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DESCRIPTION JP2016030037

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DESCRIPTION JP2016030037
The present invention provides a method of easily manufacturing an ultrasonic probe. A plurality
of ultrasonic transducers (21), a wiring portion (25), and a back load member (24) are provided.
The wiring portion has a portion disposed on the first surface side of the ultrasonic transducer,
and a transmission / reception circuit and a conductor whose potential is a predetermined
reference potential are provided at least in part. The back load member is disposed on the second
surface side of the ultrasonic transducer, and at least on the third surface on the ultrasonic
transducer side and the fourth surface on the side on which the conductor provided in the wiring
portion is located A conductive portion having conductivity is formed in part of the portion. The
conductive portion formed on the third surface is connected to the second electrode, and the
conductive portion formed on a portion of the fourth surface is connected to the conductor.
Then, each of the plurality of ultrasonic transducers is divided by a groove from the surface on
the first surface side of the wiring portion to any part between the first surface and the third
surface of the backing material. It is done. [Selected figure] Figure 3
Ultrasonic probe and ultrasonic probe manufacturing method
[0001]
Embodiments of the present invention relate to an ultrasound probe and a method of
manufacturing an ultrasound probe.
[0002]
The ultrasound diagnostic apparatus receives a reflected wave from the inside of the subject by
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scanning the inside of the subject with ultrasound, and generates an ultrasound image in which
the internal state of the subject is imaged based on the received reflected wave. Do.
For example, the ultrasonic diagnostic apparatus transmits ultrasonic waves from the ultrasonic
probe into the subject, receives the reflected wave generated by the mismatch of the acoustic
impedance inside the subject with the ultrasonic probe, and receives the reflection received by
the ultrasonic probe. An ultrasound image is generated based on the waves.
[0003]
Such an ultrasound probe has an ultrasound transducer that emits ultrasound to a subject. The
ultrasonic transducer has a ground electrode provided on the emission surface of ultrasonic
waves, and a signal electrode provided on the back surface opposite to the emission surface. For
example, a flexible printed circuit (FPC) for grounding to ground is connected to the grounding
electrode. Further, for example, a flexible wiring board for signal extraction is connected to the
signal electrode. Thereby, the signal electrode and the transmission / reception circuit are
connected via the flexible wiring board for signal extraction.
[0004]
Here, in the ultrasonic probe described above, the signal electrode connected to the flexible
wiring board for signal extraction is on the back side, and it is necessary to prevent the ultrasonic
transducers from shorting each other. That is, it is necessary to completely separate the plurality
of ultrasonic transducers. Therefore, in the ultrasonic probe manufacturing method for
manufacturing the above-described ultrasonic probe, ultrasonic vibration is generated in the step
of processing the piezoelectric material plate by dicing to form a plurality of ultrasonic
transducers on the flexible wiring board for signal extraction. It is necessary to cut the plate of
piezoelectric material so that the signal electrodes of the electrodes are completely separated.
However, it is difficult to completely separate the signal electrodes without damaging the flexible
wiring board for signal extraction by dicing. Therefore, the ultrasonic probe manufacturing
method described above can not easily manufacture an ultrasonic probe.
[0005]
JP, 2013-141243, A International Publication No. 2011-033666
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[0006]
The problem to be solved by the present invention is to provide an ultrasonic probe and an
ultrasonic probe manufacturing method that can be easily manufactured.
[0007]
The ultrasonic probe of the embodiment includes a plurality of ultrasonic transducers, a wiring
portion, and a back load material.
In the plurality of ultrasonic transducers, a first electrode is provided on a first surface to which
ultrasonic waves are emitted, and a second electrode is provided on a second surface opposite to
the first surface. There is.
The wiring board has a portion disposed on the first surface side of the ultrasonic transducer,
supplies a drive signal to the plurality of ultrasonic transducers, and the plurality of ultrasonic
transducers are reflected. A transmission / reception circuit that receives a reflected wave signal
generated by receiving a wave, and a conductor whose potential is a predetermined reference
potential are provided at least in part. The back load member is disposed on the second surface
side of the ultrasonic transducer, and at least a third surface on the ultrasonic transducer side
and a side on which the conductor provided in the wiring portion is located A conductive portion
having conductivity is formed on a part of the surface 4. Then, in the ultrasonic probe according
to the embodiment, the conductive portion formed on the third surface and the second electrode
are connected, and the conductive formed on a portion of the fourth surface Part and the
conductor are connected. Then, in the ultrasonic probe according to the embodiment, each of the
plurality of ultrasonic transducers is the first surface and the third of the backing material from
the surface on the first surface side of the wiring portion. It is divided by a groove to any part
between the faces.
[0008]
FIG. 1 is a diagram for explaining the configuration of the ultrasonic diagnostic apparatus
according to the first embodiment. FIG. 2 is a perspective view of an example of an ultrasonic
transducer that the ultrasonic probe according to the first embodiment has. FIG. 3 is a crosssectional view of the ultrasonic transducer taken along line A-A of FIG. FIG. 4 is a view for
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explaining an example of the method of manufacturing an ultrasonic probe according to the first
embodiment. FIG. 5A is a view for explaining various examples of the depth of grooves formed by
dicing. FIG. 5B is a view for explaining various examples of the depth of grooves formed by
dicing. FIG. 5C is a figure for demonstrating various examples of the depth of the groove |
channel formed by dicing. FIG. 5D is a view for explaining various examples of the depth of
grooves formed by dicing. FIG. 6 is a diagram for describing a modification according to the first
embodiment. FIG. 7 is a perspective view of an example of an ultrasonic transducer that the
ultrasonic probe according to the second embodiment has. 8 is a cross-sectional view of the
ultrasonic transducer taken along the line B-B in FIG. FIG. 9 is a diagram showing an example of a
possible ultrasonic transducer configuration of an ultrasonic probe. FIG. 10 is a view showing the
configuration of an ultrasonic transducer of another possible ultrasonic probe.
[0009]
Hereinafter, embodiments of an ultrasonic probe and a method of manufacturing an ultrasonic
probe will be described in detail with reference to the attached drawings.
[0010]
First Embodiment First, the configuration of an ultrasonic diagnostic apparatus to which the
ultrasonic probe according to the first embodiment is applied will be described.
FIG. 1 is a diagram for explaining the configuration of the ultrasonic diagnostic apparatus 100
according to the first embodiment. As shown in FIG. 1, the ultrasonic diagnostic apparatus 100
according to the first embodiment includes an ultrasonic probe 1, a monitor 2, an input device 3,
and an apparatus main body 10.
