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DESCRIPTION JP2017056124

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DESCRIPTION JP2017056124
Abstract: To suppress the propagation of heat generated in an ultrasonic probe to an ultrasonic
wave transmitting / receiving surface while suppressing noise (back reflection component)
contained in ultrasonic waves transmitted from a transducer array to a subject . A transmission /
reception unit (30) disposed in an ultrasonic probe (10) comprises a transducer array (56), a
hard backing layer (58), an acoustic separation layer (60), an adiabatic wiring block (62), and an
ASIC (66) which is an electronic circuit of a main heat source. Have. The difference in acoustic
impedance between the hard backing layer 58 and the acoustic separation layer 60 is very large,
and unnecessary ultrasonic waves transmitted downward from the transducer array 56 are
substantially reflected at the interface between the two layers. The adiabatic wiring block 62 has
an adiabatic function to limit the upward movement of heat generated in the ASIC 66. Since the
heat insulation wiring block 62 is not required to have the attenuation / reflection characteristics
of ultrasonic waves, the heat insulation wiring block 62 can be formed with a composition or
structure specialized for heat insulation. [Selected figure] Figure 4
Ultrasound probe
[0001]
BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an
ultrasonic probe, and more particularly to a laminated structure of a transmitting / receiving unit
provided in the ultrasonic probe.
[0002]
14-04-2019
1
Ultrasonic diagnostic apparatuses are used in the medical field.
The ultrasonic diagnostic apparatus is an apparatus that transmits and receives ultrasonic waves
to and from an object, and forms an ultrasonic image based on a received signal obtained
thereby. Transmission and reception of ultrasonic waves is performed by an ultrasonic probe
connected to the apparatus main body by wire or wirelessly.
[0003]
The ultrasound probe has a transducer array composed of a plurality of transducers. Each
transducer is provided with a signal (transmission signal) sent from each transmission path. As a
result, each transducer vibrates to transmit an ultrasonic wave.
[0004]
In the ultrasound probe, a transmission sub beamformer (a plurality of transmission signals are
generated according to a signal from the ultrasonic diagnostic apparatus main body and
transmitted to each transducer), and a reception sub beamformer (a plurality of signals obtained
from each transducer An electronic circuit having a function such as performing a phasing
addition process on a reception signal to generate a reception signal may be provided. The
electronic circuit is provided on the opposite side (rear side) to the object as viewed from the
transducer array.
[0005]
From the transducer array, ultrasonic waves are transmitted not only in the direction toward the
subject but also on the back side. A plurality of reflected waves are generated by multiple
reflection of the ultrasonic waves (back waves) transmitted to the back side between the
interfaces in the ultrasonic probe. When the plurality of reflected waves are directly
superimposed on the ultrasonic waves directed to the object, they become noises and the
ultrasonic image is degraded.
[0006]
14-04-2019
2
Heretofore, techniques have been proposed for preventing deterioration of an ultrasonic image
due to back reflection waves. For example, Patent Document 1 discloses a lead backing provided
on the back side of a transducer array, for electrically connecting the transducer array and an
electronic circuit and attenuating a back wave. . In addition, a reflection layer that functions as a
fixed end that reflects the back wave to the subject side is provided on the back side of the
transducer array to intentionally reflect the back wave, thereby preventing multiple reflections of
the back wave and Techniques have also been proposed to increase the ultrasound intensity
transmitted to the specimen.
[0007]
JP 2002-27593 A
[0008]
The operation of the ultrasound probe causes the electronic circuit disposed in the ultrasound
probe to generate heat.
Since the ultrasonic probe is in contact with the subject, it is necessary to prevent the
temperature rise of the contact surface (ultrasonic wave transmitting / receiving wave surface)
with the subject.
[0009]
The electronic circuit is usually provided on the back side of a backing material such as the
above-mentioned lead backing, that is, the backing material is disposed between the subject and
the electronic circuit. However, the backing material inevitably has a relatively high thermal
conductivity because it is necessary to improve the ultrasonic attenuation characteristics.
