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DESCRIPTION JPH07162994

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DESCRIPTION JPH07162994
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
surface-mounted piezoelectric receiver which is surface-mounted as an electric component on a
wiring board.
[0002]
2. Description of the Related Art In surface mounting, cream solder is applied to component
connection positions on a wiring board, then electronic components such as resistors, capacitors,
and semiconductor elements are mounted on each position, and the cream solder is heated and
melted. Although this is a method of electrically connecting components to wiring, the
conventional piezoelectric handset for a telephone is mounted on a handset and never surface
mounted on a wiring board.
[0003]
Recently, with the spread of cordless phones and mobile phones, many electronic components
are surface mounted on wiring boards, and integration of assembly is in progress.
Due to this movement, it is necessary to realize surface mounting on the wiring board also in the
piezoelectric handset.
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[0004]
However, as shown in FIG. 6, in the piezoelectric receiver, the sound release hole 2 is opened in
the upper surface of the hollow cylindrical case 1, and the acoustic leakage hole 3 is opened in
the lower surface of the case 1. ing. The sound emission hole 2 is an opening for emitting the
sound emitted from the piezoelectric vibrator built in the case 1 to the outside of the case, and
the acoustic leakage hole 3 corrects the frequency characteristic of the sound emitted from the
piezoelectric vibrator It is an opening for
[0005]
In the shape of the conventional piezoelectric receiver, the terminal drawn out from the case is
bent to the lower surface to form a solder connection portion, so that the bottom surface of the
case closely adheres to the substrate when surface mounted on the wiring substrate 4 As a result,
the acoustic leakage hole 3 is substantially closed. In order to open the acoustic leakage hole 3,
the wiring substrate 4 had to be provided with the hole 5 and the acoustic leakage hole 3 was
opened by the hole 5.
[0006]
An object of the present invention is to provide a piezoelectric receiver capable of surface
mounting without providing a conventional hole in a wiring board.
[0007]
In order to achieve the above object, a piezoelectric vibrator according to the present invention is
a piezoelectric receiver incorporating a piezoelectric vibrator in a case, wherein the piezoelectric
vibrator generates sound by piezoelectric vibration. The case has a sound release hole, an
acoustic leak hole, and a leg, and a terminal is attached, the terminal forms a pair, and supplies
an electrical signal from an external circuit to the piezoelectric vibrator. The contact portion is a
portion to be in contact with the piezoelectric vibrator, and the solder connection portion is
drawn from the contact portion to the outside of the case and protrudes downward. It is a part to
be soldered to the surface mounting product of the board, the sound emission hole is an opening
that is opened on the top surface of the case and emits the sound emitted from the piezoelectric
vibrator to the outside of the case. The frequency characteristics of the sound emitted from the
piezoelectric vibrator are The opening is a correct opening, and the leg is a rising portion
protruding from the lower surface of the case, supporting the case at a fixed height position to
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separate the acoustic leakage holes from the surface mounting surface of the case, at least two or
more Of these legs, two of the legs form a pair, and the paired legs support the soldered
connection of the terminal.
[0008]
The pair of leg portions supporting the solder connection portion of the terminal has a recessed
portion on the lower surface, and the recessed portion receives the solder connection portion and
forms a housing space for the surface mounting cream solder. .
[0009]
Further, the rising height of the leg portion secures a mounting space of the component below
the case.
[0010]
Moreover, the rising height of the said leg part is 0.5-2 mm.
[0011]
The lower surface of the case is supported at the rising height position of the leg.
Therefore, the acoustic leakage hole of the case is opened to the atmosphere through the gap
between the lower surface of the case and the mounting surface of the substrate, and the
frequency characteristic of the piezoelectric receiver is maintained.
Further, since the leg portion is a mounting portion of the terminal, by mounting the leg portion
on the mounting surface of the substrate, the terminal can be soldered to surface mount the
piezoelectric receiver on the substrate.
Moreover, since the recessed part provided in the leg part accommodates cream solder, stable
soldering can be performed with the cream solder of the amount required for soldering.
Furthermore, the gap between the lower surface of the case and the mounting surface of the
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substrate can be used as a mounting space for other components.
[0012]
An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is an
enlarged sectional view taken along line II-II in FIG. 1, and FIG. 3 is an enlarged bottom view of
FIG.
[0013]
In the figure, a piezoelectric receiver according to the present invention has a piezoelectric
vibrator 7 incorporated in a case 1. The outer peripheral edge of the piezoelectric vibrator 7 is
supported by the case 1 so as to be generated by piezoelectric vibration.
[0014]
The case 1 has a hollow cylindrical shape, has a sound output hole 2, an acoustic leak hole 3, and
a leg 6, and a terminal 8 is attached. The terminal 8 forms a pair, supplies an electric signal from
an external circuit to the piezoelectric vibrator 7, and has a contact portion 8a and a solder
connection portion 8b. The contact portion 8 a is a portion to be in contact with the piezoelectric
vibrator 7, and the solder connection portion 8 b is a portion which is pulled out from the
contact portion 8 a to the outside of the case and protrudes downward and is soldered to the
surface mounting surface 9 of the wiring substrate 4. It is.
