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DESCRIPTION JP2016508048

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DESCRIPTION JP2016508048
A transducer assembly is provided. The transducer assembly includes a flex circuit. The
transducer assembly also includes a first substrate that includes a piezoelectric micromachined
ultrasound transducer (PMUT). The transducer assembly further includes a second substrate that
includes an integrated circuit (IC) device. At least one of the first substrate and the second
substrate is coupled to the flex circuit via wire bonding or flip chip.
Transducer assembly for an imaging device
[0001]
The present invention relates generally to ultrasound imaging, and more particularly to a
piezoelectric micromachined ultrasound transducer (PMUT) assembly.
[0002]
Intravascular ultrasound (IVUS) imaging, in interventional cardiology, evaluates blood vessels
such as arteries in the human body to determine if treatment is necessary, guides interventions,
and / or their effectiveness. It is widely used as a diagnostic tool to evaluate.
Intravascular ultrasound (IVUS) imaging systems use ultrasound echoes to form cross-sectional
images of a blood vessel of interest. Generally, IVUS imaging uses transducers on an IVUS
catheter that emit ultrasound signals (waves) and receive ultrasound reflection signals. The
emitted ultrasound signals (sometimes referred to as ultrasound pulses) pass easily through most
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tissues and blood, but tissue structures (such as various layers of blood vessel walls), red blood
cells and other features of interest Part of the change in impedance caused by the part is
reflected. The IVUS imaging system, coupled to the IVUS catheter at the patient interface module,
processes the received ultrasound signals (sometimes referred to as ultrasound echoes) to
produce a cross-sectional image of the blood vessel where the IVUS catheter was located Do.
[0003]
IVUS catheters generally use one or more transducers to transmit ultrasound signals and receive
reflected ultrasound signals. However, conventional methods and apparatus for providing a
transducer assembly may be limited and less flexible. Thus, while conventional methods and
apparatus for providing a transducer assembly are generally appropriate for their intended
purpose, they have not been completely satisfactory in all respects.
[0004]
U.S. Pat. No. 5,243,988 U.S. Pat. No. 5,546,948 U.S. Provisional Patent Application No. 61 /
745,091 U.S. Provisional Patent Application No. 61 / 745,212 U.S. Provisional Patent Application
No. 61 / 646,080 U.S. Provisional Patent Application No. 61 / 646,074 U.S. Provisional Patent
Application No. 61 / 646,062
[0005]
It is an object of the present invention to provide a transducer assembly for an imaging device
that overcomes the problems of the prior art.
[0006]
Ultrasound transducers are used in intravascular ultrasound (IVUS) imaging to help assess health
status in the human body.
Ultrasonic transducers are implemented as part of a transducer assembly that may also include
integrated circuit (IC) devices.
The present invention is directed to various types of transducer assemblies that improve the
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flexibility and versatility that conventional transducer assemblies lack. In various instances,
ultrasonic transducers, which are the IC devices of the transducer assembly of the present
invention, are mounted on separate substrates and electrically interconnected via flex circuits,
wire bonds, flip chip bonding, or soldering or welding. Be done.
[0007]
According to one aspect of the invention, a transducer assembly includes a flex circuit, a first
substrate including a piezoelectric micromachined ultrasonic transducer (PMUT), and a second
substrate including an integrated circuit (IC) device, A transducer assembly is provided in which
at least one of the first and second substrates is coupled to the flex circuit via wire bonding.
[0008]
According to another aspect of the invention, a transducer assembly includes a flex circuit, a first
substrate including a piezoelectric micromachined ultrasonic transducer (PMUT), and a second
substrate including an integrated circuit (IC) device. A transducer assembly is provided, wherein
at least one of the first and second substrates is coupled to the flex circuit via a flip chip.
[0009]
According to another aspect of the present invention, a transducer assembly includes a support
substrate, a first substrate including a piezoelectric micromachined ultrasonic transducer
(PMUT), and a second substrate including an integrated circuit (IC) device. A transducer assembly
is provided, wherein the first and second substrates are each coupled to the support substrate,
and the first and second substrates are electrically interconnected via wire bonding.