Therefore, the heat insulating effect can hardly be expected from the backing material.
[0010]
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3
In addition, the above-described reflective layer is also disposed between the subject and the
electronic circuit. However, since it is necessary to electrically connect between the transducer
array and the electronic circuit, the reflective layer is formed of a conductive material such as
carbon. Such materials generally have high thermal conductivity. That is, the heat conductivity of
the reflective layer is also relatively high, and the heat insulating effect can not be expected for
the reflective layer.
[0011]
An object of the present invention is to suppress the propagation of heat generated in an
ultrasonic probe to an ultrasonic wave transmitting / receiving surface while suppressing noise
superimposed on ultrasonic waves transmitted from a transducer array to a subject.
[0012]
The ultrasonic probe according to the present invention includes a transducer array including a
plurality of transducers for transmitting and receiving ultrasonic waves, and an electronic circuit
disposed under the transducer array and electrically connected to the transducer array. An
ultrasonic separation layer provided between the transducer array and the electronic circuit and
having a sound insulation property for blocking ultrasonic waves propagated downward from the
transducer array, the ultrasonic separation layer, and the electrons And a thermal isolation layer
provided between the circuit and the thermal isolation characteristic that limits the upward
propagation of heat generated in the electronic circuit.
[0013]
According to the above configuration, all or most of the unnecessary ultrasonic waves
transmitted downward (back side) in the opposite direction to the object as viewed from the
transducer array are blocked by the ultrasonic separation layer.
This makes it possible to prevent or neglect reflection of unwanted ultrasonic waves in the
ultrasonic probe.
That is, the ultrasonic separation layer suppresses the deterioration of the ultrasonic image.
[0014]
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4
Since unnecessary ultrasonic waves are substantially blocked by the ultrasonic separation layer,
it is basically unnecessary to block or attenuate ultrasonic waves in the heat separation layer
located further below the ultrasonic separation layer. Therefore, the thermal separation layer
may have a poor property of blocking or attenuating ultrasonic waves, and the thermal
separation layer can be formed specifically for lowering the thermal conductivity (high thermal
insulation). By forming the heat separation layer having high thermal insulation, the heat
generated in the electronic circuit can be preferably restricted from moving upward (to the object
side). As described above, in the above configuration, good characteristics in both sound
insulation and heat insulation are realized by the function separation on the back side of the
array vibrator or the separate upstream restriction with respect to the two flows in the opposite
direction.
[0015]
Preferably, the heat separation layer includes a heat insulating material having a composition or
structure exhibiting the heat insulating property, and a lead array composed of a plurality of
leads passing through the heat insulating material. Also preferably, the heat insulating material is
formed of a porous resin.
[0016]
The heat insulating material is made of, for example, a highly heat insulating material such as a
resin. In particular, when the heat insulating material is formed of a porous resin, the heat
insulating property of the heat insulating material can be further enhanced. Further, the
transducer array and the electronic circuit are electrically connected by the lead array of the
thermal isolation layer. It is preferable that the lead array be formed to have as high heat
insulation as possible as long as the conductivity between the transducer array and the electronic
circuit is sufficiently ensured.
[0017]
Preferably, a hard backing layer having a second acoustic impedance higher than the first
acoustic impedance of each transducer is provided between the transducer array and the
ultrasound separation layer, and the ultrasound separation layer is And a third acoustic
impedance lower than the first acoustic impedance.
14-04-2019
5
[0018]
By making the acoustic impedance of the hard backing layer higher than the acoustic impedance
of the transducer array and making the acoustic impedance of the ultrasonic separation layer
lower than the acoustic impedance of each transducer, the distance between the hard backing
layer and the ultrasonic separation layer The difference in acoustic impedance is large, and
unnecessary ultrasonic waves can be blocked (reflected) more preferably at the interface
between the hard backing layer and the ultrasonic separation layer.
