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DESCRIPTION JP2013192959

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DESCRIPTION JP2013192959
Abstract: An improved ultrasound probe for connecting high density acoustic arrays is provided.
An acoustic element array in which a plurality of acoustic elements 202 having electrodes
provided on end faces are two-dimensionally arrayed, and the plurality of electrodes are arrayed
at a predetermined density in a first plane; An acoustic element array is stacked, and the plurality
of electrodes corresponding to at least a first region of the first surface are electrically coupled to
one another while maintaining a one-to-one correspondence with a first density lower than the
predetermined density. An ultrasound probe comprising a first interface device 220-2 having a
first electrical connection means for distributing wiring. [Selected figure] Figure 4B
Ultrasound probe
[0001]
The present invention relates to an ultrasound probe that implements the interface of a high
density transducer array of an ultrasound diagnostic imaging system.
[0002]
In the field of ultrasound screening, an acoustic array is ultimately connected to the processing
device to generate an image based on the ultrasound detected by the acoustic array.
In modern ultrasound diagnostic devices, many acoustic arrays are two-dimensional (2D). Since
the number of transducer elements has been significantly increased in 2D arrays, the connection
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density per unit area has also been significantly increased in 2D transducer arrays. The increased
density presents some difficulties in connecting a high density transducer array to other devices
that generally have low density connections.
[0003]
There have been several attempts to improve the connection between high density acoustic
arrays and predetermined low density devices in the probe of an ultrasound diagnostic device. In
general, prior art attempts have included direct connection between a high density acoustic array
in the probe and a given low density device. One prior art attempt has prepared multiple low
density flexible cables to connect high density 2D transducer arrays. While flexible cables, such
as ribbon cables, or flexible printed circuits (FPCs) are convenient and inexpensive to connect the
transducer arrays, flexible cables occupy an undesirably large amount of physical space in the
probe.
[0004]
Another prior art attempt is to stack multiple FPCs in order to reduce the physical space for
connecting high density 2D transducer arrays. The multilayer FPC is also constructed to have
interconnects using through holes and via holes. Despite the efficiency improvement of space
utilization, multilayer FPCs have increased in structural thickness, which often resulted in
acoustic impedance problems between the backing material, the acoustic layer and the
ultrasound transducer elements. In addition, the multi-layer FPC has become too rigid to be used
in a probe because the structure is quite rigid.
[0005]
Yet another prior art attempt utilized a pair of flexible cables in combination with an integrated
circuit (IC) disposed between the 2D transducer and the backing material. Each of these two
flexible cables is connected to each electrode on the front and back output faces of the acoustic
array. The connection density is reduced by providing electrodes on two sides to accommodate
low density devices such as flexible cables. The IC connects two flexible cables using through
silicon vias (TSVs), but since the TSV process requires a certain minimum thickness, the IC needs
this thickness Cause acoustic impedance problems due to Further, when such an IC is connected
by bonding, there is a problem that heat in the probe is easily accumulated.
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[0006]
In view of the above-described exemplary prior art attempts, ultrasound diagnostic devices still
require an improved interface for connecting high density acoustic arrays.
[0007]
The ultrasonic probe according to one embodiment is formed by two-dimensionally arranging a
plurality of acoustic elements provided with electrodes on an end face, and the plurality of
electrodes are arranged at a predetermined density on a first surface. An array of elements and
the array of acoustic elements are stacked, and a one-to-one correspondence with a first density
lower than the predetermined density from the plurality of electrodes corresponding to at least a
first region of the first surface A first interface device having a first electrical connection means
for distributing the electrical wiring while maintaining the
[0008]
BRIEF DESCRIPTION OF THE DRAWINGS Schematic of the ultrasound diagnosing device which
concerns on this embodiment.
Sectional drawing of the ultrasonic probe which concerns on this embodiment.
