close

Вход

Забыли?

вход по аккаунту

?

DESCRIPTION JPH0698395

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JPH0698395
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
flat loudspeaker and, more particularly, to a diaphragm for a sound source constructed by
bonding a piezoelectric ceramic plate and a nonmetallic substrate to form a multilayer structure
and radiating acoustic waves directly. .
[0002]
2. Description of the Related Art As a general structure of a diaphragm for a sound source, one
having a multilayer structure in which a piezoelectric ceramic plate and a metal substrate are
bonded to each other has been used. As a conventional metal substrate, a brass plate, aluminum
or aluminum alloy plate, iron alloy plate (42 alloy, stainless steel, etc.) has been used.
[0003]
However, in the case of using a nonmetallic diaphragm which is lighter in weight, less expensive
and easy to process into various shapes as the diaphragm for sound source, the piezoelectric
ceramic is simply placed on the nonmetallic diaphragm. There is a major drawback that it is
difficult to apply an audio signal to the piezoelectric ceramic plate from the externally connected
lead wire only by bonding the plate.
[0004]
13-04-2019
1
Furthermore, although it is possible to make the surface of the nonmetal diaphragm plate
conductive by electroless plating, vapor deposition, sputtering or the like, there is a major
drawback that the cost becomes extremely high.
[0005]
Therefore, an object of the present invention is to provide a sound source diaphragm using a
nonmetal diaphragm at a low cost by a simple manufacturing method.
[0006]
The diaphragm for sound source according to the present invention is a diaphragm for sound
source having a multilayer structure in which a piezoelectric ceramic plate and a nonmetal
substrate are bonded to each other, and the nonmetal substrate is provided as a feeding means.
After applying the conductive paste, the piezoelectric ceramic plate is attached onto the
conductive paste.
[0007]
According to the sound source diaphragm thus configured, after applying the conductive paste as
the power supply means onto the nonmetallic substrate, the piezoelectric ceramic plate is
adhered onto the conductive paste to cure the conductive paste and the piezoelectric ceramic. It
has a configuration to simultaneously complete the attachment of the plate and to
simultaneously hold and electrically connect the piezoelectric ceramic plate.
[0008]
The present invention will be described in detail below.
FIGS. 1 and 2 show the manufacturing process and specific configuration of one embodiment,
and FIGS. 3 and 4 show the manufacturing process and specific configuration of another
embodiment.
[0009]
First, the manufacturing process of the first embodiment will be described based on FIG.
13-04-2019
2
First, a nonmetallic substrate of arbitrary shape is prepared.
As the material of the nonmetal substrate, there are a polymer film such as a polyester film and a
polyimide film, a mica laminated plate, a foamed mica and the like.
Next, a conductive paste is applied onto these nonmetallic substrates.
As a type of conductive paste, Ag paste and Cu paste that can be soldered are preferable in order
to connect external leads. The conductive paste may be applied by direct application with a
squeegee, brush coating, brush coating, screen printing, or the like. Next, the piezoelectric
ceramic plate is attached to the applied part of the conductive paste. Therefore, it is desirable
that the area for applying the conductive paste onto the nonmetallic substrate be slightly larger
than the size of the piezoelectric ceramic plate. After the application of the piezoelectric ceramic
is completed, curing is performed according to the curing conditions of the conductive paste
used.
[0010]
The sound source diaphragm manufactured according to the above-described process will be
specifically described with reference to FIG.
[0011]
A nonmetallic diaphragm 1 is prepared by processing foamed mica into, for example, the shape
(circular shape) shown in FIG. 2, and then, as a conductive paste 3, Cu paste [S-5000 (trade name
of Mitsui Mining & Smelting Co., Ltd.)] Is applied to the surface of the foam mica.
The piezoelectric ceramic plate 2 is attached to the conductive paste coated surface. After the
application is completed, the curing conditions of the conductive paste, in this example of use,
are cured at 160 ° × 30 minutes. After curing of the conductive paste, the external lead wire 6
is soldered to and connected to the piezoelectric ceramic electrode layer 4 and the conductive
paste 3 respectively, and an audio signal is applied to the external lead wire 6. As a result, sound
is reliably generated. Demonstrated the functions of
13-04-2019
3
[0012]
Next, another embodiment will be described with reference to FIG. 3 and FIG. First, the
manufacturing process will be described with reference to FIG.
[0013]
The manufacturing process of FIG. 3 is a modification of the manufacturing process of FIG. The
difference is that the adhesive 5 is applied to the conductive paste application surface before the
piezoelectric ceramic plate 2 is attached to the application surface of the conductive paste 3. The
purpose of performing this step is to firmly bond the conductive paste 3 and the piezoelectric
ceramic plate 1 to each other. That is, in order to ensure the adhesive strength depending on the
material of the nonmetallic diaphragm and the size and number of the piezoelectric ceramic
plate.
[0014]
Hereinafter, an example of a sound source diaphragm manufactured according to the
manufacturing process of FIG. 3 will be described based on FIG.
[0015]
First, as the non-metallic diaphragm 1, one prepared by processing foamed mica into the shape
of FIG. 4 is prepared.
Next, as the conductive paste 3, Cu paste [S-5000 (trade name of Mitsui Mining & Smelting Co.,
Ltd.)] is applied to the surface of the foam mica. Apply, for example, Cemedine 1500 (trade name
of Cemedine Co., Ltd.) or C-323-03 (trade name of Electrochemical Co., Ltd.) as the adhesive 5 to
the piezoelectric ceramic electrode layer surface of the piezoelectric ceramic plate 2 to be
attached. . The piezoelectric ceramic plate 2 is attached to the conductive paste coated surface.
After the application is completed, the conductive paste is cured under the curing conditions of
160 ° × 30 minutes. After curing of the conductive paste, the external lead wire 6 is soldered
to and connected to the piezoelectric ceramic electrode layer 4 and the conductive paste 3
13-04-2019
4
respectively, and an audio signal is applied to the external lead wire 6. As a result, sound is
reliably generated. Demonstrated the functions of
[0016]
FIG. 5 shows an embodiment of a sound source diaphragm for a speaker in which a plurality of
piezoelectric ceramic plates 2 prepared in the manufacturing process of FIG. By using it, the
configuration is more effective.
[0017]
As described above, the piezoelectric ceramic is applied by applying the conductive paste onto
the nonmetallic diaphragm and applying the piezoelectric ceramic plate onto the conductive
paste before curing the conductive paste, and then curing the conductive paste. Since the
electrical connection of the piezoelectric ceramic plate is simultaneously performed
simultaneously with the completion of the pasting of the plate, the sound source diaphragm can
be provided at low cost by a simple manufacturing method.
13-04-2019
5
Документ
Категория
Без категории
Просмотров
0
Размер файла
12 Кб
Теги
description, jph0698395
1/--страниц
Пожаловаться на содержимое документа