[0019]
Preferably, the hard backing layer comprises a plurality of hard backing elements corresponding
to the plurality of transducers, and the ultrasonic separation layer comprises a plurality of
ultrasonic separation elements corresponding to the plurality of transducers, at least A plurality
of laminates acoustically separated from each other by a plurality of acoustic separation grooves
are formed in the lamination portion including the transducer array, the hard backing layer, and
the ultrasonic separation layer.
[0020]
A hard backing element and an ultrasonic separation element are provided corresponding to
each transducer to form a laminate, and the laminates are separated by the acoustic separation
groove, thereby acoustically receiving one laminate from the other laminate. Impact can be
eliminated.
That is, the noise superimposed on the ultrasonic waves transmitted from the transducer array to
the subject is further suppressed, and the deterioration of the image quality of the ultrasonic
image is further suppressed.
[0021]
According to the present invention, it is possible to suppress the propagation of heat generated
in the ultrasonic probe to the ultrasonic wave transmitting / receiving surface while suppressing
the noise superimposed on the ultrasonic wave transmitted from the transducer array to the
object.
14-04-2019
6
[0022]
It is an appearance perspective view of an ultrasonic probe concerning this embodiment.
It is an exploded perspective view of an ultrasonic probe concerning this embodiment.
It is an enlarged view of a transmission / reception unit.
It is sectional drawing of a transmission / reception unit. It is an expanded sectional view of the
base part of a heat insulation wiring block. It is a perspective view which shows the structure of a
lower side heat conductor. It is a figure which shows the example of the temperature distribution
in each layer of a transmission / reception unit. It is a flowchart which shows the flow of the
manufacturing method of a transmission / reception unit.
[0023]
Hereinafter, an embodiment of an ultrasonic probe according to the present invention will be
described.
[0024]
FIG. 1 is an external perspective view of an ultrasonic probe 10 according to the present
embodiment.
The ultrasonic probe 10 has a shape extended in the vertical direction (y-axis direction in FIG. 1),
and transmits and receives ultrasonic waves via the ultrasonic wave transmission / reception
wavefront 12 provided at the top.
[0025]
The ultrasonic probe 10 has an upper case 14 and a lower case 16 as a waterproof or antifungal
skin. The upper case 14 and the lower case 16 are integrated by being combined. This
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7
constitutes a probe case. The upper case 14 and the lower case 16 are preferably made of a
highly waterproof, anti-bacterial, and insulating material. In the present embodiment, the upper
case 14 and the lower case 16 are made of resin.
[0026]
From the lowermost portion of the ultrasonic probe 10, a cable 18 connected to the ultrasonic
diagnostic apparatus main body extends. A cable protection boot 20 is provided to protect the
joint between the cable 18 and the lower case 16.
[0027]
In the present specification, the lateral direction of the ultrasonic probe 10 is taken as the x-axis,
the longitudinal direction as the y-axis, and the direction orthogonal to the x-axis and the y-axis
as the z-axis. Further, the side on which the ultrasonic wave transmitting / receiving surface 12 is
provided (the positive direction side of the y axis) is referred to as “upper side”, and the
opposite direction (the negative direction side of the y axis) is referred to as “lower side”.
[0028]
FIG. 2 is an exploded perspective view of the ultrasonic probe 10. The ultrasonic probe 10
includes a transducer array, an acoustic separation layer, a heat insulating wiring block, a
transmission / reception unit 30 including an ASIC as an electronic circuit, etc. inside the case,
and an upper heat transmitting heat generated in the transducer array to the upper case 14 The
conductor 32, the lower heat conductor 34 for transferring the heat generated in the ASIC to the
lower case 16, and the FPC electrically connected to the ASIC via the relay substrate to be a
signal path from the ultrasonic diagnostic apparatus main body (Flexible (Flexible) (Printed
Circuits) 36, a wire 38 connected to the FPC 36, and a connector 40 for relaying the FPC 36 and
the wire 38 are configured.
