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DESCRIPTION JPS5760488

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JPS5760488
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1, FIGS. 2a and 2b and 3a to 3e illustrate the
structure of a conventional ultrasonic probe together with its manufacturing method, and FIGS.
4a and 4b. FIGS. 5 and 6 are diagrams for explaining one embodiment of the ultrasonic probe
according to the present invention together with a method of manufacturing the same, FIG. 7 is a
diagram showing another embodiment of the present invention, and FIG. It is a figure which
shows the principal part of the further another Example of invention.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic
probe having a plurality of ultrasonic transducers that operate independently. As an ultrasonic
probe used for a general heat-exchange-type ultrasonic transducer of an electronic scanning
type, there exists a thing shown in FIG. The ultrasonic probe is formed by arranging a plurality of
ultrasonic vibration elements 1 on an ultrasonic absorber 7 at a predetermined pitch d with a
center interval therebetween. The ultrasonic vibration element 1 used here is constructed by
providing the electrode 3.4 on the upper and lower surfaces of the vibrator 2 made of a
piezoelectric material cut into a predetermined size by means of whole surface baking or the like.
By supplying an electric signal to each of the electrodes 3.4 through the lead wires 5.6i, the
ultrasonic vibration element 1 is mechanically vibrated to generate an ultrasonic wave. And the
phase of the signal which excites these several ultrasonic vibration elements 1 is controlled, and
the ultrasonic beam which has desired directivity is obtained. An ultrasound probe of the abovedescribed structure has conventionally been manufactured as described below. As a first method,
as shown in FIG. 2 (al, a desired number of vibratory elements 1 are prepared by baking metal
electrodes 3.4 on the entire upper and lower surfaces of the vibrator 2 as shown in al). , Each
gold 1 (soldering to the shoulder of pole 3.4, etc., explosively attach lead wire 5.6). After that, as
shown in FIG. 2 ibl, a plurality of moving elements 1 manufactured in the manner of D are
arranged and adhered with a predetermined interval on the turtle sound wave absorber 7 by
bonding. The second method is, as shown in FIG. 3 (a), on the both sides of the oscillator plate 11
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made of a flat plate PZT pressing material as described above by baking electrodes etc. as
described above. Form. On the other hand, the lead wire connected to the electrode 3.4 is formed
by providing the metal plate 8 with a plurality of elongated grooves having a desired pitch d, as
shown in FIG. 3 (b). The groove width pitch d is equal to the arrangement pitch of the
transducers 2, and the remaining portion of the metal plate 8 becomes a lead wire. The metal
plate 8 is prepared to be 21 + 5, and as shown in FIG. 3 (C), when it is bonded and fixed to both
ends of the moving plate 11 by solder or the like, it becomes a lead wire group Ll (l. This lead
wire group 9 is bent at a right angle downward in the drawing as shown by a dotted line in the
drawing. Thereafter, as shown in FIG. 3 (d), the electrode side of the transducer plate 11 facing
the wave transmission / reception wavefront, that is, the electrode 3 @ is entirely bonded with
the ultrasonic absorber 7 and an adhesive such as epoxy resin. The vibrator body obtained
through such a factory is attached to a diamond force, and as shown by the broken line in FIG.
The cutting is carried out in parallel so as to pass through the center lines of the grooves
provided in the above-mentioned glue line group 9.10. As a result, as shown in FIG. 4 tel, a part
of the bonding surface of the electrode 3, the vibrator plate 11, the electrode 4 and the ultrasonic
absorber 7 is cut. By this cutting, a plurality of transducer elements 1 separated by a desired bit
or bit d are arranged on the ultrasonic absorber 7. Through such a work process, the photons of
the cutting work-although the vibrating element is omitted in the weir, it is housed in the case
and the ultrasonic probe is completed. If the method of bonding the lead wire 5.6 or 9, 10 by
soldering etc. to each vibration element 1 as described above is in the middle of the assembly
work or the probe of the diagnostic device While using as a part, you experience many
occurrences of disconnection accidents. The cause of the disconnection accident is that the
operator's mishandling to the lead wire 5.6, 9 or 10 or the expansion / contraction occurs in
each part of the probe due to the change of the ambient temperature where the probe is used
The result is that unnecessary tensile stress is applied. When such a disconnection accident
occurs, we strive to regenerate the probe by repairing the part, etc., but the density of the
vibration element is increased, and that b. As the gap is miniaturized, the repair becomes an
extremely difficult task and becomes impossible. The present invention was made in view of the
above-mentioned point, and an object of the present invention is to provide an ultrasonic probe
which can electrically connect each transducer element and each lead wire very simply and
surely. Do. In order to achieve the above object, the present invention comprises an imaging
element group arranged at a predetermined pitch and a predetermined pitch on the same plane.