FIG. 6 is a top view of a transducer array assembly including an interface device using a print
buildup substrate structure for redistributing 2D array connections according to the present
embodiments. FIG. 3C is a cross-sectional view of FIG. 3A at line A-A of a transducer array
assembly including an interface device using a print build-up substrate structure for
redistributing 2D array connections according to this embodiment. FIG. 7 is a top view of a
transducer array assembly including an interface device using a print buildup substrate structure
for redistributing 2D array connections according to another embodiment. FIG. 4B is a crosssectional view of FIG. 4A at line A-A of a transducer array assembly including an interface device
using a print buildup substrate structure for redistributing 2D array connections according to
this embodiment. FIG. 6 shows a transducer array assembly including an interface device using a
Redistribution Layer (RDL) for redistributing 2D array connections according to another present
embodiment. FIG. 7 shows a transducer array assembly including an interface device using a pair
of redistribution layers (RDLs) to redistribute 2D array connections according to another present
embodiment. FIG. 6A is a top view of a transducer array assembly including an interface device
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using a direct stack structure for redistributing 2D array connections according to another
embodiment. FIG. 7B is a cross-sectional view of FIG. 7A at line A-A of a transducer array
assembly including an interface device using a direct stacked structure for redistributing 2D
array connections according to another embodiment. FIG. 7B is a cross-sectional view of FIG. 7A
at line A-A of a transducer array assembly including two interface devices using a direct stacked
structure for redistributing 2D array connections according to another embodiment.
[0009]
Exemplary embodiments of an ultrasound diagnostic device are described in detail below with
reference to the accompanying drawings. Referring now to FIG. 1, a schematic view shows the
ultrasound diagnostic device according to the first embodiment. The first embodiment includes
an ultrasonic probe 100, a monitor 120, a touch input unit 130, a non-touch input unit 200, and
an apparatus main body 1000. One embodiment of the ultrasonic probe 100 includes a plurality
of piezoelectric vibrators, and the piezoelectric vibrators generate ultrasonic waves based on
drive signals supplied from the transmission unit 111 housed in the apparatus main body 1000.
The ultrasound probe 100 also receives the reflected wave from the subject Pt and converts it
into an electrical signal. Furthermore, the ultrasonic probe 100 includes a matching layer
provided on the piezoelectric vibrator, and a backing material that prevents the propagation of
ultrasonic waves in the reverse direction from the piezoelectric vibrator.
[0010]
When ultrasonic waves are transmitted from the ultrasonic probe 100 to the subject Pt, the
transmitted ultrasonic waves are continuously reflected by the acoustic impedance discontinuity
of the body tissue of the subject Pt and further reflected by the piezoelectric transducer of the
ultrasonic probe 100 Received as a wave signal. The amplitude of the received reflected wave
signal depends on the difference in acoustic impedance of each discontinuity reflecting the
ultrasonic wave. For example, if the transmitted ultrasound pulse is reflected at the surface of the
moving blood flow or heart wall, the reflected wave signal is subject to frequency shift. That is,
due to the Doppler effect, the reflected wave signal depends on the velocity component of the
moving object in the ultrasonic wave transmission direction.
[0011]
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The device body 100 finally generates an ultrasound image. The device body 1000 controls
transmission of ultrasonic waves from the probe 100 toward a target area of a patient, and
controls reception of reflected waves in the ultrasonic probe 100. The apparatus main body
1000 includes a transmitting unit 111, a receiving unit 112, a B mode processing unit 113, a
Doppler processing unit 114, an image processing unit 115, an image memory 116, a control
unit 117, and an internal storage unit 118. All of which are connected via an internal bus.
[0012]
The transmission unit 111 includes a trigger generation circuit, a delay circuit, a pulse circuit,
and the like, and supplies a drive signal to the ultrasonic probe 100. The pulse circuit repeatedly
generates rate pulses to form transmission ultrasonic waves of a specific rate frequency. The
delay circuit focuses the ultrasound from the ultrasound probe 100 into a beam and controls the
delay time of the rate pulse from the pulse circuit to utilize the respective piezoelectric
transducer to determine the transmission directivity. The trigger generation circuit applies a
drive signal (drive pulse) to the ultrasonic probe based on the rate pulse.
