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DESCRIPTION JP2010258911

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DESCRIPTION JP2010258911
PROBLEM TO BE SOLVED: To provide an ultrasonic sensor capable of preventing deterioration of
characteristics of a piezoelectric element at the time of manufacture. SOLUTION: An acoustic
matching plate 130 of an ultrasonic sensor 100 has a first conductive inner portion 133n to
which a first electrode 121 of a piezoelectric element 120 is connected in a bonding region
130ag, and a first conductive outer portion 133g outside the bonding region 130ag. A first
conductive portion 133 including the first conductive outer portion 133m to which the 1 lead
wire 140 is connected, a second conductive inner portion 135n to which the second electrode
123 of the piezoelectric element 120 is connected in the bonding region 130ag, and bonding
And a second conductive portion 135 including a second conductive outer portion 135m to
which the second lead wire 150 is connected outside the region 130ag. [Selected figure] Figure 1
Ultrasonic sensor
[0001]
The present invention relates to an ultrasonic sensor including a piezoelectric element, and more
particularly, a piezoelectric element, a vibrating member to which the piezoelectric element is
joined to transmit ultrasonic waves, and a pair of lead wires electrically connected to two
electrodes of the piezoelectric element. The present invention relates to an ultrasonic sensor
provided.
[0002]
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1
An ultrasonic sensor is conventionally known that includes a piezoelectric element, a vibrating
member to which the piezoelectric element is joined to transmit an ultrasonic wave, and a pair of
lead wires electrically connected to two electrodes of the piezoelectric element.
Three types of forms are known mainly as how to take out the lead wire in such an ultrasonic
sensor (connection form). For example, Patent Documents 1 to 3 disclose these connection
modes.
[0003]
That is, Patent Document 1 discloses a plurality of ultrasonic sensors including an insulating
bottomed cylindrical case made of synthetic resin and a piezoelectric element attached to the
inner bottom surface of the case (Patent Document 1) 1 to 3 and their explanatory parts). Among
these, in the ultrasonic sensor described in FIG. 1 and FIG. 3 of Patent Document 1, electrodes
(upper surface electrode and lower surface electrode) are respectively formed on upper and
lower surfaces of the piezoelectric element. Wires (leads) are connected to each other.
[0004]
Further, in the ultrasonic sensor described in FIG. 2 of Patent Document 1, electrodes (upper
surface electrode and lower surface electrode) are respectively formed on upper and lower
surfaces of the piezoelectric element, and the lower surface electrode is formed on the side
surface of the piezoelectric element. And an auxiliary electrode portion extending from the side
electrode portion and formed on the upper surface of the piezoelectric element. Wires (lead
wires) are respectively connected to the upper surface electrode and the auxiliary electrode
portion of the lower surface electrode.
[0005]
Patent Document 2 discloses an ultrasonic sensor including a bottomed cylindrical metal case
and a piezoelectric ceramic vibrator (piezoelectric element) attached to the bottom of the metal
case (Patent Document 2) 2 of FIG. 1 and its explanation etc.). Electrodes are formed on both
main surfaces of the ceramic vibrator, one of the electrodes is electrically connected to the
bottom of the metal case, and one of the electrodes is taken out through the metal case. There is.
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Moreover, the lead wire is connected to the other electrode.
[0006]
In Patent Document 3, an insulating bottomed cylindrical inner casing made of resin, a conductor
film joined to the bottom of the inner casing, and a piezoelectric vibrator (piezoelectric element)
attached to the conductor film And Electrodes are respectively formed on both main surfaces of
the piezoelectric vibrator, and one of the electrodes is connected to the conductor film. And while
one lead wire is connected to this conductor film, the other lead wire is connected to the other
electrode of a piezoelectric vibrator.
[0007]
Patent Document 1: Japanese Patent Application Publication No. 2002-232985 Patent Document
No. 3014801 Patent Document 2: Japanese Patent Application Publication No. 2006-203563
[0008]
As described above, in each of the ultrasonic sensors described in Patent Documents 1 to 3, at
least one lead wire is directly connected to an electrode formed on a piezoelectric element.
In such a thing, when soldering a lead wire to a piezoelectric element, there exists a possibility
that the characteristic of a piezoelectric element may deteriorate with heat. In particular, when
the piezoelectric element is small and thin, or when soldering is performed at a high temperature,
the characteristics of the piezoelectric element are likely to be degraded by the heat at the time
of soldering. In addition, it also causes the characteristic variation in the piezoelectric element.
