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DESCRIPTION JPH01236900

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DESCRIPTION JPH01236900
[0001]
[Summary] The present invention relates to an array-type ultrasonic probe used as a sensor of an
ultrasonic tomographic imaging apparatus. It is an object of the present invention to strengthen
the structure of an array type ultrasonic probe and prevent the occurrence of peeling or the like
that occurs between an electroacoustic transducer and an acoustic matching layer. The ultrasonic
transducer elements are formed by arranging a large number of micro strip-shaped ultrasonic
transducer elements. An electroacoustic transducer, and an acoustic matching layer provided via
an electrode on the sound wave emission side of the electroacoustic transducer. In the array type
ultrasonic probe configured to include a sound wave absorber provided via an electrode on the
back side of the electric sound V conversion element, a ground for earth to be taken out from any
one of the electrodes. As the line means, a foil-like metal mesh having a minute mesh is used, and
an adhesive agent fixed through the mesh of the metal mesh is used to strengthen the structure
of the ultrasonic transmitting / receiving element. Do. BACKGROUND OF THE INVENTION 1.
Field of the Invention The present invention relates to an array type ultrasonic probe used as a
sensor of an ultrasonic tomographic imaging apparatus, and more particularly to an array type
ultrasonic probe capable of strengthening the structure itself. It is. In the method of constructing
an array-type ultrasonic probe of an ultrasonic tomographic imaging apparatus used for medical
diagnosis etc., in the first step, electrodes are formed on the upper and lower surfaces of an
elongated plate-like piezoelectric element which is an electroacoustic transducer. Sound through
81? The ultrasonic wave is transmitted and received by forming the J junction layer and the
acoustic wave absorber and extracting the ground wire and the signal wire from these electrodes
and dividing the piezoelectric element by using a dicing saw or the like in the fifth step. A two
step manufacturing process will be taken, such as forming an array of elements. Therefore, in
this parting process. A considerably large unreasonable force will be applied to the schematically
formed ultrasonic probe. The acoustic matching layer may be formed by directly bonding the
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acoustic matching layer material on the piezoelectric element in addition to the method of
bonding the acoustic matching layer formed in advance to a thickness of 1⁄4 wavelength on the
piezoelectric element. There is a method of forming by molding, and then polishing to a thickness
of a quarter wavelength. このような。 Also in the method of forming an acoustic matching layer
in which a polishing step is performed, a considerably large unreasonable force is similarly
applied to the roughly formed ultrasonic probe. From this, it is necessary to take measures to
strengthen the structure of the array type ultrasound probe. [Prior Art] It is formed by arranging
a large number of strip-shaped minute ultrasonic transmitting and receiving elements 10.
The prior art structure of the array type ultrasound probe 20 is shown in FIG. As shown in this
figure, the ultrasonic transmitting and receiving element 10. It comprises a piezoelectric element
la which is the electroacoustic transducer 1, an acoustic matching N4 provided on the sound
wave radiation side of the piezoelectric element 1a, and a sound wave absorber 5 provided on
the back side of the piezoelectric element 1a. The metal foil 8 for grounding and the flexible
printed board 7a (lead wire for signal) are formed on the electrodes 2.3 formed by silver baking
or the like on both surfaces of the piezoelectric element 1a for electroacoustic transformation. ),
But each will be attached by soldering. The acoustic matching layer 4 provided for acoustic
matching is formed by stacking several layers of metal powder mixed with epoxy resin etc. on
fishing boat, and on the soldered piezoelectric element la of the metal foil 8 It is pasted with an
adhesive material, or is formed by direct molding. FIG. 4 shows a prior art which is an
improvement of the prior art shown in FIG. In this improved technology, the adhesive 9 is filled
in the space created between the metal foil 8 and the flexible printed board 7a. これにより。 The
soldering between the metal foil 8 and the electrode 2 can reduce the force applied to the part
and the soldering between the flexible printed board 7a and the electrode 3 can reduce the force
applied to the part 9 and both the soldering can protect the part. . In any case, in the prior art,
the metal foil 8 is used to commonly ground the ultrasonic transmitting / receiving elements 10
arranged in a large number. [Problems to be Solved by the Invention] Although a 1w4 foil or the
like has been widely used as the metal foil 8, generally the adhesive strength of the adhesive to
the metal foil 8 is low, and in particular, the method of directly molding the acoustic matching
layer 4 However, the adhesive strength is further reduced because a large amount of powder is
mixed in the epoxy resin. From this, in the prior art, there is a problem that the adhesive strength
between the metal foil 8 and the acoustic matching Jii 4 and the metal foil 8 and the flexible
printed board 7a can not be obtained sufficiently. From this, even if any force is applied to the
metal 7f38 and the acoustic matching layer 4 in the manufacturing process including dicing saw
and polishing, even if the conventional improvement technique as shown in FIG. As shown, the
bonding surfaces of the metal foil 8 and the acoustic matching layer 4 or the metal foil 8 and the
flexible print temporary 7a are easily peeled off. As a result, a sister of the piezoelectric element
1a and the acoustic matching layer 4 is caused. When such a process occurs even in one of the
many ultrasonic transmitting and receiving elements 10, the array type ultrasonic probe 20 does
not exhibit sufficient performance.
