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DESCRIPTION JP2014099760

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DESCRIPTION JP2014099760
Abstract: To provide a high density ultrasonic transducer including a plurality of organic
piezoelectric elements and a plurality of inorganic piezoelectric elements. SOLUTION: The surface
of the printed board 8 on which the signal electrode layer 62 is previously formed with a minute
pitch P on the surface is bonded to one surface of the organic piezoelectric layer 61 on which the
signal electrode layer 62 is formed. By forming the ground electrode layer 63 on the other
surface of the organic piezoelectric layer 61, the plurality of organic piezoelectric elements 6
extending at a minute pitch P by the signal electrode layer 62, the organic piezoelectric layer 61
and the ground electrode layer 63 can be obtained. The plurality of organic piezoelectric
elements 6 and the plurality of inorganic piezoelectric elements 3 and the acoustic matching
layer 4 formed in an array on the backing material 2 are joined. [Selected figure] Figure 1
Ultrasonic transducer and method of manufacturing the same
[0001]
The present invention relates to an ultrasonic transducer and a method of manufacturing the
same, and more particularly to an ultrasonic transducer in which a plurality of inorganic
piezoelectric elements and a plurality of organic piezoelectric elements are stacked on one
another and a method of manufacturing the same.
[0002]
Heretofore, in the medical field, ultrasonic diagnostic apparatuses using ultrasonic images have
been put to practical use.
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Generally, this type of ultrasonic diagnostic apparatus transmits an ultrasonic beam from an
ultrasonic transducer toward the inside of a subject, receives an ultrasonic echo from the subject
with an ultrasonic transducer, and receives the received signal. The electrical processing
produces an ultrasound image.
[0003]
In recent years, in order to perform more accurate diagnosis, harmonic imaging that receives and
visualizes harmonic components generated by distortion of an ultrasonic waveform due to nonlinearity of an object has become mainstream. In recent years, as a new diagnostic method using
ultrasound, photoacoustic imaging, which irradiates a laser to a living body and receives and
visualizes weak, wide-band elastic waves generated by adiabatic expansion, is in the spotlight .
For example, as disclosed in Patent Documents 1 to 3 and Non-Patent Document 1, an organic
piezoelectric material such as polyvinylidene fluoride (PVDF) is used as an ultrasonic transducer
suitable for the harmonic imaging and the photoacoustic imaging. Ultrasonic vibrators composed
of a plurality of organic piezoelectric elements, inorganic piezoelectric elements using an
inorganic piezoelectric material such as lead zirconate titanate (Pb (Zr, Ti) O3), and a plurality of
inorganic piezoelectric elements using an organic piezoelectric material An ultrasonic transducer
in which an organic piezoelectric element of the above is laminated and formed is proposed.
[0004]
According to the above-described ultrasonic transducer in which a plurality of inorganic
piezoelectric elements and a plurality of organic piezoelectric elements are laminated, the
ultrasonic wave of high output is transmitted by the inorganic piezoelectric element, and the
harmonic signal is increased by the organic piezoelectric element. The sensitivity can be received.
Moreover, while the reception signal of a normal ultrasonic wave is acquired by an inorganic
piezoelectric element, the broadband signal of photoacoustic imaging can be received with high
sensitivity by an organic piezoelectric element.
[0005]
Patent No. 4992995 gazette JP, 2011-72701, A JP, 2009-267528, A
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[0006]
Study on flexible array probe using polymer piezoelectric film
[0007]
In recent years, the miniaturization of the array size accompanying the densification of ultrasonic
transducers has been demanded as compared with the conventional ultrasonic transducers.
However, the organic piezoelectric material used for the organic piezoelectric element generally
has low heat resistance, and for example, has a property of depolarizing at a temperature
exceeding 80.degree.
For this reason, when the respective organic piezoelectric elements are subjected to the solder
processing to draw out the signal lines, the organic piezoelectric body may be damaged by heat.
In addition, when attempting to form a lead-out electrode using an adhesive conductive material
so as not to apply heat to the organic piezoelectric material, for example, polyvinylidene fluoride
used as the organic piezoelectric material is a fluorine-based resin Even when using an adhesive
conductive material, the adhesion performance is low, and when performing processing such as
dicing, there is a possibility that the adhesive conductive material may peel off.