[0015]
The sound emission hole 2 is an opening that is opened on the upper surface of the case 1 and
emits the sound emitted from the piezoelectric vibrator 7 to the outside of the case 1, and the
acoustic leakage hole 3 is provided on the lower surface of the case 1 7 is an opening for
correcting the frequency characteristics of the sound produced.
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[0016]
The four legs 6 are provided on the lower surface of the case 1 so as to support the case 1 at the
rising height position thereof and separate the acoustic leakage hole 3 of the case 1 from the
surface mounting surface 9 of the substrate 4 to open it to the atmosphere. It is a thing.
Of the four legs, two legs 6a and 6b form a pair, and the paired legs 6a and 6b are used as
support surfaces for the terminals, as shown in FIGS. Are provided corresponding to the positions
of the solder connection portions 8b of the terminals 8, and the lower surface has a recessed
portion 10 for receiving the solder connection portions 8b. The remaining legs 6c have a solid
cylindrical shape and are provided at positions where the case 1 can be stably supported
centering on the paired legs 6a and 6b.
[0017]
Further, the leg portions 6a, 6b have a retaining groove 6d on the lower surface. The solder
connection portion 8b of the terminal 8 is provided with an upstanding portion 8c which is
partially erected, and the upstanding portion 8c of the solder connection portion 8b is supported
by the recessed portion 10 of the leg portions 6a and 6b to prevent the removal thereof It is
locked within 6d, and the solder connection portion 8b is prevented from coming off. Therefore,
the solder connection 8 b of the terminal does not come out of the case 1.
[0018]
In the embodiment, when mounting the piezoelectric receiver on the surface of the wiring
substrate 4, the acoustic leak hole 3 of the case 1 of the piezoelectric receiver is directed to the
wiring substrate 4 side and placed at a predetermined position of the wiring substrate 4 and the
piezoelectric receiver is wired. It is mounted on the cream solder of the surface mounting surface
9 of the substrate 4. The melted cream solder on the wiring board 4 intrudes into the recessed
portion 10 of the paired legs 6a and 6b, and after melting, is solidified to solder the solder
connection portion 8b to the surface mounting surface 9 of the substrate 4 . The solder
necessary to solder the solder connection portion 8b to the surface mounting surface 9 of the
substrate 4 is also received in the recess 10 of the leg portions 6a and 6b. , Stable soldering is
performed.
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[0019]
Between the lower surface of the case 1 and the surface mounting surface 9 of the wiring board
4, a gap S corresponding to the rising height of the legs 6a to 6c is secured, and the acoustic
leakage hole 3 provided on the lower surface of the case 1 is a gap It is open to the atmosphere
through S and the frequency characteristics of the piezoelectric handset are maintained.
[0020]
According to the present embodiment, the gap S formed between one surface of the case 1 and
the surface mounting surface 9 of the wiring substrate 4 is set in the range of 0.5 mm to 2 mm.
When this gap S is 0 mm, that is, when the acoustic leakage hole 3 of the case 1 is sealed by the
surface mounting surface 9 of the substrate 4, the frequency characteristics of the piezoelectric
receiver are disturbed as shown in FIG. Can not demonstrate their performance. When the gap S
is 0.44 mm, as shown in FIG. 7, the frequency characteristics of the piezoelectric receiver are
disturbed as shown in FIG. On the other hand, the gap S is 0.8 mm as shown in FIG. 7, the gap S
is 1.32 mm as shown in FIG. 7, and the gap S is 1.76 mm as shown in FIG. The frequency
characteristic of the piezoelectric receiver is substantially flat within the range of about 300 Hz
to 1,200 Hz of the operating frequency band. Further, when the gap S is 2 mm or more, as shown
in Fig. 7, the effect is not much different from that in Fig. 7.
[0021]
Therefore, as apparent from the frequency characteristics of FIG. 7, it is understood that the gap
S is insufficient at 0.5 mm or less, 2 mm is sufficient, and it is not necessary to make the gap S
larger than 2 mm.
[0022]
Although four legs 6a, 6b and 6c are provided in the embodiment, the present invention is not
limited to this, and at least two or more may be used, and two of them may be used as a pair for
supporting the terminal. Good.
Moreover, although the remaining leg part 6c was made into cylindrical shape, the shape is not
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limited.
[0023]
As described above, according to the present invention, it is possible to mount the piezoelectric
receiver on the surface without requiring a hole in the wiring substrate, and by supporting the
case by pulling it upward from the surface mounting surface. The acoustic leakage hole of the
case can be kept open to maintain the frequency characteristics of the piezoelectric receiver.
[0024]
Furthermore, since a gap is secured between the wiring board and the case, other electronic
components can be mounted using this gap without blocking the acoustic leakage hole, and the
mounting efficiency of the wiring board can be improved. .
[0025]
Furthermore, the solder required to solder the solder contact portion of the terminal to the
substrate can also be received in the recess of the leg, so that stable soldering can be performed
with the amount of solder necessary for soldering. it can.
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