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Therefore. The conventional array-type ultrasound probe 20 using the metal foil 8 for grounding
is disadvantageous in that the yield in manufacturing is poor and the bluishness in use is not
sufficient. The present invention has been made in view of the above circumstances, and by
improving the adhesive strength of the adhesive to the metal foil 8, the structure of the array
type ultrasonic probe 20 is strengthened to acoustically match the piezoelectric element 1a. The
purpose is to prevent the occurrence of peeling and the like occurring with the layer 4. [Means
for Solving the Problems] The array type ultrasonic probe according to the present invention is a
minute ground line means attached to the electroacoustic transducer of an ultrasonic
transmitting and receiving element forming the array type ultrasonic probe. It is configured to
use a foil-like metal mesh having a mesh. [Operation] According to the present invention,
adhesive means such as a molding agent and an adhesive used in forming the ultrasonic
transmitting and receiving element are integrally fixed to the metal mesh through the mesh of
the metal mesh. As a result, the metal mesh used as the ground line means and the adhesive
means for forming the ultrasonic transmitting / receiving element do not peel off, so that the
structure of the ultrasonic transmitting / receiving element can be strengthened. Embodiments of
the present invention will be described with reference to the following nine drawings. FIG. 1 is a
perspective view showing the internal structure of an array-type ultrasonic probe 20 according
to an embodiment of the present invention as shown in FIG. 1. As shown in this figure, an arraytype ultrasonic probe of the present invention is shown. The basic structure of the sensor 20 is
the same as that of the conventional array-type ultrasound probe 20 shown in FIG. 3 and is
formed by arranging a large number of strip-shaped minute ultrasound transmitting / receiving
elements 10 ', The electroacoustic transducer I, in which the ultrasonic transmitting and
receiving element 10 is, for example, a piezoelectric element, and the acoustic matching layer 4
provided on the sound wave radiation side of the electroacoustic transducer 1. The acoustic wave
absorber 5 is provided on the back side of the electroacoustic transducer 1. そして。 A 71 pole 2
and an electrode 3 are formed on the surface of the electroacoustic transducer 1 in contact with
the acoustic matching layer 4 and the surface in contact with the acoustic wave absorber 5 by
silver baking or the like. While the voltage for the radiation is applied, the voltage excited by the
ultrasonic wave returned from the test object is taken out. Generally, signal line means 7 such as
flexible print temporary 7a is connected by soldering to the electrode 3 provided on the sound
wave absorber 5 side, and the electrode 2 provided on the acoustic matching layer 4 side is
grounded. In the present invention, as shown in FIG. 1, the ground line means is made of a
material such as copper, brass or stainless steel which can be soldered. Foil-like metal with a
minute mesh!