For this reason, the conventional ultrasonic sensor was inferior in reliability.
[0009]
The present invention has been made in view of such a current situation, and includes a
piezoelectric element, a vibrating member to which the piezoelectric element is joined to transmit
an ultrasonic wave, and a pair of lead wires electrically connected to two electrodes of the
piezoelectric element. It is an object of the present invention to provide an ultrasonic sensor that
can prevent deterioration of the characteristics of the piezoelectric element at the time of
manufacture.
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[0010]
The solution means is a piezoelectric element having an element first main surface, an element
second main surface parallel to this, and an element side surface connecting these surfaces, and
the first electrode first surface formed on the element first main surface A first main surface
portion, a first electrode side main surface portion connected to the first electrode first main
surface portion, a first electrode side surface portion formed on the element side surface, and a
first electrode side surface portion connected to the first electrode side surface portion;
Piezoelectric having a first electrode including a first electrode second main surface portion, and
a second electrode including a second electrode second main surface portion formed on the
element second main surface and insulated from the first electrode A vibrating member including
a bonding region including a bonding region to which the device second main surface of the
piezoelectric device is bonded, the vibration member transmitting ultrasonic waves, and a first
lead electrically connected to the first electrode of the piezoelectric device An ultrasonic sensor
comprising a wire and a second lead wire electrically connected to the second electrode of the
piezoelectric element; The vibrating member is made of an insulating material, is an insulating
main body forming the joint surface, and is a first conductive portion made of a conductive
material and disposed on the joint surface, wherein A first conductive inner portion disposed in
the junction region and electrically connected also in contact with the first electrode second
major surface portion of the first electrode, and the first conductive inner portion connected to
the first conductive inner portion; A first conductive portion including a first conductive outer
portion disposed on the outer side of the bonding region and connected to the first lead wire
among the bonding surfaces, and made of a conductive material and disposed on the bonding
surface A second conductive inner portion which is a second conductive portion and is disposed
in the bonding region of the bonding surface and electrically connected to the second major
surface portion of the second electrode of the second electrode. And connected to the second
conductive inner portion, and disposed outside the bonding area of the bonding surface. Is, the
second conductive outer portion which the second lead line is connected, an ultrasonic sensor
having a second conductive portion, the containing.
[0011]
In the ultrasonic sensor according to the present invention, the first electrode (first electrode
second main surface portion) of the piezoelectric element is also electrically connected in contact
with the first conductive portion (first conductive inner portion) formed on the vibrating member
The second electrode (second electrode second main surface portion) of the piezoelectric element
is also electrically connected in contact with the second conductive portion (second conductive
inner portion) formed in the vibrating member.
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The first lead wire is connected to a first conductive portion (first conductive outer portion)
formed in the vibrating member, and is electrically connected to the first electrode of the
piezoelectric element through the first conductive portion.
The second lead wire is connected to a second conductive portion (a second conductive outer
portion) formed in the vibrating member, and is electrically connected to the second electrode of
the piezoelectric element through the second conductive portion. As described above, in the
ultrasonic sensor according to the present invention, the first and second lead wires are
connected to the first and second conductive portions of the vibrating member, and are not
soldered to the piezoelectric element. It is possible to prevent the characteristics of the
piezoelectric element from being deteriorated by heat at the time of soldering of the second lead
wire. Moreover, the characteristic variation of the piezoelectric element resulting from this does
not arise, either. Therefore, the reliability of the ultrasonic sensor can be improved as compared
to the prior art.
[0012]
Furthermore, in the ultrasonic sensor described above, it is preferable that the first conductive
portion and the second conductive portion of the vibrating member be each formed of a plated
layer deposited on the bonding surface.
[0013]
In the ultrasonic sensor of the present invention, the first conductive portion and the second
conductive portion are formed by plating.
For this reason, when forming the member which becomes the 1st, 2nd conductive part
separately, it adheres to an insulating main part, or it inserts-molds the member which becomes
the 1st, 2nd conductive part, and forms a vibration member etc. In comparison, the vibrating
member having the first and second conductive portions can be easily formed. Therefore, the
ultrasonic sensor can be made inexpensive.