[0029]
The upper heat conductor 32 and the lower heat conductor 34 are formed of a material having a
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8
high thermal conductivity. For example, it is formed of a metal such as copper, aluminum,
magnesium or an alloy thereof, or a carbon material. From the viewpoint of reducing the weight
of the ultrasonic probe 10, in the present embodiment, aluminum having a relatively low specific
gravity is used as the material of the lower heat conductor 34.
[0030]
FIG. 3 is an enlarged view of the transmission / reception unit 30. As shown in FIG. FIG. 4 is a yz
sectional view of the transmission / reception unit 30. As shown in FIG. Hereinafter, each layer of
the transmission / reception unit 30 will be described with reference to FIGS. 3 and 4.
[0031]
The transmission / reception unit 30 is composed of a plurality of stacked members. In the
transmission / reception unit 30, in order from the top, the acoustic lens 50, the upper matching
layer 52, the lower matching layer 54, the transducer array 56, the hard backing layer 58, the
acoustic separation layer 60, the heat insulating wiring block 62, the relay substrate 64, And an
ASIC 66 which is an electronic circuit.
[0032]
The upper matching layer 52 and the lower matching layer 54 preferably vibrate so that
ultrasonic waves transmitted from the transducer array 56 can preferably enter the subject, or
that reflected waves returning from the subject preferably The acoustic impedance is adjusted
between the transducer array 56 and the subject so that the transducer array 56 can be reached.
The upper matching layer 52 and the lower matching layer 54 are formed of resin or the like.
The upper matching layer 52 can be omitted.
[0033]
The transducer array 56 is composed of a plurality of transducers. The vibrator is a piezoelectric
element, and is repeatedly stretched and expanded when a voltage is applied. In other words, it
vibrates. This generates an ultrasonic wave. An upper electrode layer is provided on the upper
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9
surface of the transducer array 56, and a lower electrode layer is provided on the lower surface.
The upper electrode layer is grounded, and a signal (transmission signal) from the ASIC 66 is
applied to the lower electrode layer.
[0034]
The transducer array 56 is formed of PZT (lead zirconate titanate) or a single crystal of PMN-PT
(magnesium niobate-lead titanate) or the like. The thickness (length in the vertical direction) of
the transducer array 56 is 100 to 200 μm, and the acoustic impedance is 25 to 35 MRayl. In
addition, since the thicknesses of the upper electrode layer and the lower electrode layer
provided on the upper and lower sides of the transducer array 56 are very thin, the acoustic
effect given to the ultrasonic waves is so small as to be negligible.
[0035]
The hard backing layer 58 uses the acoustic impedance difference with the transducer array 56
to make the lower side (rear side) of the transducer array 56 a node of vibration. The hard
backing layer 58 is formed of, for example, a cemented carbide such as tungsten carbide
(tungsten carbide). The thickness of the hard backing layer 58 is 50 to 500 μm, and the acoustic
impedance is 60 to 120 MRayl. That is, the acoustic impedance of the hard backing layer 58 is
higher than the acoustic impedance of the transducer array 56. Also, the hard backing layer 58 is
conductive. The hard backing layer 58 can be omitted, for example, when the acoustic impedance
between the transducer array 56 and the acoustic separation layer 60 is sufficiently large.
[0036]
The acoustic separation layer 60 has a sound insulation property that blocks the vertical
propagation of ultrasonic waves, and blocks unnecessary ultrasonic waves transmitted from the
transducer array 56 to the lower side (that is, the side opposite to the object). is there. That is, the
acoustic separation layer 60 functions as an ultrasonic separation layer. The acoustic separation
layer 60 is formed of, for example, a porous body such as porous carbon. That is, the acoustic
separation layer 60 is also conductive. The thickness of the acoustic separation layer 60 is 80 to
250 μm, and the acoustic impedance is 0.1 to 1.0 MRayl. That is, the acoustic impedance of the
acoustic separation layer 60 is lower than the acoustic impedance of the transducer array 56 and
the hard backing layer 58. In particular, the difference in acoustic impedance with the hard
14-04-2019
10
backing layer 58 is very large, and the acoustic impedance of the acoustic separation layer 60 is
1/1200 to 1/60 of the acoustic impedance of the hard backing layer 58. Thereby, unnecessary
ultrasonic waves are substantially totally reflected at the interface between the hard backing
layer 58 and the acoustic separation layer 60.