[0011]
The ultrasonic probe 1 has an ultrasonic transducer that transmits ultrasonic waves and receives
reflected waves. The ultrasonic transducer has a plurality of ultrasonic transducers. The plurality
of ultrasonic transducers generate ultrasonic waves based on drive signals supplied from a
transmission / reception unit 11 of an apparatus main body 10 described later. Then, the
plurality of ultrasonic transducers receive the reflected wave from the subject P and convert the
received reflected wave into an electrical signal. The ultrasonic transducer has an acoustic
matching layer provided on the ultrasonic transducer, a back load material (backing material)
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that suppresses the propagation of ultrasonic waves from the ultrasonic transducer to the rear,
and the like. The ultrasonic probe 1 is detachably connected to the apparatus main body 10.
[0012]
For example, when ultrasonic waves are transmitted from the ultrasonic probe 1 to the subject P,
the transmitted ultrasonic waves are reflected one after another by the discontinuous surface of
the acoustic impedance in the body tissue of the subject P, and the ultrasonic waves are reflected
waves. A plurality of ultrasonic transducers included in the probe 1 are received. The reflected
wave is converted into a reflected wave signal, which is an electrical signal, by the ultrasonic
transducer that has received the reflected wave. The amplitude of the reflected wave signal
depends on the difference in acoustic impedance at the discontinuity where the ultrasound is
reflected. Note that the reflected wave signal when the transmitted ultrasonic pulse is reflected
by the moving blood flow, the surface of the heart wall or the like depends on the velocity
component of the moving body in the ultrasonic transmission direction by the Doppler effect.
Receive a frequency shift.
[0013]
In the first embodiment, the case where the ultrasound probe 1 is an ultrasound probe in which
ultrasound transducers are arranged in a one-dimensional manner will be described. The
ultrasonic probe 1 according to the first embodiment can be easily manufactured, although the
details will be described later.
[0014]
The monitor 2 displays a graphical user interface (GUI) for the operator of the ultrasonic
diagnostic apparatus 100 to input various setting requests by using the input device 3, or an
ultrasonic image or the like generated in the apparatus main body 10 Display.
[0015]
The input device 3 has a trackball, a switch, a dial, a touch command screen, and the like.
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The input device 3 receives various setting requests from the operator of the ultrasonic
diagnostic apparatus 100, and transfers the received various setting requests to the device main
body 10. For example, the input device 3 receives various setting requests for controlling the
ultrasonic probe 1 and transfers the requests to the control unit 17.
[0016]
The apparatus body 10 is an apparatus that controls transmission and reception of ultrasonic
waves by the ultrasonic probe 1 and generates an ultrasonic image based on the reflected wave
received by the ultrasonic probe 1. As shown in FIG. 1, the device body 10 includes a
transmitting / receiving unit 11, a B mode processing unit 12, a Doppler processing unit 13, an
image generation unit 14, an image memory 15, an internal storage unit 16, and a control unit
17. And.
[0017]
The transmission / reception unit 11 includes a trigger generation circuit, a delay circuit, a pulser
circuit, and the like, and supplies a drive signal to the ultrasonic probe 1. The pulser circuit
repeatedly generates rate pulses for forming transmission ultrasonic waves at a predetermined
rate frequency. Also, the delay circuit is configured to generate each pulse generator delay time
for each ultrasonic transducer necessary to focus the ultrasonic waves generated from the
ultrasonic probe 1 in a beam shape and determine transmission directivity. Apply to pulse. The
trigger generation circuit also applies a drive signal (drive pulse) to the ultrasonic probe 1 at a
timing based on the rate pulse. That is, the delay circuit arbitrarily adjusts the transmission
direction from the ultrasonic transducer surface by changing the delay time given to each rate
pulse.
[0018]
In addition, the transmission / reception unit 11 has a function capable of instantaneously
changing the transmission frequency, the transmission drive voltage, and the like in order to
execute a predetermined scan sequence based on an instruction of the control unit 17 described
later. In particular, the change of the transmission drive voltage is realized by a linear amplifier
type transmission circuit whose value can be switched at an instant or a mechanism for
electrically switching a plurality of power supply units.
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[0019]
The transmission / reception unit 11 also has an amplifier circuit, an A / D converter, an adder,
and the like, and performs various processes on the reflected wave signal generated in the
ultrasonic probe 1 to generate reflected wave data. The amplifier circuit amplifies the reflected
wave signal for each channel to perform gain correction processing. The A / D converter A / D
converts the gain-corrected reflected wave signal and gives digital data the delay time necessary
to determine the reception directivity. The adder adds the reflected wave signals processed by
the A / D converter to generate reflected wave data. The addition processing of the adder
emphasizes the reflection component from the direction according to the reception directivity of
the reflection wave signal. Thus, the transmitting and receiving unit 11 controls transmission
directivity and reception directivity in transmission and reception of ultrasonic waves.
[0020]
The B mode processing unit 12 receives the reflected wave data from the transmitting and
receiving unit 11, performs logarithmic amplification, envelope detection processing, and the
like, and generates data (B mode data) in which the signal intensity is represented by the
brightness of luminance. .
[0021]
The Doppler processing unit 13 performs frequency analysis of velocity information from the
reflected wave data received from the transmitting and receiving unit 11, extracts blood flow,
tissue, and contrast agent echo component due to the Doppler effect, and mobile object
information such as average velocity, dispersion, and power. To generate data (Doppler data)
extracted for multiple points.
[0022]
The image generation unit 14 generates an ultrasound image from the data generated by the Bmode processing unit 12 and the Doppler processing unit 13.
That is, the image generation unit 14 generates a B-mode image in which the intensity of the
reflected wave is represented by luminance from the B-mode data generated by the B-mode
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processing unit 12.
[0023]
Further, the image generation unit 14 generates, from the Doppler data generated by the Doppler
processing unit 13, an average velocity image representing moving object information, a
dispersion image, a power image, or a color Doppler image as a combination image thereof.
[0024]
The image memory 15 is a memory for storing the ultrasound image generated by the image
generation unit 14.
The image memory 15 can also store data generated by the B-mode processing unit 12 and the
Doppler processing unit 13.
[0025]
The internal storage unit 16 stores various data such as a control program for performing
ultrasound transmission / reception, image processing and display processing, diagnostic
information (for example, patient ID, doctor's findings, etc.), diagnostic protocol, various body
marks, etc. Do.
In addition, the internal storage unit 16 is also used, for example, to store an image stored in the
image memory 15 as needed.
[0026]
The control unit 17 is a control processor (CPU: Central Processing Unit) that realizes a function
as an information processing apparatus (computer), and controls the entire processing of the
ultrasonic diagnostic apparatus 100. Specifically, based on various setting requests input from
the operator via the input device 3 and various control programs and various data read from the
internal storage unit 16, the control unit 17 transmits / receives the unit 11, B mode The
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processing of the processing unit 12, the Doppler processing unit 13, and the image generation
unit 14 is controlled. Further, the control unit 17 may be an ultrasonic image stored in the image
memory 15, various images stored in the internal storage unit 16, a GUI for performing
processing by the image generation unit 14, a processing result of the image generation unit 14,
etc. Are controlled to be displayed on the monitor 2.
