a desired site in the body, and uses information of the reflected ultrasound signal
(ultrasound echo signal) to It is a device that non-invasively obtains an image of a tomogram or
blood flow.
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This device is smaller and less expensive than other imaging diagnostic equipment such as X-ray
diagnostic equipment, CT scanner (Computerized Tomography Scanner), MRI (Magnetic
Resonance Image), nuclear medicine diagnostic equipment, etc., and is displayed in real time It is
widely used in heart, abdomen, urology, and obstetrics and gynecology related diagnoses
because it has advantages such as being possible and high safety without exposure to X-rays and
the like.
[0003]
In particular, in order to obtain an ultrasound image of an object, the ultrasound diagnostic
apparatus includes a probe that transmits an ultrasound signal to the object and receives an
ultrasound echo signal reflected from the object.
[0004]
The probe comprises a transducer, a case open at the upper end, and a cover coupled to the
upper end of the open case and in direct contact with the surface of the object.
[0005]
Here, the transducer is a piezoelectric layer that vibrates a piezoelectric material to convert an
electrical signal and an acoustic signal to each other, and a piezoelectric layer so that an
ultrasonic wave generated from the piezoelectric layer is maximally transmitted to an object. A
matching layer that reduces the acoustic impedance difference between the target and the object,
a lens layer that focuses ultrasonic waves propagating forward of the piezoelectric layer to a
specific point, and ultrasonic waves propagating backward of the piezoelectric layer And a sound
absorbing layer (backing layer) for blocking to prevent distortion of the image.
[0006]
The piezoelectric layer includes a piezoelectric body and an electrode, and the electrode is
bonded to the upper end and the lower end of the piezoelectric body, respectively.
Then, a printed circuit board (PCB: Printed Circuit Board) is bonded to the piezoelectric layer.
The printed circuit board and the piezoelectric body are usually connected by soldering using a
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solder material such as lead.
[0007]
The above-mentioned probe requires a difficult and time-consuming soldering operation to
connect the piezoelectric body and the printed circuit board, which requires a great deal of time
and heat generated during the soldering operation. The performance of the piezoelectric body
may be degraded.
Furthermore, since the soldering is performed manually, the durability of the connection portion
is low and uneven, and there is a problem that the performance of the probe is deteriorated.
Therefore, it is required to improve this.
[0008]
The object of the present invention is intended to ameliorate the problems as described above,
and is easy to manufacture and causes heat generated during the manufacturing process, and a
bonding failure between the piezoelectric body and the printed circuit board. It is an object of the
present invention to provide a probe for an ultrasonic diagnostic apparatus whose structure is
improved so as to prevent performance degradation due to
[0009]
A probe for an ultrasonic diagnostic apparatus, which is an embodiment of the present invention,
comprises a sound absorbing layer, a piezoelectric body bonded to the sound absorbing layer, a
single body bonded to at least one of the sound absorbing layer and the piezoelectric body. And a
directional conductor.
[0010]
Here, a first electrode and a second electrode are formed on the piezoelectric body, and the
unidirectional conduction portion is joined to the first electrode and the second electrode.
[0011]
The piezoelectric body is composed of a plurality of piezoelectric bodies arranged in parallel, and
the unidirectional conduction part is joined to the plurality of piezoelectric bodies.
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[0012]
Preferably, the unidirectional conduction portion includes an anisotropic conductive material.
[0013]
The probe of the present invention further comprises a printed circuit board bonded to the
unidirectional conduction portion.
[0014]
Further, according to another aspect of the present invention, there is provided a method of
manufacturing a probe for an ultrasonic diagnostic apparatus, comprising: bonding a
piezoelectric body having a first electrode and a second electrode to a sound absorbing layer;
Bonding the unidirectional conductive portion to the two electrodes.
[0015]
Here, the step of bonding the piezoelectric body preferably includes a step of forming a plurality
of piezoelectric bodies.
[0016]
Preferably, the step of bonding the unidirectional conductive portion includes the step of
bonding the unidirectional conductive portion to the plurality of piezoelectric members.
[0017]
The present invention further includes the step of bonding a printed circuit board to the
unidirectional conduction portion.
[0018]
According to the probe for an ultrasonic diagnostic apparatus of the present invention and the
method of manufacturing the same, the piezoelectric body and the printed circuit board are
connected using a unidirectional conductive portion instead of the soldering operation which is
difficult and time-consuming in the manufacturing process. This facilitates manufacture and
reduces manufacturing time.
[0019]
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Further, according to the present invention, the operation of connecting the first electrode and
second electrode separated for each channel and the wiring electrode of the printed board
separately for each channel is unidirectional instead of soldering manually. As it is performed in
one heating and pressurizing operation through the conductive part, a strong and uniform
connection can be made.
In this way, the low durability and non-uniformity of the connection site can prevent
performance degradation and failure.