[0008]
The present invention has been made to solve such problems, and it is an object of the present
invention to provide a high-density ultrasonic transducer including a plurality of organic
piezoelectric elements and a plurality of inorganic piezoelectric elements. Another object of the
present invention is to provide a method of manufacturing an ultrasonic transducer capable of
obtaining such an ultrasonic transducer.
[0009]
An ultrasonic transducer according to the present invention includes a backing material, a
plurality of inorganic piezoelectric elements arranged in an array on the surface of the backing
material, and a plurality of inorganic piezoelectric elements arranged on a plurality of inorganic
piezoelectric elements. A plurality of organic piezoelectric elements including an extending
acoustic matching layer and a plurality of organic piezoelectric elements arranged in an array on
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the acoustic matching layer, wherein the plurality of organic piezoelectric elements extend over
the plurality of organic piezoelectric elements. A body layer, a ground electrode layer formed on
one side of the organic piezoelectric layer and extending over the plurality of organic
piezoelectric elements, and arranged on the other side of the organic piezoelectric layer and
separated from each other The plurality of signal electrode layers are characterized in that the
plurality of signal electrode layers are formed in advance on one printed circuit board.
[0010]
Also, the acoustic matching layer includes a first acoustic matching layer disposed on the
plurality of inorganic piezoelectric elements having different acoustic impedances, and a second
acoustic matching layer disposed on the first acoustic matching layer. It is preferable to consist
of
[0011]
Further, it is preferable that a plurality of separation grooves be provided to separate the layers
from the acoustic matching layer to the inorganic piezoelectric element in parallel at equal
intervals, and the separation grooves be filled with a urethane resin or an epoxy resin.
[0012]
The organic piezoelectric layer is preferably made of polyvinylidene fluoride, and may be formed
of a polymer composite piezoelectric which is a composite of an organic polymer resin and an
inorganic piezoelectric element.
[0013]
In addition, the printed circuit board is made of any of polyimide, urethane, epoxy resin and
acrylic resin, and can also serve as an acoustic matching layer.
[0014]
An acoustic lens may be further provided on the printed circuit board.
[0015]
Further, in the present invention, a plurality of inorganic piezoelectric elements are formed in an
array on the surface of the backing material, an acoustic matching layer extending over the
inorganic piezoelectric elements is respectively formed on the plurality of inorganic piezoelectric
elements, A plurality of signal electrode layers formed in an array on a printed circuit board are
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bonded to one side of the organic piezoelectric layer together with the printed board, and one
ground electrode layer extending over the other side of the organic piezoelectric layer is formed
of organic By bonding to the other surface of the piezoelectric layer, a plurality of organic
piezoelectric elements are arrayed by a plurality of signal electrode layers, an organic
piezoelectric layer and a ground electrode layer, and a plurality of inorganic piezoelectric
elements and a plurality of organic piezoelectric elements And bonding the ground electrode
layer of the organic piezoelectric element and the acoustic matching layer so as to correspond to
the arrangement of the above.
[0016]
Further, in the method of manufacturing an ultrasonic transducer described above, the urethane
resin or the epoxy resin is filled in a plurality of separation grooves provided so as to separate
the layers from the acoustic matching layer to the inorganic piezoelectric element in parallel at
equal intervals. Is preferred.
[0017]
According to the present invention, it is possible to form the lead-out wiring from each signal
electrode of the plurality of minute organic piezoelectric elements with a small pitch without
applying heat to the organic piezoelectric body. It is possible to provide a high density ultrasonic
transducer including an inorganic pressure element.
[0018]
BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows the whole structure
of the ultrasonic transducer | vibrator which concerns on embodiment of this invention.
It is a sectional view showing a process of joining a backing material and an inorganic
piezoelectric element among sectional views showing a manufacturing process of an ultrasonic
transducer concerning an embodiment.
It is sectional drawing which shows the process of joining an acoustic matching layer on an
inorganic piezoelectric element.
It is sectional drawing which shows the process of dicing the laminated structure from an
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acoustic matching layer to an inorganic piezoelectric element by micro pitch P. FIG.
It is sectional drawing which shows the process of filling a filler in the groove | channel made by
dicing.
It is sectional drawing which shows the process of adhere | attaching the printed circuit board in
which the signal electrode was previously formed in array form on one surface of an organic
piezoelectric material layer, and adhering the ground electrode extended on one surface to the
other surface of an organic piezoelectric material layer.