[0010]
The foregoing general description and the following detailed description are exemplary and
explanatory in nature and are intended to provide an understanding of the invention without
limiting the scope of the invention.
In this regard, additional aspects, features and advantages herein will be apparent to those skilled
in the art from the following detailed description.
[0011]
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A transducer assembly for an imaging device that overcomes the problems of the prior art is
provided.
[0012]
FIG. 1 is a schematic representation of an intravascular ultrasound (IVUS) imaging system in
accordance with various aspects of the present invention.
FIG. 2 is various schematic views of the plane and cross-section of different embodiments of a
transducer assembly in accordance with various aspects of the present invention.
FIG. 3 is various schematic views of the plane and cross-section of different embodiments of a
transducer assembly in accordance with various aspects of the present invention.
FIG. 4 is various schematic views of the plane and cross-section of different embodiments of a
transducer assembly in accordance with various aspects of the present invention. FIG. 5 is
various schematic views of the plane and cross-section of different embodiments of a transducer
assembly in accordance with various aspects of the present invention. FIG. 6 is various schematic
views of the plane and cross-section of different embodiments of a transducer assembly in
accordance with various aspects of the present invention. FIG. 7 is various schematic views of the
plane and cross-section of different embodiments of a transducer assembly in accordance with
various aspects of the present invention. FIG. 8A is a schematic representation of various planes
and cross sections of different embodiments of a transducer assembly in accordance with various
aspects of the invention. FIG. 8B is various schematic views of the plane and cross section of
different embodiments of a transducer assembly in accordance with various aspects of the
present invention. FIG. 8C is various schematic views of the plane and cross-section of different
embodiments of a transducer assembly in accordance with various aspects of the present
invention. FIG. 8D is a schematic representation of various planes and cross-sections of different
embodiments of a transducer assembly in accordance with various aspects of the present
invention. FIG. 9A is various schematic views of the plane and cross-section of different
embodiments of a transducer assembly in accordance with various aspects of the present
invention. FIG. 9B is various schematic views of the plane and cross-section of different
embodiments of a transducer assembly in accordance with various aspects of the present
invention. FIG. 9C is various schematic views of the plane and cross section of different
embodiments of a transducer assembly in accordance with various aspects of the present
invention. FIG. 9D is a schematic representation of various planes and cross-sections of different
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embodiments of a transducer assembly in accordance with various aspects of the present
invention. FIG. 10A is a perspective view of one embodiment of a transducer assembly in
accordance with various aspects of the present invention. FIG. 10B is a perspective view of one
embodiment of a transducer assembly in accordance with various aspects of the present
invention. FIG. 10C is a perspective view of one embodiment of a transducer assembly in
accordance with various aspects of the present invention. FIG. 11 is a cross-sectional view of yet
another embodiment of a transducer assembly.
[0013]
For the purpose of promoting an understanding of the principles of the present invention,
reference will now be made to the illustrated embodiments and specific language will be used to
describe the present invention, but the present invention is not intended to be limited thereto.
Modifications and further modifications of the devices, systems, methods described herein, and
further applications of the principles disclosed herein, are fully contemplated as would normally
occur to one of ordinary skill in the art to which this invention pertains. Shall be included. For
example, while the present invention provides an ultrasound imaging system described for
intravascular imaging, such description is not intended to limit the application, and such imaging
system is for imaging throughout the entire human body. It should be understood that it can be
used for In one embodiment, the illustrated ultrasound imaging system is a side-viewing
intravascular imaging system, although transducers formed in accordance with the present
invention may be mounted in other directions, including forward looking. The imaging system is
equally suitable for any application where imaging in a small cavity is required. In particular, it is
fully contemplated that features, components and / or steps described for one embodiment may
be combined with features, components and / or steps described for another embodiment of the
invention. However, for the sake of brevity, these many combinations are not repeated
separately.
