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DESCRIPTION JPH0448900

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DESCRIPTION JPH0448900
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
method of manufacturing an ultrasonic probe, and more particularly to a method of
manufacturing an ultrasonic probe having an electrode on the side surface of a piezoelectric
ceramic. [Prior Art] Medical ultrasound probes are widely used for dynamic observation of soft
tissues in the body such as the abdomen and chest as an image display by emitting ultrasonic
waves from the skin surface toward the inside of the body. Recently, in order to obtain more
accurate diagnostic information, there has been an increasing demand to swallow an ultrasound
probe from the mouth and to clearly depict the state of the mucous membrane of the stomach
wall as an image. In particular, a diagnostic imaging method of observing an affected area using a
medical endoscope and observing the internal state using an ultrasonic wave will be further
required in the future as it can provide more reliable information. As described above, when
using an ultrasound probe together with a medical endoscope, the ultrasound probe is inserted
into the processing tool hole of the endoscope and used, so this micro ultrasound probe is
considerably It is required to be small. An example of the structure of a conventionally used
ultrasonic probe is shown in FIG. In FIG. 3, an electrode 2 is provided on a vibration surface of
the piezoelectric ceramic 1 for transmitting and receiving ultrasonic waves. On the other hand, in
order to secure more the vibration surface and the vibration area, the electrodes 2, 2 of the
upper and lower vibration surfaces are not short-circuited on the side different from the
vibration surface that transmits and receives ultrasonic waves of the piezoelectric ceramic 1. The
electrode extended from the electrode 2.2 of each of the upper and lower vibration surfaces is
the side electrode 2a. It is provided as 2a. The electrode 2 and the side electrode 2a are formed
by vapor deposition or plating of metal or conductive metal oxide on the piezoelectric ceramic l,
coating of a conductive paint, or the like. An acoustic matching layer 3 is adhered and fixed to
one vibration surface of the piezoelectric ceramic 1 via an adhesive 5 for lamination such as
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epoxy. In addition, the backing material 4 is also adhered and fixed to the vibration surface of the
piezoelectric ceramic 1 on the opposite side to the vibration surface of the piezoelectric ceramic
1 to which the acoustic matching layer 3 is fixed, also via the laminating adhesive 5.
Furthermore, this piezoelectric ceramic l having the acoustic matching layer 3 and the backing
material 4 is embedded in the mold housing 6 together with the lead wire 8, and the side
electrode 2 a of the piezoelectric ceramic 1 is through the lead wire 8 and the conductive
adhesive 7. Electrically connected. When manufacturing such an ultrasonic probe by laminating,
first, the acoustic matching layer 3 and the backing material 4 are respectively joined to the
piezoelectric ceramic l through the laminating adhesive 5 and the bonding adhesive 5 is cured
Later, after embedding in the mold housing 6, the side electrode 2a of the piezoelectric ceramic 1
and the lead wire 8 are electrically coupled using the conductive adhesive 7 or solder or the like.
As an ultrasonic probe using a piezoelectric ceramic having such a side electrode, the one
described in JP-A-63-242100 or the like has been proposed. By the way, when bonding the
acoustic matching layer 3 and the backing material 4 to the piezoelectric ceramic 1 via the
laminating adhesive 5 as described above, the amount of the laminating adhesive 5 is If the
amount is smaller, the piezoelectric ceramic 1 and the acoustic matching layer 3 or the
piezoelectric ceramic 1 and the backing material 4 may be peeled off due to deterioration with
time, so the amount of the laminating adhesive 5 is generally increased. However, when the
amount of the laminating adhesive 5 is increased, as shown in FIG. 4, the laminating adhesive 5
protrudes to the outside of the joining surface at the time of joining, and the side electrode 2a is
covered. Then, after joining the piezoelectric ceramic 1 having the side electrode 2a covered with
the laminating adhesive 5, it is embedded in the mold housing 6, and the side electrode 2a of the
piezoelectric ceramic l and the lead wire 8 are made of the conductive adhesive 7. Even if
electrical connection is attempted, the laminating adhesive 5 already covering the side electrode
2a does not have conductivity, resulting in poor conductivity. In order to prevent such problems,
utilization of the invention described in JP-A-63-242100 can be considered. This is to provide an
auxiliary electrode serving as a lead of the electrode on a part of the electrode of backing
overturn. However, in order to obtain an ultrasonic probe as small as possible, a piezoelectric
ceramic as small as possible (for example, 1 × 2 × 0.14 (mm)) is used, and a vibration surface
for transmitting and receiving ultrasonic waves of this piezoelectric ceramic is used. Although it
is necessary to use the entire surface, when the auxiliary electrode is provided as described
above, there is a problem that an unnecessary reflected wave of the sound wave is generated as
noise by the auxiliary electrode and the acoustic characteristic is deteriorated. The present
invention has been made in view of such conventional problems, and a minute ultrasonic probe
can be easily created without causing a conductive failure of the electrode portion, and moreover,
an ultrasonic wave as a product An object of the present invention is to provide a manufacturing
method that does not deteriorate the acoustic characteristics of a probe. [Means for Solving the
Problems] In order to achieve the above object, according to the present invention, one of the
vibration surface of the piezoelectric ceramic having an electrode on a side different from the
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two vibration surfaces for transmitting and receiving ultrasonic waves and an acoustic matching
layer And forming a laminate by bonding the other of the vibrating surface and the backing
material using the laminating adhesive, and embedding a part of the laminate in the mold
housing, and In the method of manufacturing an ultrasonic probe for electrically coupling a lead
wire embedded in the mold housing, the vibration surface and the acoustic matching layer in a
state in which the side electrode is covered with a resin, And bonding the vibrating surface and
the backing material using the laminating adhesive, and curing the laminating adhesive before
the electrical connection between the side electrode and the lead wire. Followed by removal of.