It is characterized in that it is connected to a lead array arranged in a chain via a soft substance
having anisotropic conductivity. Hereinafter, the present invention will be described in detail with
reference to the drawings. An embodiment of an ultrasonic probe according to the present
invention will be described together with a method of manufacturing the same using FIGS. 4 to
46. First, one pole 22.23 is electrically separated from each other and formed on both surfaces of
the vibration element plate 21 made of a flat plate-like PZT piezoelectric material, and this
vibrator plate 21 is ultrasonic wave as shown in FIG. 4 (al The entire surface is adhered to the
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surface of the absorber 250. In this case, the length L 'of the ultrasonic absorber 25 is smaller
than the length L of the transducer plate 21, and at least 10,000 ends of the transducer plate 21
in the bonded state, ie, lead wire attachment The portion 21a is L (1, 5-2 rry mm degree) Take
Hami "one letter shape addition" from the ultrasonic wave absorber 25.
As shown in FIG. 4 (fb), the vibrator plate 21 bonded in this manner is cut in the longitudinal
direction. As a result, a part of the bonding surface of the electrode 22, the transducer plate 21,
the electrode 23, and the ultrasonic absorber 25 is cut. Thus, the plurality of transducer elements
24 provided with the electrodes 22. 23 on both surfaces of the transducer 21 are arrayed on the
surface of the ultrasonic absorber 250 at a desired pitch d apart from each other, and One end
24 a slightly protrudes from the ultrasonic absorber 25. As shown in FIG. 5, the lead wires 27
respectively connected to the electrodes 23 of the respective vibration elements 24 are partially
arranged on one side 26a of the insulating terminal plate 26 at the same pitch d as the
arrangement pitch d of the vibration elements 24. It is formed by applying a conductive
substance. Further, the lead wire 27 is formed by coating at the end [i] 26 bf of the terminal
board 26. The end face 26 b faces the electrode 23 on the lower surface of the end 24 a of the
imaging element 24 during assembly. Then, as shown in FIG. Ix 6, the terminal plate 26 on which
a plurality of lead wires 27 arranged at a predetermined distance d is formed is made to match
the arrangement of the lead wires 27 with the arrangement of the vibrating elements 24.
Between the end 24 a of the element 24 and the shoulder surface 26 b of the terminal plate 26, a
strip of soft material 28 having conductivity in the direction of arrow A in the figure, ie,
anisotropic conductivity, is inserted. The surface of the terminal plate 26 opposed to the forming
surface 26a is fixed to l1 llili of the ultrasonic absorber 25. Thus, by bringing the vibrating
element 24 and the terminal plate 26 into contact with each other via the soft material 'ji [28
having anisotropic conductivity, the electrodes 23 on the lower surface of each vibrating element
24 and the leads on the terminal plate 26 Each of the lines 27 can be securely connected with
each other. Next, the electrodes 22 on the upper surface of each imaging element 24 are
commonly connected by the thin metal plate 29 to complete the probe. Thus, here, the ultrasonic
absorber 25 and the terminal plate 26 having lead wires 27 of a predetermined pitch d and
provided on the side surface of the absorber 25 and the upper surface of the absorber 25 on the
top H + [email protected]@ The imaging element group 24 disposed at a pitch equal to the group pitch d, and
an anisotropically conductive soft material 28 provided between the terminal plate 26 and the
vibration element group 24; An ultrasonic probe is obtained in which the electrodes 23 of the
respective vibration elements 24 and the respective 11-wires 27 are electrically connected via
the soft material 28, respectively. In the probe of such a configuration, the first electrode 22 of
each imaging element 24 is a complete-semipolar, the second electrode 23 is a signal electrode,
and each imaging element 24 is electrically connected through the individual lead wires 27.
These can be mechanically driven S @ by energizing them.
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According to the present invention, the vibration element group and the lead wire group are
brought into contact with each other through the soft substance, so that a structure resistant to
vibration can be obtained. In the process of manufacturing the probe, the performance can be
easily checked. That is, immediately after cutting the imaging moving plate 21 as shown in FIG. 4
fbl, it is necessary to investigate the variations in the respective characteristics of the vibrating
elements 24 arranged on the surface of the ultrasonic absorbing material 25. In the case of
performing such an inspection, a terminal plate 26 provided with the soft substance 28 is
provided in advance in a part of the vibration element valve jig, and a structure as shown in FIG.