It is sectional drawing which shows the process of adhere | attaching aligning an organic
piezoelectric material element and an acoustic matching layer.
[0019]
Hereinafter, an embodiment of the present invention will be described based on the attached
drawings.
FIG. 1 shows the configuration of an ultrasonic transducer 1 according to the embodiment of the
present invention.
A plurality of inorganic piezoelectric elements 3 are arrayed at a minute pitch P on the surface of
the backing material 2.
The plurality of inorganic piezoelectric elements 3 have a plurality of inorganic piezoelectric
bodies 31 separated from one another, the signal electrode layer 32 is joined to one surface of
each inorganic piezoelectric body, and the ground electrode layer 33 is joined to the other
surface. It is done. That is, each inorganic piezoelectric element 3 is formed of a dedicated
inorganic piezoelectric body 31, a signal electrode layer 32 and a ground electrode layer 33. The
acoustic matching layer 4 is bonded onto such a plurality of inorganic piezoelectric elements 3.
The acoustic matching layer 4 is divided into a plurality of pieces and arranged at the same fine
pitch P as the plurality of inorganic piezoelectric elements 3. In addition, the acoustic matching
layer 4 includes a first acoustic matching layer 41 directly bonded onto the inorganic
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piezoelectric element 3 and a second acoustic matching layer 42 superimposed and bonded onto
the first acoustic matching layer 41. It consists of
[0020]
Further, the organic piezoelectric element 6 is bonded onto the acoustic matching layer 4
(second acoustic matching layer 42). The organic piezoelectric element 6 includes an organic
piezoelectric layer 61, a signal electrode layer 62 arranged in an array on one side of the organic
piezoelectric layer 61, and an acoustic matching layer 4 on the other side of the organic
piezoelectric layer 61. A ground electrode layer 63 is formed to be directly bonded. The organic
piezoelectric layer 61 extends over the plurality of organic piezoelectric elements 6, and the
ground electrode layer 63 also extends over the plurality of organic piezoelectric elements 6
together with the organic piezoelectric layer 61. The signal electrode layer 62 is arranged on the
organic piezoelectric layer 61 at the same fine pitch P as the inorganic piezoelectric element 3
and the acoustic matching layer 4, and each of the organic piezoelectric elements 6 is a portion
of the extending organic piezoelectric layer 61. It is formed of a part, one signal electrode layer
62 and a ground electrode layer 63. Therefore, the organic piezoelectric elements 6 are also
arranged at the same minute pitch P as the inorganic piezoelectric elements 3 and the acoustic
matching layer 4.
[0021]
A plurality of fragments separated by the same minute pitch P in each of the plurality of
inorganic piezoelectric elements 3 and the acoustic matching layer 4 are aligned between the
respective layers and aligned in the stacking direction, and between the respective rows By being
filled with the filler, the separation portion 5 is formed to separate the plurality of fragments
constituting the plurality of inorganic piezoelectric elements 3 and the acoustic matching layer 4
from each other. That is, the separation portion 5 has the same fine pitch P in the stacking
direction so as to penetrate each layer from the surface of each acoustic matching layer 4
(second acoustic matching layer 42) to the surface of the backing material 2 It extends in
parallel.
[0022]
The signal electrode layer 62 is formed on the printed circuit board 8 and is arranged on the
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organic piezoelectric layer 61 by adhering the signal electrode layer 62 together with the printed
circuit board 8 with the adhesive 7 without any gap with the organic piezoelectric layer 61. Ru.
The printed board 8 plays a role as a protective layer of the signal electrode layer 62 and the
organic piezoelectric layer 61, and is formed of polyimide, urethane, epoxy resin, acrylic resin or
the like. The protective layer is most preferably polyimide having heat resistance, chemical
resistance, water resistance and also serving as an acoustic matching layer.