[0014]
Furthermore, in the ultrasonic sensor according to any one of the above, the first lead wire is
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connected by soldering to the first conductive portion, and the second lead wire is soldered to
the second conductive portion. It is good to set it as the ultrasonic sensor connected and
connected.
[0015]
In the ultrasonic sensor of the present invention, the first lead wire is connected to the first
conductive portion and the second lead wire is connected to the second conductive portion by
soldering.
Therefore, since the connection between the first and second lead wires and the first and second
conductive parts can be performed easily and reliably, the ultrasonic sensor can be made
inexpensive and reliable.
[0016]
FIG. 2 is a longitudinal sectional view of the ultrasonic sensor according to the first embodiment.
FIG. 2 is a plan view of the ultrasonic sensor according to the first embodiment and viewed from
the top of FIG. 1; FIG. 7 is a plan view of the piezoelectric element according to Embodiment 1 as
viewed from the element first main surface side. FIG. 7 is a plan view of the piezoelectric element
according to the first embodiment and viewed from the element second main surface side. FIG. 5
is a side view of the piezoelectric element according to the first embodiment and viewed from the
direction A of FIG. 4; FIG. 7 is a plan view of the acoustic matching plate according to the first
embodiment and viewed from the bonding surface side. FIG. 7 is a plan view of the acoustic
matching plate according to the first embodiment and viewed from the second main surface side.
It concerns on Embodiment 1, and is a side view of a sound matching board. FIG. 6 is an
explanatory view according to Embodiment 1, showing a state in which the piezoelectric element,
the acoustic matching plate, and the first and second lead wires are connected to each other. FIG.
10 is an explanatory view of the state in which the piezoelectric element, the acoustic matching
plate, and the first and second lead wires are connected to each other according to Embodiment
1 as viewed from above in FIG. 9; 7 is a longitudinal sectional view of an ultrasonic sensor
according to Embodiment 2. FIG. It is the top view seen from the upper direction of FIG. 11 in the
state without the sealing resin of the ultrasonic sensor which concerns on Embodiment 2. FIG.
[0017]
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Embodiment 1 Hereinafter, an embodiment of the present invention will be described with
reference to the drawings. 1 and 2 show an ultrasonic sensor 100 according to the first
embodiment. Moreover, the piezoelectric element 120 is shown in FIGS. Moreover, the acoustic
matching board 130 is shown in FIGS. 6-8. 9 and 10 show a state in which the piezoelectric
element 120, the acoustic matching plate 130, and the first and second lead wires 140 and 150
are connected to each other.
[0018]
The ultrasonic sensor 100 includes a case (resin case) 110, a piezoelectric element (piezoelectric
ceramic vibrator) 120, an acoustic matching plate (vibration member) 130, a first lead wire 140
and a second lead wire 150, and a seal. It is comprised from the stop resin 160 grade | etc., And
is formed in the column shape which has axis AX.
[0019]
Among these, the case 110 is made of an insulating material (specifically, insulating resin), and is
formed in a bottomed cylindrical shape (specifically, a bottomed cylindrical shape) having an axis
AX (FIGS. 1 and 1). 2).
The case 110 is integrally formed of a disc-like case bottom 110b and a cylindrical case side wall
110c extending from the periphery of the case bottom 110b in a direction (upward in FIG. 1)
orthogonal to the case bottom 110b. It is configured.
[0020]
The piezoelectric element 120 is formed in a disk shape having a circular element first major
surface 120a, a circular element second major surface 120b parallel to this, and an element side
surface 120c connecting these planes. (Refer FIG. 1, FIG. 3-5, FIG. 9, FIG. 10). The piezoelectric
element 120 is bonded to a bonding area 130ag of a bonding surface 130a of an acoustic
matching plate 130 whose element second major surface 120b is described later. The
piezoelectric element 120 has two electrodes (a first electrode 121 and a second electrode 123),
and is polarized in the thickness direction of the piezoelectric element 120.
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[0021]
Specifically, the first electrode 121 is mainly formed on the element first major surface 120a, and
extends to the element second major surface 120b through the element side surface 120c. That
is, the first electrode 121 is connected to the first electrode first major surface portion 121p
formed on the element first major surface 120a and the first electrode first major surface portion
121p, and is formed on the element side surface 120c. It comprises a side surface portion 121 q
and a first electrode second main surface portion 121 r connected to the first electrode side
surface portion 121 q and formed on the element second main surface 120 b.
