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DESCRIPTION JPS62122499

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DESCRIPTION JPS62122499
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
method of forming a composite piezoelectric material used for a probe or the like for an
ultrasonic diagnostic apparatus. BACKGROUND OF THE INVENTION The construction of a
composite piezoelectric material targeted by the present invention is shown in FIG. 101 is a
columnar vibrator such as lead zirconate titanate! +, 102 are resins such as silicone rubber. A
conventional processing example of this composite piezoelectric material is described in Senna
Technology, 1982. VOt 2.47. Pm) Fix the transducer block to the base with adhesive as in 81-86.
Slicing with an appropriate thickness, filling and curing epoxy in the gap, slicing in the direction
orthogonal to the tip, filling curing with epoxy in the gap, and cutting 9 into a suitable thickness.
However, if the filled resin is soft or if it is thinly cut out, processing becomes very difficult.
OBJECTS OF THE INVENTION It is an object of the present invention to provide a method of
forming a reliable composite piezoelectric material that can be manufactured. [Summary of the
Invention] The feature of the present invention is to form a cutting groove leaving a part of the
thickness from the surface of the vibrator, fill the cutting groove with a resin, turn over the
vibrator and turn off the columnar vibration of a predetermined thickness. This is a method of
forming a composite piezoelectric material in which an unnecessary portion of the back surface
vibrator is scraped to make it a child. DESCRIPTION OF THE PREFERRED EMBODIMENTS The
present invention will now be described by way of examples. First, as shown in FIG. 2A, the
vibrator 201 is temporarily adhered to a platform 203 with good parallelism and flatness by a
resin 202 which is softened by heating, such as wax. Next, instead of completely cutting 201, as
in (B), a thickness greater than the thickness of the composite piezoelectric material to be formed
in a matrix while leaving a part of the thickness of 201. Forming a cut IIjr groove 204 using a
dicing saw. Next, polyurethane, EVO, resin or the like or resin 206 is filled and cured in 204 (C)
and melted 202, and (D) O is reversed 201 so that wax etc. is provided on the table 207 with
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good parallelism and flatness. Temporarily bond at 208. Next, unnecessary portions are scraped
off in order using the thick blade 209 or using the disk and the outer periphery of the stone so as
to obtain the thickness t2 of the composite piezoelectric material to be formed as shown in (E).
Go. By doing this, a composite piezoelectric material can be obtained by peeling off from (207) as
in (F). In this method, it is one point to scrape off an unnecessary part little by little at 209, and in
this way the stress at the time of scraping is small and acts on a part of 201 only. In the method
of cutting thin sections from a block in which a vibrator plate is laminated as in the conventional
method, or in the method of grinding the entire surface of the element at once in the state of FIG.
2 (D) In the method of this embodiment, it is possible to produce a composite piezoelectric
material having a soft resin 206 or a very thin composite piezoelectric material.
Furthermore, as shown in FIG. 2 CB), the cutting grooves are formed in a matrix, and in the case
where the element is chipped (i.e., in the case of a composite piezoelectric material, it means that
the columnar vibrator is missing). It should be like. That is, first, after the state of FIG. 2 (A) is set,
the cutting groove 302 is formed in one direction of the vibrator 301 (FIG. 3 (A)). Note that 303
and 304 correspond to 202 and 203, respectively. Thereafter, a resin such as epoxy is filled and
cured in 302 (FIG. 3 (B)), and then a cutting groove 306 is formed in the perpendicular direction
(FIG. 3 (C)). Further, the resin is filled with filler 307 (FIG. 3 (D)). By this, the state corresponding
to FIG. 2 (C) is obtained. The subsequent method of forming the composite piezoelectric material
is shown in FIG. 2 (D), (E). It is the same as the method described in (11 '). Moreover, as for 305,
it is desirable that the machinability is good. By using the method of FIG. 3, it is also possible to
further reduce chipping of the element. Moreover, it is also possible to use resin of different
material as 305 and 307. That is, the composite piezoelectric material shown in the present
invention. The nature changes depending on the organic matter loaded. ?????? By using
different materials such as epoxy and polyurethane as 305. 307, it is possible to construct a
composite piezoelectric material having various properties. Next, another embodiment is shown
in which the embodiment shown in FIG. 3 is further developed. First, as shown in FIG. 4A, the
vibrator 401 is temporarily adhered to a platform 403 with good parallelism and flatness by a
resin 402 or the like that softens when heated, such as wax. Next, instead of completely cutting K
and 401, a cutting groove 404 is formed in one direction 401 as in CB). At this time, a reference
line 405 is made at 401 by cutting or the like. Thereafter, the resin 404 such as epoxy is filled
and hardened at 404 (C), and then a cutting groove 407 is formed at right angles (D). At this
time, a reference line 408 is made at 401 by cutting or the like. Furthermore, a resin 407 is filled
and cured 409 (E), and 201 is turned over as in CF), and is adhered to a base 410 with good
parallelism and flatness by wax 411 or the like. ???? Based on 405.408, a cutting groove
412 is formed until reaching 404 and 407 G) and resin etc. is filled and hardened 213 (H).
Finally, the wax is melted and peeled off from 410 to form the first composite piezoelectric
material.
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In Nao (G) and (H), IJ LUX-like cut and filled with resin, but as in (B), (C), (D) and (H), cut groove
formation in only one direction, Resin Filling 1 It is also possible to adopt a method of forming a
cutting groove in the direction intersecting with the resin filling first and resin filling. The resin of
406 has the effect of preventing chipping of the element at the time of formation of 407, and by
turning it over and cutting it. Even if the resin 406.409 is somewhat soft, it can form a large
number of columnar vibrators with almost no chipping. In addition, according to the method of
the present embodiment, it is possible to fill up to four types of cutouts. The composite
piezoelectric material changes its properties due to the nature of the resin. Therefore, the method
of the present invention can realize more diverse composite piezoelectric materials. As described
above, according to the method of the present invention, the composite piezoelectric material
which has been difficult to process can be easily and surely manufactured, and therefore mass
production is possible.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is a perspective view showing a method of forming a composite piezoelectric material
according to an embodiment of the present invention, and FIGS. 2, 3 and 4 which are targets of
the present invention.
201. 301, 401 иии Vibrator, 203, 207 ░ 304. 403 иии Support base, 204, 302, 306 ░ 404. 407 иии
Cutting at groove, 206, 305, 307 ░ 406. 409, 413 ... resin. / (Rho) / / (rho) 2MZ Figure (A) (El),
3 (A) alpha one ([3) (p
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