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DESCRIPTION JPH0644297

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DESCRIPTION JPH0644297
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
piezoelectric diaphragm used by being incorporated into a piezoelectric buzzer or the like.
[0002]
2. Description of the Related Art Conventionally, as this type of piezoelectric vibration plate, as
shown in FIGS. 3 and 4, a piezoelectric ceramic plate 1 having electrode layers (not shown)
formed on both sides, and Generally, an aluminum plate 2 which is a conductive support plate
having a spread surface larger than this is face-to-face bonded using a thermosetting epoxy
adhesive or an ultraviolet curing adhesive (not shown). It has become. Then, in this piezoelectric
diaphragm, an aluminum plate 2 electrically connected to the one surface side electrode layer of
the piezoelectric ceramic plate 1 through an adhesive and a lead wire for each of the other
surface side electrode layers of the piezoelectric ceramic plate 1 Soldering of the external lead
terminal 3 is performed.
[0003]
However, the aluminum plate 2 constituting the piezoelectric diaphragm in the above-mentioned
conventional example is excellent in acoustical effect but poor in solderability. Since it is difficult
to solder the external lead terminal 3, when using a thermosetting adhesive, as shown in FIG. 3, it
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is interposed in advance between the piezoelectric ceramic plate 1 and the aluminum plate 2. The
external lead terminal 3 is soldered to a predetermined portion of the copper foil 4, or as shown
in FIG. 4, the external lead terminal 3 is made to the rivet 5 made of copper which has been
punched into a predetermined portion of the aluminum plate 2. It is necessary to adopt a means
such as soldering, which is troublesome in manufacturing time and causes an increase in cost. In
addition, when using an ultraviolet curable adhesive having an anaerobic property, copper ions
are required to start the hardening, so copper ions are previously deposited on the aluminum
plate 2 by spraying or coating a copper ion solution. It has to be done, and the inconvenience
that the increase in labor and cost can not be avoided is caused.
[0004]
The present invention has been made in view of these problems, and it is an object of the present
invention to provide a piezoelectric diaphragm configured so as to easily reduce the labor and
cost at the time of manufacture.
[0005]
SUMMARY OF THE INVENTION In order to achieve such an object, the piezoelectric diaphragm
according to the present invention faces a piezoelectric ceramic plate having electrode layers
formed on both sides, and one side of the piezoelectric ceramic plate. It is characterized in that it
comprises a joined aluminum plate, and a copper plating layer to which an external lead terminal
is soldered is formed on at least a predetermined portion of the aluminum plate.
[0006]
According to the above configuration, the copper plating layer is in close contact with the
aluminum plate, and the copper plating layer can be soldered. As a result, the aluminum plate
and the external lead terminal are copper plating. It will be connected through layers.
[0007]
Embodiments of the present invention will be described below with reference to the drawings.
[0008]
FIG. 1 is a side view showing a schematic configuration of a piezoelectric diaphragm according to
the present embodiment, and FIG. 2 is a side view showing a modification thereof. It is used as an
acoustic conversion component (piezoelectric buzzer component).
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It is to be noted that the overall configuration of this piezoelectric diaphragm is basically the
same as that of the conventional example, so in FIGS. 1 and 2, parts and parts identical or
corresponding to those in FIGS.
[0009]
The piezoelectric diaphragm according to the present embodiment is, as shown in FIG. 1, a
piezoelectric ceramic plate 1 having electrode layers (not shown) formed on both sides facing
each other, and a spread surface larger than this. An aluminum plate joined to one surface side of
the piezoelectric ceramic plate 1 and having a structure in which the aluminum plate 2 having
the above is bonded face-to-face with a thermosetting epoxy adhesive or an ultraviolet curing
adhesive (not shown) A copper plating layer 6 having a predetermined area is formed on the
predetermined portion 2.
Then, for each of the copper plating layer 6 on the aluminum plate 2 electrically connected to the
one surface side electrode layer of the piezoelectric ceramic plate 1 through the adhesive and the
other surface side electrode layer of the piezoelectric ceramic plate 1, a lead is provided. An
external lead terminal 3 such as a wire is connected by soldering.
In addition, when using the ultraviolet curing adhesive which has anaerobic property, this copper
plating layer 6 will supply a copper ion required in a hardening start.
[0010]
That is, at this time, the copper plating layer 6 is in close contact with the aluminum plate 2, and
soldering can be performed on the copper plating layer 6. As a result, the aluminum plate 2 and
the external lead terminal 3 are concerned. The external lead terminals 3 are connected via the
soldered copper plating layer 6.
By the way, when forming the copper plating layer 6 as shown in FIG. 1, the entire surface of the
non-plating unnecessary portion except the predetermined portion where the copper plating
layer 6 is to be formed is covered and covered with a plating protective film (not shown). Plating
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is performed, but in order to reduce the time and effort at such time, for example, as shown in
FIG. 2, one side of the aluminum plate 2 or, although not shown, both sides Of course, a copper
plating layer 6 may be formed to cover the entire surface.
[0011]
As described above, according to the piezoelectric vibrating plate of the present invention, at
least a predetermined number of aluminum plates bonded to one surface of the piezoelectric
ceramic plate having the electrode layers formed on both surfaces thereof are provided. Since a
copper plating layer to which an external lead terminal is soldered is formed on the portion, an
operation required when using a thermosetting adhesive, that is, between the piezoelectric
ceramic plate and the aluminum plate As a result, there is no need to interpose a copper foil or
insert a copper rivet into an aluminum plate, so that it is possible to easily reduce the labor and
cost when manufacturing this piezoelectric diaphragm. Further, since the copper plating layer
supplies the copper ion necessary when using the ultraviolet curing adhesive, it is not necessary
to carry out the injection of the copper ion solution as in the conventional example, and the same
effect as described above is obtained. Is obtained.
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