[0027]
The overall configuration of the ultrasound diagnostic apparatus 100 according to the first
embodiment has been described above. Under such a configuration, the ultrasonic probe 1
applied to the ultrasonic diagnostic apparatus 100 according to the first embodiment is an
ultrasonic probe which can be easily manufactured as described in detail below.
[0028]
Next, with reference to FIG. 2 and FIG. 3, an example of the configuration of the ultrasonic
transducer 20 that the ultrasonic probe 1 according to the first embodiment has will be
described. FIG. 2 is a perspective view of an example of an ultrasonic transducer 20 that the
ultrasonic probe 1 according to the first embodiment has. FIG. 3 is a cross-sectional view of the
ultrasonic transducer 20 taken along line A-A of FIG. In the example of FIG. 2, the ultrasonic
transducer 20 is schematically shown, and illustration of a flexible wiring board 25, a substrate
26, an acoustic lens 27 and the like described later is omitted.
[0029]
As shown in the example of FIG. 2 and FIG. 3, the ultrasonic transducer 20 includes a plurality of
ultrasonic transducers 21, an acoustic matching layer 22, a conductive bonding portion 23, a
backing material 24, a flexible wiring board 25, a substrate 26 and acoustics. It has a lens 27.
[0030]
The ultrasonic transducer 21 is a piezoelectric element having piezoelectricity.
For example, the ultrasonic transducer 21 may be made of PZT (lead zirconate titanate / Pb (Zr,
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Ti) O 3), PMN-PT (lead magnesium niobate-lead titanate / Pb (Mg 1/3 Nb 2/3) It is a
piezoelectric element such as) O 3 -PbTiO 3). In the first embodiment, the plurality of ultrasonic
transducers 21 are provided in a one-dimensional array on a predetermined surface of the back
load member 24. A signal electrode 21 a is provided on the surface of the ultrasonic transducer
21 on which the ultrasonic waves are emitted (the emission surface of the ultrasonic waves).
Further, a ground electrode 21 b is provided on the surface (rear surface) opposite to the
ultrasonic radiation surface side of the ultrasonic transducer 21. The signal electrode 21a is an
example of a first electrode, and the ground electrode 21b is an example of a second electrode.
[0031]
The plurality of ultrasonic transducers 21 are driven by a drive signal from a transmission /
reception circuit 26a described later, and emit ultrasonic waves from the surface on the signal
electrode 21a side. Also, when receiving the reflected wave, the plurality of ultrasonic
transducers 21 convert the received reflected wave into a reflected wave signal, and output the
converted reflected wave signal from the signal electrode 21a. The surface of the ground
electrode 21 b opposite to the signal electrode 21 a is bonded to a conductive film 24 a
described later of the backing material 24. For example, the surface of the ground electrode 21b
opposite to the signal electrode 21a is conductively bonded to the conductive film 24a described
later by a conductive adhesive containing conductive particles. In this case, since the conductive
adhesive has high viscosity and does not require a strong pressing force at the time of bonding, it
is between the surface of the ground electrode 21b opposite to the signal electrode 21a side and
the conductive film 24a described later. A conductive adhesive portion 23 having a constant
thickness is formed.
[0032]
The surface of the ground electrode 21b opposite to the signal electrode 21a may be bonded to
the conductive film 24a described later using an epoxy resin or the like which has low viscosity
and high insulation. In this case, the surface of the ground electrode 21b opposite to the signal
electrode 21a is brought into pressure contact with the conductive film 24a described later to
draw out a signal by applying heat and curing while applying a strong pressure upon bonding. it
can.
[0033]
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An acoustic matching layer 22 is provided on the surface of the signal electrode 21a opposite to
the ground electrode 21b. The acoustic matching layer 22 is at least one or more acoustic
matching layers. The acoustic matching layer 22 is used to adjust the acoustic impedance
mismatch between the ultrasonic transducer 21 and the subject P so that the ultrasonic wave
emitted from the ultrasonic transducer 21 is efficiently incident into the subject P. ease.
[0034]
In addition, the acoustic matching layer 22 is made of a conductive material. The flexible wiring
board 25 is electrically connected to the surface of the acoustic matching layer 22 opposite to
the ultrasonic transducer 21 side. Thereby, the signal electrode 21a and the transmission /
reception circuit 26a described later are electrically connected via the acoustic matching layer 22
and the flexible wiring board 25. The flexible wiring board 25 is an example of a flexible wiring
board. Further, the wiring board is an example of the wiring portion.
[0035]
The flexible wiring board 25 is, for example, a double-sided FPC. When the flexible wiring board
25 is a double-sided FPC, each of the wiring patterns connected to each of the plurality of
ultrasonic transducers 21 is provided on the surface of the flexible wiring board 25 opposite to
the acoustic matching layer 22 side. ing. Each wiring pattern is connected to an adhesive pad
(not shown) provided on the back side of the flexible wiring board 25 through a through hole
electrically connecting both surfaces of the flexible wiring board 25. Each of the bonding pads is
provided at the position on the back surface side of the flexible wiring board 25 according to the
position of the acoustic matching layer 22 electrically connected to the ultrasonic transducer 21
to be connected. . Then, each bonding pad is bonded to the corresponding acoustic matching
layer 22. Thereby, the signal electrode 21a and the transmission / reception circuit 26a
described later are electrically connected via the wiring pattern provided for each ultrasonic
transducer 21 on the surface of the flexible wiring board 25 opposite to the acoustic matching
layer 22 side. Connected
[0036]
A single-sided FPC can also be used as the flexible wiring board 25. When the flexible wiring
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board 25 is a single-sided FPC, on the surface of the flexible wiring board 25 on the side of the
acoustic matching layer 22, wiring patterns connected to the plurality of ultrasonic transducers
21 are provided. When a single-sided FPC is used as the flexible wiring board 25, cost and
acoustic performance are better than when a double-sided FPC is used.
[0037]
Further, the wiring pattern 25 a is provided on the surface on the back side of the flexible wiring
board 25 in an exposed state. The wiring pattern 25a is a ground pattern whose potential is a
predetermined reference potential. The wiring pattern 25a is an example of a conductor whose
potential is a predetermined reference potential.
