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DESCRIPTION JP2015503283

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DESCRIPTION JP2015503283
Provided is an ultrasonic probe capable of emitting heat generated from an ultrasonic vibrator to
the side opposite to the surface of the ultrasonic probe. A backing member 27 provided on the
ultrasonic probe 1 is attached to the ultrasonic vibrator 7 for transmitting the ultrasonic wave to
the subject, on the side opposite to the ultrasonic wave transmitting direction to the subject, and
the backing member 27 is , A plate-like backing material 24 and a thermal conductor 25 and a
thermal conductive plate 26 made of a material having a thermal conductivity higher than the
thermal conductivity of the backing material 24, the thermal conductor 25 being buried in the
backing material 24 The heat conductive plate 26 is formed in a pillar shape so as to reach both
plate surfaces of the backing material 24, and the heat conduction plate 26 is at least one of the
plate surfaces 24 a and 24 b of the backing material 24 near the ultrasonic vibrator 7. It is
provided on the surface.
Backing member, ultrasonic probe and ultrasonic image display device
[0001]
The present invention relates to a backing member, an ultrasonic probe, and an ultrasonic image
display apparatus capable of suppressing an increase in the surface temperature of an ultrasonic
probe.
[0002]
The ultrasonic image display apparatus displays an ultrasonic image based on an echo signal
obtained by performing an ultrasonic scan on a subject.
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In the ultrasound image display described above, ultrasound scanning is performed using an
ultrasound probe connected to the body of the device by a probe cable.
[0003]
The ultrasound probe includes an ultrasound vibrator, an acoustic matching layer and a backing
member. More specifically, the acoustic matching layer is provided near the subject with respect
to the ultrasonic vibrator, while the backing member is provided on the opposite side of the
subject (see, for example, Patent Document 1). An acoustic lens in contact with the subject is
provided near the subject relative to the acoustic matching layer. The ultrasonic vibrator is
manufactured by a piezoelectric transducer such as PZT (lead zirconate titanate), and a voltage is
applied to the ultrasonic vibrator to irradiate ultrasonic waves.
[0004]
JP, 2009-61112, A
[0005]
During the transmission and reception of the ultrasonic waves, heat is generated on the
ultrasonic vibrators.
Since the thermal conductivity of the backing member is lower than the thermal conductivity of
the acoustic matching layer, the heat generated on the ultrasonic vibrator is transferred to the
acoustic matching layer rather than to the backing member, ie to the subject. Therefore,
continuous use of the ultrasonic probe raises the temperature of the acoustic lens surface.
Therefore, in order to avoid the temperature rise of the acoustic lens surface during transmission
and reception of the ultrasonic wave, the output of the ultrasonic wave from the ultrasonic
vibrator is limited. From these, there is a need for an ultrasonic probe that can release the heat
generated on the ultrasonic vibrator to the side opposite to the surface of the ultrasonic probe.
[0006]
The present invention for solving the above problems is an ultrasonic probe, which is a backing
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member provided on an opposite side to an ultrasonic wave transmitting direction to an object
with respect to an ultrasonic vibrator transmitting ultrasonic waves to the object; The backing
member includes a plate-like backing material and a thermal conductor and a thermal conductive
plate made of a material having a thermal conductivity higher than that of the backing material,
and the thermal conductor is embedded in the backing material. The heat conducting plate is
provided on at least one of the plate surfaces of the backing material near the ultrasonic vibrator,
the pillars being formed to reach both plate surfaces of the backing material; It is an ultrasound
probe including a backing layer having the backing member, and an ultrasound image display
including the ultrasound probe.
[0007]
According to another aspect, the thermal conductor is dispersedly embedded in the backing
material of the above-described invention.
[0008]
According to an aspect of the present invention, the backing member provided on the opposite
side of the ultrasonic wave transmission direction to the subject with respect to the ultrasonic
vibrator includes a backing material, a thermal conductor and a thermal conduction plate.
The heat conducting plate is provided on at least the plate surface of the backing material near
the ultrasonic vibrator, and the heat conductor is formed in a pillar shape so as to reach both
plate surfaces of the backing material.
Therefore, the heat generated from the ultrasonic vibrator can be dissipated to the side opposite
to the surface of the ultrasonic probe through the heat conduction plate and the heat conductor.
Therefore, the rise of the surface temperature of the ultrasonic probe can be avoided.
[0009]
According to another aspect of the present invention, the heat conductor is dispersedly
embedded in the backing material, thereby avoiding a reduction in the effect of the backing layer
as an acoustic absorber.
