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DESCRIPTION JPH11309143

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DESCRIPTION JPH11309143
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to
an ultrasonic probe used as an ultrasonic wave transmitting and receiving unit in an ultrasonic
diagnostic apparatus such as a medical device. The present invention relates to a method of
manufacturing an acoustic wave probe (hereinafter referred to as an array-type probe).
[0002]
BACKGROUND OF THE INVENTION Arrayed probes consist of piezoelectric elements arranged in
the width direction, and transmit and receive ultrasonic waves by, for example, linear and sector
electronic scanning, and information from the diseased part of the living body It is known as
what you get. In recent years, along with the advancement of medical science and the upgrading
of diagnostic equipment, an ultrasonic wave frequency is increased, and a high quality and highly
reliable ultrasonic probe is desired.
[0003]
(An example of the prior art) FIG. 6 is a front view of an arrayed probe for explaining an example
of the prior art. The array type probe is formed by fixing the piezoelectric element 2 having the
drive electrode 1 (ab) on both main surfaces on the backing material 3 and guiding the drive
electrode 1 by the metal thin film 4. Furthermore, the metal thin film 4 is connected to an
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external cable, for example, by connecting a thin metal wire 7 such as a silver wire to the line 6
of the flexible substrate 5 by solder (not shown).
[0004]
Normally, first, as shown in FIG. 7, the strip-like metal thin film 4a is adhered to one side of one
main surface of the piezoelectric plate 8 facing the backing material 5. A metal film to be the
drive electrode 1 (ab) is formed on the piezoelectric plate 8. Next, one principal surface side of
the piezoelectric plate 8 having the strip-like metal thin film 4 a is fixed on the backing material
3. In this case, the strip-like metal thin film 4 a is integrally fixed to the side surface of the
backing material 3 together with the piezoelectric plate 8. Then, a cut 9 reaching the backing
material 3 from above the piezoelectric plate 8 is provided by a dicing saw or the like, and
divided into a plurality of piezoelectric elements 2 (see previous FIG. 5). At this time, a part of the
upper end side of the strip-like metal thin film 4a is simultaneously cut. Finally, the remaining
portion of the strip-like metal thin film 4 a is cut along the cut 9 into individual metal thin films 4
by a cutter.
[0005]
In such a case, the metal thin film 4 is extremely soft as compared with the one in which the
flexible substrate 5 is directly bonded to the piezoelectric plate 8 and divided, and therefore the
piezoelectric plate 8 is not warped or distorted. On the other hand, since the flexible substrate 5
is rigid, it adheres to the piezoelectric plate 8 and then causes mechanical deformation such as
warpage or distortion in the piezoelectric plate 8 due to flexible thermal deformation or the like,
thereby deteriorating ultrasonic characteristics. From this, the primary electrode lead-out by the
metal thin film 4 is performed as described above.
[0006]
(Problems to be Solved by the Invention) (Problems of the Prior Art) However, in the array type
probe of the above configuration, the strip-like metal thin film 4a is adhered to the side surface
of the backing material 3 Cut by. However, since the backing material 3 is a rubber-based resin,
the metal thin film 4 fluctuates due to its flexibility and can not be cut as expected. Further, also
in the case of soldering of the thin metal wire 7 connected to the flexible substrate 5, the
flexibility of the rubber-based resin is similarly aggravated, making smooth work difficult and
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causing breakage due to breakage or breakage. .
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to provide an array-type
probe in which the lead-out of the piezoelectric plate with little mechanical deformation is
maintained, the workability is improved, and the disconnection of the metal thin film is
prevented. .
[0008]
SUMMARY OF THE INVENTION In the present invention, the basic solution is to provide a
reinforcing plate between the side surface of the backing material and the strip metal thin film
and to bond them to each other.
[0009]
In the present invention, since the reinforcing plate is provided between the backing material 3
and the strip-like metal thin film 4a, the strength of the strip-like metal thin film 4a is enhanced
to make the cutting easy without fluctuation.
Hereinafter, an embodiment of the present invention will be described.
[0010]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 3 are ultrasonic probe
and process diagrams for explaining an embodiment of the present invention.