[0038]
Then, as shown in FIG. 3, the flexible wiring board 25 is bent so as to be substantially parallel to
the side surface of the backing material 24. The wiring pattern 25a and the conductive film 24a
described later are electrically connected. For example, the wiring pattern 25a and the
conductive film 24a described later are bonded by a conductive adhesive. Here, an epoxy
adhesive in which conductive particles are mixed and dispersed may be mentioned as an example
of the conductive adhesive used when bonding the wiring pattern 25a and the conductive film
24a described later. When such a conductive adhesive is used, the wiring pattern 25a and the
conductive film 24a described later can be press-bonded by applying heat and curing while
applying a strong pressure upon bonding.
[0039]
When bonding the wiring pattern 25a and the conductive film 24a described later, a conductive
adhesive having high viscosity containing conductive particles can also be used. In this case,
since the conductive adhesive has high viscosity and does not require a strong pressing force at
the time of bonding, it is constant between the wiring pattern 25a and the conductive film 24a
described later, as exemplified in FIG. A conductive adhesive portion 28 having a thickness of
Here, the thickness of the conductive bonding portion 28 can be controlled to several tens μm
to 100 μm.
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[0040]
As described above, since the wiring pattern 25a and the conductive film 24a described later are
connected, the ground electrode 21b and the transmission / reception circuit 26a described later
are electrically connected through the wiring pattern 25a and the conductive film 24a described
later. Be done.
[0041]
The back load member 24 suppresses the propagation of ultrasonic waves from the ultrasonic
transducer 21 in the back direction (backward).
The backing material 24 is a non-conductive material containing a metal such as tungsten or the
like, a resin (for example, an epoxy resin) filled with a metal oxide such as alumina or zinc oxide,
or a rubber or the like. A conductive film 24a having conductivity is formed on the surface of the
backing material 24 by means such as plating. Thus, in the present embodiment, the surface of
the backing material 24 is made conductive. The conductive film 24 a is an example of a
conductive portion.
[0042]
The conductive film 24 a is preferably covered with a thin film of gold in order to suppress the
effects of oxidation, corrosion, and the like. However, since gold is expensive and adhesion to the
back load material 24 is not good, it is more preferable to form a gold thin film after performing
an undercoating treatment such as nickel or chromium. The thickness of such a conductive film
24 a is thinner than the thickness of a general flexible wiring board.
[0043]
The conductive film 24 a formed on the backing material 24 may not be formed over the entire
surface of the backing material 24 as illustrated in FIG. 3. The conductive film 24a formed on the
backing material 24 is formed at least on the surface of the backing material 24 on the ultrasonic
transducer 21 side and a part of the surface on which the wiring pattern 25a is located. Just do
it. Here, the conductive film 24a formed on the surface of the backing material 24 on the
ultrasonic transducer 21 side and the conductive film 24a formed on a part of the surface on the
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side on which the wiring pattern 25a is located are connected. Need to be connected. In addition,
the surface of the back load material 24 is masked by applying masking to the surface of the
back load material 24 other than a part of the surface of the back load material 24 on the side of
the ultrasonic transducer 21 and the surface on which the wiring pattern 25a is located. You can
also maintain sex.
[0044]
The substrate 26 has a transmission / reception circuit 26a. The transmission / reception circuit
26 a is connected to a wiring pattern (not shown) provided on the substrate 26. When the
flexible wiring board 25 is a double-sided FPC, the wiring pattern connected to the transmission /
reception circuit 26 a is a wiring provided for each ultrasonic transducer 21 on the surface of the
flexible wiring board 25 opposite to the acoustic matching layer 22 side. The patterns are
electrically connected via through holes (not shown) formed in the flexible wiring board 25.
When the flexible wiring board 25 is a single-sided FPC, the wiring pattern connected to the
transmission / reception circuit 26 a is a wiring pattern provided for each ultrasonic transducer
21 on the surface of the flexible wiring board 25 on the acoustic matching layer 22 side. It is
electrically connected. Furthermore, the wiring pattern connected to the transmission / reception
circuit 26a is electrically connected to the wiring pattern 25a. Therefore, the transmission /
reception circuit 26a is electrically connected to the signal electrode 21a and the ground
electrode 21b.
[0045]
For example, the flexible wiring board 25 is electrically connected to the substrate 26 by ACF
(Anisotropic Conductive Film) connection to the substrate 26.
[0046]
The transmission / reception circuit 26 a transmits / receives various signals to / from the
ultrasonic transducer 21.
For example, when the transmission / reception circuit 26a receives the drive signal transmitted
from the apparatus main body 10, the transmission / reception circuit 26a transmits the received
drive signal to the ultrasonic transducer 21 to be driven, thereby the ultrasonic transducer 21 to
be driven. Between the two electrodes (the signal electrode 21a and the ground electrode 21b) at
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a voltage corresponding to the drive signal. That is, the transmission / reception circuit 26 a
supplies the ultrasonic transducer 21 with a drive signal for ultrasonic wave transmission. As a
result, the ultrasonic transducer 21 is driven to emit an ultrasonic wave.
[0047]
Further, when receiving the reflected wave signals output from the plurality of ultrasonic
transducers 21, the transmitting / receiving circuit 26a performs known bundling processing on
the received reflected wave signals, and the reflected wave signal subjected to bundling
processing Are transmitted to the transmission / reception unit 11 of the apparatus main body
10.
[0048]
The transmission / reception circuit 26a may further have various functions of the transmission /
reception unit 11 described above.
In this case, the transmission / reception unit 11 is omitted in the apparatus body 10.
[0049]
The acoustic lens 27 focuses the ultrasonic waves. The acoustic lens 27 is provided on the
surface of the flexible wiring board 25 in the direction in which the ultrasonic waves are emitted.
[0050]
Next, with reference to FIG. 4, an example of a method of manufacturing the ultrasonic probe 1
(the ultrasonic transducer 20) according to the first embodiment (method of manufacturing the
ultrasonic probe) will be described. FIG. 4 is a view for explaining an example of a method of
manufacturing the ultrasonic probe 1 according to the first embodiment.
[0051]
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As shown in the example of FIG. 4, in step 1, the laminate 31 in which the acoustic matching
layer 22 is laminated on the piezoelectric material plate 30, and the conductive film 24 a is
formed on the surface; It adheres to a predetermined surface of the material 24. Here, in the
piezoelectric material plate 30, the signal electrode 21a is provided on the surface on which the
ultrasonic wave is emitted, and the ground electrode 21b is provided on the surface on the
opposite side to the surface on which the ultrasonic wave is emitted. In the process 1, for
example, as described above, the surface of the ground electrode 21b opposite to the signal
electrode 21a is conductively bonded with the conductive adhesive containing conductive
particles as described above. In this case, since the conductive adhesive has high viscosity and
does not require a strong pressing force for bonding, the conductive adhesive is provided
between the surface of the ground electrode 21b opposite to the signal electrode 21a and the
conductive film 24a. A conductive bonding portion 23 having a constant thickness is formed.