[0014]
Today, mainly two types of catheters are in common use: solid-state and rotary catheters. One
example of a solid state catheter uses a transducer array (typically 64) distributed around the
circumference of the catheter and connected to an electronic multiplexer circuit. An electronic
multiplexer circuit selects an transducer from the transducer array that transmits the ultrasound
signal and receives the reflected ultrasound signal. Solid state catheters can combine the effects
of mechanically scanned transducer elements without moving parts by stepping through a
sequence of transducer pairs for transmission and reception. The absence of rotational
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mechanical elements allows the transducer array to be placed in direct contact with blood and
vascular tissue with minimal risk of vascular trauma, solid-state scanners with simple electrical
cables and standard The removable electrical connector allows direct wire connection to the
imaging system.
[0015]
One example of a rotary catheter includes a single transducer positioned at the distal end of a
flexible drive shaft that pivots within a sheath that has passed through the blood vessel of
interest. The transducer is typically oriented so that the ultrasound signal diffuses at a generally
right angle to the axis of the catheter. In a typical rotary catheter, a fluid-filled (e.g., saline-filled)
sheath protects the vascular tissue from the pivoting transducer and drive shaft while free
diffusion of ultrasound signals from the transducer into the tissue And allow its return. As the
drive shaft rotates (e.g., 30 revolutions per second), the transducer is periodically excited with
high voltage pulses to emit short bursts of ultrasound. An ultrasonic signal is emitted from the
transducer and penetrates the fluid-filled sheath and sheath wall in a direction generally
perpendicular to the rotational axis of the drive shaft. The transducer then receives ultrasound
signals that are reflected back from the various tissue structures, and the imaging system can
generate blood vessels from one of the hundreds of these ultrasound pulse / echo capture
sequences that occur during one revolution of the transducer. Assemble a 2D image of the cross
section
[0016]
FIG. 1 is a schematic illustration of an ultrasound imaging system 100 in accordance with various
aspects of the present invention. In one embodiment, the ultrasound imaging system 100
includes an intravascular ultrasound imaging system (IVUS). The IVUS imaging system 100
includes an IVUS catheter 102 coupled to an IVUS control system 106 by a patient interface
module (PIM) 104. The IVUS control system 106 is coupled to a monitor 108 that displays an
IVUS image (an image generated by the IVUS system 100).
[0017]
In one embodiment, the IVUS catheter 102 is a Revolution® Rotational IVUS Imaging Catheter
available from Volcano, Inc., and / or US Pat. No. 5, which is incorporated herein by reference in
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its entirety. , 243, 988 and US Pat. No. 5,546, 948 may be similar to rotational IVUS catheters.
The IVUS catheter 102 includes an elongated, flexible catheter sheath 110 (having a proximal
end portion 114 and a distal end portion 116) that has a shape and configuration for insertion
into the lumen of a blood vessel (not shown). The longitudinal axis LA of the IVUS catheter 102
extends between the proximal end portion 114 and the distal end portion 116. The IVUS catheter
102 may be flexible such that it can conform to the curve of the blood vessel during use. In this
regard, the curved form illustrated in FIG. 1 is for illustrative purposes and is not intended to
limit the curved aspect of the IVUS catheter 102 in other embodiments. In general, the IVUS
catheter 102 may have a configuration that takes on the desired straight or arcuate contour
when in use.
[0018]
A rotating imaging core 112 distracts within the sheath 110. Imaging core 112 has a proximal
end portion 118 disposed within proximal end portion 114 of sheath 110 and a distal end
portion 120 disposed within distal end portion 116 of sheath 110. The distal end portion 116 of
the sheath 110 and the distal end portion 120 of the imaging core 112 are threaded into the
blood vessel of interest during operation of the IVUS imaging system 100. The effective length of
the IVUS catheter 102 (e.g., of the patient, particularly of the portion that can be threaded into
the blood vessel of interest) may be any suitable length and may be varied depending on the
application. The proximal end portion 114 of the sheath 110 and the proximal end portion 118
of the imaging core 112 are coupled to the interface module 104. The proximal end portions
114, 118 are fitted with a catheter hub 124 removably coupled to the interface module 104. The
catheter hub 124 supports and supports a rotational interface that electrically and mechanically
couples between the IVUS catheter 102 and the interface module 104.