46 is used. It is desirable that the corners between the w1's of this metal M46 be sufficiently
smaller than the array pitch of the ultrasonic transmitting / receiving elements 10, but it is not
always necessary for the mesh to have regularity like the usual wire mesh, and random small
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holes It is also possible to use an array of Next, the manufacturing method shown in FIG. 2 shows
how the array-type ultrasonic probe 20 of the present invention using such a metal mesh 6 as
the earth line means can strengthen its structure. It will be described according to the
explanatory drawing of the method. As shown in FIG. 2 (A), first, the signal line means 7 is
soldered to the end of the electrode 3 of the electroacoustic transducer 1 formed in advance, and
then the sound wave absorber 5 is bonded or bonded. It is fixed to the electroacoustic transducer
1 through the electrode 3 by molding. Next, as shown in FIG. 2 (B), a metal mesh 6 is soldered to
the end of the electrode 2 of the electroacoustic transducer 1 formed in advance, and thereafter,
the acoustic matching layer material is used as an electric sound opening Changed dust 1): Direct
molding on the core 1 and polishing to a thickness of a quarter wavelength to form the
lowermost layer 4 a of the acoustic matching layer 4. The other end of the metal mesh 6 is
soldered to the signal line means 7 as a ground. At this time, as shown in Figure 1. A part of the
acoustic matching layer flows into the mesh of the metal mesh 6 and solidifies in such a manner
as to sandwich the metal mesh 6 through the fifth eye 5. Therefore, the metal mesh 6, the
acoustic matching layer 4 and the signal line means 7 are firmly fixed without being separated
from each other. Then, as shown in FIG. 2 (C), after the acoustic matching layer 4 is formed by
overlapping the second and third layers by the same method, it is divided into fine rectangular
shapes in the scanning direction by means of wicking or the like. Thus, an array of ultrasonic
transmitting and receiving elements IO as shown in FIG. 1 is formed. Even when cutting with this
dicing saw, the problem of peeling as shown in FIG. 5 does not occur because the structure is
already reinforced by the metal mesh 6. Although the method of forming the D ′ ′ matching
layer 4 by direct molding on the electroacoustic transducer 1 is shown in the manufacturing
method illustrated in FIG. 2, this is different. Even in the manufacturing method in which the
previously formed sound alignment N4 is bonded onto the electric sound V conversion element
1, the adhesive used flows into the mesh of the metal mesh 6, so that the metal mesh 6 and the
acoustic are similarly made. The alignment N4 and the signal line means 7 are firmly fixed
without peeling off each other.
As described above, according to the present invention, unlike the case of using the conventional
metal foil, the adhesive or the like does not peel off from the earth line means, so that the
structure of the ultrasonic transmitting / receiving element 10 can be remarkably reinforced. As
described above with reference to the two illustrated embodiments, the present invention has
nine. It is not limited only to the aspect of the said Example. For example, metal mesh 6 as an
earth line means. It may be soldered to the electrode 3 on the sound wave absorber 5 side. Also,
the shape of the wire mesh 6 is not particularly specified. And 1 this invention will be applicable
also to various array-type ultrasound probes, such as a sector phased array, a convex array, and a
consensus array. [Effects of the Invention] As described above, according to the present
invention, the structure of the array type ultrasonic probe can be greatly strengthened, so that
the electroacoustics of the ground line means and the acoustic matching layer conventionally
generated in the manufacturing process can be obtained. Peeling or the like from the conversion
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element can be prevented, whereby the manufacturing yield can be significantly improved. Since
it is also possible to prevent the ground line means and the acoustic matching layer from being
separated due to the shock given during use after manufacture or distortion caused by
temperature change. The reliability of the array type ultrasonic probe can also be improved.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is a perspective view of an array type ultrasonic probe according to an embodiment of the
present invention.
FIG. 2 is an explanatory view for explaining the method of manufacturing the array type
ultrasonic probe shown in FIG. 1; FIG. 3 is a perspective view of a conventional array-type
ultrasonic probe. FIG. 4 is a cross-sectional view of a conventional array-type ultrasound probe
which is an improvement over the prior art of FIG. FIG. 5 is an explanatory view for explaining
the problems of the prior art. In the figure, 1 is an electroacoustic transducer, and la is a
piezoelectric element. 2.3 is an electrode, 4 is an acoustic matching layer, 5 is a sound absorber.
6 is a metal mesh, 7 is a signal line means, 7a is a flexible printed board, 8 is a metal foil, and 9 is
an adhesive. 10 is an ultrasonic wave transmitting / receiving element, and 20 is an array type
ultrasonic probe.
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