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DESCRIPTION JPH11355889

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DESCRIPTION JPH11355889
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
piezoelectric speaker.
[0002]
2. Description of the Related Art In FIG. 3, reference numeral 20 denotes a piezoelectric
diaphragm in which a piezoelectric ceramic plate 21 and a metal substrate 22 are bonded to
each other, and the piezoelectric diaphragm 20 is adhered to a lower case 25 with an adhesive
27. Further, the metal substrate 22 and the terminal 23, and the piezoelectric ceramic plate 21
and the terminal 24 are respectively connected by soldering and covered by the upper case 26.
[0003]
In the above-mentioned conventional example, an adhesive is applied to the lower surface of the
lower case 25 made of a synthetic resin, installed on a printed circuit board of the device, heatcured, and bonded. , 24 are respectively soldered to the copper foil pattern formed on the printed
circuit board. Such a conventional piezoelectric speaker requires two steps of bonding and
soldering for mounting the device on a printed circuit board, which requires many steps.
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[0004]
An object of the present invention is to reduce the number of man-hours and to improve
productivity in mounting an apparatus on a printed circuit board.
[0005]
[Means for Solving the Problems] In order to solve this problem, the present invention provides a
metal case, a piezoelectric diaphragm provided in the metal case, and bonding a metal substrate
and a piezoelectric ceramic plate, and one end Are connected to the piezoelectric ceramic plate,
and the other end is a terminal protruding to the outside of the metal case, and a protrusion with
a resist film formed on the periphery is formed downward on the bottom of the metal case, and
the protrusion is It is an electrode part connected to the circuit of the device.
[0006]
By this, when the piezoelectric sounding body is mounted on the printed circuit board, paste
solder is applied to the printed board or the terminal of the piezoelectric sounding body and the
installation surface of the metal case in advance, and the piezoelectric sounding body is set and
heated in a high temperature furnace. By melting the solder, the terminal and the metal case can
be simultaneously and electrically and mechanically connected to the printed circuit board, the
adhesion between the printed circuit board and the metal case becomes unnecessary, the number
of steps is reduced, and the productivity is improved.
[0007]
According to a first aspect of the present invention, there is provided a metal case, a piezoelectric
diaphragm provided in the metal case, and formed by bonding a metal substrate and a
piezoelectric ceramic plate, and one end A terminal connected to the piezoelectric ceramic plate
and having the other end projecting out of the metal case, a protrusion having a resist film
formed on the periphery is formed downward on the bottom surface of the metal case, and the
bottom surface of the protrusion As the electrode part connected to the circuit of the device,
whereby the metal case and the terminal can be soldered simultaneously to the printed circuit
board, the number of steps can be reduced, and the productivity is improved.
[0008]
The invention according to claim 2 of the present invention is the piezoelectric sounding body
according to claim 1, wherein the bottom surface of the protrusion is formed in a convex curved
surface facing downward, in the soldering of the protrusion and the printed circuit board The
gap between the curved portion and the printed circuit board can be filled with solder, and a
soldering thickness necessary for securing the soldering strength can be obtained.
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[0009]
The invention according to a third aspect of the present invention is characterized in that the
projections are formed at two positions on both sides of the base of the isosceles triangle
including the center of the metal case inside with the other end of the terminal. The piezoelectric
sounding body according to the item 1, wherein floating and play from the printed circuit board
of the device can be eliminated by the other end of the terminal and the three points of the
projection, and the installation can be stabilized.
[0010]
(Embodiment) In FIG. 1, reference numeral 1 denotes a cylindrical lower metal case, and two
projections 3 and 4 are formed on the lower surface, the details of which will be described later.
2 is a dish-shaped upper metal case.
The piezoelectric diaphragm 7 formed by bonding the metal substrate 11 and the piezoelectric
ceramic plate 10 is accommodated in the upper and lower metal cases 2 and 1, and the outer
periphery of the metal substrate 11 is a side projection of the lower metal case 1. It is supported
by 12 and held by the curling 13 of the lower metal case 1 and the upper metal case 2.
Further, one end 14 of the terminal 8 is soldered to the piezoelectric ceramic plate 10, and the
middle portion of the terminal 8 is covered with the insulating tube 9 to insulate the lower metal
case 1 and the other end 15 is protruded outward. There is.
[0011]
As shown in FIG. 2, the projections 3 and 4 formed on the bottom surface of the lower metal case
1 are formed by the curved surface 6 and the periphery thereof is printed with the resist film 5
and the lower metal together with the other end 15 of the terminal 8 It arrange | positions at the
base both ends of the isosceles triangle which includes the center of case 1 inside.
[0012]
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The lower metal case 1 and the upper metal case 2 are metal materials excellent in solderability
and press processability, and are formed of a thin material of 0.2 mm to 0.5 mm such as tinplated steel, tin-plated brass, etc. doing.
The two projections 3 and 4 formed on the bottom of the lower metal case 1 have a protrusion
size of about 0.2 mm in consideration of productivity.
The resist film 5 of the lower metal case 1 is formed by thinly printing a heat resistant resin
material such as polyester or epoxy.
The processing of the resist film 5 is carried out in a continuous process of resist coating, press
punching, bending, and the like from the metal material raw fabric before pressing, and the
productivity is extremely excellent.
[0013]
As described above, the present invention enables highly productive mounting by surface
mounting for connection between a piezoelectric sounding body and a printed circuit board.
That is, the metal case and the terminal can be simultaneously electrically and mechanically
connected to the printed circuit board printed with paste solder through the high temperature
furnace. In addition, the soldered shape can be controlled by the curved surface of the protrusion
of the metal case and the resist film or the like formed around the protrusion, and high quality
soldering can be maintained. Furthermore, since the metal case can be processed continuously
from resist application to press processing, and the protrusion is formed also as the ground
electrode of the piezoelectric sounding body, only one terminal can be led out from the internal
piezoelectric diaphragm. Well, productivity improves.
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