[0019]
Distal end portion 120 of imaging core 112 includes a transducer assembly 122. Transducer
assembly 122 is configured to rotate (using a motor or other rotating device) to obtain an image
of a blood vessel. The transducer assembly 122 can be of any suitable type that visualizes a
blood vessel, in particular a stenosis of the blood vessel. In the illustrated embodiment,
transducer assembly 122 includes a piezoelectric micromachined ultrasonic transducer ("PMUT"
transducer) and associated circuitry, such as an application specific integrated circuit (ASIC). An
example of a PMUT for use in an IVUS catheter may include a polymeric piezoelectric film such
as that described in US Pat. No. 6,641,540, which is incorporated herein by reference in its
entirety. . The PMUT transducer can provide a bandwidth of 100% or more for optimal resolution
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in the radial direction and spherically-focused holes for optimal resolution in the azimuth and
slice directions.
[0020]
Transducer assembly 122 also includes a housing having a PMUT transducer and associated
circuitry disposed therein, the housing having an opening through which the ultrasonic signal
generated by the PMUT transducer is transmitted. In yet another embodiment, transducer
assembly 122 includes an ultrasonic transducer array (e.g., an array having 16, 32, 64 or 128
elements is used in some embodiments).
[0021]
The rotation of the imaging core 112 within the sheath 110 is controlled by an interface module
104 that provides user operable control of the user interface. Interface module 104 can receive,
analyze, and / or display information received via imaging core 112. Any suitable functionality,
control, information processing and analysis, and display can be incorporated into interface
module 104. In one example, interface module 104 receives data corresponding to the
ultrasound signal (echo) detected by imaging core 112 and transfers it to control system 106. In
one example, interface module 104 performs preprocessing of echo data prior to transfer to
control system 106. Interface module 104 may perform amplification, filtering, and / or
aggregation of echo data. The interface module 104 can also provide high and low direct current
(DC) voltages that support operation of the catheter 102, including circuitry within the
transducer assembly 122.
[0022]
In one embodiment, the wires associated with IVUS imaging system 100 may be extended from
control system 106 to interface module 104 such that signals from control system 106 may be
communicated to interface module 104 and / or vice versa. In one embodiment, control system
106 is in wireless communication with interface module 104. Similarly, in one embodiment, the
wire associated with IVUS imaging system 100 may be extended from control system 106 to
monitor 108 so that signals from control system 106 may be communicated to monitor 108 and
/ or vice versa. In one embodiment, control system 106 is in wireless communication with
monitor 108.
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[0023]
As mentioned above, transducer assembly 122 includes miniature ultrasound transducers and
associated electronics. The transducers and circuitry may be formed separately and then
electrically interconnected as part of a transducer assembly 122. Details of several different
embodiments of the transducer assembly 122 in accordance with various aspects of the present
invention are described below.
[0024]
A simplified top view of one embodiment of a transducer assembly 122A of the present invention
is shown in FIG. Transducer assembly 122 A includes microcomponent 200 and microcomponent
201. In the illustrated embodiment, microcomponents 200 and 201 include microsubstrates,
which may be referred to as such. These micro substrates may have a thickness of miniature
dimensions, for example, a thickness in the range of about 75 μm to about 600 μm. In another
embodiment, the microcomponents 200, 201 may include dies or other miniature devices
suitable for growth or placement of microelectronic devices.
[0025]
An ultrasonic transducer 210 is formed on the micro substrate 200. The ultrasound transducer
210 is suitable for intravascular imaging because of its small size and high resolution. In one
embodiment, the ultrasound transducer 210 has a size on the order of tens or hundreds of
microns and can operate in a frequency range between about 1 megahertz (MHz) and about 135
MHz, with a depth of at least 10 mm (mm) Can provide 50 submicron resolution while still
providing In addition, the ultrasound transducer 210 defines a target focusing area based on the
deflection depth of the transducer aperture by the developer, thereby providing an image over
surface features that is useful in defining vessel morphology. It is also shaped in such a way that
it can be produced. In the illustrated embodiment, the ultrasound transducer 210 is a
piezoelectric micromachined ultrasound transducer (PMUT). In other embodiments, ultrasound
transducer 210 may include other types of transducers. Additional details of the ultrasound
transducer 210 are all submitted by Dylan Van Hoven on Dec. 21, the entire content of which is
incorporated herein by reference, "Preparation and Application of a Piezoelectric Film. U.S.