[0020]
1 schematically illustrates the structure of a probe for an ultrasonic diagnostic apparatus
according to an embodiment of the present invention.
It is a flowchart which shows the manufacturing method of the probe for ultrasonic diagnostic
apparatuses based on one Example of this invention.
It is drawing which shows the process of joining a printed circuit board to a piezoelectric
material.
It is drawing which shows the process of joining a printed circuit board to a piezoelectric
material.
It is drawing which shows the process of joining a printed circuit board to a piezoelectric
material.
[0021]
Hereinafter, an embodiment of a probe for an ultrasonic diagnostic apparatus according to the
present invention and a method of manufacturing the same will be described with reference to
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the attached drawings.
For convenience of explanation, the thickness of lines, the size of components and the like shown
in the drawings may be exaggerated for the clarity of the explanation and the convenience.
Also, the terms used in the text are defined in consideration of the function of the present
invention, and can be changed according to the intention or practice of the user or operator.
Therefore, definitions for such terms should be made based on the content throughout the
present specification.
[0022]
FIG. 1 is a view schematically showing the configuration of a probe for an ultrasonic diagnostic
apparatus according to an embodiment of the present invention.
In the following description, the upper side in FIG. 1 is referred to as “upper” and the lower
side is referred to as “lower”.
[0023]
Referring to FIG. 1, a probe 100 for an ultrasonic diagnostic apparatus according to an
embodiment of the present invention includes a sound absorbing layer (Backing layer) 110 and a
piezoelectric body 120.
[0024]
The sound absorbing layer 110 is disposed below the piezoelectric body 120.
The sound absorbing layer 110 suppresses free vibration of the piezoelectric body 120 to reduce
the pulse width of the ultrasonic wave, and prevents the ultrasonic wave from unnecessarily
propagating below the piezoelectric layer, thereby preventing distortion of the image. Do.
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The sound absorbing layer 110 can be formed of a material containing rubber to which epoxy
resin, tungsten powder, or the like is added.
[0025]
The piezoelectric body 120 is “bonded” to the sound absorbing layer 110.
The piezoelectric body 120 generates ultrasonic waves using the current resonance state,
thereby making a ceramic of lead zirconate titanate (PZT), PZNT single crystal made of a solid
solution of lead zinc niobate and lead titanate, and magnesium niobate It is formed of, for
example, PZMT single crystal made of a solid solution of lead and lead titanate.
[0026]
The piezoelectric body 120 is provided with a first electrode 122 and a second electrode 124.
The first electrode 122 and the second electrode 124 are disposed to surround the piezoelectric
body 120. Such first and second electrodes 122 and 124 can be formed using a highly
conductive metal such as gold, silver or copper. Here, any one of the first electrode 122 and the
second electrode 124 is an anode of the piezoelectric body 120, and the other is a cathode of the
piezoelectric body 120. The first electrode 122 and the second electrode 124 are formed such
that the anode and the cathode are separated from each other. In the present embodiment, the
first electrode 122 is illustrated as an anode, and the second electrode 124 is illustrated as a
cathode.
[0027]
In addition, the first electrode 122 and the second electrode 124 are formed in a mutually
symmetrical shape so that the upper part and the lower part of the piezoelectric member 120 are
symmetrical. Each of the first electrode 122 and the second electrode 124 can desirably be
formed in a J shape that encloses the piezoelectric member 120. Since the upper and lower
portions of the piezoelectric body 120 including the first electrode 122 and the second electrode
124 are symmetrical, upper and lower sections are eliminated, and the upper and lower portions
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of the piezoelectric body are not divided. The piezoelectric body can be bonded to the sound
absorbing layer 110.
[0028]
The piezoelectric body 120 can be used in multiple channels by being formed such that a
plurality of piezoelectric bodies 120 are arranged in an array. In this embodiment, the
piezoelectric body 120 is divided into a plurality of pieces by dicing so as to have a
predetermined distance on one sound absorbing layer 110, and the plurality of separated
piezoelectric bodies 120 are in the form of an array. The form arranged side by side is illustrated.
However, the present invention does not have to be limited to this, and the piezoelectric body
120 of the present invention is diced together with the sound absorbing layer 110 so as to have
a predetermined spacing, and separated into plural pieces together with the sound absorbing
layer 110. The laminated body of the plurality of sound absorbing layers 110 and the
piezoelectric body 120 may be arranged side by side in an array shape.
[0029]
On the other hand, the ultrasonic diagnostic device probe 100 of the present embodiment may
further include a unidirectional conduction unit 130 and a printed circuit board 140 (PCB).
[0030]
The unidirectional conduction portion 130 is joined to the piezoelectric body 120 (the first
electrode 122 and the second electrode 124) arranged in an array as described above.