[0022]
Among these, the first electrode first major surface portion 121 p is formed in a circular shape
on the entire surface of the element first major surface 120 a (see FIG. 3 and the like). Further,
the first electrode side surface portion 121 q is formed in a rectangular shape in plan view on a
part of the element side surface 120 c (see FIG. 5). Further, the first electrode second major
surface portion 121 r is formed in a substantially semicircular shape on a part of the element
second major surface 120 b (see FIG. 4 and the like).
[0023]
On the other hand, the second electrode 123 includes only the second electrode second major
surface portion 123p formed on the element second major surface 120b. The second electrode
123 (second electrode second major surface portion 123p) is disposed so as to be insulated from
the first electrode 121 via the gap between the first electrode second major surface portion 121r
of the first electrode 121, and the second element main It is formed on most of the surface 120b
(see FIG. 4 and the like).
[0024]
Next, the acoustic matching plate 130 will be described. The acoustic matching plate 130 is a
vibrating member to which the piezoelectric element 120 is bonded to transmit an ultrasonic
wave, and the circular bonding surface 130a forming the first main surface thereof and the
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circular second main surface parallel to this. It is formed in disk shape which has 130b and the
side 130c which ties these surfaces (refer FIG. 1, FIGS. 6-10). As described above, the element
second major surface 120 b of the piezoelectric element 120 is bonded to the center of the
bonding surface 130 a by an adhesive. In the bonding surface 130a, a central circular region to
which the element second major surface 120b is bonded is a bonding region 130ag (see FIG. 6
and the like). The acoustic matching plate 130 is bonded to the center of the bottom 110 b of the
case 110 by an adhesive.
[0025]
The acoustic matching plate 130 is configured of an insulating main body portion 131, a first
conductive portion 133, and a second conductive portion 135. Among them, the insulating main
body portion 131 is made of an insulating material (specifically, an insulating resin), and is
formed in a disk shape that forms the above-described joint surface 130a, the second main
surface 130b, and the side surface 130c.
[0026]
The first conductive portion 133 is made of a conductive material (specifically, copper), and is
formed on the bonding surface 130 a. The first conductive portion 133 is formed of a plating
layer deposited on the bonding surface 130a. The first conductive portion 133 has a
substantially oval shape, and is connected to the first conductive inner portion 133 n and the
first conductive inner portion 133 n disposed in the bonding area 130 ag of the bonding surface
130 a and radially outward. It consists of a first conductive outer portion 133m which is
extended and is disposed outside the bonding area 130ag in the bonding surface 130a.
[0027]
The first conductive inner portion 133 n of the first conductive portion 133 is also in contact
with and electrically connected to the first electrode second main surface portion 121 r of the
first electrode 121 of the piezoelectric element 120. Further, a first lead wire 140 to be described
later is connected to the first conductive outer portion 133m of the first conductive portion 133.
Therefore, the first lead wire 140 is not connected directly to the first electrode 121 of the
piezoelectric element 120, but is electrically connected to the first electrode 121 of the
piezoelectric element 120 through the first conductive portion 133. There is.
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[0028]
The second conductive portion 135 is made of a conductive material (specifically, copper), and is
formed on the bonding surface 130 a in a substantially oval shape symmetrically with the first
conductive portion 133. The second conductive portion 135 is formed of a plating layer
deposited on the bonding surface 130 a. The second conductive portion 135 is connected to the
second conductive inner portion 135n disposed in the bonding region 130ag of the bonding
surface 130a and the second conductive inner portion 135n and extends radially outward, and
the second conductive portion 135 is included in the bonding surface 130a. , And the second
conductive outer portion 135m disposed outside the bonding region 130ag.
[0029]
The second conductive inner portion 135n of the second conductive portion 135 is also
electrically connected to the second electrode 123 (second electrode second major surface
portion 123p) of the piezoelectric element 120. In addition, a second lead wire 150 described
later is connected to the second conductive outer portion 135m of the second electrode 123.
Therefore, the second lead wire 150 is not connected directly to the second electrode 123 of the
piezoelectric element 120, but is electrically connected to the second electrode 123 of the
piezoelectric element 120 through the second conductive portion 135. There is.