[0037]
As shown in FIG. 4, after the lower matching layer 54, the transducer array 56, the hard backing
layer 58, and the acoustic separation layer 60 are stacked, a plurality of grid-like grooves 70 are
formed in the stack by a dicing saw or the like. It is formed. Thereby, a plurality of transducers
are formed in the transducer array 56, and the members of each layer are divided into portions
corresponding to the respective transducers. Specifically, the lower matching layer 54 is divided
to form a plurality of lower matching elements corresponding to each transducer, and the hard
backing layer 58 is divided to form a plurality of hard backing elements corresponding to each
transducer. The acoustic separation layer 60 is divided to form a plurality of acoustic separation
elements corresponding to the respective transducers.
[0038]
The lower matching element, the vibrator, the hard backing element, and the acoustic separation
element constitute one laminate. That is, it can be said that the transmission / reception unit 30
has a plurality of stacked bodies which are separated by the plurality of grooves 70 and arranged
in a two-dimensional manner. In each laminate, one vibrator and one hard backing element
constitute a vibrator. The hard backing element acts as a resonator in each oscillator.
[0039]
The heat insulation wiring block 62 has a heat insulation property that restricts the vertical
movement of heat, and restricts the heat generated in the ASIC 66 from propagating upward
(that is, the object side). That is, the heat insulation wiring block 62 functions as a heat
separation layer. The heat insulation wiring block 62 has a lead array 62 b composed of a base
material 62 a and a plurality of leads (conductors) extending in the vertical direction.
[0040]
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11
Further, conductive electrode surfaces (upper electrode surface and lower electrode surface) are
formed on the upper surface and the lower surface of the heat insulation wiring block 62,
respectively. The plurality of grooves 70 described above reach the upper surface of the heat
insulation wiring block 62, whereby the upper electrode surface is divided into a plurality of
upper electrode pads corresponding to the respective vibrators. Further, a plurality of grooves 72
are also formed on the lower electrode surface, whereby the lower electrode surface is divided
into a plurality of lower electrode pads corresponding to the respective vibrators.
[0041]
The base material 62a is formed of a material having low thermal conductivity, that is, high
thermal insulation. Specifically, it is formed of a resin such as epoxy. By forming the base
material 62 a of a highly heat insulating material, the base material 62 a becomes a heat
insulating material that limits the upward movement of the heat generated in the ASIC 66.
[0042]
Preferably, the base material 62a is formed of a porous resin. FIG. 5 shows an enlarged crosssectional view of the base material 62a. As the base material 62a, one filled with the void filler
74a shown in FIG. 5 (a) may be used, or one filled with the rubber filler 74b shown in FIG. 5 (b)
may be used. . By filling these fillers, that is, by using a porous resin as the base material 62a, the
heat insulating properties of the heat insulating wiring block 62 are further improved.
[0043]
Returning to FIG. 3 and FIG. 4, each lead included in the lead array 62 b corresponds to each
transducer included in the transducer array 56. The plurality of transmission signals output in
parallel from the ASIC 66 are sent to the transducer array 56 via the lead array 62 b. The lead
array 62 b is preferably formed to have as low thermal conductivity as possible as long as the
conductivity between the transducer array 56 and the ASIC 66 is sufficiently maintained.
[0044]
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12
The adiabatic wiring block 62 looks at first glance the same as a conventional lead backing, but
the adiabatic wiring block 62 does not have to have ultrasound blocking / damping properties.
