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DESCRIPTION JP2013144111

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DESCRIPTION JP2013144111
Abstract: The present invention provides an ultrasonic probe including a matching layer in which
an electrode is formed on a surface in contact with a piezoelectric layer to provide conductivity,
and a method of manufacturing the same. According to a method of manufacturing an ultrasonic
probe according to the present invention, a kerf is formed on one surface of a matching layer, an
electrode is formed on any one of the surface on which the kerf is formed and the opposite
surface, and an electrode is formed. Installing the second surface on the piezoelectric layer.
[Selected figure] Figure 1
Ultrasonic probe and method of manufacturing the same
[0001]
The present invention relates to an ultrasound probe for generating an image of the inside of a
subject using ultrasound and a method of manufacturing the same.
[0002]
The ultrasonic diagnostic apparatus irradiates an ultrasonic signal from the body surface of the
object toward a target site in the body, and uses information of the reflected ultrasonic signal
(ultrasound echo signal) to cut a tomographic image or blood flow of soft tissue. It is an
apparatus which obtains the image about the non-invasively.
[0003]
The ultrasonic diagnostic apparatus is smaller and cheaper than other image diagnostic
apparatuses such as an X-ray diagnostic apparatus, an X-ray CT scanner (Computerized
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Tomography Scanner), an MRI (Magnetic Resonance Image), and a nuclear medicine diagnostic
apparatus, and is real-time It is widely used for heart, abdomen, urology, and obstetrics and
gynecology diagnoses because it can be displayed and has high safety without exposure to
radiation and the like.
[0004]
The ultrasound diagnostic apparatus includes a probe for transmitting an ultrasound signal to
the object and receiving an ultrasound echo signal reflected from the object to obtain an
ultrasound image of the object.
[0005]
The ultrasonic probe comprises a piezoelectric layer for converting an electric signal and an
acoustic signal to each other while the piezoelectric material vibrates, and a piezoelectric layer
and an object so that ultrasonic waves generated from the piezoelectric layer are maximally
transmitted to an object. A matching layer which reduces the acoustic impedance difference
between the body and a lens which focuses the ultrasonic waves traveling in front of the
piezoelectric layer to a specific point, blocking the ultrasonic waves traveling in the rear of the
piezoelectric layer, And a sound absorbing layer for preventing distortion of an image.
[0006]
One aspect of the present invention provides an ultrasonic probe including a matching layer in
which an electrode is formed on a surface in contact with a piezoelectric layer to provide
conductivity, and a method of manufacturing the same.
[0007]
An ultrasonic probe according to one aspect of the present invention includes a piezoelectric
layer, and a matching layer located on the front surface of the piezoelectric layer and having an
electrode formed on the surface on which the piezoelectric layer is provided. .
[0008]
The piezoelectric layer may be processed into one of a one-dimensional array and a twodimensional array, and the matching layer may be processed into the same array as the
piezoelectric layer.
[0009]
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Also, the spacing between the respective elements constituting the array of matching layers may
be the same as the spacing between the respective elements constituting the array of
piezoelectric layers.
[0010]
Further, the matching layer can be formed of at least one layer.
[0011]
In the method of manufacturing an ultrasonic probe according to one aspect of the present
invention, a kerf is formed on one surface of the matching layer, and an electrode is formed on
any one of the surface on which the kerf is formed and the opposite surface. The method may
further include installing the surface on which the electrode is formed on a piezoelectric layer.
[0012]
Also, forming a kerf on one surface of the matching layer forms the kerf on the one surface of the
matching layer in order to process the matching layer into any one shape of a one-dimensional
array and a two-dimensional array. It may be one.
[0013]
The piezoelectric layer may be processed into one of a one-dimensional array and a twodimensional array by forming a kerf having the same pattern as the kerf formed in the matching
layer.
[0014]
Further, the matching layer can be formed of at least one layer.
[0015]
In the forming of the electrode, the kerf is filled with a material, and the opposite surface of the
surface on which the kerf is formed is cut in the lateral direction so that the material filled in the
kerf is exposed. Can be included.
[0016]
More efficient ultrasound emission is possible because there is no printed circuit board or the
like in the direction in which the ultrasound is emitted and only the matching layer.
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[0017]
FIG. 7 is a view showing a manufacturing process of an ultrasonic probe according to an
embodiment of the present invention.
FIG. 5 is a view showing that a ground FPCB is connected to an ultrasonic probe according to an
embodiment of the present invention.
It is a perspective view of the matching layer in (d) of FIG.
FIG. 7 is a view showing a manufacturing process of an ultrasonic probe according to another
embodiment of the present invention.
It is a perspective view of the matching layer in (c) of FIG.
FIG. 14 is a view showing a manufacturing process of an ultrasonic probe according to still
another embodiment of the present invention.
It is a perspective view of the matching layer in (c) of FIG.
