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DESCRIPTION JPH08122311

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DESCRIPTION JPH08122311
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
back load material, a piezoelectric vibrator laminated on the back load material, and an ultrasonic
probe provided with a matching layer laminated on the piezoelectric vibrator. .
[0002]
2. Description of the Related Art A conventional example will be described with reference to the
drawings. FIG. 8 is a perspective view of the main part of a first conventional example of an
ultrasonic probe, FIG. 9 is a view for explaining extraction of electrodes in FIG. 8, and FIG. 10 is a
second conventional example of an ultrasonic probe. FIG. 11 is a perspective view of the main
part, and FIG. 11 is a view for explaining extraction of the electrode in FIG.
[0003]
First, a first conventional example will be described with reference to FIGS. 8 and 9. FIG. In these
figures, 1 is a piezoelectric vibrator (PZT). The signal electrode layer 2 is formed on one surface
of the piezoelectric vibrator 1 and the ground electrode layer 3 is formed on the other surface in
advance.
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[0004]
On the signal electrode layer 2 side of the piezoelectric vibrator 1, a back load member 4 that
mechanically supports the piezoelectric vibrator 1 and acoustically dampens the piezoelectric
vibrator 1 to shorten an ultrasonic pulse waveform is provided. It is stacked. Further, an acoustic
matching layer 18 is laminated on the side of the ground electrode layer 3 of the piezoelectric
vibrator 1.
[0005]
The stacked piezoelectric vibrator 1, backing material 4 and acoustic matching layer 18 are
divided into a plurality of linearly arranged elements by dicing cutting, and the acoustic isolation
of each element is obtained. Is secured.
[0006]
Although an acoustic lens is stacked on the acoustic matching layer 18, it is not shown.
Here, the extraction of the electrode of the piezoelectric vibrator 1 will be described. A flexible
printed circuit board 5 is disposed on one side of the backing material 4 and has a conductive
pattern 7 corresponding to the signal electrode layer 2 of each piezoelectric vibrator 1 formed on
a thin insulating base 6 such as polyimide (hereinafter referred to as It is called FPC). Then, the
signal electrode layer 2 of each piezoelectric vibrator 1 and each conductive pattern 7 of the FPC
5 are connected using the conductive adhesive 8, and the signal electrode is taken out.
[0007]
A copper foil 10 is connected to the ground electrode layer 3 of the piezoelectric vibrator 1 using
a conductive adhesive 9 on the other side surface of the backing material 4, and the ground
electrode is taken out. Next, a second conventional example will be described using FIG. 10 and
FIG. In these figures, the same parts as those in FIG. 8 and FIG. 9 are assigned the same reference
numerals and descriptions thereof will be omitted.
[0008]
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The difference between the second prior art and the first prior art is the structure for taking out
the signal electrode. A printed circuit board 11 is disposed on one side of the backing material 1
and has a conductive pattern 13 corresponding to the signal electrode layer 2 of each
piezoelectric vibrator 1 formed on an insulating base 12 such as epoxy resin. The conductive
pattern 13 of the printed board 11 and the signal electrode 2 of each piezoelectric vibrator 1 are
connected by wire bonding 14.
[0009]
Although the printed circuit board 11 is used in the second conventional example, connection
may be made by wire bonding using an FPC.
[0010]
However, in the ultrasonic probe of the above configuration, the signal electrode can be taken
out only from one side of the back load member 4 and the degree of freedom in the taking out
direction is small. There is a problem of that.
[0011]
In the above-described conventional example, although a plurality of elements are linearly
arranged (one-dimensional), in the case of an ultrasonic probe in which the elements are twodimensional, extraction of the signal electrode is There is a problem that becomes difficult.
[0012]
The present invention has been made in view of the above problems, and a first object of the
present invention is to increase the degree of freedom of the extraction direction of the signal
electrode and further to increase the degree of freedom of the signal electrode even if the
elements have a two-dimensional array. An object of the present invention is to provide an
ultrasonic probe which is easy to take out.
[0013]
A second object of the present invention is to provide an ultrasonic probe which increases the
freedom of taking out the ground electrode.
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A third object of the present invention is to provide an ultrasonic probe in which the shielding
effect against noise is enhanced.
[0014]
A first invention for solving the above problems is a back load material, and a thin film laminated
on the back load material and having a conductive pattern formed on a thin insulating base
material. A piezoelectric vibrator having a substrate and a signal electrode layer formed on the
thin substrate and having a signal electrode layer connected to the conductive pattern of the thin
substrate formed on the surface on the thin substrate side; It is an ultrasonic probe which has a
layer, and it divides | segments except the said thin board | substrate into some element.
[0015]
According to a second aspect of the present invention, there is provided a back load material, a
piezoelectric vibrator laminated on the back load material, and having a ground electrode layer
formed on the surface opposite to the back load material, and the piezoelectric vibration. An
ultrasonic probe comprising: a thin substrate laminated on a thin film and having a conductive
pattern formed on a thin insulating substrate and connected to the ground electrode layer; and a
matching layer laminated on the thin substrate. And the thin substrate other than the thin
substrate is divided into a plurality of elements.