Because the unnecessary ultrasonic waves are blocked in the acoustic separation layer 60, it is
not necessary to block or attenuate the unnecessary ultrasonic waves in the heat insulation
wiring block 62. That is, the role of the heat insulating wiring block 62 is different from that of
the conventional lead backing.
[0045]
The thickness of the heat insulation wiring block 62 is 3 to 20 mm. As the thickness of the heat
insulation wiring block 62 is increased, the heat insulation performance is improved, but on the
other hand, the ultrasonic probe 10 is enlarged. Thus, the thickness of the adiabatic wiring block
62 is determined in relation to the size of the ultrasound probe 10. Further, because the base
material 62a is formed of a highly thermally insulating material, as a result, the acoustic
impedance is low. Specifically, it is 0.01 to 4 MRayl.
[0046]
The relay substrate 64 is formed of, for example, a material such as glass epoxy. The relay
substrate 64 is a multilayer substrate, and electrical wiring is provided in each layer. On the
lower surface of the relay substrate 64, an ASIC 66 is surface-mounted substantially at the
center, and chip components such as capacitors or thermistors are surface-mounted around the
ASIC 66. A bump array 64 a composed of a plurality of metal bumps connected to each pattern
in the relay substrate 64 is provided on the upper side surface of the relay substrate 64. The
metal bumps are formed of solder or metal such as gold. Each metal bump is electrically
connected to each other by contacting a plurality of lower electrode pads formed on the lower
surface of the heat insulating wiring block 62.
[0047]
The ASIC 66 functions as a transmit sub-beamformer and a receive sub-beamformer. The
transmission sub-beamformer generates a plurality of transmission signals having a delay
relationship according to the signal from the ultrasonic diagnostic apparatus main body, and
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13
transmits them to the respective transducers. The reception sub-beamformer performs phasing
addition processing on a plurality of reception signals obtained from each transducer to generate
reception signals. The received signal is sent to the ultrasonic diagnostic apparatus body and
processed in the apparatus body to generate one beam data. The ASIC 66 performs the abovedescribed processing to reduce the number of signal lines between the ultrasonic probe 10 and
the apparatus main body.
[0048]
A plurality of transmission signals are vibrated from the ASIC 66 via the bump array 64a, the
lower electrode surface of the heat insulation wiring block 62, the lead array 62b, the upper
electrode surface of the heat insulation wiring block 62, the acoustic separation layer 60, and the
hard backing layer 58. It is sent to the lower electrode layer of the child array. The plurality of
received signals are sent from the transducer array 56 to the ASIC 66 in a path reverse to the
transmission signal.
[0049]
The operation of the ultrasound probe 10 generates heat in the ASIC 66. Although heat is
generated also in the transducer array 56, the amount of heat generation of the ASIC 66 is
several or ten times larger than the amount of heat generation of the transducer array 56.
Therefore, the main heat generation source in the ultrasonic probe 10 is the ASIC 66.
[0050]
The heat generated by the ASIC 66 is mainly transferred to the lower heat conductor 34 because
the heat insulating wiring block 62 restricts the upward movement.
[0051]
FIG. 6 is a view showing the structure of the lower heat conductor 34. As shown in FIG.
The lower heat conductor 34 has a shape extending in the vertical direction, and is disposed
below the transmission / reception unit 30, that is, below the ASIC 66 serving as the main heat
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14
source. As shown in FIG. 4, the lower heat conductor 34 is configured to include a main frame
80, a first side frame 82, and a second side frame 84. The main frame 80, the first side frame 82,
and the second side frame 84 have shapes that can be combined with one another, and the lower
heat conductor 34 is configured by combining these. Specifically, the main frame 80 has a
structure in which two side surfaces are released, and the plate-like first side surface frame 82
and the second side frame 84 are combined so as to cover the two side surfaces.