[0023]
The inorganic piezoelectric body 31 of the inorganic piezoelectric element 3 is formed of a Pbbased perovskite structure oxide. For example, a Pb-based piezoelectric ceramic represented by
lead zirconate titanate (Pb (Zr, Ti) O3), or a magnesium niobate / lead titanate solid solution
(PMN-PT) and a zinc niobate / lead titanate solid solution It can be formed from a relaxor-based
piezoelectric single crystal represented by (PZN-PT). On the other hand, the organic piezoelectric
layer 61 of the organic piezoelectric element 6 is formed of a vinylidene fluoride (VDF) based
material. For example, it can be formed from a polymeric piezoelectric element such as
polyvinylidene fluoride (PVDF) or polyvinylidene fluoride trifluoride ethylene copolymer (P (VDFTrFE)). Further, the organic piezoelectric element 6 may be formed of a polymer composite
piezoelectric body which is a complex of an organic polymer resin and an inorganic piezoelectric
body. The polymer composite piezoelectric material is formed by poling a composite formed by
uniformly dispersing piezoelectric particles made of a ferroelectric material in an organic
polymer resin. In addition, as organic polymer resin, it is also referred to as cyanoethylated
polyvinyl alcohol (cyanoethylated PVA, for example). Can be mentioned. The piezoelectric
particles are made of ceramic particles having a perovskite crystal structure. For example, lead
zirconate titanate (PZT), lead zirconate titanate zirconate (PLZT), barium titanate (BaTiO3), or
titanic acid It is composed of a solid solution (BFBT) of barium and bismuth ferrite (BiFe3).
[0024]
The backing material 2 supports the plurality of inorganic piezoelectric elements 3 and absorbs
ultrasonic waves emitted backward, and may be formed of a rubber material such as ferrite
rubber, and also glass epoxy, chlorinated polyethylene composite You may form from resin etc.
The acoustic matching layer 4 is for efficiently causing ultrasonic beams from the plurality of
inorganic piezoelectric elements 3 to enter the subject, and an acoustic impedance intermediate
between the acoustic impedance of the inorganic piezoelectric elements 3 and the acoustic
impedance of the living body is obtained. It is formed from the material which it has. The
acoustic impedance of the inorganic piezoelectric element 3 is 25 to 30 Mrayl, the acoustic
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impedance of the first acoustic matching layer 41 constituting the acoustic matching layer 4 is 6
to 10 Mrayl, and the second acoustic impedance layer is superimposed on the first acoustic
matching layer. The acoustic impedance of the acoustic matching layer 42 is 4 to 6 Mrayl. The
first acoustic matching layer 41 and the second acoustic matching layer 42 are both configured
by mixing alumina powder with epoxy, and the acoustic impedance is adjusted.
[0025]
Further, the acoustic impedances of the organic piezoelectric element 6 and the printed board 8
are also adjusted in order to efficiently cause the ultrasonic beams from the plurality of inorganic
piezoelectric elements 3 to be incident into the object. The acoustic impedance of the organic
piezoelectric element 6 is set to 3 to 4 Mrayl, and the acoustic impedance of the printed circuit
board 8 is set to 2.5 to 3 Mrayl. The ultrasonic beams from the plurality of inorganic
piezoelectric elements 3 are adjusted by adjusting the acoustic impedance of each of the first
acoustic matching layer 41 and the second acoustic matching layer 42, the organic piezoelectric
element 6, and the printed board 8 stepwise. It can be efficiently made to enter into a subject. In
addition, a urethane or an epoxy resin is used for the filler with which the isolation | separation
part 5 is filled.
[0026]
Next, the operation of this embodiment will be described. In operation, for example, the plurality
of inorganic piezoelectric elements 3 are used as transducers dedicated to transmission of
ultrasonic waves, and the plurality of organic piezoelectric elements 6 are used as transducers
dedicated to reception of ultrasonic waves. When a pulse or continuous wave voltage is applied
between the signal electrode layer 32 and the ground electrode layer 33 of the plurality of
inorganic piezoelectric elements 3, the inorganic piezoelectric body 31 of each inorganic
piezoelectric element 3 expands and contracts to form a pulse or continuous Wave ultrasound is
generated. These ultrasonic waves enter the subject through the first acoustic matching layer 41,
the second acoustic matching layer 42, the organic piezoelectric element 6, and the printed
board 8, are combined with each other, and form an ultrasonic beam. And propagate within the
subject.
[0027]
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Subsequently, when ultrasonic echoes propagated and reflected in the object are made incident
on the respective organic piezoelectric elements 6 through the printed circuit board 8, the
organic piezoelectric layer 61 becomes a high harmonic component of ultrasonic waves. It
expands and contracts in response to the sensitivity, and an electric signal is generated between
the signal electrode layer 62 and the ground electrode layer 63 and is output as a reception
signal. In this manner, harmonic images can be generated based on the reception signals output
from the plurality of organic piezoelectric elements 6. Here, since the plurality of inorganic
piezoelectric elements 3 and the plurality of organic piezoelectric elements 6 are aligned with
each other in the stacking direction and arranged at the same minute pitch P, the plurality of
inorganic piezoelectric elements 3 and the plurality of organic piezoelectric elements 6
Ultrasonic echoes from the sample can be received, and harmonic images can be generated with
high accuracy.