[0030]
One end of the first lead wire 140 is connected to the first conductive outer portion 133m of the
first conductive portion 133 formed on the acoustic matching plate 130 by the solder 141 as
described above, and the other end is the upper side. It extends towards the The second lead wire
150 is connected at one end to the second conductive outer portion 135m of the second
conductive portion 135 formed on the acoustic matching plate 130 by the solder 151 as
described above, and the other end is at the upper side It extends towards the The sealing resin
160 is filled and formed in the case 110.
[0031]
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As described above, in the ultrasonic sensor 100 according to the first embodiment, the first
conductive portion in which the first electrode 121 (first electrode second major surface portion
121 r) of the piezoelectric element 120 is formed on the acoustic matching plate 130 It is also
electrically connected in contact with 133 (first conductive inner portion 133 n). In addition, the
second electrode 123 (second electrode second major surface portion 123p) of the piezoelectric
element 120 is in electrical contact with the second conductive portion 135 (second conductive
inner portion 135n) formed in the acoustic matching plate 130. It is connected. Then, the first
lead wire 140 is connected to the first conductive portion 133 (the first conductive outer portion
133 m) formed in the acoustic matching plate 130, and the first lead wire 140 is connected to
the first conductive portion 133 via the first conductive portion 133. It is in conduction with the
electrode 121. Further, the second lead wire 150 is connected to the second conductive portion
135 (second conductive outer portion 135 m) formed in the acoustic matching plate 130, and
the second lead wire 150 is connected to the second conductive portion 135 via the second
conductive portion 135. Conduction with the electrode 123 is made.
[0032]
As described above, in the ultrasonic sensor 100 according to the first embodiment, the first and
second lead wires 140 and 150 are connected to the first and second conductive portions 133
and 135 of the acoustic matching plate 130, respectively. Since it is not soldered, it is possible to
prevent the characteristic of the piezoelectric element 120 from being deteriorated by the heat at
the time of soldering of the first and second lead wires 140 and 150. Moreover, the characteristic
variation of the piezoelectric element 120 resulting from this does not arise, either. Therefore,
the reliability of the ultrasonic sensor 100 can be improved.
[0033]
Furthermore, in the first embodiment, the first conductive portion 133 and the second
conductive portion 135 are formed by plating. For this reason, a member to be the first and
second conductive portions 133 and 135 is separately formed and bonded to the insulating main
portion 131, or a member to be the first and second conductive portions 133 and 135 is insertmolded to vibrate The acoustic matching plate 130 having the first and second conductive
portions 133 and 135 can be easily formed as compared with the case where the member 130 is
formed. Therefore, the ultrasonic sensor 100 can be made inexpensive.
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[0034]
In the first embodiment, the first lead wire 140 is connected to the first conductive portion 133
and the second lead wire 150 is connected to the second conductive portion 135 by soldering.
Therefore, since the connection between the first and second lead wires 140 and 150 and the
first and second conductive portions 133 and 135 can be performed easily and reliably, the
ultrasonic sensor 100 can be inexpensive and reliable. It can be done.
[0035]
Second Embodiment Next, a second embodiment will be described. The ultrasonic sensor 200
according to the second embodiment is different from the ultrasonic sensor 200 according to the
first embodiment in that the piezoelectric element 120 is directly joined to the bottom portion
210b of the case 210 without the intervention of the acoustic matching plate 130 according to
the first embodiment. . The other parts are basically the same as those of the first embodiment,
and therefore, the description of the same parts as those of the first embodiment will be omitted
or simplified. 11 and 12 show an ultrasonic sensor 200 of the second embodiment. FIG. 12
shows a state in which the sealing resin 160 is removed.
[0036]
The ultrasonic sensor 200 according to the second embodiment includes a case 210, a
piezoelectric element 120, a first lead wire 140 and a second lead wire 150, and a sealing resin
160. Among these, the case 210 is mainly made of an insulating material (specifically, insulating
resin), and is formed in a bottomed cylindrical shape (specifically, a bottomed cylindrical shape).
The case 210 has a case main body portion 211 including a disk-like case bottom portion 210 b
and a cylindrical case side wall portion 210 c. In the second embodiment, the case 210
corresponds to the vibrating member of the present invention, and the case main body 211
corresponds to the insulating main body of the present invention.
[0037]
The element second main surface 120b of the piezoelectric element 120 similar to that of the
first embodiment is bonded to the center of the bonding surface 210ba which is the first main
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surface of the case bottom 210b by an adhesive. Of the bonding surface 210ba, a central circular
region to which the element second major surface 120b of the piezoelectric element 120 is
bonded is a bonding region 210bag.