[0052]
The lower heat conductor 34 in which the main frame 80, the first side frame 82, and the second
side frame 84 are combined has an elliptical xz cross section. The xz cross section of the inner
peripheral surface of the lower case 16 is also elliptical, and the outer peripheral surface of the
lower heat conductor 34 just fits in the inner peripheral surface of the lower case 16. As a result,
the contact area between the lower heat conductor 34 and the lower case 16 is increased, and
the heat transferred to the lower heat conductor 34 can be transferred to the lower case 16 more
efficiently. However, the xz cross-sectional profile of the lower heat conductor 34 does not
necessarily have to be elliptical, and at least a portion of the outer surface may be in contact with
the inner peripheral surface of the lower case 16. Of course, since it is preferable that the contact
area between the lower case 16 and the lower heat conductor 34 be large, the shape of the lower
heat conductor 34 conforms to the inner peripheral surface of the lower case 16 as described
above. Is preferred.
[0053]
The main frame 80 has an upper side surface 80 a facing the ASIC 66 at the upper side surface
thereof. The area of the upper side surface 80 a is larger than the surface area of the ASIC 66.
The heat generated in the ASIC 66 is absorbed by the lower heat conductor 34 by the upper
surface 80 a coming into direct or indirect contact with the ASIC 66.
[0054]
Further, the main frame 80 has a block 80b extending downward from the upper side surface
80a. By having the block 80b, the lower heat conductor 34 does not have a cylindrical hollow
structure, but a solid structure that is somewhat filled. As a result, the volume of the lower heat
conductor 34 is increased, whereby the heat capacity is increased, and the heat absorptivity or
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15
thermal conductivity of the lower heat conductor 34 is improved. If only the heat absorption rate
and the thermal conductivity are considered, it is preferable to make the lower heat conductor 34
into a complete solid structure, and such an embodiment can also be adopted. However, in the
present embodiment, in order to reduce the weight of the ultrasonic probe 10, or to
accommodate the FPC 36, the wire 38, or the connector 40 in the lower heat conductor 34, a
certain amount of space (gap) is left.
[0055]
The ultrasonic probe 10 according to the present embodiment is as described above. In the
present embodiment, as described above, the main purpose is to separate the acoustic separation
layer 60 mainly for blocking unnecessary ultrasonic waves between the transducer array 56 and
the ASIC 66, and heat insulation from the ASIC 66. A heat insulating wiring block 62 is provided.
[0056]
The unnecessary ultrasonic waves are substantially blocked in the acoustic separation layer 60,
whereby noises mixed in the ultrasonic waves transmitted to the subject are not increased.
Moreover, in the heat insulation wiring block 62, it is not necessary to consider the blocking /
reflection characteristics of the ultrasonic wave. Thus, the heat insulation wiring block 62 can be
specialized to the heat insulation function, and thus can be formed with the corresponding
composition or structure. Thereby, the heat insulation performance of the heat insulation wiring
block 62 can be improved. That is, the combination of the acoustic separation layer 60 and the
adiabatic wiring block 62 suppresses the increase of the noise mixed in the ultrasonic wave
transmitted to the object, and propagates the heat generated in the ASIC 66 to the ultrasonic
wave transmission / reception 12 It can be restricted.
[0057]
FIG. 7A shows an example of the temperature distribution in each layer of the transmission /
reception unit 30. As shown in FIG. Further, for comparison, FIG. 7B shows an example of the
temperature distribution in each layer when the heat insulating wiring block 62 is not provided.
In both figures, the vertical axis indicates the temperature, and the horizontal axis indicates the
position of the transmission / reception unit in the vertical direction. The left end of the
horizontal axis is the upper end of the ASIC 66, and the right end of the acoustic lens area is the
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ultrasonic wave transmission / reception wavefront 12. It is assumed that the amount of heat
generation in the ASIC 66 is the same in both figures.