[0016]
According to a third aspect of the present invention, there is provided a back load material, a
piezoelectric vibrator stacked on the back load material, a matching layer stacked on the
piezoelectric vibrator, and a thin layer stacked on the matching layer. It is an ultrasonic probe
which has a thin substrate in which a conductive pattern was formed on an insulating substrate,
and the conductive pattern of the thin substrate is used as a frame ground, and the elements
other than the thin substrate are divided into a plurality of elements. .
[0017]
The thin substrate in the first to third inventions is preferably a flexible printed circuit.
[0018]
In the ultrasonic probe according to the first aspect of the invention, the piezoelectric vibrator is
stacked on the thin substrate, and the signal electrodes of the plurality of element-divided
piezoelectric vibrators are connected to the conductive pattern of the thin substrate. Therefore,
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the degree of freedom of the direction of taking out the signal electrode is increased, and even
when the element is a two-dimensional array, the taking out of the signal electrode becomes
easy.
[0019]
In the ultrasonic probe according to the second aspect of the present invention, the thin
substrate is laminated on the piezoelectric vibrator, and the ground electrode of the piezoelectric
vibrator divided into a plurality of elements is connected to the conductive pattern on the thin
substrate Therefore, the degree of freedom of the extraction direction of the ground electrode is
increased.
[0020]
In the ultrasonic probe according to the third aspect of the present invention, since the thin
substrate is laminated on the acoustic matching layer so that the conductive pattern functions as
a frame ground, the piezoelectric vibrator is covered with the conductive pattern without any
gap, and noise is generated. Shielding effect is improved.
[0021]
Next, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of the first embodiment of the present invention, FIG. 2 is a sectional
view taken along the line AA in FIG. 1, and FIG. 3 is a plan view of the FPC in FIG.
[0022]
In FIG. 1, reference numeral 31 denotes a back load material.
An FPC 34 as a thin substrate on which a conductive pattern 33 is formed is laminated on a thin
base material 32 of polyimide on the backing material 31.
[0023]
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On the FPC 34, a piezoelectric vibrator 35 on which a signal electrode layer is formed on the
lower surface and a ground electrode layer is formed on the upper surface is laminated.
On the piezoelectric vibrator 35, a first acoustic matching layer 36 and a second acoustic
matching layer 37 that achieve acoustic matching with the object are stacked.
Furthermore, on the second acoustic matching layer 37, an acoustic lens 38 for focusing the
ultrasonic beam is stacked.
[0024]
As shown in FIG. 2, the components other than the FPC 34 are divided into a plurality of linearly
arranged elements by dicing cutting, and acoustic isolation of each element is secured.
[0025]
The FPC 34 extends from both sides of the back load member 31, and as shown in FIG. 3, the
conductive pattern 33 is connected to the signal electrodes of the piezoelectric vibrators 35
divided into elements, and alternately in both side directions It is extended.
[0026]
A copper foil 39 is connected to the ground electrode of the piezoelectric vibrator 35 and
functions as a ground electrode extraction.
The manufacturing method of the said structure has the following methods.
[0027]
(1) Grooves are formed in the backing material 31 at a pitch P in advance, and the FPC 34, the
piezoelectric vibrator 35, the first acoustic matching layer 36, the second acoustic matching layer
37, and the acoustic lens 38 are formed thereon. By stacking them all at once or sequentially,
and dicing and cutting the FPC 34.
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[0028]
(2) After laminating the piezoelectric vibrator 35, the first acoustic matching layer 36, and the
second acoustic matching layer 37, the surface of the second acoustic matching layer 37 is
temporarily fixed to a table with good flatness. Then, dicing cut from the side of the piezoelectric
vibrator 35, next, laminate the FPC 34 and the piezoelectric vibrator 35 according to the
conductive pattern 33 of the FPC 34, and finally, on the back load material 31 cut in advance by
the pitch P. How to stack.
[0029]
Next, the operation of the above configuration will be described.
The FPC 34, which is an electrode on the signal side, and the copper foil 39, which is an
electrode on the ground side, are connected to the transmission / reception circuit of the
ultrasonic diagnostic apparatus via a coaxial cable or the like.
The transmission voltage from the main body is applied to each element of the piezoelectric
vibrator 35 via the FPC 34, converted into a sound wave, and emitted from the acoustic lens 38
into the subject.
[0030]
The acoustic wave reflected from the inside of the subject is converted into an electric signal by
the piezoelectric vibrator 35, and is sent to the ultrasonic diagnostic apparatus through a system
opposite to that at the time of transmission.