[0052]
In the process 1, the conductive film 24a may be bonded to the surface of the ground electrode
21b opposite to the signal electrode 21a with an epoxy resin or the like having a low viscosity
and a high insulation property as described above. In this case, by heating and curing while
applying a strong pressure upon bonding, a signal can be extracted by press-bonding the surface
of the ground electrode 21b opposite to the signal electrode 21a with the conductive film 24a. In
this case, since the pressure bonding is performed, the thickness of the epoxy resin becomes so
thin that it can be ignored.
[0053]
Further, in step 1, instead of the laminate 31 in which the acoustic matching layer 22 is
laminated on the piezoelectric material plate 30, the piezoelectric material plate 30 on which the
acoustic matching layer 22 is not laminated is a back load material 24 whose surface is made
conductive. It may be adhered to a predetermined surface of
[0054]
Next, in step 2, between the surface (surface on the electrode 21 a side) of the piezoelectric
material plate 30 from which the ultrasonic waves are radiated from the upper surface 31 a of
the laminate 31 and the surface on the piezoelectric material plate 30 side of the backing
material 24. A plurality of ultrasonic transducers 21 are formed on the back load material 24 by
forming grooves by dicing or the like to any part of the above.
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[0055]
Here, in the first embodiment, the electrode on the back side of the ultrasonic transducer 21 is
the ground electrode 21 b of the common potential.
Therefore, the ultrasonic transducer 21 divided by the groove by dicing may be acoustically
separated, and unlike the case where the electrode on the back side of the ultrasonic transducer
is the signal electrode, the ultrasonic vibration is generated. There is no need to electrically
separate the electrode (ground electrode 21b) on the back side of the element 21.
Therefore, in the first embodiment, the depth of the groove formed by dicing is the surface (the
surface on the signal electrode 21a side) on which the ultrasonic wave of the piezoelectric
material plate 30 is emitted from the upper surface 31a of the laminate 31. It may be any part
between the back load member 24 and the surface on the piezoelectric material plate 30 side.
Therefore, according to the method of manufacturing an ultrasonic probe according to the first
embodiment, since the range of the depth of the groove formed by dicing at the time of
manufacturing a non-defective product is wide, the difficulty in dicing processing can be reduced.
Thus, the ultrasonic probe 1 can be manufactured easily.
[0056]
Further, according to the method of manufacturing an ultrasonic probe according to the first
embodiment, since the difficulty in dicing can be reduced, an increase in processing tact time can
be suppressed.
[0057]
Further, according to the method of manufacturing an ultrasonic probe according to the first
embodiment, ultrasonic vibration does not have to be cut by dicing as compared to the case
where the electrode on the back side of the ultrasonic transducer is a signal electrode. The load
at the time of dicing of the child 21 and the back load material 24 can be suppressed.
Therefore, according to the ultrasonic probe manufacturing method according to the first
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embodiment, the ultrasonic probe 1 can be manufactured with a high probability of being a nondefective product. Therefore, according to the method of manufacturing an ultrasonic probe
according to the first embodiment, the yield can be improved.
[0058]
Furthermore, according to the method of manufacturing an ultrasonic probe according to the
first embodiment, an increase in processing tact time can be suppressed, and a good yield can be
achieved. Therefore, it is required when manufacturing the ultrasonic probe 1 Cost increase can
be suppressed.
[0059]
Here, when forming a groove in a piezoelectric material plate by dicing to form an ultrasonic
transducer, as a technique for separating the ultrasonic transducer reliably without damaging the
flexible wiring board on the lower surface of the ultrasonic transducer, There is a technology to
make a groove by dicing on the lower surface.
Such a technique complicates the process. However, according to the ultrasonic probe
manufacturing method according to the first embodiment, the ultrasonic probe 1 having a high
probability of being a non-defective product can be manufactured without using a technique
having such a complicated process. Therefore, also from this point, it can be said that the
ultrasonic probe 1 can be easily manufactured according to the ultrasonic probe manufacturing
method according to the first embodiment.
[0060]
Further, from the above, the ultrasonic probe 1 according to the first embodiment can be easily
manufactured.
[0061]
In the first embodiment, various variations in the depth of grooves formed by dicing are
conceivable.
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For example, as shown in the example of FIG. 4, in the process 2, a groove having a depth from
the upper surface 31 a to the ground electrode 21 b may be formed. In this case, the ultrasonic
transducer 21 is completely divided and completely separated acoustically, so that the acoustic
performance (wideness of directivity) is excellent.
[0062]
5A to 5D are diagrams for explaining various examples of the depth of grooves formed by dicing.
The depth of the groove formed by dicing may be the depth from the upper surface 31 a to the
middle of the conductive bonding portion 23. For example, as shown in the example of FIG. 5A, in
the process 2, a groove having a depth from the upper surface 31a to the middle of the
conductive bonding portion 23 can also be formed. Also in this case, the ultrasonic transducers
21 are completely divided and completely separated acoustically. Therefore, the acoustic
performance is excellent. In addition, in the process 2, a groove having a depth from the upper
surface 31a to the middle of the backing material 24 can also be formed. In addition, since the
thickness of the conductive bonding portion 23 can be controlled to several tens of μm to 100
μm, in the case where the back load material 24 contains rubber as a main component,
compared to such a back load material 24, it is conductive. The cuttability of the bonded portion
23 is excellent.
[0063]
Here, when the thickness of the conductive bonding portion 23 is controlled to several tens of
μm to 100 μm, since the conductive bonding portion 23 has a certain thickness, it is possible to
secure the clearance of the groove formed by dicing. It is not necessary to put a groove by dicing
on the lower surface.
[0064]
Further, the depth of the groove formed by dicing may be a depth from the upper surface 31a to
an arbitrary position between the upper and lower electrodes of the ultrasonic transducer 21
(between the signal electrode 21a and the ground electrode 21b).
For example, as shown in the example of FIG. 5B, in the process 2, a groove having a depth from
the top surface 31a to (L × (9/10)) when the length in the cutting direction of the ultrasonic
vibration 21 is L is You may form. The example of FIG. 5B shows the case where the surface of
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the ground electrode 21b opposite to the signal electrode 21a and the conductive film 24a are
press-bonded to each other. In this case, by making the depth of the groove as close as possible
to the ground electrode 21b, it is possible to separate acoustically to a level that causes no
problem. In addition, since the ultrasonic transducer 21 is not completely divided, the load at the
time of dicing is reduced, and the processability is improved.
[0065]
Further, an intermediate layer may be provided on the back surface side of the ultrasonic
transducer 21, and the depth of the groove formed by dicing may be a depth from the upper
surface 31a to the middle of the intermediate layer. For example, as shown in the example of FIG.
