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The present invention relates to (1) a method of manufacturing an electrode of a ceramic
electronic component used in, for example, a small electronic device. In recent years, base metal
materials such as zinc, copper, nickel, and aluminum have come to be used as electrode materials
for ceramic electrical components, but these materials have conductivity when baked in the
atmosphere. Since the wettability is very poor, when soldering the external connection lead to the
electrode, the material is baked in a reducing atmosphere or baked in the air to improve the
solder wettability of the 1A 1 electrode surface. The plating process was performed. According to
this method, the solderability is improved over the entire surface of the electrode, but when it is
required to solder the external connection lead at a predetermined position on the limb electrode
(a narrow portion: That is, for example, in a small ceramic electrical component with a diameter
of 10 H?, the position and size of the soldering on the electrode should be smaller than 2 J) I?))
In the present invention, the object of the present invention is to eliminate such inconveniences,
and in a ceramic electric component in which a metal electrode having poor solderability is
deposited at a predetermined position of the ceramic body. A plating solution containing a metal
having good solder wettability is dropped on a predetermined portion on the metal electrode, and
the portion for the external connection conductor soldering is formed on the portion.
Embodiments of the invention will now be described with reference to the drawings. The
drawings show five piezoelectric ceramic plates used in, for example, a piezoelectric visor
manufactured by the manufacturing method of the present invention. In the same figure, the
ceramic body (1) is a porcelain exhibiting high piezoelectricity mainly composed of pb (ZrTi) 03,
and has a thickness of 0.2 ? as the shape. One side of the ceramic body (1) is coated with F zinc
(Zn) in a screen printing method, dried, and then baked in the air at 600 ░ C., and the zinc
electrode (2) having very poor solder wettability is obtained This is washed, heated to 70 ░ C.
and heated to 70 ░ C., and a plating solution containing copper sulfate as a main component and
a reducing agent and a complexing agent is added to a predetermined portion of the electrode (2)
using, for example, a dropper. After 1 minute, the reaction was finished, washed with pure water
and dried, and gold N (3) having good solder wettability was deposited, and the outer connection
conductor soldering formed a capital. The same treatment was applied to the opposite side, and
copper coated with the metal (3) was coated with the zinc electrode (2) and the solderable
external connection conductor. The table below shows two types of piezoelectric ceramic plates A
and B with the copper plating area changed by dropping the plating solution at 0.5 tm ? ? and
9 m ? ? to the ceramic body and changing the copper plating area, and 200 ?m of the plating
solution. 8 is dropped and the entire surface of the electrode is plated with copper, and screen
printing is carried out for the external connection conductor soldering, leaving the 2R? of the
part and applying the resist and drying, and for the piezoelectric ceramic plate 0 (10 pieces each)
The results of measuring the relative dielectric constant ? and the electromechanical coupling
coefficient are shown.
The polarization treatment 17j and the soldering of the external connection conductor of the
piezoelectric ceramic plate were performed for 2 hours at 120 ░ C. and 2 KV / 1111. As
described above, the soldering of the electrodes of the piezoelectric ceramic plate (A, B)
according to the present invention can be made almost equal in area to the resist coating and J:
soldered to the case where the area is regulated. I was able to make a cohabitation. As described
above, according to the present invention, a plating solution containing a metal having good
solder wettability is dropped onto a predetermined portion on a metal electrode having poor
solder wettability deposited on the ceramic body in the ceramic suction part, As part of external
connection conductor soldering is formed in the local area, the manufacturing process is
simplified as compared with the conventional method, and metal with good solder wettability can
be saved, and the manufacturing time can be shortened. Have.
Brief description of the drawings
FIG. 1 and FIG. 2 show a side view and a plan view of a piezoelectric ceramic plate in which an
electrode is formed by the manufacturing method of the present invention.
(1) иии Ceramic body (2) и и и Poorly wettable metal electrode (3) и и и Well solderable metal patent
applicant Taiyo Yuden Co., Ltd.
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description, jps59126399
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