Provisional Patent Application No. 61 / 745,091 entitled "An anit Transducer", Atny Docket No.
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44755.1060, and Atny Docket No. 44755.1061, entitled "Method and Apparatus for Focusing
Miniature Ultrasound Transducer" No. 61 / 745,212. Because the transducer 210 is a microelectro-mechanical system (MEMS) device, the substrate 200 may also be referred to as a MEMS
substrate.
[0026]
The micro substrate 201 includes microelectronic circuitry to control the transducer 210 and to
interact with the transducer 210. In the illustrated embodiment, such microelectronic circuits are
implemented in an application specific integrated circuit (ASIC) 220 such that micro substrate
201 acts as a substrate for this ASIC 220. The ASIC 220 may be electrically connected to the
micro substrate 201 via the conductive pad 230. In another embodiment, the micro substrate
201 itself may be an integrated circuit (IC) chip.
[0027]
In the embodiment of FIG. 2, the substrate 200 including the transducer 210 is electrically and
mechanically coupled to the substrate 201 including the ASIC 220 via wire bonding. Specifically,
opposite distal ends of the wire bond (or bond wire) 225 are attached to the bonding pad 230 on
the substrate 200 and the bonding pad 231 on the substrate 201. In one embodiment, bonding
pads 230, 231 are smaller than about 60 μm × 60 μm. Wirebonds 225 may be electrically
conductive to establish electrical communication between transducer 210 and ASIC 220. In other
words, ASIC 220 may send an electrical signal to transducer 210 and / or receive an electrical
signal from transducer 210 to control transducer 210 and interact with transducer 210. The
wire bond 225 has some flexibility and can move, rotate or shift the substrates 200 and 201
relatively to some extent. In one embodiment, the bonding loop is less than about 300 μm in
height. In one embodiment, wire bonding is performed at a temperature less than 70 ° C. so as
not to overheat the transducer 210 or ASIC 220.
[0028]
3A-3B are simplified views of the plane and cross-section of a transducer assembly 122B in
accordance with another embodiment of the present invention. Transducer assembly 122B in the
embodiment shown in FIGS. 3A-3B is similar to transducer assembly 122A in the embodiment
shown in FIG. Accordingly, similar components in these two embodiments are appended with the
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same numbers for consistency and clarity.
[0029]
Specifically, transducer assembly 122 B also includes substrate 200 (with transducer 210)
secured to substrate 201 (with ASIC 220) via wirebond 225. However, support substrate 240
(also referred to as support backing component) is attached to substrates 200 and 201. As
shown in FIG. 3B, the support substrate 240 supports the bottom side of the substrates 200, 201.
In other words, the substrates 201 and 200 are disposed over or on the support substrate 240.
The support substrate 240 provides mechanical strength and support for the substrates 200 and
201 disposed thereon.
[0030]
In one embodiment, the support substrate 240 may be formed with an opening or hole that
exposes the transducer 210. For example, FIG. 4B illustrates a bottom view of the transducer
assembly 122 B, wherein an opening 260 (or hole) is formed behind the transducer 210 on the
back side of the support substrate 240. 4A is also shown side by side in FIG. 4B, and FIG. 4A
shows a simplified plan view of transducer assembly 122B, which illustrates the positional
position of the opening 260 with respect to the transducer 210. In one embodiment, the support
substrate 240 is a continuous piece that does not form an opening or hole.
[0031]
FIG. 5 is a simplified cross-sectional view of another embodiment of a transducer assembly 122C
of the present invention. Due to the similarity between the transducer assembly 122C of FIG. 5
and the transducer assembly 122A shown in FIG. 2, similar components in these two
embodiments will be numbered the same.
