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BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a structural example of a conventional
ultrasonic transducer, and FIG. 2 shows a structural example of an ultrasonic transducer
according to the present invention. Ultrasonic transducer, 2 packing material, 3: resin layer.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic
transducer, especially for medical use v6. Medical and medical application technology of 15
ultrasonic wave receiving device (, 19 human body set, ((after 2 times emitting ultrasonic wave
and converting the ultrasonic wave reflected by 2 tissues into electric signal by the receiver 7) ' It
is something to be treated as an euphemism of the organization by applying electronic
processing. Its features include the ability to observe X-rays through (1), the ability to observe
tissue that is surrounded by soft tissues and bones of '17 / 2 ', and real-time observation of the
tissue. jT can be mentioned. In the ultrasonic transducer, the ultrasonic transducer element is
fixed to the bottom of the flexible bulk 5 king material mixed with metal powder and contained in
a substantially rectangular housing, and the element or the surface of the housing becomes a
sheet. As described above, the backing material is fixed to the inner surface of the housing. An
eleventh is a structural example of a conventional ultrasonic transducer. 10: here 1: l is an
ultrasonic transducer, and the element material is ceramic. Reference numeral 2 denotes a
banking material, which is made of special rubber or special plastic mixed with metal powder,
porcelain powder or the like having a large density of two or more in order to match acoustic
impedance with the element 1, and has 15 flexibility. The backing material 2 reinforces and
supports the fragile ultrasonic transducer 1. The ultrasonic transducer element 1 is fixed to the
bottom surface of the banking material 2Q as a one-piece element from the adhesive material Z2
as a one-piece element in order to suppress variations in its characteristics. After fixing, the core
element 1 is cut into strips in the middle direction with a predetermined width (2). The banking
material 2 has flexibility-C '), and the backing material No. 2 and 2 distortion occur at the time of
the ultrasonic transducer 1 power cutting, so that the element processing may be repelled or
broken). There is a shortage of 5 to 70 (Ai. In order to prevent this, it is conceivable to
individually bond the previously cut elements separately to the backing material, but this means
significantly increases the burden of one operation and causes variations in element
characteristics. It must be avoided. 10 Therefore, the present invention is intended to improve
the disadvantages of the conventional ultrasonic transducer, the purpose of which is the removal
and breakage of the wave changer element at the time of manufacture? Anti-LI: It is to provide an
ultrasonic transducer with a structure of seven layers, and its feature is that the bottom surface
of the banking material is made of the super praying wave conversion element 15 via a resin
layer having a higher hardness than the backing material. The ultrasonic transducer is
configured to be fixed to the
An embodiment will be described below with reference to the drawings. The second shows 11)
an example of the structure of an ultrasonic transducer according to the present invention (3). l
and 2 are the same as in FIG. 81, and in other words, the ultrasonic transducer and the packing o.
A resin layer 3 has a hardness of 7 pots as compared to the backing material. The ultrasonic
transducer 11 is fixed to the bottom of the backing material 2 through the resin 5 layer 3 as an
element of a single-piece product. Such an element of one piece? Since the resin 7 is adhesively
bonded, it does not require a burden on one operation, and the occurrence of variations in
element characteristics can be prevented. After fixing, the element 1 is cut into strips of a
predetermined width: two. In this case 10, the cutting depth 9 is set to be in the middle of the
resin layer 3 as shown in FIG. 7 (7, the element 1 is completely cut. Because the resin layer 3 is
harder in comparison with the banking material 2 itself. The backing material 2Q) produced at
the time of cutting of the element 1 is generated along the edge of the backing material 2Q).
Although not shown in FIG. 1, lead wires are drawn from suitable ultrasonic transducers 15
which are not shown in FIG. 1 from the individual ultrasonic transducers 15 which have been cut,
and are connected to external electronic devices. The resin layer 3 is made of, for example, an
epoxy resin mixed with metal powder (aluminum powder, tungsten, etc.) [7. , Use same wave
number Sini related. Assuming that the wavelength is λ, the thickness of the resin layer 3 is a
case. Husband λ, ...? in the range of λ (n: odd number)] and 0.3 to 1. In the thickness range of O
mm, select and determine the appropriate thickness for the operating frequency. Therefore, the
speed of the resin layer 3 with a frequency of 2 C will be thin, if the frequency is too thin. If it is
too wide open, it does not make sense to provide a resin layer, so that when the ultrasonic
transducer is cut, the element is easily broken. (10) Conversely, if the resin layer 3 is thickened,
forest-like echo will be generated inside the transducer. Therefore, as described above, the
thickness of the resin layer 3 is within the range of 0.3 to 1.0 cylinder. In the ultrasonic
transducer 15 according to the present invention described below, the ultrasonic transducer is
used as a buffing / gluing through a resin layer mixed with a metal powder having a thickness of
0.3 to 1.0 cubic inch. Since it is configured to be fixed to the bottom surface of the material, it
has the effect of being able to prevent peeling and breakage of the ultrasonic transducer when it
is cut. Add (5)
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description, jps55156712
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