The unidirectional conduction parts 130 are disposed one by one on the first electrode 122 side
and one on the second electrode 124 side, and can be made of an anisotropic conductive
material.
[0031]
Anisotropic conductive material is an adhesive material that can simultaneously perform
electrical connection and mechanical connection between electrodes with a predetermined
constant pressure and temperature, and the portion to which pressure is applied is electrically
conductive. Since the portion which has elasticity and does not apply pressure has the
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characteristic that it does not have electrical conductivity, if a unidirectional conduction portion
130 containing such an anisotropic conductive material is used, Electrical) separation can be
solved in a single mechanical step.
[0032]
The printed circuit board 140 is bonded to the unidirectional conduction unit 130.
The printed circuit board 140 is attached so as to be substantially perpendicular to the stacking
direction of the sound absorbing layer 110 and the piezoelectric body 120. Such a printed circuit
board 140 includes a ductile printed circuit board (FPCB: Flexible Printed Circuit Board), and can
supply various signals and electricity.
[0033]
According to the present embodiment, the printed circuit board 140 is disposed one each on the
first electrode 122 side and the second electrode 124 side, and each printed circuit board 140
has a plurality of wiring electrodes (not shown). ) Is formed. Such a printed circuit board 140 is
bonded to the piezoelectric body 120 via the unidirectional conduction portion 130.
[0034]
Here, the above-mentioned "junction" means that two or more members are electrically
connected to each other through an interconnection (Interconnection). That is, the printed circuit
board 140 is electrically connected to the piezoelectric body 120 through the interconnection
portion, and as a result, is provided on the piezoelectric body 120.
[0035]
In other words, each printed circuit board 140 is mechanically coupled to the piezoelectric body
120 through the unidirectional conductive portion 130 when it is pressurized at a constant
pressure and temperature determined across the unidirectional conductive portion 130. Ru. The
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plurality of wiring electrodes of the printed circuit board 140 are electrically connected to the
first electrode 122 and the second electrode 124 of the piezoelectric body 120. A detailed
description of this is provided below.
[0036]
Meanwhile, reference numerals 150 and 160 respectively indicate the matching layer 150 made
of glass or resin for reducing the acoustic impedance difference between the objects and the
ultrasonic signal traveling above the piezoelectric body 120 at a specific point. And the lens layer
160.
[0037]
FIG. 2 is a flow chart showing a method of manufacturing a probe for an ultrasonic diagnostic
apparatus according to an embodiment of the present invention, and FIGS. 3 to 5 are views
showing a process of bonding a printed board to a piezoelectric body.
[0038]
Hereinafter, a method of manufacturing a probe for an ultrasonic diagnostic apparatus according
to an embodiment of the present invention will be described with reference to FIGS. 2 to 5.
[0039]
In order to manufacture the probe 100 for an ultrasonic diagnostic apparatus of the present
embodiment, first, the sound absorbing layer 110 is formed from a material containing rubber to
which epoxy resin and tungsten powder etc. are added, and the first electrode is formed on the
sound absorbing layer 110. The piezoelectric body 120 which has 122 and the 2nd electrode
124 is joined (S10).
[0040]
The piezoelectric body 120 is symmetrically formed so that the first electrode 122 and the
second electrode 124 wrap the piezoelectric body 120 in a J shape.
Thereby, the upper part and the lower part of the piezoelectric body become symmetrical with
each other, and it is not necessary to distinguish the upper and lower sides of the piezoelectric
body.
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As a result, since the piezoelectric body can be bonded to the sound absorbing layer 110 without
distinguishing the upper and lower portions thereof, manufacture of the probe 100 for an
ultrasonic diagnostic apparatus becomes easier.
[0041]
On the other hand, the piezoelectric bodies 120 of this embodiment are divided into a plurality of
pieces so as to have a predetermined interval and arranged in an array, and a plurality of divided
piezoelectric bodies 120 are formed on the printed circuit board 140. It is connected
corresponding to the wiring electrode and used in multiple channels.
[0042]
One of the piezoelectric bodies 120 separated as described above forms one channel, and a
plurality of such piezoelectric bodies 120 are arranged side by side and arranged in an array
shape to form a multi-channel.
[0043]
According to this embodiment, the laminate of the sound absorbing layer 110 and the
piezoelectric body 120 is diced by a dicing apparatus.
Such dicing is performed to a sufficient depth to ensure that the first electrode 122 and the
second electrode 124 are separated.
[0044]
The piezoelectric body 120 is separated into a plurality of pieces so as to have a predetermined
distance by the dicing, and the first electrode 122 and the second electrode 124 formed on one
separated piezoelectric body 120 are adjacent to each other, The first electrode 122 and the
second electrode 124 formed on the piezoelectric body 120 are completely separated from each
other electrically.