[0032]
In particular, the transducer assembly 122C is coupled to the substrate 200 (having a transducer
210 not shown in FIG. 5) coupled to the substrate 201 (having a simplified ASIC 220 not shown
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in FIG. 5) via flip chip bonding. Also included. Conductive bonding pad 270 of substrate 200 is
coupled to conductive bonding pad 271 of substrate 201. Electrical communication can be
established between the transducer on substrate 200 and the ASIC on substrate 201 via bonding
pads 270, 271. Bonded bonding pads 270, 271 mechanically hold the substrates 200, 201
together as well.
[0033]
A simplified cross-sectional view of another embodiment of a transducer assembly 122D of the
present invention is shown in FIG. Due to the similarity between the transducer assembly 122D
of FIG. 6 and the transducer assembly 122A shown in FIG. 2, similar components in these two
embodiments are numbered the same.
[0034]
In particular, transducer assembly 122D includes substrate 201 (with ASIC 220 not shown in
FIG. 6), as well as substrate 200 (with a transducer 210 not shown in FIG. 6 for simplification).
The substrate 200 includes conductive bonding pads 280, and the substrate 201 includes
conductive bonding pads 281 and 282. The substrates 200 and 201 are coupled to the flex
circuit 300 through flip chip bonding via the bonding pads 280-282. In particular, flex circuit
300 includes conductive bonding pads 310-312 which bond bonding pads 280-282 respectively
thereto. The flex circuit 300 is flexible and can be bent or "flexed" to conform to the desired
shape. Flex circuit 300 may itself include microelectronic components and electrical routing such
as associated bias and metal lines (not shown for simplicity). Electrical communication may be
established between the transducer on substrate 200 and the ASIC on substrate 201 via flex
circuit 300.
[0035]
Referring to FIG. 7, a simplified cross-sectional view of another embodiment of a transducer
assembly 122E of the present invention is shown. Due to the similarity between the transducer
assembly 122E of FIG. 7 and the transducer assembly 122A shown in FIG. 2, similar components
in these two embodiments are numbered the same.
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[0036]
In particular, the transducer assembly 122E includes not only the substrate 200 (with the
transducer 210 not shown in FIG. 7 for simplification) but also the substrate 201 (having an ASIC
220 not shown in FIG. 7 for simplification). The substrate 200 includes conductive bonding pads
320, and the substrate 201 includes conductive bonding pads 321 and 322. The substrates 200
and 201 are coupled to the flex circuit 300 via the bonding pads 320-322. In particular, flex
circuit 300 includes conductive bonding pads 330-332 that couple bonding pads 320-322,
respectively. In the illustrated embodiment, substrate 200 is coupled to bonding pads 330 of flex
circuit 300 via wire bonds 340 (or bond wires), and substrate 201 is coupled to bonding pads
331-332 of flex circuit 300 via flip chip technology. Ru. In one alternative, the substrate 200
may be coupled to the flex circuit 300 via flip chip, and the substrate 201 may be coupled to the
flex circuit 300 via wire bonding. In yet another embodiment, the substrate 200 and the
substrate 201 can both be coupled to the flex circuit 300 via wire bonding.
[0037]
Again, the flex circuit 300 is flexible and can be bent or "flexed" to conform to the desired shape.
Flex circuit 300 may itself include microelectronic components and electrical routing such as
associated bias and metal lines (not shown for simplicity). Electrical communication may be
established between the transducer on substrate 200 and the ASIC on substrate 201 via flex
circuit 300.
[0038]
8A-8D and 9A-9D are simplified illustrations of various embodiments of the transducer assembly,
some of which may be similar to those described above with reference to FIGS. 1-7. Crosssectional view is illustrated. Due to the similarity between the transducer assemblies illustrated in
FIGS. 8A-8D and 9A-9D and the transducer assemblies shown in FIGS. 1-7, like components are
appended with the same numbers for consistency and clarity. Be done.