[0028]
Also, the plurality of inorganic piezoelectric elements 3 can be used as a transducer for both
transmission and reception of ultrasonic waves. In this case, ultrasonic echoes received by the
organic piezoelectric element 6 through the printed board 8 are further incident on the
respective inorganic piezoelectric elements 3 through the second acoustic matching layer 42 and
the first acoustic matching layer 41. The inorganic piezoelectric body 31 expands and contracts
mainly in response to the fundamental wave component of the ultrasonic wave, and an electrical
signal is generated between the signal electrode layer 32 and the ground electrode layer 33.
Thus, based on the received signal corresponding to the fundamental wave component obtained
from the plurality of inorganic piezoelectric elements 3 and the received signal corresponding to
the harmonic wave component obtained from the organic piezoelectric element 6, the
fundamental wave component and the harmonics Compound images combined with wave
components can be generated.
[0029]
Also in this case, since the plurality of inorganic piezoelectric elements 3 and the plurality of
organic piezoelectric elements 6 are aligned with each other in the stacking direction and
arranged at the same minute pitch P, the fundamental wave component and the harmonic
component of ultrasonic echoes Can be received at the same arrangement position, and a
compound image in which the fundamental wave component and the harmonic component are
combined with high accuracy can be generated.
[0030]
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Such an ultrasonic transducer 1 can be manufactured as follows.
First, as shown in FIG. 2, the inorganic piezoelectric element layer 9 extending over the entire
surface of the backing material 2 is bonded onto the surface of the backing material 2 by an
adhesive or the like. In the inorganic piezoelectric element layer 9, conductive layers 92 and 93
are formed on the entire surface of the inorganic piezoelectric layer 91 extending over the entire
surface of the backing material 2.
[0031]
Next, as shown in FIG. 3, the acoustic matching layer 10 extending over the entire area of the
inorganic piezoelectric element layer 9 is bonded to the inorganic piezoelectric element layer 9.
Also, the acoustic matching layer 10 is composed of a first acoustic matching layer 101 and a
second acoustic matching layer 102. Thus, the first acoustic matching layer 101 is bonded onto
the conductive layer 93 at a temperature of, for example, 80 ° C. to 100 ° C., and the second
acoustic matching layer is extended over the entire first acoustic matching layer 101. 102 is
bonded onto the first acoustic matching layer 101 at a temperature of, for example, 80 ° C. to
100 ° C.
[0032]
Subsequently, as shown in FIG. 4, each layer is separated into a plurality of pieces by dicing each
layer of the second acoustic matching layer 102, the first acoustic matching layer 101, and the
inorganic piezoelectric element layer 9 with a minute pitch P. Do. At this time, since dicing is
performed so as to completely separate the layers from the second acoustic matching layer 102
to the inorganic piezoelectric element layer 9, each piece of the separated layers is aligned and
aligned in the stacking direction Be done. Thereby, a plurality of inorganic piezoelectric elements
3 arranged at a minute pitch P are formed on the surface of the backing material 2, and the first
acoustic matching layer 41 and the second acoustic matching layer 41 are formed on the
respective inorganic piezoelectric elements 3. The fragments of the matching layer 42 are
formed so as to sequentially overlap in position. Further, between the respective rows in which
the plurality of fragments of each layer are aligned in the stacking direction with the fine pitch P,
a plurality of flat grooves 11 penetrating the layers in the stacking direction are formed by
dicing. Thus, by dicing each layer from the second acoustic matching layer 102 to the inorganic
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piezoelectric element layer 9 with a minute pitch P, each layer is separated into a plurality of
pieces simply and each piece of each separated layer Can be aligned in the fault direction.
[0033]
Next, as shown in FIG. 5, a filler is filled in the inside of the plurality of grooves 11 formed by
dicing. By filling the filler, it is possible to form the separation portion 5 which fixes the position
and posture of the plurality of pieces of each layer.