[0010]
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FIG. 1 is a block diagram showing an example of an ultrasonic diagnostic apparatus according to
an embodiment.
It is a perspective view which shows the external appearance of the ultrasonic probe by the said
embodiment. It is a perspective view which shows the external appearance of only the functional
element unit of the ultrasonic probe shown by FIG. It is sectional drawing in the cutting plane
line xz of the functional element unit of the ultrasonic probe shown by FIG. It is a top view which
shows a part of backing member in which the heat conductor was embedded. It is a figure
showing irradiation of an ultrasonic wave. It is sectional drawing in the cutting plane line xz of
the functional element unit of the ultrasonic probe by deformation | transformation of 1st
Embodiment. It is a perspective view which shows the external appearance of only the functional
element unit of the ultrasonic probe by 2nd Embodiment. It is sectional drawing in the cutting
plane line xz of the functional element unit of the ultrasonic probe shown by FIG. It is sectional
drawing in the cutting plane line xz of the functional element unit of the ultrasonic probe by
deformation | transformation of 2nd Embodiment. FIG. 7 is an end view of a portion of a curved
backing member. It is a top view which shows a part of another backing member in which the
heat conductor was embedded. It is a top view which shows a part of another backing member in
which the heat conductor was embedded.
[0011]
Embodiments of the invention are described below. The ultrasonic diagnostic apparatus shown in
FIG. 1 transmits ultrasonic waves to a patient (subject in the present invention), receives
ultrasonic waves from the patient, and displays an ultrasonic image of the patient, thereby
displaying an ultrasonic image according to the present invention It is an example of an
apparatus. The ultrasonic diagnostic apparatus 100 includes an ultrasonic probe 1 and an
apparatus body 101 to which the ultrasonic probe 1 is connected.
[0012]
The device body 101 includes a transmission / reception unit 102, an echo data processing unit
103, a display control unit 104, a display unit 105, an operation unit 106, and a control unit
107.
[0013]
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The transmission / reception unit 102 supplies an electric signal for transmitting an ultrasonic
wave from the ultrasonic probe 1 under a predetermined scanning condition to the ultrasonic
probe 1 based on a control signal from the control unit 107.
The transmission / reception unit 102 also performs signal processing such as A / D conversion
or phasing / addition processing on the echo signal received by the ultrasonic probe 1.
[0014]
The echo data processing unit 103 performs processing to generate an ultrasound image for
echo data output from the transmission / reception unit 102. For example, the echo data
processing unit 103 performs B mode processing such as logarithmic compression processing or
envelope demodulation processing to generate B mode data.
[0015]
The display control unit 104 performs scan conversion on the data input from the echo data
processing unit 103 using a scan converter to generate ultrasound image data, and the display
unit 105 performs superimposing on the basis of the ultrasound image data. Display a sound
wave image. The display control unit 104 generates B-mode image data based on the B-mode
data, and displays the B-mode image on the display unit 105, for example.
[0016]
The display unit 105 is made of, for example, an LCD (liquid crystal display) or a CRT (cathode
ray tube). The operation unit 106 includes switches, a keyboard and a pointing device (not
shown) that the operator uses to input commands or information.
[0017]
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The control unit 107 is configured to include a CPU (central processing unit), although not
shown. The control unit 107 reads a control program stored in a storage unit (not shown) and
executes the function of each unit in the ultrasonic diagnostic apparatus 100.
[0018]
The ultrasound probe 1 will be described with reference to FIGS. 2 to 6. The ultrasound probe 1
performs ultrasound scanning on a patient. The ultrasound probe 1 also receives ultrasound echo
signals.
[0019]
The ultrasonic probe 1 has an acoustic lens unit 2 at its front end. The ultrasonic probe 1
includes a probe housing 3 and a connection cable 4 for connecting the ultrasonic probe 1 to the
apparatus main body 101. Note that a sectored probe is shown in FIG.
[0020]
The functional element unit 5 is provided in the probe housing 3. The functional element unit 5
will be described in detail with reference to FIGS. 3 to 5. The functional element unit 5 includes
an acoustic matching layer 6, an ultrasonic vibrator 7, an adhesive layer 8, a reflective layer 9, a
backing layer 10, a flexible base 11, and a support 12. The acoustic matching layer 6, the
ultrasonic vibrator 7 and the reflection layer 9 each have a rectangular three-dimensional shape
elongated in the x-axis direction, and are stacked in the z-axis direction along the irradiation
direction of ultrasonic waves to form a laminate 13 There is. A plurality of stacks 13 are aligned
in the y-axis direction.