[0039]
In the embodiment shown in FIG. 8A, the substrates 200 and 201 are connected to each other
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through wire bonding. In the embodiment shown in FIG. 8B, the substrates 200 and 201 are
connected to each other via wire bonding, and the substrate 201 is also connected to the flex
circuit 300 via flip chip. In the embodiment shown in FIG. 8C, the substrate 200 is connected to
the flex circuit 300 via wire bonding, and the substrate 201 is connected to the flex circuit via
flip chip. Flex circuit 300 does not provide support to substrate 200 in this embodiment. In the
embodiment shown in FIG. 8D, the substrate 200 is connected to the flex circuit 300 via wire
bonding, and the substrate 201 is connected to the flex circuit via flip chip. Flex circuit 300
provides support to substrate 200 in this embodiment.
[0040]
In the embodiment shown in FIG. 9A, the substrates 200 and 201 are connected to each other via
flip chips. In the embodiment shown in FIG. 9B, substrates 200 and 201 are both connected to
flex circuit 300 via flip chips. In the embodiment shown in FIG. 9C, the substrates 200 and 201
are connected to each other via wire bonding, and both substrates are supported by the support
substrate 240. In the present embodiment, the support substrate 240 has no through hole. In the
embodiment shown in FIG. 9D, the substrates 200 and 201 are connected to each other via wire
bonding, and both substrates are supported by the support substrate 240. In the present
embodiment, the support substrate 240 has a through hole.
[0041]
10A, 10B, and 10C illustrate perspective views from different angles of the transducer assembly
122F in another aspect according to various aspects of the present invention. Due to the
similarity between the transducer assembly 122F shown in FIGS. 10A-10C and the transducer
assembly 122A shown in FIG. 2, similar components are numbered the same.
[0042]
Specifically, the transducer assembly 122F includes not only the substrate 210 but also the
substrate 201 (having an ASIC 220 not shown in simplified fashion in FIG. 7). The substrates
200, 201 are electrically interconnected via wire bonding, ie, wire bonds 225. As shown in FIGS.
10B and 10C, a hole or opening 350 is also formed on the back side that exposes the transducer
210. The holes or openings 350 may also be referred to as wells.
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[0043]
FIG. 11 is a simplified cross-sectional view of an embodiment of imaging core 400 showing
another embodiment of a transducer assembly in which a substrate having a transducer can be
positioned at an angle with respect to a substrate having an ASIC. Is illustrated. The substrate
with the transducer is hereafter referred to as MEMS 438 and the substrate with the ASIC is
hereafter referred to as ASIC.
[0044]
As shown in FIG. 11, imaging core 400 includes a MEMS 438 having a transducer 442 formed
thereon, and an ASIC 444 electrically coupled to MEMS 438. However, in the exemplary
configuration of FIG. 11, the components of ASIC 444 and MEMS 438 are wire bonded to each
other, attached to transducer housing 416 and secured accordingly by epoxy 448 or other
bonding material to provide ASIC / MEMS hybrid assembly 446 Form In this embodiment, the
leads of cable 434 are soldered or otherwise directly electrically connected to ASIC 444.
[0045]
One benefit in the wire bonding method may be to attach the MEMS component carrying the
transducer at an oblique angle with respect to the longitudinal axis of the housing 416 and the
imaging core 400, thus the ultrasound beam 430 is perpendicular to the central longitudinal axis
of the imaging core. It is to diffuse below the oblique angle. This tilt angle helps reduce sheath
echo that may echo in the space between the transducer and the catheter sheath 412, and is
incorporated herein by reference in its entirety into 2012. US Provisional Patent Application No.
61 / 646,080, filed on May 11, entitled "DEVICE AND SYSTEM FOR IMAGING AND BLOOD FLOW
VELOCITY MEASUREMENT" (Attached Packet No. 44755.817 / 01-0145-US) And U.S.