[0038]
Further, on the bonding surface 210ba of the case bottom 210b, a first conductive portion 233
and a second conductive portion 235 each formed of a plated layer are formed. The first
conductive portion 233 has a substantially oval shape, and is connected to the first conductive
inner portion 233 n and the first conductive inner portion 233 n disposed in the bonding region
210 bag of the bonding surface 210 ba and radially outward. It consists of a first conductive
outer portion 233m disposed outside the bonding area 210bag of the bonding surface 210ba.
The first conductive inner portion 233 n is also electrically connected to the first electrode
second major surface portion 121 r of the first electrode 121 of the piezoelectric element 120.
Further, the first lead wire 140 is connected to the first conductive outer side portion 233 m by
the solder 141.
[0039]
The second conductive portion 235 is formed on the bonding surface 210 ba in a substantially
oval shape symmetrically with the first conductive portion 233. The second conductive portion
235 is connected to the second conductive inner portion 235 n disposed in the bonding area 210
bag and the second conductive inner portion 235 n of the bonding surface 210 ba and extends
radially outward. The second conductive outer portion 235m is disposed outside the bonding
area 210bag. The second conductive inner portion 235 n is also electrically connected to the
second electrode 123 (second electrode second major surface portion 123 p) of the piezoelectric
element 120. In addition, the second lead wire 150 is connected to the second conductive outer
portion 235 m by the solder 151.
[0040]
As described above, in the ultrasonic sensor 200 according to the second embodiment, the first
conductive portion 233 (the first electrode second major surface portion 121 r) of the
piezoelectric element 120 is formed in the case 210 (the first conductive portion 233 It is
electrically connected in contact with the first conductive inner portion 233 n). Further, the
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second electrode 123 (second electrode second major surface portion 123 p) of the piezoelectric
element 120 is connected to the second conductive portion 235 (second conductive inner
portion 235 n) formed in the case 210. Then, the first lead wire 140 is connected to the first
conductive portion 233 (first conductive outer portion 233 m) formed in the case 210, and the
first electrode 121 of the piezoelectric element 120 via the first conductive portion 233.
Conducted with. Further, the second lead wire 150 is connected to the second conductive portion
235 (second conductive outer portion 235 m) formed in the case 210, and the second electrode
123 of the piezoelectric element 120 via the second conductive portion 235. Conducted with.
[0041]
As described above, in the ultrasonic sensor 200 according to the second embodiment, the first
and second lead wires 140 and 150 are connected to the first and second conductive portions
233 and 235 of the case 210, respectively. Since it is not attached, it is possible to prevent the
characteristic of the piezoelectric element 120 from being deteriorated by the heat at the time of
soldering of the first and second lead wires 140 and 150. Moreover, the characteristic variation
of the piezoelectric element 120 resulting from this does not arise, either. Therefore, the
reliability of the ultrasonic sensor 200 can be improved. The other parts similar to those of the
first embodiment have the same effects as those of the first embodiment.
[0042]
Although the present invention has been described above with reference to the embodiment, the
present invention is not limited to the above-described first and second embodiments, and it goes
without saying that the present invention can be appropriately modified and applied without
departing from the scope of the invention. Yes. For example, in the first embodiment, the case
110 is formed of an insulating resin, but since the piezoelectric element 120 is joined to the case
110 through the insulating acoustic matching plate 130, the case 110 may be made of metal.
Good.
[0043]
100, 200 Ultrasonic Sensor 110 Case 210 Case (Vibration Member) 211 Case Body (Insulated
Body) 120 Piezoelectric Element 120a Element First Main Surface 120b Element Second Main
Surface 120c Element Side 121 First Electrode 121p First Electrode First 1 principal surface
portion 121q first electrode side surface portion 121r first electrode second principal surface
portion 123 second electrode 123p second electrode second principal surface portion 130
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acoustic matching plate (vibration member) 130a, 210ba bonding surface (first principal surface)
130ag, 210 bag junction area 131 insulating main body portion 133, 233 first conductive
portion 133n, 233n first conductive inner portion 133m, 233m first conductive outer portion
135, 235 second conductive portion 135n, 235n second conductive inner portion 135m, 235m
second Conductive outer portion 140 first lead wire 141, 151 solder 150 second Lead wire
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