[0021]
The acoustic matching layer 6 is adhered to the surface of the ultrasonic vibrator 7 on the
ultrasonic wave irradiation side (the adhesive layer is not shown). The acoustic matching layer 6
has an acoustic impedance between the ultrasonic vibrator 7 and the acoustic lens unit 2. The
acoustic matching layer 6 has a thickness of about one-fourth of the center frequency of the
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transmission ultrasonic wave, and inhibits reflection at boundary surfaces having different
acoustic impedances. Although the acoustic matching layer 6 is only one in this embodiment, two
or more acoustic matching layers 6 may be formed.
[0022]
The ultrasonic vibrator 7 includes a piezoelectric member 14 and a conductive layer 15 formed
on the surface of the piezoelectric member 14. The piezoelectric member 14 is PZT or the like.
The conductive layer 15 is formed on the surface of the piezoelectric member 14 by sputtering.
[0023]
The conductive layer 15 has a signal electrode 16 and an outer electrode 17. The signal
electrode 16 is formed on the surface of a portion 14 a between the holes 18 and 18 described
later of the piezoelectric member 14. The outer electrode 17 is formed at the end portions 14b
and 14b of the piezoelectric member 14 across the holes 18 and 18 on the same surface as the
signal electrode 16, and the first portion 17a of the piezoelectric member 14 And 17a are formed
on the surface opposite to the second portion 17b, and the side surface of the ultrasonic vibrator
7 having a rectangular three-dimensional shape between the first portions 17a and 17a and the
second portion 17b. And third portions 17c and 17c formed on the The signal electrode 16 is
formed so as to be sandwiched between the first portions 17 a and 17 a of the outer electrode
17, and both the electrode 16 and the electrode 17 are electrically isolated by the holes 18 and
18.
[0024]
The overall thickness of the ultrasonic vibrator 7 and the adhesive layer 8 is about one fourth of
the center frequency of the ultrasonic wave generated by the vibration of the ultrasonic vibrator
7. Specifically, the thickness of the ultrasonic vibrator 7 is about several hundred micrometers.
[0025]
The reflective layer 9 is adhered to the surface of the ultrasonic vibrator 7 opposite to the
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direction of the ultrasonic wave irradiation to the patient (opposite the acoustic matching layer 6)
by an adhesive layer 8 made of an epoxy resin adhesive. The reflective layer 9 is bonded to the
signal electrode 16 and the first portions 17a and 17a.
[0026]
The surface of the reflective layer 9 near the ultrasonic vibrator 7 is mirror-polished. The
surfaces of the signal electrode 16 of the ultrasonic vibrator 7 and the first portions 17a and 17a
are also mirror-polished. As a result of this process, the surface of the reflective layer 9 near the
ultrasonic vibrator 7 and the surfaces of the signal electrode 16 of the ultrasonic vibrator 7 and
the surfaces of the first portions 17a and 17a have asperities of only a few micrometers.
Therefore, the adhesive layer 8 can be set to have a thickness of several micrometers, whereby
the adhesive layer 8 can be formed as thin as possible with an even thickness.
[0027]
As described above, the thickness of the adhesive layer 8 is substantially the same as the
irregularities on the surface of the signal electrode 16, the irregularities on the surfaces of the
first portions 17a and 17a, and the irregularities on the surface of the reflective layer 9.
Therefore, although the adhesive layer 8 is an insulating member containing an epoxy resin
adhesive, the signal electrode 16, the first portions 17a and 17a, and the reflective layer 9 make
local contact with the irregularities on their surfaces, and hence the conductivity is established.
Do.
[0028]
The reflective layer 9 functions as a fixed end that reflects ultrasonic waves generated toward the
reflective layer 9 by the vibration of the ultrasonic vibrator 7 toward the patient. The ultrasonic
waves reflected by the reflective layer 9 increase the ultrasonic incident power to the patient.
The reflective layer 9 is an example of a reflective layer according to an embodiment of the
present invention. The reflective layer 9 is made of a material having an acoustic impedance
larger than that of the piezoelectric member 14 in order to reflect the ultrasonic wave generated
from the ultrasonic vibrator 7. For example, the reflective layer 9 is made of tungsten.
