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DESCRIPTION JPH02185197

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DESCRIPTION JPH02185197
[0001]
This invention relates to a lead extraction structure for a piezoelectric body, and more
particularly to a lead extraction structure for connecting a spring terminal to an electrode formed
on the surface of a piezoelectric body. <Prior Art> Conventionally, a type in which a spring
terminal is in pressure contact with an electrode is used as one of the lead-out structures of a
lead in the piezoelectric body such as a piezoelectric buzzer. FIG. 2 shows the above-described
conventional lead-out structure, which is fixed to a case, a wiring board or the like with respect to
the electrode 2 of the piezoelectric body 3 formed by providing the electrode 2 on the surface of
the piezoelectric element 1 using piezoelectric ceramic or the like. The front end projection 5 of
the spring terminal 4 is pressed against so that the spring pressure becomes about several tens
of g to 300 g, and the electrode lead is taken out by the spring terminal 4. <Problems to be
Solved by the Invention> By the way, the position at which the tip projection 5 of the spring
terminal 4 abuts on the electrode 2 must be set at a node point where the vibration of the
piezoelectric body 3 is small. There is a problem that the vibration is limited when the position is
shifted, and furthermore, the electrode 2 is scraped due to the vibration of the connection
portion. Also, in order to reliably press the spring terminal against the electrode, it is difficult to
design and control the shape and pressure of the spring terminal. Furthermore, since only the tip
end protrusion 5 of the spring terminal 4 is in pressure contact with the electrode 2, there is a
problem that connection defects occur when foreign matter such as an insulator intrudes
between the connection portions. The present invention has been made to solve the abovedescribed problems, and the connection between the electrode and the crimp terminal can be
reliably performed regardless of the spring pressure of the spring terminal, and the connection
position to the piezoelectric body can be widely selected. An object of the present invention is to
provide a lead extraction structure of a piezoelectric body without vibration damping and
electrode scraping. In order to solve the problems described above, in order to solve the
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problems as described above, according to the present invention, a flexible conductive adhesive
is applied and adhered on the electrode provided on the surface of the piezoelectric element, and
the adhesive is used to flatten the tip of the spring terminal. After bonding the parts, the flexible
conductive adhesive is cured. Function> A thin flexible conductive adhesive is print-applied to the
electrode provided on the surface of the piezoelectric element in the vicinity of the node point of
the piezoelectric body. Bonding is performed with the flat end of the spring terminal joined to
this adhesive When the agent is forced or allowed to dry and cure, the electrode and the crimp
terminal can be electrically connected, and the flexibility of the adhesive absorbs vibration even if
the joint of the spring terminal deviates from the node point to some extent The spring terminal
is less likely to resonate and damp the vibration, and the occurrence of scraping of the electrode
can also be prevented.
An embodiment of the present invention will be described below with reference to FIG. 1 of the
attached drawings. As illustrated, the piezoelectric body 3 is formed by providing an electrode 2
using a conductive material such as Ag, Cu, Ni or the like on the surface of a piezoelectric
element 1 using a piezoelectric ceramic or the like, and a spring connected to the electrode 2 The
terminal 11 is formed with a flat portion 12 at the tip. The flexible conductive adhesive 13 used
to connect the spring terminal 11 to the electrode 2 can be exemplified by epoxy type, silicon
type and urethane type. In order to connect the electrode 2 and the spring terminal 11, the
flexible conductive adhesive 13 is thinly print-applied on the electrode 2 of the piezoelectric
body 3 in the vicinity of the node point, and this adhesive 13 is a curing agent having flexibility.
The flat end portion 12 of the spring terminal 11 fixed to the case or the wiring board is brought
into pressure contact with the adhesive 13. Thereafter, the flexible conductive adhesive 13 is
cured by forced drying or natural drying with hot air or the like, and the electrode 2 and the
spring terminal 11 are fixed via the adhesive 13 and simultaneously joined electrically. In the
joint portion between the electrode and the screw terminal 11, due to the flexibility of the
adhesive 13, the vibration is absorbed even if it deviates to some extent from the node point of
the piezoelectric body 3, and the spring terminal 11 resonates or damps the vibration of the
piezoelectric body 3. As a result, the flexible conductive adhesive 13 between the electrode 2 and
the spring terminal 11 acts as a buffer to prevent the occurrence of the scraping of the electrode
2 by the spring terminal 11 and to reliably maintain the bonding state of both. As described
above, according to the present invention, since the flat end of the spring terminal is joined to the
flexible conductive adhesive applied to the electrode of the piezoelectric body to connect the
electrode and the spring terminal, the following will be described. There is an effect to
enumerate. (The D electrode and the spring terminal can be joined reliably, and a stable
conduction state similar to soldering can be obtained. (3) Due to the flexibility of the adhesive,
even if it deviates to some extent from the node point position of the piezoelectric body, it
absorbs vibration, and the spring terminal does not resonate or damp the vibration of the
piezoelectric body. Because 1 assembly work becomes easy. (2) By interposing the flexible
conductive adhesive, the electrode can not be scraped off by the spring terminal (the bonding
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state can be reliably maintained. (11) Since the flat end portion of the spring terminal is
adhesively fixed to the electrode, the spring pressure of the spring terminal can be reduced, and
design conditions such as spring pressure and shape of the spring terminal can be reduced.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is a front view showing a lead extraction structure of a piezoelectric body according to the
present invention, and FIG. 2 is a front view showing a conventional lead extraction structure.
DESCRIPTION OF SYMBOLS 1 ... Piezoelectric element 2 ... Electrode 3 ... Piezoelectric body 11 ...
Spring terminal 12 ... Tip flat part 13 ... Flexible conductive adhesive
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