Provisional Patent Application Serial No. 61 / 646,074 entitled "ULTRASOUND CATHETER FOR
IMAGING AND BLOOD FLOW MEASUREMENT" (Attached Packet No. 44755.961), "Ci. Easy to do
doppler color flow imaging as described in US Provisional Patent Application No. 61 / 646,062,
entitled "Architect Architecturs and Electrical Interfaces for Rotational Intravascular Ultrasound
(IVUS) Devices" (Attorney Docket No. 44755.838) Turn
[0046]
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According to one aspect of the present invention, a transducer assembly includes a first substrate
including a piezoelectric micromachined ultrasonic transducer (PMUT) and a second substrate
including an integrated circuit (IC) device, the first substrate And a second substrate coupled to
each other via wire bonding.
[0047]
In one embodiment, the wire bonding is performed at a temperature of 70 ° C. or less.
In one embodiment, the bonding pad is smaller than 60 μm × 60 μm. In one embodiment, the
height of the bonding loop is 300 μm or less.
[0048]
According to one aspect of the present invention, a transducer assembly includes a flex circuit, a
first substrate including a piezoelectric micromachined ultrasonic transducer (PMUT), and a
second substrate including an integrated circuit (IC) device. A transducer assembly is provided,
wherein at least one of the first substrate and the second substrate is coupled to the flex circuit
via wire bonding. In one embodiment, the wire bonding is performed at a temperature of 70 ° C.
or less. In one embodiment, the bonding pad is smaller than 60 μm × 60 μm. In one
embodiment, the height of the bonding loop is 300 μm or less. According to one aspect of the
present invention, a transducer assembly includes a support substrate, a first substrate including
a piezoelectric micromachined ultrasonic transducer (PMUT), and a second substrate including
an integrated circuit (IC) device. A transducer assembly is provided, wherein the first and second
substrates are each coupled to the support substrate, and the first and second substrates are
electrically interconnected via wire bonding. In one embodiment, the wire bonding is performed
at a temperature of 70 ° C. or less. In one embodiment, the bonding pad is smaller than 60 μm
× 60 μm. In one embodiment, the height of the bonding loop is 300 μm or less.
[0049]
According to one aspect of the invention, a transducer assembly includes a first substrate
including a piezoelectric micromachined ultrasonic transducer (PMUT) and a second substrate
including an integrated circuit (IC) device, A transducer assembly is provided in which a
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substrate and a second substrate are interconnected via soldering or welding. In one
embodiment, the bonding pad is smaller than 60 μm × 60 μm. According to one aspect of the
present invention, a transducer assembly includes a support substrate, a first substrate including
a piezoelectric micromachined ultrasonic transducer (PMUT), and a second substrate including
an integrated circuit (IC) device. A transducer assembly is provided, wherein the first and second
substrates are each coupled to the support substrate, and the first and second substrates are
electrically interconnected via welding or soldering. In one embodiment, the bonding pad is
smaller than 60 μm × 60 μm.
[0050]
While the invention has been described with reference to the examples, it is to be understood
that various modifications may be made within the invention.
[0051]
100 ultrasound imaging system / IVUS system / IVUS imaging system 102 IVUS catheter /
imaging core / catheter 104 interface module 106 IVUS control system / control system 108
monitor 110 catheter sheath 112 imaging core 114 proximal end portion 116 distal end portion
118 Position end portion 120 Distal end portion 122 Transducer assembly 122A Transducer
assembly 122B Transducer assembly 122C Transducer assembly 122D Transducer assembly
122E Transducer assembly 122F Transducer assembly 124 Catheter hub 200 Micro component
/ Ultrasonic transducer 201 Micro component / Micro substrate / substrate 210 ultrasonic
transducer / substrate 225 wire bond 230 conductive pad / bonding pad 240 support substrate
260 opening 270 bonding pad 271 conductive bonding pad 280-282 bonding pad 300 flex
circuit 310-312 bonding Pads 320-322 Bonding pads 330-332 Bonding pads 340 Wirebonds
350 Openings 400 Imaging Core 412 Catheter Sheath 416 Housing 430 Ultrasonic Beam 434
Cable 442 Transducer 446 ASIC / MEMS Hybrid Assembly 448 Epoxy
14-04-2019
17
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