5C, the intermediate layer 32 is provided on the back side of the ultrasonic transducer 21, and in
step 2, even if a groove is formed from the upper surface 31a to the middle of the intermediate
layer 32 Good. As the intermediate layer 32, for example, a mixed sintered body made of a metal
such as tungsten which has a high acoustic impedance as compared to the ultrasonic transducer
21 and is conductive, or a metal powder is used. Since such an intermediate layer 32 has an
extremely high acoustic impedance, the back side of the ultrasonic transducer 21 is not
susceptible to acoustic influences. Therefore, even if the intermediate layer 32 is not completely
divided, the acoustic influence on the back side of the ultrasonic transducer 21 is small.
[0066]
Further, as shown in the example of FIG. 5D, in the process 2, a groove having a depth from the
upper surface 31a to the middle of the ultrasonic transducer 21 may be formed.
[0067]
Returning to the description of FIG. 4, in the next step 3, the flexible wiring board 25 is disposed
on the side of the ultrasonic transducer 21 on which the ultrasonic waves are emitted, and the
signal electrodes 21 a of the plurality of ultrasonic transducers 21 The flexible wiring board 25
is connected.
The flexible wiring board 25 in the step 3 is connected to the transmission / reception circuit
26a, and is provided with a wiring pattern 25a whose potential is a predetermined reference
potential.
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[0068]
For example, in step 3, the bonding pads (not shown) provided on the back side of the flexible
wiring board 25 and the corresponding acoustic matching layer 22 are pressed and bonded. In
addition, when pressing and bonding, alignment between each bonding pad and the acoustic
matching layer 22 is performed by microscopic observation. Here, since the flexible wiring board
25 is translucent, the position of the acoustic matching layer 22 can be confirmed.
[0069]
Next, in step 4, the surface of the backing material 24 and the wiring pattern 25a are connected.
For example, in step 4, the wiring pattern 25 a and the conductive film 24 a are bonded using a
conductive adhesive containing conductive particles and having high viscosity. In this case, since
the conductive adhesive has high viscosity and does not require a strong pressing force at the
time of bonding, a certain thickness is provided between the wiring pattern 25a and the
conductive film 24a, as illustrated in FIG. A conductive adhesive portion 28 is formed.
[0070]
In the process 4, the wiring pattern 25a and the conductive film 24a can also be adhered using
an epoxy adhesive in which the conductive particles are mixed and dispersed. In this case, the
wiring pattern 25a and the conductive film 24a can be press-bonded to each other by heating
and curing while applying a strong pressure.
[0071]
Next, in step 5, the acoustic lens 27 is bonded to the surface of the flexible wiring board 25
opposite to the acoustic matching layer 22 side.
[0072]
The ultrasonic probe 1 and the ultrasonic probe manufacturing method according to the first
embodiment have been described above.
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As described above, the ultrasonic probe 1 according to the first embodiment can be easily
manufactured.
[0073]
In addition, as described above, according to the method of manufacturing an ultrasonic probe
according to the first embodiment, since the range of the depth of the groove formed by dicing at
the time of manufacturing a non-defective product is wide, the difficulty at the time of dicing
processing The ultrasonic probe 1 can be easily manufactured.
[0074]
Further, according to the method of manufacturing an ultrasonic probe according to the first
embodiment, since the difficulty in dicing can be reduced, an increase in processing tact time can
be suppressed.
[0075]
Further, according to the method of manufacturing an ultrasonic probe according to the first
embodiment, the yield can be improved.
[0076]
Furthermore, according to the method of manufacturing an ultrasonic probe according to the
first embodiment, an increase in processing tact time can be suppressed, and a good yield can be
achieved. Therefore, it is required when manufacturing the ultrasonic probe 1 Cost increase can
be suppressed.
[0077]
In the first embodiment described above, since the signal electrode 21a is provided on the
radiation surface side of the ultrasonic transducer 21, the radiated radio wave is reduced In order
to enhance the resistance to radio wave noise, it is preferable to cover the radiation surface with
a shield member.
Therefore, such an embodiment will be described as a modification of the first embodiment with
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reference to FIG.
[0078]
FIG. 6 is a diagram for describing a modification according to the first embodiment.
As shown in FIG. 6, a shield member 33 is provided between the flexible wiring board 25 and the
acoustic lens 27.
The shield member 33 reduces radiated radio waves and enhances resistance to radio noise.
For example, when the flexible wiring board 25 is a double-sided FPC, a conductive thin film can
be formed on the flexible wiring board 25 as the shield member 33 by sputtering or the like on a
base film having a thickness of 7 to 25 μm. Moreover, when the flexible wiring board 25 is
single-sided FPC, a conductive thin film can be formed directly. Heretofore, the modification
according to the first embodiment has been described. According to the modification of the first
embodiment, radiated radio waves can be reduced, and resistance to radio wave noise can be
enhanced. Further, according to the modification of the first embodiment, the same effect as that
of the first embodiment can be obtained.
[0079]
In addition, an acoustic matching layer can also be provided between the shield member 33 and
the acoustic lens 27.
[0080]
Second Embodiment In the first embodiment described above, the case where the ultrasonic
transducers 21 are arranged in a one-dimensional manner has been described, but the ultrasonic
transducers 21 may be arranged in a two-dimensional manner. .
Thus, such an embodiment will be described as a second embodiment with reference to FIGS. 7
and 8. In addition, about the structure similar to 1st Embodiment, the same code | symbol may
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23
be attached | subjected and description may be abbreviate | omitted.
[0081]
FIG. 7 is a perspective view of an example of an ultrasonic transducer 40 that the ultrasonic
probe according to the second embodiment has. FIG. 8 is a cross-sectional view of the ultrasonic
transducer 40 taken along the line B-B in FIG. In the example of FIG. 7, the ultrasonic transducer
40 is schematically shown, and the flexible wiring board 25 and the substrate 26 are omitted.
[0082]
As shown in the example of FIG. 7, the second embodiment is different from the first embodiment
in that a plurality of ultrasonic transducers 21 are two-dimensionally arranged.
[0083]
Here, the method of manufacturing an ultrasonic probe according to the second embodiment is
substantially the same as the method of manufacturing an ultrasonic probe according to the first
embodiment, but in step 2, the laminated body 31 described above is diced or the like. It differs
from the first embodiment in that the plurality of ultrasonic transducers 21 are twodimensionally formed on the back load member 24 by forming the grooves in a lattice shape.
Here, in the second embodiment, the depth of the groove formed by dicing is substantially the
same as that of the first embodiment, but since the grooves are formed in a grid shape by dicing,
the ground electrode on the back side is formed. Since 21 b can not be separated, the depth of
the groove is other than when the ground electrode 21 b is separated. Therefore, according to
the ultrasonic probe according to the second embodiment and the ultrasonic probe
manufacturing method according to the second embodiment, the same effect as that of the first
embodiment can be obtained.