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[0029]
Since tungsten forming the reflective layer 9 has conductivity, the reflective layer 9 is a signal of
the ultrasonic vibrator 7 and the first copper foil layer 19 and the second copper foil layer 20 of
the flexible substrate 11 described later. It has a function of electrically connecting the electrode
16 and the outer electrode 17. Therefore, the voltage supplied from the first copper foil layer 19
and the second copper foil layer 20 is applied to the ultrasonic vibrator 7 through the reflective
layer 9.
[0030]
Holes 18 and 18 are formed at both ends of the reflective layer 9, the adhesive layer 8 and the
ultrasonic vibrator 7 in the longitudinal direction. The holes 18 and 18 are formed by bonding
the ultrasonic vibrator 7 and the reflection layer 9 with the adhesive layer 8 and then cutting the
reflection layer 9 using a diamond grindstone.
[0031]
The flexible substrate 11 is bonded between the surface opposite to the surface to which the
ultrasonic vibrator 7 of the reflection layer 9 is bonded and the backing layer 10 (the bonding
layer is not shown). The flexible substrate 11 extends in the width direction along the side of the
backing layer 10 and is connected to the connection cable 4 (connection structure not shown).
[0032]
The structure of the flexible substrate 11 will be described. The flexible substrate 11 includes
four layers: a first copper foil layer 19, a second copper foil layer 20, a first polyimide film layer
21 and a second polyimide film layer 22. The first copper foil layer 19 and the second copper foil
layer 20 are electrically isolated from each other by the first polyimide film layer 21. The first
copper foil layer 19 is bonded to the reflective layer 9 so as to be located at both ends of the
reflective layer 9 from the holes 18 and 18. The second copper foil layer 20 is laminated
between the first polyimide film layer 21 and the second polyimide film layer 22, and through
the through holes H at the central portion of the reflective layer 9 between the holes 18 and 18.
It exists on the same surface as the first copper foil layer 19. The first copper foil layer 19 and
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the second copper foil layer 20 present on the same surface are mutually insulated by the
separation channel 23. The separation channel 23 is formed to be located in the holes 18 and 18
with the reflective layer 9 adhered to the flexible substrate 11. By this structure, the first copper
foil layer 19 is electrically connected from the holes 18 and 18 to the end of the conductive
reflective layer 9, and the second copper foil layer 20 is between the holes 18 and 18. Are
electrically connected to the central portion of the reflective layer 9. Therefore, the first copper
foil layer 19 is electrically connected to the first portions 17 a and 17 a of the outer electrode 17
on the ultrasonic vibrator 7 through the reflection layer 9, and the second copper foil layer 20 is
an ultrasonic vibrator It is electrically connected to the signal electrode 16 of 7 through the
reflection layer 9.
[0033]
Since the first copper foil layer 19 connected to the outer electrode 17 is formed on the entire
front surface of the flexible substrate 11, the conductivity of the outer electrodes 17 of all the
ultrasonic vibrators 7 aligned in the y-axis direction is Is established. On the other hand, the
second copper foil layer 20 is divided into a plurality of portions in the y-axis direction by a
copper foil division channel not shown, and includes a plurality of copper foil patterns not shown
formed on the flexible substrate 11. The copper foil pattern is formed on each of the plurality of
laminates 13 aligned in the y-axis direction.
[0034]
The backing layer 10 is bonded to the surface of the flexible substrate 11 opposite to the
reflective layer 9, or the backing layer 10 is formed directly on the back surface of the flexible
substrate 11 to form the flexible substrate 11. Support. The backing layer 10 is an example of a
backing layer according to an embodiment of the present invention.
[0035]
The backing layer 10 includes a backing member 27 made of a backing material 24, a heat
conductor 25 and a heat conduction plate 26. The backing member 27 is an example of a
backing member according to an embodiment of the present invention.
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[0036]
The backing material 24 is made of, for example, an epoxy resin formed by dispersing and
solidifying metal powder. The thermal conductor 25 and the thermal conductive plate 26 are
made of a material having a thermal conductivity higher than the thermal conductivity of the
backing material 24, and made of metal, for example. Due to this structure, the heat resistance of
the backing layer 10 is lower than that of the conventional case.
[0037]
The only requirement is that the heat conductor 25 and the heat conduction plate 26 be made of
a material having a thermal conductivity several hundred times or several thousand times the
thermal conductivity of the backing material 24 and is not necessarily limited to metal. For
example, the heat conductor 25 and the heat conduction plate 26 may be made of carbon.