[0034]
Further, as shown in FIG. 6, on the surface of the printed board 8, the signal electrode layer 62 is
formed in advance at a minute pitch P. The surface of the printed board 8 on which the signal
electrode layer 62 is formed is bonded together with the signal electrode layer 62 to one surface
of the organic piezoelectric layer 61 without a gap by the adhesive 7. Further, on the other
surface of the organic piezoelectric layer 61, a ground electrode layer 63 which is a conductive
layer is formed over the entire surface. The ground electrode layer 63 may be formed by
laminating a conductive layer on the surface of the organic piezoelectric layer 61, or may be
formed by bonding a film-like conductive layer. The signal electrode layer 62, the organic
piezoelectric layer 61, and the ground electrode layer 63 form a plurality of organic piezoelectric
elements 6 extending at a minute pitch P.
[0035]
Next, as shown in FIG. 7, the plurality of organic piezoelectric elements 6 provided with the
printed circuit board 8 are adhered, for example, at a temperature of about 80 ° C. on the
plurality of second acoustic matching layers 42. The plurality of organic piezoelectric elements 6
have a size sufficient to extend over the plurality of second acoustic matching layers 42, and the
plurality of second acoustic matching layers 42, the separation portion 5 and the ground
electrode layer 63 are directly Be glued. Further, the signal electrode layer 62 disposed at a
minute pitch P on the surface on the side to which the printed board 8 is adhered is disposed in
alignment with the plurality of acoustic matching layers 4 and the plurality of inorganic
piezoelectric elements 3. Alignment of the plurality of organic piezoelectric elements 6 with the
plurality of acoustic matching layers 4 and the plurality of inorganic piezoelectric elements 3 is
performed. Since the plurality of inorganic piezoelectric elements 3 and the plurality of organic
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piezoelectric elements 6 are aligned and aligned with each other, highly accurate harmonic
images and compound images can be generated.
[0036]
In addition, the printed board 8 and the organic piezoelectric layer 61 together with the first
acoustic matching layer 41 and the second acoustic matching layer 42 acoustically match
ultrasonic waves transmitted from the plurality of inorganic piezoelectric elements 3. Double as
[0037]
Thus, by bonding the organic piezoelectric layer 61 having the ground electrode layer 63 and the
signal electrode layer 62 on the respective surfaces on the plurality of second acoustic matching
layers 42, as shown in FIG. The ultrasonic transducer 1 is manufactured.
[0038]
As described above, the organic piezoelectric layer 61 is weak to heat and may be damaged by
heat such as solder processing. However, in the method of manufacturing an ultrasonic
transducer according to the present invention, the arrayed signal electrodes 62 are printed Since
the adhesive is formed directly on the substrate 8 and an adhesive is used for bonding the
organic piezoelectric layer 61 and the printed substrate 8 and the organic piezoelectric element
6 and the second acoustic matching layer 42, the organic piezoelectric layer 61 is directly heated
It is not exposed to
In addition, the layers stacked on the lower side from the organic piezoelectric element 6, that is,
the signal electrode layer 32, the inorganic piezoelectric body 31, the ground electrode layer 33,
the first acoustic matching layer 41 and the second acoustic matching layer 42 are sequentially
bonded In the meantime, since the organic piezoelectric layer 61 does not exist, these layers can
be adhered to each other at a high temperature to be laminated with high adhesion.
[0039]
Alternatively, an acoustic lens may be grounded on the printed circuit board 8 of the ultrasonic
transducer 1, and refraction may be used to squeeze the ultrasonic beam to improve the
resolution in the elevation direction.
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The acoustic lens is formed of silicone rubber or the like.
[0040]
As mentioned above, although the ultrasonic transducer concerning the present invention and its
manufacturing method were explained in detail, the present invention is not limited to the abovementioned embodiment, In the range which does not deviate from the gist of the present
invention, various improvement And you may make changes.
[0041]
Reference Signs List 1 ultrasonic transducer, 2 backing material, 3 inorganic piezoelectric
element, 4 acoustic matching layer, 5 filler, 6 organic piezoelectric element, 7 adhesive, 8 printed
board, 9 inorganic piezoelectric element layer, 10 acoustic matching layer, 11 groove 31
inorganic piezoelectric body 32 signal electrode layer 33 ground electrode layer 41 first acoustic
matching layer 42 second acoustic matching layer 61 organic piezoelectric layer 62 signal
electrode layer 63 ground electrode layer 92 93 conductive layer, 101 first acoustic matching
layer, 102 second acoustic matching layer, P fine pitch.
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