[0084]
Further, as shown in the example of FIG. 8, in the second embodiment, the plurality of ultrasonic
transducers 21 arranged in a two-dimensional manner are divided into a plurality of blocks, and
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24
the ultrasonic transducer 40 is divided into blocks. This embodiment differs from the first
embodiment in that it has modules 41a and 41b provided with an ultrasonic transducer 21, an
acoustic matching layer 22, a conductive adhesive 23, a back load member 24, a flexible wiring
board 25 and a substrate 26. The acoustic lens 27 is shared by the plurality of modules 41a and
41b. Although FIG. 8 shows the case where the ultrasonic transducer 40 has two modules 41a
and 41b, the number of modules is not limited to this, and three or more modules may be used.
[0085]
As the flexible wiring board 25 according to the second embodiment, the configuration using the
above-mentioned double-sided FPC is adopted because it is necessary to wire the ultrasonic
transducer 21 (central part element) in the central part. For example, the through holes are twodimensionally arranged, and the wiring of the ultrasonic transducer 21 at the central portion
passes by the fine wiring between the through holes.
[0086]
The bonding between the modules 41a and 41b is performed by aligning the positions of the
ultrasonic transducers 21 in a two-dimensional manner (radial direction, array direction) and
pressing and bonding them in the module stacking direction. The radiation direction corresponds
to the AZ (AZimuth) direction, and the array direction corresponds to the EL (Elevation) direction.
At this time, the stability of the thickness of the side structure (flexible wiring board 25 and
wiring pattern 25a) of the module becomes important. If the thickness is not stable, the position
of the ultrasonic transducer 21 can not be accurately reflected in the delay control. According to
the ultrasonic probe according to the second embodiment, since the structure is simple, the
stability of the thickness is high.
[0087]
As shown in the example of FIG. 8, the plurality of modules 41a and 41b are arranged in parallel.
The distance between adjacent ultrasonic transducers 21 in the same module is L1, and the
distance between adjacent ultrasonic transducers 21 between adjacent modules 41a and 41b is
L2. That is, the intra-module element pitch is L1 and the inter-module element pitch is L2.
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[0088]
Here, it is also conceivable to configure the ultrasonic probe as follows. FIG. 9 is a view showing
an example of the configuration of an ultrasonic transducer 50 of a possible ultrasonic probe.
[0089]
As shown in the example of FIG. 9, the ultrasonic transducer 50 has two modules 50a and 50b.
Each of the modules 50a and 50b includes a plurality of ultrasonic transducers 51, an acoustic
matching layer 52, a back load member 53, flexible wiring boards 54 and 55, a substrate 56, and
an acoustic lens 57.
[0090]
A first electrode 51 a is provided on the surface of the ultrasonic transducer 51 on the side
where ultrasonic waves are emitted. A second electrode 51b is provided on the surface of the
ultrasonic transducer 51 opposite to the surface on which the ultrasonic waves are emitted.
Further, a back load member 53 is provided on the opposite side of the surface of the ultrasonic
transducer 51 on which the ultrasonic waves are emitted.
[0091]
The plurality of ultrasonic transducers 51 are two-dimensionally arranged. The ultrasonic
transducer 51 is driven by a drive signal from a transmission / reception circuit 56a described
later, and emits an ultrasonic wave from the surface on the first electrode 51a side. Further,
when receiving the reflected wave, the ultrasonic transducer 51 converts the received reflected
wave into a reflected wave signal, and outputs the converted reflected wave signal from the
second electrode 51b.
[0092]
The first electrode 51 a is connected to the acoustic matching layer 52. The second electrode 51
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b is connected to a wiring pattern (not shown) provided on the flexible wiring board 55. Thereby,
the second electrode 51 b and the transmission / reception circuit 56 a described later are
electrically connected via the flexible wiring board 55.
[0093]
An acoustic matching layer 52 is provided on the surface of the first electrode 51a opposite to
the second electrode 51b. The acoustic matching layer 52 is at least one acoustic matching layer.
The acoustic matching layer 52 is made of a conductive material. The surface of the acoustic
matching layer 52 opposite to the ultrasonic transducer 51 is connected to a wiring pattern (not
shown) provided on the flexible wiring board 54. Thereby, the first electrode 51a and the
transmission / reception circuit 56a described later are electrically connected via the acoustic
matching layer 52 and the flexible wiring board 54.
[0094]
The substrate 56 has a transmission / reception circuit 56a. The transmission / reception circuit
56 a is connected to a wiring pattern (not shown) provided on the substrate 56. The wiring
pattern connected to the transmission / reception circuit 56 a is electrically connected to the
wiring pattern of the flexible wiring board 55. Furthermore, the wiring pattern connected to the
transmission / reception circuit 56 a is also electrically connected to the wiring pattern of the
flexible wiring board 56. Therefore, the transmission / reception circuit 56a is electrically
connected to the first electrode 51a and the second electrode 51b.
[0095]
The acoustic lens 57 is shared by the plurality of modules 50a and 50b.
[0096]
In the ultrasonic transducer 50 shown in the example of FIG. 9, the distance between adjacent
ultrasonic transducers 51 in the same module is L3, and the distance between adjacent ultrasonic
transducers 51 between adjacent modules 50a and 50b is L4. Do.
[0097]
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27
The magnitudes of the above-described distance L1 in the ultrasonic transducer 40 according to
the second embodiment shown in the example of FIG. 8 and the distance L3 in the ultrasonic
transducer 50 of the conceivable ultrasonic probe do not substantially change.
However, the above-mentioned interval L2 in the ultrasonic transducer 40 according to the
second embodiment shown in the example of FIG. 8 is shorter than the interval L4 in the
ultrasonic transducer 50.
[0098]
Here, the reason why the interval L2 is shorter than the interval L4 will be described.
In the ultrasonic transducer 50, as many as four flexible wiring boards exist between the
ultrasonic transducers 51 adjacent between the modules 50a and 50b. On the other hand, in the
ultrasonic transducer 40, only two flexible wiring boards exist between the ultrasonic
transducers 21 adjacent between the modules 41a and 41b, and the thickness of the conductive
bonding portion 28 is several tens of μm to 100 μm. It can be ignored. For these reasons, the
interval L2 is shorter than the interval L4.