[0013]
The receiving unit 112 includes an amplifier circuit, an analog-to-digital converter (A / D), an
adder, and the like, and generates reflected wave data by performing various processes on the
reflected wave signal received by the ultrasonic probe 100. The amplifier circuit performs gain
correction by amplifying the reflected wave signal. The A / D converter converts the gaincorrected reflected wave signal from analog form to digital form, and provides a delay time
necessary to determine reception directivity. The adder generates reflected wave data by adding
the digitally converted reflected wave signals from the A / D converter. By the addition
processing, the adder emphasizes the reflected component from the direction that matches the
reception directivity of the reflected wave signal. In the above-described method, the transmitting
unit 111 and the receiving unit 112 respectively control transmission directivity at the time of
ultrasonic wave transmission and reception directivity at the time of ultrasonic wave reception.
[0014]
Apparatus main body 1000 further includes a B mode processing unit 113 and a Doppler
processing unit 114. The B mode processing unit 113 receives the reflected wave data from the
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receiving unit 112 and performs logarithmic amplification, envelope detection processing, and
the like to generate data (B mode data) in which the signal intensity is represented by the
luminance. The Doppler processing unit 114 performs frequency analysis on the velocity
information of the reflected wave data received from the receiving unit 112. The Doppler
processing unit 114 extracts components of blood flow, tissue and echo of contrast medium by
Doppler effect. The Doppler processing unit 114 generates Doppler data on moving object
information such as average velocity, distribution, power, etc., for many points.
[0015]
The device body 1000 further includes an additional unit associated with image processing of
ultrasound image data. The image processing unit 115 generates an ultrasound image from the B
mode data from the B mode processing unit 113 or the Doppler data from the Doppler
processing unit 114. Specifically, the image processing unit 115 generates a B-mode image from
the B-mode data and a Doppler image from the Doppler data. Furthermore, the image processing
unit 115 converts or scan converts the scan line signal series of the ultrasound scan into a scan
line signal series of a predetermined video format such as a television. The image processing unit
115 finally generates an ultrasound display image, such as a B-mode image or a Doppler image
for the display device. The image memory 116 stores ultrasonic display image data generated by
the image processing unit 115.
[0016]
The control unit 117 controls the entire processing in the ultrasonic diagnostic apparatus.
Specifically, the control unit 117 is based on various setting requests input by the operator via
the input unit, various control programs read from the internal storage unit 118, and various
setting information. It controls processing performed by the transmission unit 111, the reception
unit 112, the B-mode processing unit 113, the Doppler processing unit 114, and the image
processing unit 115. For example, the control program executes a particular programmed
sequence of instructions for ultrasound transmission and reception, image processing and
display processing. Configuration information includes diagnostic information such as patient
identification and physician opinion, diagnostic protocols, and other information. In addition,
internal storage unit 118 is used to store images stored in image memory 116 as needed.
Specific data stored in internal storage unit 118 is optionally transferred to an external
peripheral device via an interface circuit. Finally, the control unit 117 also controls the monitor
120 for displaying the ultrasound image stored in the image memory 116.
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[0017]
A plurality of input units exist in the ultrasonic diagnostic apparatus according to the present
embodiment. Although the monitor or display unit 120 displays the above-described ultrasound
image, the display unit 120 is additionally a single touch panel for a system user interface or
other input unit in the first embodiment of the ultrasound diagnostic apparatus It also functions
as an input unit such as a touch panel combined with the The display unit 120 provides a
graphical user interface (GUI) for inputting various setting requests together with the input unit
130 to the operator of the ultrasonic diagnostic apparatus. The input unit 130 includes a mouse,
a keyboard, buttons, a panel switch, a touch command screen, a foot switch, a trackball, and the
like. The combination of the display unit 120 and the input unit 130 receives a predetermined
setting request and an operation instruction from the operator of the ultrasonic diagnostic
apparatus. The combination of the display unit 120 and the input unit 130 then generates
signals or instructions for each of the received configuration requests and / or instructions to be
sent to the device body 1000. For example, a request is made using the mouse and monitor to set
the area of interest at the next scan session. In another example, the operator specifies the start
and end of the image processing to be performed on the image by the image processing unit 115
via the processing execution switch.