The same parts as in the prior art example are given the same reference numerals and their
description will be simplified. As described above, the arrayed probe connects one end side of the
strip-shaped metal thin film 4 a to one side portion of one main surface of the piezoelectric plate
8. And in this embodiment, the reinforcement board 10 is first provided in the other end side of
the strip shaped metal thin film 4a. Next, the piezoelectric plate 8 is fixed on the backing material
3 with the adhesive 11, and the reinforcing plate 10 is attached to the side surface of the backing
material 3. In the drawing, the adhesive between the piezoelectric plate 8 and the backing
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material 3 is omitted. Next, in the same manner as described above, the cut 9 reaching the
backing material 3 from above the piezoelectric plate 8 is provided to divide into the plurality of
piezoelectric elements 2 and cut a part of the upper end side of the metal thin film 4. Finally,
along the cut 9, the remaining portion of the strip-like metal thin film 4a is cut into individual
metal thin films 4 to derive the drive electrode 1b. Then, the individual thin metal films 4 and the
lines 6 of the flexible substrate 5 are connected by the thin metal wires 7 (FIG. 3).
[0011]
With such a configuration, the strip-like metal thin film 4 a is fixed by the reinforcing plate 10
and is not shaken, so that smooth cutting can be performed. Therefore, when the strip metal thin
film 4 a is cut into the individual metal thin films 4, the breakage can be prevented without any
breakage. In addition, since such individual thin metal films 4 are formed on the respective
reinforcing plates 10, even when the thin metal wires 7 are connected to the flexible substrate 5
as described above, the thin metal films 4 are fixed on the reinforcing plates 10 Since the
operation is easy, ultrasonic characteristics can be well maintained.
[0012]
[Other Matters] In the above embodiment, an example was described in which the drive electrode
1 was derived from only one side of the piezoelectric plate 8, but when the drive electrodes 1 are
derived alternately from both sides in a so-called staggered manner. But it is applicable. Further,
although the reinforcing plate 10 is protruded on the side surface of the backing material 5, a
recess may be provided on the side surface of the backing material 5 to be accommodated in the
surface (FIG. 4). The reinforcing plate 10 is attached to the backing metal 5 together with the
piezoelectric plate 8 after being connected to the strip-like metal thin film 4, but after bonding
the reinforcing plate 10 to the backing material 5, the piezoelectric plate 8 and the strip-like
metal thin film 4a are backing material It may be fixed to
[0013]
Moreover, although the backing material 5 used a solid thing and adhered the piezoelectric plate
8 etc. with an adhesive agent, for example, when manufacturing a backing material by pouring of
resin, since this becomes an adhesive agent itself, it is a separate adhesive agent Not required.
Further, although the metal thin film 4 is connected to the flexible substrate 5 by the thin metal
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wires 7, it is not limited to the flexible substrate 5 and may be a simple substrate on which a line
is formed.
[0014]
Further, in the above embodiment, although the metal thin film 4 and the flexible line 6 are
connected, it may be, for example, as shown in FIG. That is, for example, a strip metal thin film 4a
is attached to the surface of the reinforcing plate 10 as a glass epoxy plate having a conductor
formed on the surface and divided into individual piezoelectric elements 2, and then the
reinforcing plate 10 is individually separated by a dicing saw or the like. To divide. Then, the
individual reinforcing plates 10 and the lines 6 of the flexible substrate 5 are connected by the
thin metal wires 7. In this way, since it is not necessary to solder each metal thin film 4, breakage
and the like can be further prevented.
[0015]
The present invention, in summary, is provided with a reinforcing plate 10 for the purpose of
preventing breakage at the time of cutting of the strip-like metal thin film 4a and at the time of
attachment of the metal thin wire 7 to the metal thin film 4. It belongs to the technical scope of
the invention.
[0016]
According to the present invention, since reinforcing plates are provided between the side
surfaces of the backing material and the strip-like metal thin film and they are adhered to each
other, the electrode lead-out with less mechanical deformation of the piezoelectric plate is
maintained, and the workability is good. Thus, it is possible to provide an array-type probe in
which breakage of the metal thin film is prevented.
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