[0018]
Hereinafter, an ultrasonic probe and a method of manufacturing the same according to an
embodiment of the present invention will be described in detail with reference to the
accompanying drawings.
[0019]
The ultrasonic probe according to one embodiment of the present invention is provided on the
piezoelectric layer 20, the matching layer 10 provided on the front surface (upper surface in the
drawing) of the piezoelectric layer 20, and the rear surface (lower surface in the drawing) of the
piezoelectric layer 20. Sound absorbing layer 30 (see, for example, FIG. 1 (f)).
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[0020]
When mechanical pressure is applied to a given substance, a voltage is generated, and when the
voltage is applied, the effect of causing mechanical deformation is called the piezoelectric effect
and the inverse piezoelectric effect, and a substance having such an effect is called a piezoelectric
substance. .
[0021]
That is, a piezoelectric substance is a substance that converts electrical energy into mechanical
vibrational energy and mechanical vibrational energy into electrical energy.
[0022]
The ultrasonic probe according to an embodiment of the present invention includes a
piezoelectric layer 20 made of a piezoelectric material that converts an electrical signal to
mechanical vibration to generate an ultrasonic wave.
[0023]
The piezoelectric material constituting the piezoelectric layer 20 is a ceramic such as lead
zirconate titanate (PZT), PZMT single crystal made of a solid solution such as lead magnesium
niobate and lead titanate, or lead zinc niobate or lead titanate And PZNT single crystals made of a
solid solution of
[0024]
Also, the piezoelectric layer 20 may be arranged in a fault structure or a multilayer structure.
[0025]
In general, the laminated piezoelectric layer 20 is easier to adjust the impedance and voltage, and
thus has an advantage of obtaining good sensitivity, energy conversion efficiency, and soft
spectrum.
[0026]
Further, on the front and back surfaces of the piezoelectric layer 20, electrodes to which an
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electrical signal can be applied can be formed.
When electrodes are formed on the front and back surfaces, one of the electrodes formed on the
front and back surfaces may be a ground electrode, and the remaining one may be a signal
electrode.
[0027]
The matching layer 10 is disposed on the front surface of the piezoelectric layer 20.
The matching layer 10 reduces the acoustic impedance difference between the piezoelectric layer
20 and the object to match the acoustic impedance of the piezoelectric layer 20 with the object,
so that the ultrasonic waves generated from the piezoelectric layer 20 are efficiently transmitted
to the object. Be transmitted.
[0028]
To that end, the matching layer 10 can be provided to have an intermediate value between the
acoustic impedance of the piezoelectric layer 20 and the acoustic impedance of the object.
[0029]
The matching layer 10 can be formed of glass or resin.
Also, the matching layer 10 can be composed of a plurality of matching layers 10 so that the
acoustic impedance can be changed stepwise from the piezoelectric layer 20 toward the object,
and the material of the plurality of matching layers 10 Can be configured to be different from
one another.
[0030]
In the matching layer 10 according to an embodiment of the present invention, an electrode is
formed on the surface in contact with the piezoelectric layer 20, which will be described later
with reference to the drawings.
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[0031]
The piezoelectric layer 20 and the matching layer 10 can be processed into the shape of a
matrix-like two-dimensional array by a dicing process (see, for example, FIGS. Good.
[0032]
Although not shown, a protective layer can be provided on the front surface of the matching
layer 10.
The protective layer may be an RF shield capable of preventing the outflow of high frequency
components that may be generated from the piezoelectric layer 20 and blocking the inflow of
external high frequency signals.
[0033]
In addition, the protective layer can protect the internal parts from water and chemicals used for
disinfection and the like by coating or depositing a conductive substance on the surface of the
film having moisture resistance and chemical resistance. It may be
[0034]
Although not shown, a lens can be placed in front of the protective layer.
The lens may have a bulging shape in the radiation direction of the ultrasonic wave to focus the
ultrasonic wave, and may be embodied in a concave shape if the speed of sound is faster than the
speed of the human body.
[0035]
The sound absorbing layer 30 is disposed on the rear surface of the piezoelectric layer 20 (see,
for example, FIG. 1 (f)), absorbs and scatters ultrasonic waves generated from the piezoelectric
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layer 20 and traveling backward, and annihilates.
Therefore, it is possible to prevent the occurrence of image distortion.
[0036]
The sound absorbing layer 30 can be made of a plurality of layers in order to improve the
attenuation or blocking effect of ultrasonic waves.
[0037]
An electrode for applying an electrical signal to the piezoelectric layer 20 can be formed on the
front surface of the sound absorbing layer 30 in contact with the piezoelectric layer 20 or inside
the sound absorbing layer 30.