[0018]
Referring now to FIG. 2, the figure shows a cross-sectional view of the relevant part of the
ultrasound probe 100 according to the present embodiment. The exemplary embodiment of the
ultrasound probe 100 further includes an acoustic element portion 200, an interface device 220,
and a backing portion 240. One embodiment of the acoustic element portion 200 is a high
density 2D acoustic array or stack composed of a predetermined number of acoustic elements,
such as piezoelectric transducers that generate and transmit ultrasound to a patient. The acoustic
element portion 200 also receives ultrasound echoes or acoustic signals reflected from the
patient and converts them into electrical signals. One embodiment of the interface device 220
includes a relatively rigid structure placed in close proximity to the acoustic element portion 200
after assembly. That is, the interface device 200 prevents the high-density 2D acoustic array
from being broken due to, for example, arrangement intervals, deformation of elements, stress
due to deformation, etc. (arrangement intervals of a plurality of acoustic elements or To maintain
electrical connection with a high density 2D acoustic array, it is embodied as a rigid medium
having a predetermined stiffness and having a rigid interface area for interfacing physical
connections. Be done. Therefore, typically, the interface device 200 is required to have high
rigidity compared to the FPC, but if it can prevent destruction due to deformation of the high
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density 2D acoustic array, some flexibility is provided. It may be possessed.
[0019]
In this manner, the interface device 220 as a structure that is relatively rigid with respect to the
FPC extends beyond the footprint of the acoustic element portion 200 in at least one
predetermined lateral direction. One exemplary implementation of interface device 220 is a print
build-up substrate structure for redistributing 2D transducer array connections, as will be further
described. Furthermore, the ultrasonic probe 100 includes a matching layer provided on the
piezoelectric vibrator, and a backing material as the backing portion 240 that prevents backward
propagation of the ultrasonic wave from the piezoelectric vibrator. The backing portion 240 is
located after the interface device 220 in this embodiment, but in other embodiments is not
limited to the relative position described above with respect to the interface device 220.
[0020]
Still referring to FIG. 2, in the embodiment of interface device 220, each of the electrical output
connections from acoustic element portion 200 and the corresponding one of the electrical
output connections, such as solder pads, disposed in extension region 220A. Vary the density of
electrical connections while maintaining a one-to-one connection between the two. The density of
physical electrical connections per unit surface area is defined by this embodiment as density.
That is, the acoustic array 200 has a predetermined high density of acoustic elements, and the
interface device 220 connects at a high density level to the high density acoustic array 200 at
one end. At the other end, interface device 220 provides an intermediate density level electrical
connection lower than a predetermined high density while maintaining a one-to-one individual
connection from high density acoustic array 200. As a result, low density devices, such as flexible
ribbon cables or flexible printed circuit boards, are advantageously connected to interface device
220 on the intermediate density side without significantly modifying the electrical connection
density of low density devices and high density devices. Ru.
[0021]
Furthermore, due to the simple one-to-one interconnection, in the embodiment of the interface
device 220, the structure is relatively thin in the vertical direction of the figure indicated by the
double arrow. As a result, interface device 220 substantially avoids or reduces the acoustic
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impedance problem of acoustic array 200 due to its relatively thin structure.
[0022]
Referring now to FIG. 3A, the figure shows a top view of one embodiment of a transducer array
assembly including an interface device using a print buildup substrate structure for
redistributing 2D array connections according to the present embodiments. . The 2D array 200
has eight rows by eight columns of acoustic elements 202 for illustrative purposes, but is not
limited to any particular size, and includes a higher number of acoustic elements 202 of higher
density. The 2D array 200 uses a printed buildup substrate structure, such as high density
interconnect (HDI) or high density package (HDP), on top of an off-the-shelf interface device 2201. Fixed to In one embodiment, the off-the-shelf interface device 220-1 is generally larger than
the footprint of the 2D array 200 and extends in four lateral directions. In other embodiments,
off-the-shelf interface device 220-1 is not limited to any particular size or shape.
[0023]
Still referring to FIG. 3A, the extension of the prefabricated interface device 220-1 is the surface
area 220A, where the electrical connections 222 such as solder balls or pads are greater than the
electrical output connection density of the 2D array 200. In general, they are arranged at a low
predetermined connection density. In the illustrated exemplary embodiment, the off-the-shelf
interface device 220-1 provides 64 electrical connections 222 to 64 acoustic elements 202 of
the 8 × 8 acoustic array 200 on one side of the extended surface area 220A. This single side is
the top surface of the prefabricated interface device 220-1, as can be clearly seen in FIG. 3B. At
the same time, each electrical connection is one-to-one between the electrical output connection
of the 2D array 200 and the electrical connection 222 of the off-the-shelf interface device 220-1,
as also described further below.