[0045]
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In the present embodiment, it is exemplified that only the piezoelectric body 120 is diced to align
the plurality of piezoelectric bodies 120 in an array shape on one sound absorbing layer 110, but
the present invention is not limited thereto. It is not limited to
In the ultrasonic diagnostic device probe 100 of the present invention, the laminated body of the
sound absorbing layer 110 and the piezoelectric body 120 is separated into a plurality of pieces
by dicing the sound absorbing layer 110 together with the piezoelectric body 120. There may be
various alternative embodiments, such as structures arranged side-by-side in an array.
[0046]
When the piezoelectric body 120 is bonded to the sound absorbing layer 110, as shown in FIGS.
4 and 5, the plurality of first electrodes 122 and the second electrode 124 arranged side by side
include an anisotropic conductive material. The unidirectional conduction portion 130 is joined
(S20), and the printed circuit board 140 is joined to the unidirectional conduction portion 130
joined to the first electrode 122 and the second electrode 124 (S30).
At this time, the unidirectional conduction portion 130 and the printed circuit board 140 are
disposed so as to be substantially perpendicular to the laminating direction of the sound
absorbing layer 110 and the piezoelectric body 120.
[0047]
An anisotropic conductive material is an adhesive material that can simultaneously perform
electrical connection and mechanical connection between electrodes by applying a
predetermined constant pressure and temperature.
The material contains conductive particles at a constant density and is non-conductive in the
absence of pressure, but when pressure is applied the conductive particles contact each other,
exerting pressure. It has the characteristic of anisotropic conductivity that becomes conductive
only in the opposite direction.
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[0048]
Therefore, the unidirectional conductive portion 130 is disposed between the plurality of
piezoelectric members 120 arranged side by side and the printed board 140, and the first
electrode 122 and the second electrode 124 correspond to the corresponding wiring of the
printed board 140. When the printed circuit board 140 is aligned and the fixed pressure and
temperature are applied to the unidirectional conduction unit 130 through the printed circuit
board 140 so that the printed circuit board 140 is aligned with the electrodes, the printed circuit
board 140 itself may pass through the unidirectional conduction unit 130. It is bonded to the
piezoelectric body 120.
On the other hand, the wiring electrode of the printed circuit board 140 is electrically connected
to the first electrode 122 and the second electrode 124 by the unidirectional conduction unit
130.
[0049]
At this time, the pressure applied to the unidirectional conduction portion 130 acts on the
connection portion of the first electrode 122 and the second electrode 124 and the wiring
electrode of the printed circuit board 14. The wiring electrodes are connected to one another so
as to have conductivity only in each channel.
[0050]
On the other hand, in the present embodiment, the case where the unidirectional conductive
portion 130 and the printed circuit board 140 are joined after the piezoelectric body 120 is
joined to the sound absorbing layer 110 has been illustrated, but it is not necessary to
necessarily carry out in the above order. It may be implemented in different order or may be
implemented simultaneously.
[0051]
Moreover, although the case where the unidirectional conduction part 130 was joined to the
piezoelectric material 120 was illustrated in the present Example, this invention is not limited to
this.
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For example, the unidirectional conduction portion 130 of the present invention is joined to the
sound absorbing layer 110 and connected there to the first electrode 122 and the second
electrode 124 of the piezoelectric body 120 to form the printed circuit board 140 and the sound
absorbing layer 110. There can be various alternative embodiments, such as being electrically
connected to an electrode.
[0052]
According to the ultrasonic diagnostic apparatus probe 100 of the present embodiment
described above, the first electrode 122 and the second electrode 124 and the wiring electrodes
of the printed circuit board 140 are electrically connected via the unidirectional conduction
portion 130. Because it is connected, there are the following effects.
[0053]
First, instead of performing a difficult and time-consuming soldering operation in the
manufacturing process, manufacturing becomes easier by connecting the piezoelectric body 120
and the printed circuit board 140 using the unidirectional conduction portion 130. , Production
time is reduced.
[0054]
Second, the operation of connecting the first electrode 122 and the second electrode 124
separated for each channel and the wiring electrode of the printed circuit board 140 for each
channel is a substitute for the soldering operation performed manually. In addition, since the
heating and pressing operations are performed once through the unidirectional conduction
portion 130, the connection portion is strong and uniform.
For this reason, due to the low durability and non-uniformity of the connection site, it is possible
to prevent the performance from being reduced or a failure from occurring.
[0055]
While the present invention has been described with reference to the embodiments shown in the
drawings, this is merely an example, and various modifications and equivalents will be apparent
to those skilled in the art to which the present invention pertains. Other embodiments can be
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devised.
As described above, the claims of the present invention are as described below.
[0056]
Reference Signs List 100 probe for ultrasonic diagnostic apparatus, 110 sound absorbing layer,
120 piezoelectric body, 122 first electrode, 124 second electrode, 130 unidirectional conductive
portion, 140 printed circuit board, 150 matching layer, 160 lens layer
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