[0038]
The backing material 24 is formed in a plate-like shape. The heat conductor 25 is embedded in
the backing material 24. The heat conductor 25 is formed in a pillar shape so as to reach both
surfaces of the backing material 24. The heat conductors 25 are formed to be dispersed twodimensionally as shown in FIG. In this embodiment, the heat conductors 25 are aligned at
predetermined intervals in the x and y directions.
[0039]
The heat conductor 25 is formed to have a rectangular shape in a plan view, and the longitudinal
direction is directed to the y-axis direction. The heat conductor 25 is embedded in the backing
material 24 by being inserted into a hole formed in the backing material 24, for example. The
method of attaching the heat conductor 25 to the backing material 24 is not limited to this.
[0040]
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The heat conducting plate 26 is adhered to the plate surface 24 a of the backing material 24. The
plate surface 24a is an example of one surface of the backing material according to an
embodiment of the present invention. The thickness of the heat conducting plate 26 is preferably
10% or less of the wavelength of the center frequency of the ultrasonic waves transmitted from
the ultrasonic vibrator 7. The reason is described below. Most of the ultrasonic waves emitted
from the ultrasonic vibrator 7 toward the reflective layer 9 (toward the patient) are reflected by
the reflective layer 9 toward the patient. However, low frequency ultrasonic waves pass through
the reflective layer 9 to reach the backing material 24 and are absorbed by the backing material
24.
[0041]
If the heat conducting plate 26 is too thick, the ultrasonic waves passing through the reflective
layer 9 may be reflected by the heat conducting plate 26 before being absorbed by the backing
material 24. For this reason, the heat conducting plate 26 is formed to have the above-mentioned
thickness capable of avoiding the reflection of the ultrasonic wave at the heat conducting plate
26.
[0042]
The backing layer 10 is adhered to the support 12 with an adhesive (the adhesive is not shown).
The support 12 is made of metal and forms, for example, a part of the probe housing 3. The
support 12 is an example of a metal body according to an embodiment of the present invention.
[0043]
The operation of the functional element unit 5 of the ultrasonic probe 1 in this embodiment will
be described. When a voltage is applied between the signal electrode 16 and the outer electrode
17, the ultrasonic vibrator 7 excites resonant vibration. The patient side is a low acoustic
impedance composed of the acoustic matching layer 6, and the backing layer 10 opposite to the
patient is a high acoustic impedance composed of the reflective layer 9. Thus, as shown in FIG. 6,
the resonant vibration forms a standing wave W, where the patient side acts as a free end and
the reflective layer 9 acts as a fixed end.
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[0044]
The coordinate position on the z-axis in the lower part of FIG. 6 corresponds to the position of
the ultrasonic vibrator 7 and the reflective layer 9 in the z-axis direction shown in FIG.
[0045]
FIG. 6 shows a standing wave W in which the amplitude is maximum at the surface of the
ultrasonic vibrator 7 near the patient and zero at the surface of the reflective layer 9 near the
ultrasonic vibrator 7.
The reflective layer 9 functions as a fixed end. As described above, the standing wave W is
generated on the ultrasonic vibrator 7, and the thickness in the z-axis direction of the ultrasonic
vibrator 7 is set as a wavelength of 1⁄4 in a resonant state.
[0046]
As described above, since the thickness of the adhesive layer 8 is uniformly thin, the adhesive
layer 8 does not reduce the function as the fixed end of the reflective layer 9.
[0047]
The heat of the ultrasonic vibrator 7 generated during the ultrasonic irradiation is transmitted to
the reflective layer 9 and the flexible substrate 11 and reaches the backing layer 10.
The heat reaching the backing layer 10 is transferred to the heat conducting plate 26 and the
heat conductor 25 and reaches the metal support 12. Therefore, since the heat from the
ultrasonic vibrator 7 can be released to the opposite side of the acoustic lens unit 2, the
temperature rise of the acoustic lens unit 2 can be avoided.
[0048]
The heat conducting plate 26 is provided on the surface of the backing layer 10 in contact with
the flexible substrate 11, and the plate surface 24 a is entirely covered with a material having a
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thermal conductivity higher than that of the backing material 24. It is Thus, heat is efficiently
transferred from the flexible substrate 11 to the backing layer 10.
[0049]
The heat conductors 25 are embedded in the backing material 24, but the heat conductors 25
are dispersed at predetermined intervals in the x direction and y direction. Thus, the backing
layer 10 can exhibit a function as an acoustic absorber.
[0050]
Even when the metal heat conductor 25 is formed on the surface of the backing layer 10, the
ultrasonic wave transmitted from the ultrasonic vibrator 7 to the opposite side of the patient is
reflected by the reflective layer 9, so that the acoustic condition is adversely affected. Will not
bring
[0051]
Next, a modification of the first embodiment will be described with reference to FIG.