[0024]
Reference is now made to FIG. 3B, which shows line A of FIG. 3A of an embodiment of a
transducer array assembly, including an interface device using a print buildup substrate
structure for redistributing 2D array connections according to the present embodiment. Sectional view at -A is shown. The off-the-shelf interface device 220-1 is fixedly installed between
the 2D array 200 and the backing material 240. The off-the-shelf interface device 220-1, in one
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embodiment, extends laterally beyond the 2D array 200 and backing material 240 to form an
extended surface area 220A. The off-the-shelf interface device 220-1 is not limited to any
particular size, shape or internal structure in other embodiments.
[0025]
Still referring to FIG. 3B, the off-the-shelf interface device 220-1 changes the electrical
connection density while maintaining a one-to-one connection. The ready-made interface device
220-1 makes electrical connection with the 2D array 200 at a predetermined high density. That
is, high density connections are made at one end through the metal pads 204 of the acoustic
element 202 and the internal solder pads 224 of the interface device 220-1. Each acoustic
element 202 further includes a matching layer 202A, an ultrasonic transducer 202B such as a
PZT element or a MUT element, and an anti-matching layer 202C. Next, the high density
connections are redistributed towards the extended surface area 220A via discrete traces 226 in
the redistribution layer which is a separately formed substrate based multilayer. Each trace 226
is connected at its other end to a corresponding one of the outer solder pads 222. The outer
solder pads 222 are disposed at a predetermined intermediate density only on the top surface of
the extension surface area 220A. As a result of redistribution, high density connections are
converted to intermediate densities while maintaining a one to one connection. A predetermined
low density device 160, such as a flexible cable or flexible printed circuit, is connected to the
outer solder pad 222 on a predetermined side of the interface device 220-1 in this embodiment.
In the illustrated embodiment, the intermediate density outer solder pads 222 are provided on
one side of the interface device 220-1, but other embodiments are not limited to having the outer
solder pads 222 on one side or all sides.
[0026]
Referring now to FIG. 4, the figure shows a top view of another embodiment of a transducer
array assembly including an interface device using a print buildup substrate structure for
redistributing 2D array connections according to the present embodiment. . The 2D array 200
has eight rows by eight columns of acoustic elements 202 for illustrative purposes, but is not
limited to any particular size, and includes a higher number of acoustic elements 202 of higher
density. The 2D array 200 is fixedly installed over the off-the-shelf interface device 220-2 using a
print buildup substrate structure such as high density interconnect (HDI) or high density package
(HDP). In one embodiment, the off-the-shelf interface device 220-2 is generally larger than the
footprint of the 2D array 200 and extends in four lateral directions. In other embodiments, offthe-shelf interface device 220-2 is not limited to a particular size or shape.
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[0027]
Still referring to FIG. 4A, the extension of the prefabricated interface device 220-2 is the surface
area 220A, where the electrical connections 222 such as solder balls or pads are greater than the
electrical output connection density of the 2D array 200. In general, they are arranged at a low
predetermined connection density. In the illustrated exemplary embodiment, off-the-shelf
interface device 220-2 provides 52 (14 + 14 + 12 + 12) electrical connections 222 on top of the
extended surface area 220A. Although not shown in this top view, the off-the-shelf interface
device 220-2 also provides twelve electrical connections 222 to the lower surface of the
extension surface area 220A. That is, the ready-made interface device 220-2 provides a total of
64 connections to the 64 acoustic elements 202 of the 8 × 8 acoustic array 200. At the same
time, each electrical connection is one-to-one between the electrical output connection of the 2D
array 200 and the electrical connection 222 of the prefabricated interface device 220-2, as will
be further described.
[0028]
Reference is now made to FIG. 4B, which illustrates line A of FIG. 4A of an embodiment of a
transducer array assembly that includes an interface device using a print buildup substrate
structure for redistributing 2D array connections according to the present embodiment. Sectional view at -A is shown. The 2D array 200 is fixedly installed between the prefabricated
interface device 220-2 and the backing material 240 using a print buildup substrate structure.