According to the above configuration, since the piezoelectric vibrator 35 is stacked on the FPC
34 and the signal electrodes of the plurality of element-divided piezoelectric vibrators 35 are
connected to the conductive pattern 33 of the FPC 34, the shape of the FPC 34 and the
conductive pattern 33 are By selecting, the extraction direction of the signal electrode can be
freely set.
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[0031]
Next, a second embodiment of the present invention will be described with reference to FIGS. 4
and 5. FIG.
FIG. 4 is a perspective view of an essential part of the second embodiment, and FIG. 5 is a plan
view of the FPC in FIG.
In the present embodiment, the same parts as those in FIG. 1 to FIG. 3 are given the same
reference numerals, and the explanation thereof will be omitted.
[0032]
The difference between this embodiment and the first embodiment is that divided elements other
than the FPC 40 are two-dimensionally arranged.
The FPC 40 extends from one side surface of the back load member 31, and as shown in FIG. 5,
the conductive pattern 41 is connected to the signal electrode of each piezoelectric vibrator 35
divided into elements.
[0033]
According to the above configuration, the piezoelectric vibrator 35 is stacked on the FPC 40, and
the signal electrodes of the plurality of element-divided piezoelectric vibrators 35 are connected
to the conductive pattern 41 of the FPC 40. Therefore, the elements are two-dimensionally
arrayed. Even if there is, it is easy to take out the signal electrode.
[0034]
Next, a third embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the same parts as those in FIG. 1 to FIG. 3 are given the same
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reference numerals, and the explanation thereof will be omitted.
The difference between this embodiment and the first embodiment is that the FPC 45 is stacked
on the piezoelectric vibrator 35 and the ground electrode of the piezoelectric vibrator 35 is
connected to the conductive pattern of the FPC 45.
[0035]
According to the above configuration, the undivided FPC 45 is stacked on the piezoelectric
vibrator 35, and the ground electrode of the piezoelectric vibrator 35 divided into a plurality of
elements is connected to the conductive pattern on the FPC 45. The direction of taking out can
be set freely.
[0036]
When the first and second acoustic matching layers 36 and 37 and the acoustic lens 38 are
stacked on the FPC 45 using an adhesive, the adhesive is formed of the piezoelectric vibrator 35
by the presence of the FPC 45. It can be prevented from entering the groove formed between.
[0037]
Next, a fourth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, the same parts as those in FIG. 1 to FIG. 3 are given the same
reference numerals, and the explanation thereof will be omitted.
The difference between this embodiment and the first embodiment is that the FPC 50 is
laminated on the first acoustic matching layer 36, and a conductive pattern which covers the
piezoelectric vibrator 35 of the FPC 50 without gaps is used as a frame ground.
[0038]
According to the above configuration, the conductive pattern of the FPC 50 functioning as a
frame ground covers the piezoelectric vibrator 35 without a gap, so that the noise shielding
effect can be enhanced.
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[0039]
As described above, according to the ultrasonic probe of the first invention, the piezoelectric
vibrator is stacked on a thin substrate, and the signal electrode of the piezoelectric vibrator is
divided into a plurality of elements. Since it is connected to the conductive pattern of the thin
substrate, the degree of freedom of the extraction direction of the signal electrode is increased,
and the extraction of the signal electrode is facilitated even if the elements are in a twodimensional array.
[0040]
According to the ultrasonic probe of the second invention, the thin substrate is laminated on the
piezoelectric vibrator, and the ground electrode of the piezoelectric vibrator divided into a
plurality of elements is connected to the conductive pattern on the thin substrate Therefore, the
degree of freedom of the extraction direction of the ground electrode can be increased.
[0041]
According to the ultrasonic probe of the third invention, the thin substrate is laminated on the
acoustic matching layer so that the conductive pattern functions as a frame ground, thereby
covering the piezoelectric vibrator with no gap. The noise shielding effect is improved.
[0042]
Brief description of the drawings
[0043]
1 is a perspective view of a first embodiment of the present invention.
[0044]
2 is a sectional view taken along the line AA in FIG.
[0045]
3 is a plan view of the FPC in FIG.
[0046]
4 is a perspective view of the main part of the second embodiment of the present invention.
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[0047]
5 is a plan view of the FPC in FIG.
[0048]
6 is a cross-sectional view for explaining the third embodiment of the present invention.
[0049]
7 is a cross-sectional view for explaining the fourth embodiment of the present invention.
[0050]
8 is a perspective view of the main part of the first conventional example of the ultrasound
probe.
[0051]
9 is a diagram for explaining the extraction of the electrode in FIG.
[0052]
10 is a perspective view of the main part of a second conventional example of the ultrasound
probe.
[0053]
11 is a diagram for explaining the extraction of the electrode in FIG.
[0054]
Explanation of sign
[0055]
Reference Signs List 31 back load member 32 base material 33 conductive pattern 34 FPC (thin
substrate) 35 piezoelectric vibrator 36 first acoustic matching layer 37 second acoustic matching
layer 38 acoustic lens
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