[0058]
As shown in FIG. 7A, even when the ASIC 66 generates heat to 60 ° C., the heat is insulated by
the heat insulation wiring block 62, and the upper end of the heat insulation wiring block 62 is
approximately 30 ° C. Then, the temperature is about 24 ° C. in the ultrasonic wave
transmission / reception 12. On the other hand, in FIG. 7B, since the heat insulation effect by the
heat insulation wiring block 62 can not be obtained, most of the heat generated in the ASIC 66
has reached the ultrasonic wave transmit / receive surface 12 and Is over 40 ° C.
[0059]
As described above, the heat insulation wiring block 62 exhibits an excellent heat insulation
effect, thereby suppressing the temperature rise of the ultrasonic wave transmission / reception
wavefront 12 due to the heat generation of the ASIC 66.
[0060]
Further, in the present embodiment, a (60 to 120 MRayl) hard backing layer 58 having high
acoustic impedance is provided below the transducer array 56.
The acoustic impedance of the acoustic separation layer 60 adjacent below the hard backing
layer 58 is very small (0.1 to 1.0 MRayl). Thereby, the unnecessary ultrasonic waves are
substantially reflected at the interface between the hard backing layer 58 and the acoustic
separation layer 60, and the propagation of the unnecessary ultrasonic waves to the lower side
can be suitably prevented.
[0061]
Further, in the present embodiment, a plurality of stacked bodies (consisting of lower matching
elements, vibrators, hard backing elements, and acoustic separation elements) separated by the
plurality of grooves 70 above the heat insulation wiring block 62 are configured. Be done. By
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separating the stacks by the grooves 70, the acoustic effects of other stacks can be reduced when
viewed from one stack. Thereby, the noise mixed in the ultrasonic wave which each laminated
body (vibrator) transmits to a test object is further reduced.
[0062]
Hereinafter, the manufacturing procedure of the transmission / reception unit 30 will be
described according to the flowchart of FIG. 8 with reference to FIG.
[0063]
In step S10, the heat insulating wiring block 62 and the upper layer portion (the lower matching
layer 54, the transducer array 56, the hard backing layer 58, and the acoustic separation layer
60) are bonded.
The adhesion is performed using, for example, a conductive adhesive.
[0064]
In step S12, an element cutting process is performed to divide the upper electrode surface
formed on the upper layer portion and the upper surface of the heat insulating wiring block 62
into a grid.
[0065]
In step S14, the ground electrode is bonded to the upper side of the lower matching layer 54.
Thereby, the upper electrode layer formed on the top surface of the transducer array 56 is
grounded via the conductive lower matching layer 54.
[0066]
In step S16, the upper matching layer 52 is bonded to the upper side of the ground electrode
bonded in step S14.
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[0067]
In step S18, the acoustic lens 50 is placed on the upper side of the upper matching layer 52.
[0068]
In step S20, lower electrode division processing is performed to divide the lower electrode
surface formed on the lower surface of the heat insulation wiring block 62 into a grid.
[0069]
In step S22, the relay substrate 64 on which the ASIC 66 is mounted is connected to the lower
surface of the heat insulating wiring block 62.
[0070]
As mentioned above, although embodiment which concerns on this invention was described, this
invention is not limited to the said embodiment, A various change is possible unless it deviates
from the meaning of this invention.
[0071]
DESCRIPTION OF SYMBOLS 10 ultrasonic probe, 12 ultrasonic wave transmission / reception
wavefronts, 14 upper case, 16 lower case, 18 cables, 20 cable protection boots, 30 transmission
/ reception unit, 32 upper heat conductor, 34 lower heat conductor, 36 FPC, 38 Wires, 40
connectors, 50 acoustic lenses, 52 upper matching layers, 54 lower matching layers, 56
transducer arrays, 58 hard backing layers, 60 acoustic separation layers, 62 thermal insulation
wiring blocks, 62a base materials, 62b lead arrays, 64 relays Substrate, 64a bump array, 66
ASIC, 70, 72 groove, 74a hole filler, 74b rubber filler, 80 main frame, 80a upper side, 80b block,
82 first side frame, 84 second side frame.
14-04-2019
19
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