The off-the-shelf interface device 220-2, in one embodiment, extends laterally beyond the 2D
array 200 and backing material 240 to form an extended surface area 220A. The off-the-shelf
interface device 220-2 is not limited to any particular size, shape or internal structure in other
embodiments.
[0029]
Still referring to FIG. 4B, off-the-shelf interface device 220-2 changes the electrical connection
density while maintaining a one-to-one connection. The off-the-shelf interface device 220-2
makes electrical connection with the 2D array 200 at a predetermined high density. That is, high
density connections are made at one end through the metal pads 204 of the acoustic element
202 and the internal solder pads 224 of the interface device 220-2. Each of the acoustic
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elements 202 further includes a matching layer 202A, an ultrasonic transducer 202B, such as a
PZT or MUT element, and an anti-matching layer 202C. The high density connections are then
redistributed towards the extended surface area 220A via the discrete traces 226 and / or vias
227 in the redistribution layer which are substrate base multilayers formed separately. Traces
226 and / or through holes 227 are each connected at the other end to a corresponding one of
the outer solder pads 222. The outer solder pads 222 are disposed at a predetermined
intermediate density on both the top and bottom surfaces of the extension surface area 220A. As
a result of redistribution, high density connections are converted to intermediate densities while
maintaining a one to one connection. Certain low density devices, such as flexible cable 160, are
connected to the outer solder pads 222 on both sides of interface device 220-2, in this
embodiment. Low density devices also include printed circuit boards used in place of or in
combination with flexible cable 160. In the illustrated embodiment, the intermediate density
outer solder pads 222 are provided on both sides of the interface device 220-2, but in other
embodiments it is limited to having the outer solder pads 222 on one side.
[0030]
Next, referring to FIGS. 3B and 4B, the extension surface area 220A is optionally implemented in
different sizes based on the same predetermined intermediate density according to the present
embodiment. The outer solder pads 222 are mounted as in the case of interface device 220-1,
since both sides or both sides of extended surface area 220A are mounted with outer solder pads
222 as in the case of interface device 220-2. The required area is optionally smaller compared to
one side or one side of the extension surface area 220A. As a result, in the embodiment of
interface device 220-2, the overall size of the transducer array assembly is advantageously
reduced. On the other hand, where interface device 220-2 is optionally implemented using vias
or through holes 227, the required thickness of interface device 220-2 is greater than interface
device 220-1 without through holes. Could be Furthermore, the first interface device 220-1 and
the second interface device 220-2 are generally manufactured using flip chip package substrate
technology. Flip chip package substrate technology is a low cost, high volume process that
supports high density interconnections suitable for 2D transducer arrays.
[0031]
Reference is now made to FIG. 5, which is another embodiment of a transducer array assembly
including an interface device using a redistribution layer (RDL) 230 for redistributing 2D array
connections. The RDL 230 is used as a backing of the 2D array 200 or as an interface between
the piezoelectric material and the flip chip package 260. RDL 230 is another high density
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interconnect technology applied directly to PZT, backing or CMUT technology. The redistribution
layer is capable of connecting a high density of less than 1 micron at at least one end. That is, the
interface device is embodied as a rigid medium having a rigid interface area for interfacing
physical connections. The redistribution layer is capable of connecting low density devices
embodied as flexible media at the other end.
[0032]
Reference is now made to FIG. 6, which is yet another embodiment of a transducer array
assembly including interface devices using a pair of redistribution layers (RDLs) 230A and 230B
for redistributing 2D array connections. RDLs 230A and 230B are used as the backing of 2D
array 200 or as an interface between the piezoelectric material and flip chip packages 260A and
260B. RDLs 230A and 230B are formed to connect output terminals or connections on the top
and bottom surfaces of the 2D array 200, respectively. Furthermore, flip chip packages 260A and
260B are placed on top of the formed RDL 230A and 230B after the RDL 230A and 230B are
formed directly on the top and bottom surfaces. RDLs 230A and 230B are another high density
interconnect technology applied directly to PZT elements, backings, or CMUT technology. That is,
the redistribution layers (RDLs) 230A and 230B are embodied as a rigid medium having rigid
interface areas for interfacing physical connections. While FIG. 6 shows an embodiment with a
pair of RDLs 230A and 230B, in one alternative embodiment, either one of RDLs 230A and 230B
is formed on the top or bottom surface of 2D array 200.