4 (b) is provided. The lead wire 27 and the vibrating element 24 can be easily connected by
pressing down the vibrating element group of the above, and the characteristics of each vibrating
element can be easily checked. This makes a great contribution to the improvement of the yield
of the probe because the characteristics of the vibrating element 24 after cutting can be 100%
inspected and then transferred to the next K manufacturing process. In recent years, ultrasonic
probes have been required to have higher performance. That is, the non-directionality of the
probe, the low occurrence of the transverse wave, and the high density of the number of pixels
are matters that directly affect I [1111 m. It is desirable to make the pitch d as small as possible.
As an example, d = 0.3 mm degree at the excitation frequency Zh. As described above, the lead
wire 270 on the terminal board 26 is also closely spaced, in spite of the fact that the
arrangement pitch of the image pickup elements is narrowed. As a result, a short circuit may
occur between the lead wires, which prevents the densification of the probe. As a method of
solving this problem, as shown in FIG. 7, as shown in FIG. 7, a number of terminal plates 26 'of
the other plate are provided on 11 surfaces facing the side surface of the ultrasonic absorber 25
on which the terminal plate 26 is provided. It can be solved by That is, on the skin plate 26.26 ',
the lead wires 27 having the same shape are provided at pitches 2d twice the arrangement pitch
d of the vibrating elements 24. When the two terminal plates 26, 26 'are fixed to the opposite
side surfaces of the absorber 25, the positions of the lead wires of the terminal plate 26' with
respect to the lead wires 27 of the terminal plate 26 are When fixed with just a half shift, each
electrode 23 of the odd-numbered vibration element group in the vibration element group 24 is
connected to each lead wire f 27 of the terminal plate 26. The electrodes 23 of the evennumbered even-numbered vibration element groups of the well-known and unconnected ones are
respectively connected to the lead wires 27 of the terminal plate 26 '.
Thus, by alternately connecting the lead wires 27 of the two terminal plates 26 and 26 'to the
electrodes 23 of the respective vibration elements 24, the arrangement pitch of the lead wires 27
is set to 2 of the arrangement pitch of the vibration elements 24. The density can be doubled,
and even higher density can be realized without shorting between the lead wires. FIG. 8 is a view
showing the main part of another embodiment of the present invention, and shows the
configuration of a terminal plate for achieving higher density. That is, a plurality of terminal
boards 26 provided with the lead wires 27 with a predetermined pitch are stacked and adhered
to form a terminal board 30 having a multilayer structure. In this case, the pitch of the lead wires
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27 provided on each terminal plate 26 may be twice the number of the terminal plates 26
superimposed on the pitch d of the vibrators. For example, when four terminal boards 26 are
stacked, the pitch of the lead wire 27 provided on each terminal board 26 is 4 d when the
terminal boards 30 are attached only to the 111 IU surface of the ultrasonic wave absorber, and
it is 1 When it is attached, it becomes 8d, and the gap between the lead wires to be provided on
the terminal board becomes wider. This has the features described below. That first. It is possible
to insert a ground electrode between each lead 27 as 1 and thereby shield the lead 27 one-toone. Second, it is possible to provide a part of the ultrasonic transmission / reception circuit 2 by
using the device manufacturing technology on the surface of the terminal board 26 2, and this
whole system for compacting the whole diagnostic device It is possible to realize a device with
excellent operability. As the soft material 28 used in the present invention, for example, an
interconnector (AP type) manufactured by Shin-Etsu Polymer Co., Ltd. is suitable. In this
connector, conductive materials are arranged innumerably in the thickness direction of the sheet,
and the conductive materials protrude several μs from the surface. Therefore, it is an anisotropic
conductive rubber which is a conductor in a direction perpendicular to the sheet surface and an
insulator in a parallel direction. As described above, according to the present invention, it is
possible to extremely easily provide an ultrasonic probe in which lead wires are respectively
connected to a large number of transducer elements arranged at predetermined intervals in an
ultrasonic absorber. Then, according to the present invention, after bonding the flat transducer
plate on the entire surface of the ultrasonic wave absorber surface, the imaging element group
cut at a predetermined interval and the lead wire group printed at a predetermined interval on
the terminal board The connection of the lead wire to each transducer can be easily made K and
surely by simply bringing the two into contact via the soft substance having anisotropic
conductivity. As a result, the structure is resistant to vibration, breaks frequently during assembly
work or handling, and does not require careful handling, thus improving productivity, economy,
and reliability. It plays.
In addition, by forming the terminal board on which the lead wires are printed in a laminated
structure, the spacing between the lead wires can be effectively reduced, and therefore, it is
possible to realize high density of the imaging element. Furthermore, by providing integrated
circuits on each terminal board, downsizing of the diagnostic device and improvement of
operability can be achieved.
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