According to the above means, the side electrodes are covered with resin in advance before
laminating and aligning the acoustic matching layer or the backing material on the vibration
surface of the piezoelectric ceramic using the laminating adhesive, Even if the side surface is
covered with the laminating adhesive, the side electrode is protected by the above-mentioned
resin, and if the resin is removed, the side electrode is exposed. Therefore, the conduction
between the side electrode and the lead wire can be secured. Also, since the electrical coupling
between the side electrode and the lead wire is performed without using the auxiliary electrode
unlike the invention disclosed in JP-A-63-242100, the acoustic characteristics of the ultrasonic
probe as a product are deteriorated. I have nothing to do. Embodiment 1 (First Embodiment) A
first embodiment of the present invention will be described based on FIGS. 1 and 2. FIG. First, the
piezoelectric ceramic 1 having the electrodes 2, 2 and the side electrodes 2a, 2a is drawn in with
the release films 9a, 9b. At this time, the release film is transparent and has a high ultraviolet
light transmittance, and for example, an olefin-based, polyester-based, fluorine-based or the like
is used. Then, a dispenser, a syringe, or the like is used at a portion partitioned by the release
films 9a, 9b and the side electrodes 2a, 2a. The protective resin 10 is evenly injected so that 2a
gets wet. At this time, the protective resin 1 o may be, for example, modified polyacrylamide,
modified polyacrylic acid, modified polymethacrylic acid, modified polyitaconic acid, modified
polyvinyl alcohol, modified polyethylene oxide, modified polyvinyl pyrrolidone, modified
polyvinyl methyl ether, etc. in the molecule. One hundred NH ,. Water-soluble
photopolymerization type obtained by adding a photopolymerization initiator such as
acetophenone or benzophenone and an additive such as an adhesion promoter or a thickener to
a ring or oligomer on a linear polymer having a -COOH, -OH group or the like A polymer based
resin is used. Next, the protective resin 1o is cured by irradiating high intensity ultraviolet light
through the release films 9a and 9b or irradiating ultraviolet light from the side. The state up to
here is shown in FIG. Next, after peeling and removing the release films 9a and 9b, the acoustic
matching layer 3 and the backing material 4 are laminated and bonded to the piezoelectric
ceramic 1 using the laminating adhesive 5 in a normal process, and heat curing is performed
while pressing. Let In this case, if a normal two-component propoxy-based adhesive is used as
the laminating adhesive 5, curing is completed in about 2 hours at 80 ° C. After bonding and
curing, it is as shown in FIG. 2. The cured protective resin 10 is dissolved and removed by
immersing it in warm water at 30 to 40 ° C. or performing ultrasonic cleaning in water.