[0033]
FIG. 7A shows a top view of another embodiment of a transducer array assembly including an
interface device using a direct stack structure for redistributing 2D array connections. The 2D
array 200 has 6 rows by 6 columns of acoustic elements 202 for illustrative purposes, but is not
limited to any particular size, and includes a higher number of acoustic elements 202 of higher
density. The redistribution layer (RDL) of interface device 220-3 is formed directly on top of 2D
array 200 by laminating a set of predetermined materials. That is, interface device 220-3 is an
integration redistribution layer. The interface device 220-3 manufactured is generally larger than
the footprint of the PZT or MUT elements of the 2D array 200, and in one embodiment extends
in four lateral directions, but in other embodiments it has a specific size Or it is not limited to the
shape.
[0034]
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Still referring to FIG. 7A, the extension of the manufactured interface device 220-3 is the surface
area 220A, where the electrical connections 222 such as solder balls or pads are the density of
the electrical output connection of the 2D array 200. It is generally arranged at a lower
predetermined connection density. In the illustrated exemplary embodiment, the manufactured
interface device 220-3 provides 36 electrical connections 222 to the extension surface area
220A on one side of a 6 × 6 acoustic array 200 of 36 acoustic elements 202. . This single side is
the lower surface of the manufactured interface device 220-3, as can be clearly seen in FIG. 7B.
At the same time, each electrical connection is one to one between the electrical output
connection of the 2D array 200 and the electrical connection 222 of the manufactured interface
device 220-3, as will also be described further.
[0035]
FIG. 7B shows a cross-sectional view on line A-A of FIG. 7A of an embodiment of a transducer
array assembly that includes an interface device using a direct stacking structure to redistribute
2D array connections. The manufactured interface device 220-3 is formed directly on the 2D
array 200. In one embodiment, the manufactured interface device 220-3 is generally larger than
the footprint of the PZT or MUT element 202 of the 2D array 200 and extends in four lateral
directions, so that the interface device 220-3 is The extension portion is supported by the
extended footprint portion 203 of the 2D array 200. In other embodiments, the manufactured
interface device 220-3 is not limited to a particular size, shape or internal structure.
[0036]
Still referring to FIG. 7B, the manufactured interface device 220-3 changes the electrical
connection density while maintaining a one-to-one connection. The manufactured interface
device 220-3 makes electrical connection with the 2D array 200 at a predetermined high density.
That is, high density connections are made at one end through the metal pads 204 of the
acoustic element 202 and the internal solder pads 224 of the interface device 220-3. Next, the
high density connections are redistributed towards the extended surface area 220A via discrete
traces 226 in the redistribution layer which is a separately formed substrate based multilayer.
Each trace 226 is connected at its other end to a corresponding one of the outer solder pads 222.
The outer solder pads 222 are disposed at a predetermined intermediate density only on the
lower surface of the extension surface area 220A. As a result of redistribution, high density
connections are converted to intermediate densities while maintaining a one to one connection. A
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predetermined low density device, such as a flexible cable or flexible printed circuit, is connected
to the outer solder pad 222 on a predetermined side of the interface device 220-3 in this
embodiment. In the illustrated embodiment, the medium density outer solder pads 222 are
provided on one side of the interface device 220-3, but other embodiments have the outer solder
pads 222 on one side or all sides of the interface device 220-3. It is not limited to.
[0037]
FIG. 7C shows a cross-sectional view on line A-A of FIG. 7A of an embodiment of a transducer
array assembly that includes two interface devices using a direct stacking structure for
redistributing 2D array connections. The first manufactured interface device 220-3 is formed
directly on the lower surface of the 2D array 200. In addition, a second manufactured interface
device 220-4 is formed directly on top of the 2D array 200. That is, interface devices 220-3 and
220-4 are each an integrated redistribution layer. In one embodiment, the interface devices 2203 and 220-4 manufactured are generally larger than the footprint of the PZT or MUT element
202 of the 2D array 200 and extend in four lateral directions The extended portions of 220-3
and 220-4 are supported by the extended footprint portion 203 of the 2D array 200. Interface
devices 220-3 and 220-4 are not limited to being identical with respect to a particular size, shape
or internal structure in other embodiments.
