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DESCRIPTION JPS5648198

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DESCRIPTION JPS5648198
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal cross-sectional view of an
ultrasonic transducer according to the present invention, FIG. 2 is an exploded perspective view
showing the main parts, and FIG. It is a vertical side view showing. 1: Polymer piezoelectric film,
2.2a: electrode, 3: substrate, 4: frame.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an open-to-wave
transducer using a polymeric piezoelectric film. Electroacoustic transducers using polymeric
piezoelectric films such as polyvinylidene fluoride and polyvinyl fluoride are already well known.
Furthermore, as a structure of a transducer used in an ultrasonic region, one in which a
polymeric piezoelectric film is lined with a substrate having a larger elastic modulus and mass
than the polymeric piezoelectric film is known from the invention of Japanese Patent No. 886
922. In an ultrasonic transducer having such a structure, the thickness of the polymer
piezoelectric film "/ l-5 '/ imitation piezoelectricity, that is, the change in thickness due to the
applied voltage causes the generation of sound pressure. At the same time, the change repeatedly
applies stress to the bonding surface of the polymeric piezoelectric film and the substrate, which
may cause peeling of the bonding surface of the polymeric piezoelectric film and the substrate
during a long operation. This peeling is particularly likely to occur from the periphery of the
polymeric piezoelectric film, and particularly when the transducer is used in water, when a
portion of the peripheral portion of the polymeric piezoelectric film is peeled, water penetrates
into that portion and the peeling occurs. Will expand rapidly. The present invention has been
made to improve the disadvantages of the conventional ultrasonic transducers as described
above, and provides a highly reliable ultrasonic transducer. Hereinafter, embodiments of the
present invention will be described with reference to the drawings. In FIGS. 1 and 2, 1 is a
polymeric piezoelectric film, and thin film electrodes 2.2a (2) are formed by vapor deposition or
plating on both surfaces thereof. The polymeric piezoelectric film l is bonded by an adhesive on
the upper surface of a substrate 3 made of synthetic resin, metal or the like thicker than the
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polymeric piezoelectric film l, and further, a frame is formed on the upper surface of the
peripheral portion of the polymeric piezoelectric film l. 4 will be placed. The frame 4 is fastened
to the base 3 by a bolt 5 penetrating the polymeric piezoelectric film 1 and the base 3, and the
periphery of the polymeric piezoelectric film 1 is firmly fixed on the base 3. Furthermore, if no
electrode is provided at the peripheral fixing portion of the piezoelectric film 1, piezoelectric
vibration of the peripheral fixing portion itself does not occur, and therefore the fixing effect of
the frame 4 can be further enhanced. Any material may be used as the material of the frame 4 so
long as it has sufficient strength to fix the polymeric piezoelectric film 1, but a synthetic resin
plate or metal plate having a thickness of 0.5 mm or more is usually preferable. Leads @ 6, 6a are
connected to the electrodes 2.2a on both sides of the polymer piezoelectric film 1, and among
them, the lead wire 6a connected to the electrode 2a of the base 3 @ is provided on the base 3
(3) It is drawn out through the through hole 7.
When the peripheral frame 4 is a metal, it is not necessary to provide a lead wire particularly to
the electrode 2 in contact with the frame, and as shown in FIG. 1, take out the lead wire 6 from
the frame 4 via the bolt 5 good. In this case, in order to ensure the electrical connection between
the electrode 2 and the frame 4, it is preferable to connect the electrode 2 and the frame 4 with a
conductive adhesive 8. It is also preferable to coat the entire transducer with a silicone resin or
insulating feces, in particular, to improve the waterproofness. When the substrate 3 is metal, the
electrode 2a on the substrate side is unnecessary because it also serves as the substrate 3, and
the structure for removing the lead 116.6a is also changed as shown in FIG. That is, the lead wire
6 is taken out from the lower surface of the metal base 3, and the bolt 5 for taking out the lead
wire 6a is insulated from the base 3. As described above, the ultrasonic transducer according to
the present invention is extremely reliable for use in applications such as converting ultrasonic
waves into electrical signals under severe conditions r to prevent peeling of the polymeric
piezoelectric film (4). Have sex.
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