In this variation, the heat conducting plate 28 is also provided on the plate surface 24 b of the
backing material 24. Similar to the heat conducting plate 26, the heat conducting plate 28 is also
made of a material having a thermal conductivity higher than the thermal conductivity of the
backing material 24, such as metal or carbon. The plate surface 24b is an example of another
surface of the backing material according to an embodiment of the present invention.
[0052]
The backing layer 10 is fixed to the support 12 by an adhesive sheet layer 29. Even when the
layer made of a material having heat resistance higher than that of metal is between the backing
layer 10 and the support 12, the entire plate surface 24 b in which the heat conduction plate 28
is in contact with the support 12. Heat can be transferred efficiently from the backing layer 10 to
the support 12.
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[0053]
Second Embodiment Next, a second embodiment of the present invention will be described with
reference to FIGS. 8 and 9. FIG. The same components as in the first embodiment are identified
by the same numbers.
[0054]
In the ultrasonic probe 1 according to this embodiment, the laminate 13 ′ does not have the
reflective layer 9 but has only the acoustic matching layer 6 and the ultrasonic vibrator 7.
[0055]
Also in the ultrasonic probe 1 according to this embodiment, since the backing layer 10 has the
same configuration as that of the first embodiment, the temperature rise of the acoustic lens unit
2 can be avoided as in the ultrasonic probe 1 according to the first embodiment. .
[0056]
A modification of the second embodiment will be described with reference to FIG.
In this variation, as in the variation of the first embodiment, the heat conducting plate 28 is also
provided on the plate surface 24 b of the backing material 24.
The backing layer 10 is fixed to the support 12 by an adhesive sheet layer 29. Since the heat
conducting plate 28 is also provided on the plate surface 24b, the heat can be efficiently
transferred to the support 12 as in the modification of the first embodiment.
[0057]
The invention has been described with reference to the embodiments. It will be appreciated that
various modifications are possible without departing from the scope of the invention. For
example, the ultrasound probe 1 may be a convex or linear probe. When the ultrasonic probe 1 is
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a convex type probe, the backing layer 10 is formed by bending the backing member 27 in the zaxis direction as shown in FIG. In this case, slits 50 formed along the x-axis direction may be
formed on the plate surfaces 24 a and 24 b of the backing material 24 in order to easily bend the
backing member 27. The number of thermal conductors 25 (not shown in FIG. 11) in the
alignment direction (y-axis direction) of the ultrasonic vibrators 7 may be equal to the number of
ultrasonic vibrators 7. This structure allows the backing member 27 to be easily bent. Since there
is a gap in the y-axis direction between the thermal conductors 25 of the backing member 27,
the backing member 27 can be easily bent.
[0058]
In each embodiment, a plurality of thermal conductors 25 are embedded in the backing material
24 so as to be aligned in the x and y directions. However, the alignment of the thermal
conductors 25 is not limited thereto. The only requirement is that the heat conductors 25 be
dispersed and buried in the backing material 24. For example, the thermal conductors 25 may be
interspersed as shown in FIG.
[0059]
The heat conductor 25 does not necessarily have a rectangular shape in plan view as in each
embodiment. For example, the heat conductor 25 may have a circular shape in plan view as
shown in FIG.
[0060]
Reference Signs List 1 thermal acoustic probe 2 lens unit 3 probe housing 4 connection cable 5
functional element unit 6 acoustic matching layer 7 ultrasonic vibrator 8 adhesive layer 9
reflective layer 10 backing layer 11 flexible base 12 support 13 laminate 13 ′ laminate 14
Piezoelectric member 15 Conductive layer 16 Signal electrode 17 Outer electrode 17a First
portion 17b of piezoelectric member 14 Second portion 17c of piezoelectric member 14 Third
portion 18 of piezoelectric member 14 Hole 19 First copper foil layer of flexible base 11 20
second copper foil layer 21 of flexible substrate 11 first polyimide film layer 22 second
polyimide film layer 23 separation channel 24 backing material 24 a backing material 24 plate
surface 24 b backing material 24 plate surface 25 thermal conductor 26 heat conduction plate
27 backing member 28 heat conduction plate 29 adhesive sheet layer 50 slit 10 Ultrasound
system apparatus body 102 receiving unit 103 echo data processing unit 104 display control
unit 105 display unit 106 operation unit 107 control unit
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