[0038]
FIG. 1 is a view showing a manufacturing process of an ultrasonic probe according to an
embodiment of the present invention, and FIG. 2 is a view showing that a grounding FPCB is
connected to the ultrasonic probe according to an embodiment of the present invention. FIG. 3 is
a perspective view of the matching layer in FIG. 1 (d).
[0039]
As shown in FIG. 1, first, a kerf (kerf) 11 is formed on one surface of a material used as the
matching layer 10 (FIG. 1 (b)).
[0040]
The kerf 11 can be formed by a dicing process, and the formation of the kerf 11 can process the
matching layer 10 into a one-dimensional array or a two-dimensional array.
The kerf 11 formed in the matching layer 10 is formed to have the same width as the kerf 22 of
the piezoelectric layer 20 to be processed in the same array shape as the matching layer 10.
[0041]
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As shown in FIG. 1 (b), when the kerf 11 is formed in the matching layer 10, the kerf 11 is filled
with the material 12 (FIG. 1 (c)).
[0042]
The kerf 11 can be filled with a known material 12 commonly used for filling the kerf 11 of an
ultrasound probe.
[0043]
As shown in FIG. 1 (c), when the kerf 11 is filled, the opposite surface of the surface on which the
kerf 11 is formed is cut along the dotted line shown in FIG. 1 (c) (FIG. 1) (D)).
[0044]
Here, the lateral direction is a direction parallel to the xy plane.
In the drawing, the opposite surface of the surface on which the kerf 11 is formed is cut in the
lateral direction, but this is only an example, and if it can be processed into a shape as shown in
FIG. There is no limit to the
[0045]
FIG. 3 is a perspective view of the alignment layer 10 in which the opposite surface of the surface
on which the kerf 11 is formed is cut.
Referring to FIG. 3, it can be seen that the matching layers 10 are arranged in a matrix-like twodimensional array, with the material filled with the kerfs 11 as a boundary.
The two-dimensional array is an example, and when the piezoelectric layer 20 is processed into
the shape of a one-dimensional array, the matching layer 10 can also be processed into the shape
of the one-dimensional array.
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[0046]
As the cutting method, various known methods such as cutting and grinding may be applied.
[0047]
By cutting the opposite surface of the surface on which the kerf 11 is formed and processing the
matching layer 10 as shown in FIG. 1D and FIG. 3, the electrode 13 is formed on at least one of
the front and back surfaces of the matching layer 10. It forms (FIG.1 (e)).
[0048]
FIG. 1E shows that the electrode 13 is formed on the rear surface of the matching layer 10.
In addition to the rear surface, the electrode can be formed to extend from the rear surface to the
side surface to the front surface.
The electrode 13 may be formed by coating or depositing a conductive material on the front or
back surface of the matching layer 10.
In one embodiment of the present invention, the electrodes 13 are formed on the back surface of
the matching layer 10 by sputtering.
[0049]
Although FIG. 1 is described taking the matching layer 10 formed as a single layer as an example,
it is of course possible to include two or more layers.
[0050]
The matching layer 10 having the electrode 13 formed on one surface by the process described
above is disposed on the piezoelectric layer 20 so that the electrode 13 and the piezoelectric
layer 20 are in contact with each other (FIG. 1 (f)).
[0051]
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The piezoelectric layer 20 may be in a state of being processed into the shape of a onedimensional array or a two-dimensional array with the sound absorption layer 30 disposed on
the rear surface.
As shown in FIG. 1 (f), the matching layer 10 and the piezoelectric layer 20 are processed into an
array of the same shape, and the distance between the kerfs 11 and 22 is also processed the
same. Correspond one to one.
[0052]
An electrode is formed on the front surface of the sound absorbing layer 30 in contact with the
piezoelectric layer 20, and the electrode can be used as a signal electrode to apply an electrical
signal to the elements constituting the piezoelectric layer array.
Further, an electrode penetrating from the front surface to the rear surface of the sound
absorbing layer 30 is formed inside the sound absorbing layer 30, and an electric signal is
similarly applied to the elements constituting the piezoelectric layer array using this electrode as
a signal electrode. It can be done.
However, it is of course possible to form a signal electrode for applying an electrical signal to the
piezoelectric layer 20 by various known methods without being limited thereto.
[0053]
The ultrasonic probe according to an embodiment of the present invention can use the electrode
13 formed on the rear surface of the matching layer 10 as a ground electrode.
[0054]
FIG. 2 shows various embodiments in which the electrode 13 formed in the matching layer 10 is
grounded.
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As shown in FIG. 1, when the electrode 13 is formed on the rear surface of the matching layer
10, the FPCB 40 is connected to the electrode 13 formed on the rear surface of the matching
layer 10, as shown in FIG. 2 (a). Thus, the electrode 13 can be grounded.
[0055]
When the electrode 13 is formed extending from the back surface to the side surface of the
matching layer 10 to the front surface, that is, when the electrode 13 is formed to cover the
entire matching layer 10, the electrode 13 is formed on the front surface of the matching layer
10. The FPCB 40 can be connected to the formed electrode 13 to ground the electrode 13 (see
FIG. 2B).