[0099]
As the spacing between adjacent ultrasonic transducers between modules increases, grating
lobes are more likely to occur. If grating lobes are generated, artifacts and the like may be
generated in the ultrasonic image generated by the apparatus main body of the ultrasonic
diagnostic apparatus, and the image quality of the ultrasonic image may be degraded. Therefore,
according to the ultrasonic probe according to the second embodiment, the distance between the
ultrasonic transducers adjacent to each other between the modules is short as compared with the
ultrasonic probe having the ultrasonic transducer 50 shown in the example of FIG. The
generation of grating lobes can be suppressed. Therefore, according to the ultrasonic probe
according to the second embodiment, it is possible to suppress the deterioration of the image
quality of the ultrasonic image.
[0100]
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28
In addition, as the distance between adjacent ultrasonic transducers in the modules increases, the
focusing performance in the EL direction is degraded. Therefore, according to the ultrasonic
probe according to the second embodiment, it is possible to suppress a decrease in focusing
performance in the EL direction as compared with the ultrasonic probe having the ultrasonic
transducer 50 shown in the example of FIG.
[0101]
Moreover, it is also conceivable to configure the ultrasonic probe as follows. FIG. 10 is a view
showing the configuration of an ultrasonic transducer 60 of another possible ultrasonic probe.
[0102]
As shown in the example of FIG. 10, the ultrasonic transducer 60 has two modules 60a and 60b.
Each of the modules 60a and 60b includes a plurality of ultrasonic transducers 61, an acoustic
matching layer 62, a back load member 63, flexible wiring boards 64 and 65, a substrate 66, and
an acoustic lens 67.
[0103]
A ground electrode 61 a is provided on the surface of the ultrasonic transducer 61 on the side
where ultrasonic waves are emitted. A signal electrode 61 b is provided on the surface of the
ultrasonic transducer 61 opposite to the surface on which the ultrasonic waves are emitted. In
addition, a back load member 63 is provided on the opposite side of the surface of the ultrasonic
transducer 61 on which the ultrasonic waves are emitted.
[0104]
The plurality of ultrasonic transducers 61 are driven by a drive signal from a transmission /
reception circuit 66a described later, and emit ultrasonic waves from the surface on the ground
electrode 61a side. Further, when receiving the reflected wave, the plurality of ultrasonic
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transducers 61 convert the received reflected wave into a reflected wave signal, and output the
converted reflected wave signal from the signal electrode 61 b.
[0105]
The ground electrode 61 a is connected to the acoustic matching layer 62. The signal electrode
61 b is connected to a wiring pattern (not shown) provided on the flexible wiring board 65.
Thereby, the signal electrode 61 b and the transmission / reception circuit 66 a described later
are electrically connected via the flexible wiring board 65.
[0106]
An acoustic matching layer 62 is provided on the surface of the ground electrode 61a opposite to
the signal electrode 61b. The acoustic matching layer 62 is at least one acoustic matching layer.
In addition, the acoustic matching layer 62 is made of a conductive material. The surface of the
acoustic matching layer 62 opposite to the ultrasonic transducer 61 side is connected to a wiring
pattern (not shown) provided on the flexible wiring board 64. The flexible wiring board 64 is
bent so as to be substantially parallel to the side surface of the back load member 63. A wiring
pattern (not shown) provided on the flexible wiring board 64 is connected to a wiring pattern
(not shown) provided on the flexible wiring board 65 by the conductive bonding portion 64 a. As
a result, the ground electrode 61a and the transmission / reception circuit 66a described later
are electrically connected via the acoustic matching layer 62, the flexible wiring board 64, and
the flexible wiring board 65.
[0107]
The substrate 66 has a plurality of transmission / reception circuits 66a. The transmission /
reception circuit 66 a is connected to a wiring pattern (not shown) provided on the substrate 66.
The wiring pattern connected to the transmission / reception circuit 66 a is electrically
connected to the wiring pattern of the flexible wiring board 65. Therefore, each of the plurality of
ultrasonic transducers 61 is electrically connected to one of the transmission / reception circuits
66a.
[0108]
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30
The acoustic lens 67 is shared by the plurality of modules 60a and 60b.
[0109]
In the ultrasonic transducer 60 shown in the example of FIG. 10, the distance between adjacent
ultrasonic transducers 61 in the same module is L5, and the distance between adjacent ultrasonic
transducers 61 between adjacent modules 60a and 60b is L6. Do.
[0110]
The size of the above-mentioned interval L1 in the ultrasonic transducer 40 according to the
second embodiment shown in the example of FIG. 8 and the interval L5 in the ultrasonic
transducer 60 of the conceivable ultrasonic probe do not substantially change.
However, the above-mentioned interval L2 in the ultrasonic transducer 40 according to the
second embodiment shown in the example of FIG. 8 is the same as the reason described above
for the relationship between the interval L4 and the interval L2. Shorter than the interval L6 in
Therefore, according to the ultrasonic probe according to the second embodiment, as compared
with the ultrasonic probe having the ultrasonic transducer 60 shown in the example of FIG. The
generation of grating lobes can be suppressed. Therefore, according to the ultrasonic probe
according to the second embodiment, it is possible to suppress the deterioration of the image
quality of the ultrasonic image.
[0111]
In addition, according to the ultrasonic probe according to the second embodiment, it is possible
to suppress a decrease in focusing performance in the EL direction, as compared with the
ultrasonic probe having the ultrasonic transducer 60 shown in the example of FIG.
[0112]
The ultrasonic probe according to the second embodiment and the ultrasonic probe
manufacturing method according to the second embodiment have been described above.
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31
As described above, according to the ultrasonic probe according to the second embodiment and
the ultrasonic probe manufacturing method according to the second embodiment, the same
effect as that of the first embodiment can be obtained.
[0113]
Moreover, according to the ultrasonic probe according to the second embodiment, the generation
of grating lobes can be suppressed. Moreover, according to the ultrasound probe which concerns
on 2nd Embodiment, deterioration of the image quality of an ultrasound image can be
suppressed. Moreover, according to the ultrasonic probe according to the second embodiment, it
is possible to suppress the decrease in focus performance in the EL direction.
[0114]
According to the ultrasonic probe and the ultrasonic probe manufacturing method of at least one
embodiment described above, it can be manufactured easily.
[0115]
While certain embodiments of the present invention have been described, these embodiments
have been presented by way of example only, and are not intended to limit the scope of the
invention.
These embodiments can be implemented in other various forms, and various omissions,
replacements, and modifications can be made without departing from the scope of the invention.
These embodiments and modifications thereof are included in the invention described in the
claims and the equivalents thereof as well as included in the scope and the gist of the invention.
[0116]
Reference Signs List 1 ultrasonic probe 20 ultrasonic transducer 21 ultrasonic transducer 21a
signal electrode 21b ground electrode 22 acoustic matching layer 23, 28 conductive bonding
portion 24 back load material 25 flexible wiring board 25a wiring pattern 26a transmission /
reception circuit
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