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In addition, the laminating adhesive 5 which has hardened while being out is easily removed with
a knife or the like. When the penetration of water into the backing material etc. is a problem due
to the performance of the ultrasonic probe, when dissolving the protective resin 10, for example,
an organic solvent such as acetone or ethanol is used instead of hot water or water. Use. Also in
this case, ultrasonic cleaning may be performed. If an epoxy-based adhesive is used as the
laminating adhesive 5, it can sufficiently withstand solvents and ultrasonic cleaning. According to
the above embodiment, the following effects can be obtained. That is, before the acoustic
matching layer 3 and the backing material 4 are laminated and aligned on the vibrating surface
of the piezoelectric ceramic 1 using the laminating adhesive 5, the side electrode is covered with
the protective resin 10 in advance. The acoustic matching layer 3 and the backing material 4 can
be joined without the side electrode 2a of 1 being covered with the insulating laminating
adhesive 5, and as a result, after embedding in the mold housing 6, the side surface of the
piezoelectric ceramic 1 The electrode 2a and the lead wire 8 can be reliably electrically coupled
using the conductive adhesive 7 or solder or the like. Moreover, since the electrical coupling
between the side electrode 2a and the lead wire 8 is performed without using the auxiliary
electrode unlike the invention described in JP-A-63-242100, the acoustic characteristics of the
ultrasonic probe as a product can be obtained. There is also no deterioration. Second
Embodiment The second embodiment of the present invention will be described below. The
difference from the first embodiment is that cyanoacrylate is used instead of the water-soluble
polymer resin of photopolymerization type used as the protective resin 10 It is a point of using a
resin. The manufacturing process is the same as that of the first embodiment. First, the protective
resin 10 is injected into the part partitioned by the release films 9a, 9b and the side electrodes
2a, 2a. The cyanoacrylate-based resin used as the protective resin 10 is usually used as an
instant adhesive, and has the property of reacting with moisture in the air and curing in a short
time. However, since the curing speed becomes extremely slow when injecting a large amount as
in the present invention, after the injection of the protective resin 10, an aromatic amine
dissolved in ethanol as a hardening accelerator is added. Next, a hard-to-mold film 9 a after
curing of the protective resin 10. After peeling and removing 9b, the acoustic matching layer 3
and the backing material 4 are laminated and bonded to the piezoelectric ceramic 1 using the
laminating adhesive 5 in a normal process, and heat curing is performed while pressing. After
curing, the resin is dipped in an organic solvent such as acetone, nitromethane,
dimethylformamide or the like and subjected to ultrasonic cleaning for several minutes to
dissolve and remove the cured protective resin 10.
The laminating adhesive 5 which has hardened as it has run out can be easily removed with a
knife or the like. According to the above embodiment, the following effects can be obtained. That
is, the acoustic matching layer 3 and the backing material 4 can be joined without covering the
side electrode 2a of the piezoelectric ceramic l with the insulating laminating adhesive 5, and as a
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result, after being embedded in the mold housing 6, the piezoelectric The side electrode 2a of the
ceramic l and the lead wire 8 can be reliably electrically coupled using the conductive adhesive 7
or solder or the like. Further, since the electrical coupling between the side electrode 2a and the
lead wire 8 is performed without using the auxiliary electrode unlike the invention described in
JP-A-63-242100, the acoustic characteristics of the ultrasonic probe as a product It does not
degrade the [Effect of the Invention] In the method of manufacturing an ultrasonic probe
according to the present invention, one of the vibration surface of the piezoelectric ceramic
having electrodes on the side different from the two vibration surfaces for transmitting and
receiving ultrasonic waves and an acoustic matching layer, A laminate is formed by bonding the
other of the vibration surface and each of the backing material using the laminating adhesive,
and a part of the laminate is embedded in a mold housing, and then the side electrode and the
mold are formed. When electrically connecting the lead wires embedded in the housing, the
vibration surface and the acoustic matching layer, and the vibration surface and the backing
material are laminated in a state where the side electrode is covered with a resin. The adhesive is
used for bonding, and after curing of the laminating adhesive, the resin is removed before the
electrical connection between the side electrode and the lead wire, so that the laminating
adhesive is used. Even surfaces got covered, the side electrode is protected by the resin, it is
possible to expose the side surface electrode by removing a resin. Therefore, the conduction
between the side electrode and the lead wire can be secured, and the quality can be improved.
Further, unlike the invention disclosed in JP-A-63-242100, the electrical connection between the
side electrode and the lead wire is performed without using the auxiliary electrode, so that the
acoustic characteristics of the ultrasonic probe as a product are deteriorated. It also disappears.
[0002]
Brief description of the drawings
[0003]
1 and 2 are process sectional views in an embodiment of the method of manufacturing an
ultrasonic probe according to the present invention, FIG. 3 is a sectional view of a normal
ultrasonic probe, and FIG. It is sectional drawing in the middle of manufacture of the ultrasound
probe which arose.
.... Piezoelectric ceramic a ... Side electrode ... Acoustic matching layer ... Backing material ...
Adhesive for lamination ... Patent applicant for protective resin (resin) Olympus Optical Co., Ltd.
Company agent Takeshi Nana Takeshi 6 Correct the figures 3 and 4 according to the attached
sheet. September 28, 1990 7 List of attached documents
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