[0056]
In addition, the electrode 13 connected to the electrode 13 formed on the rear surface of the
matching layer 10 is formed on the side surfaces of the piezoelectric layer 20 and the sound
absorbing layer 30, and thus formed on the side surfaces of the piezoelectric layer 20 and the
sound absorbing layer 30 The FPCB 40 can be connected to the electrode 13 to ground the
electrode 13 (see FIG. 2C).
[0057]
Although the electrode 13 formed in the matching layer 10 can be grounded in the manner
described above, it is of course not limited to this, and various modifications can be implemented.
Also in the other embodiments of the present invention described below, the electrode 13 formed
on the matching layer 10 can be grounded by various methods as described above.
[0058]
Thus, an electrical signal can be applied to each element constituting the piezoelectric layer array
by the electrode 13 formed on the rear surface of the matching layer 10 and the electrode that
can be formed on the sound absorbing layer 30 as described above .
[0059]
FIG. 4 is a view showing a manufacturing process of an ultrasonic probe according to another
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embodiment of the present invention, and FIG. 5 is a perspective view of the matching layer in (c)
of FIG.
[0060]
The processes up to forming the kerf 11 in the matching layer 10 (FIGS. 4A and 4B) are the same
as FIG.
[0061]
When the kerf 11 is formed in the matching layer 10, the electrode 15 is formed on the surface
on which the kerf 11 is formed without filling the kerf 11 (FIG. 4C).
[0062]
The electrode 15 can be formed by coating or depositing a conductive material on the surface on
which the kerf 11 is formed.
In one embodiment of the present invention, the electrode 15 is formed on the surface on which
the kerf 11 is formed by sputtering.
FIG. 5 is a perspective view showing the matching layer 10 in which the electrode 15 is formed
on the surface on which the kerf 11 is formed.
Referring to FIG. 5, it can be seen that the electrodes 15 are all formed on the surface of the
matching layer 10 arranged in a matrix-like two-dimensional array.
The two-dimensional array is an example, and when the piezoelectric layer 20 is processed into
the shape of a one-dimensional array, the matching layer 10 can also be processed into the shape
of the one-dimensional array.
[0063]
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The matching layer 10 on which the electrode 15 is formed by the above-described process is
disposed on the front surface of the piezoelectric layer 20 so that the surface on which the kerf
11 is formed is directed to the piezoelectric layer 20 (FIG. 4D).
As shown in FIG. 4 (d), the matching layer 10 and the piezoelectric layer 20 are processed into an
array of the same shape, and the distance between the kerfs 11 and 22 is also processed the
same. Correspond one to one.
[0064]
Similar to FIG. 1, the ultrasonic probe according to another embodiment of the present invention
can use the electrode 15 of the matching layer 10 as a ground electrode.
The description of the signal electrode is the same as that of FIG.
[0065]
FIG. 6 is a view showing a manufacturing process of an ultrasonic probe according to another
embodiment of the present invention, and FIG. 7 is a perspective view of the matching layer in (c)
of FIG.
[0066]
The steps up to forming the kerf 11 in the matching layer 10 (FIGS. 6A and 6B) are the same as
FIG.
[0067]
When the kerf 11 is formed in the matching layer 10, the electrode 16 is formed on the opposite
side of the surface on which the kerf 11 is formed (FIG. 6 (c)).
[0068]
The electrode 16 can be formed by coating or depositing a conductive material on the side
opposite to the side on which the kerf 11 is formed.
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In one embodiment of the present invention, sputtering forms an electrode 16 on the opposite
side of the surface on which the kerf 11 is formed.
FIG. 7 is a perspective view showing the matching layer 10 in which the electrode 16 is formed
on the opposite surface of the surface on which the kerf 11 is formed.
[0069]
The matching layer 10 in which the electrode 16 is formed by the process described above is
disposed on the piezoelectric layer 20 so that the electrode 16 and the piezoelectric layer 20 are
in contact with each other (FIG. 6 (d)).
As shown in FIG. 6D, the matching layer 10 and the piezoelectric layer 20 are processed into an
array of the same shape, and the distance between the kerfs 11 is also processed the same, so the
elements of the matching layer 10 and the piezoelectric layer 20 are It corresponds to one to
one.
[0070]
Similar to FIG. 1, the ultrasonic probe according to still another embodiment of the present
invention can use the electrode 16 of the matching layer 10 as a ground electrode.
The description of the signal electrode is the same as that of FIG.
[0071]
DESCRIPTION OF SYMBOLS 10 Matching layer 11 Calf 12 Materials 13, 15, 16 Electrode 20
Piezoelectric layer 22 Calf 30 Sound absorbing layer 40 FPCB
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