[0038]
Still referring to FIG. 7C, the manufactured interface devices 220-3 and 220-4 change the
electrical connection density while maintaining a one-to-one connection. The manufactured
interface devices 220-3 and 220-4 make electrical connection with the 2D array 200 at a
predetermined high density. That is, high density connections are made at one end through the
metal pads 204 of the acoustic element 202 and the internal solder pads 224 of the interface
device 220-3. Next, the high density connections are redistributed towards the extended surface
area 220A via discrete traces 226 in the redistribution layer which is a separately formed
substrate based multilayer. Each trace 226 is connected at its other end to a corresponding one
of the outer solder pads 222. The outer solder pads 222 are disposed at a predetermined
intermediate density only on the lower surface of the extension surface area 220A. As a result of
redistribution, high density connections are converted to intermediate densities while
maintaining a one to one connection. Certain low density devices, such as flexible cables or
flexible printed circuits, are connected to the outer solder pads 222 on certain sides of interface
devices 220-3 and 220-4 in this embodiment. In the illustrated embodiment, substantially the
same structure is provided between the interface devices 220-3 and 220-4, but other
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embodiments are substantially between the interface devices 220-3 and 220-4. Is not limited to
having the same structure.
[0039]
Next, referring to FIGS. 7B and 7C, the extension surface area 220A is optionally implemented
with different sizes based on the same predetermined intermediate density according to the
present embodiment. Each extension surface area 220A has an outer solder pad 222 mounted as
in the case of interface devices 220-3 and 220-4 of FIG. 7C, so that extension surface area 220A
of only interface device 220-3 of FIG. By comparison, the required area is optionally smaller. As a
result, in the embodiments of interface devices 220-3 and 220-4, the overall size of the
transducer array assembly is advantageously reduced. Furthermore, the first interface device
220-3 and the second interface device 220-4 are generally manufactured using flip chip package
substrate technology. Flip chip package substrate technology is a low cost, high volume process
that supports high density interconnections suitable for 2D transducer arrays.
[0040]
In each embodiment mentioned above, the case where an ultrasound probe was a twodimensional array probe was explained to an example. However, the configuration disclosed in
each of the above embodiments is applicable regardless of the example, for example, even when
the ultrasonic probe is a 1.5-dimensional array probe.
[0041]
Moreover, in each embodiment mentioned above, the wiring drawn out from each acoustic
element 202 is drawn out on the acoustic element 202 lamination surface of interface device
220 or the surface on the opposite side to the lamination surface, and the wiring of flexible cable
160 is connected The case was illustrated. However, the present invention is not limited to this
example, and the wiring drawn out from each acoustic element 202 is drawn out stepwise from
the acoustic element 202 laminated surface of the interface device 220 to the surface opposite to
the laminated surface, It may be connected.
[0042]
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Moreover, in each embodiment mentioned above, the ultrasonic probe used for an ultrasonic
diagnosing device was demonstrated as a typical example. However, the configuration disclosed
in each of the above embodiments can also be applied to an ultrasonic probe of an ultrasonic
sensor used for construction or the like without being limited to the example.
[0043]
While several embodiments have been described, these embodiments are presented by way of
example only and are not intended to limit the scope of the present invention. Indeed, the novel
methods and systems described herein may be embodied in various other forms, and
furthermore, the methods and systems described herein may be embodied without departing
from the spirit of the invention. Various omissions, substitutions and changes may be made in the
form of the system. The appended claims and their equivalents are intended to cover such forms
or modifications as would fall within the scope of the present invention.
[0044]
100 ... ultrasonic probe, 120 ... monitor, 130 ... touch input unit, 200 ... non-touch input unit, 111
... transmission unit, 112 ... reception unit, 113 ... B mode processing unit, 114 ... Doppler
processing unit, 115 ... image processing Unit 116 image memory 117 control unit 118 internal
storage unit 160 flexible cable 202 acoustic element interface device 220, 260 flip chip package
230 redistribution layer 1000 device body
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