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DESCRIPTION JPS63146697

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DESCRIPTION JPS63146697
[0001]
The present invention relates to the FJ JZh method of a two-dimensional array transducer in
which prismatic elements are arranged in a grid. (Prior Art) Conventionally, various methods are
known for producing a two-dimensional seven-layer transducer in which prismatic elements are
arranged in a grid pattern j1. For example, one example is disclosed in IE [[[TRANS-ACTIONS ON
5 ONIC 3 AND II LTRAs ON Ics, VOL, 5 U-19 ° NO, 4, 0 CTOB [R 1972]. According to the above
disclosure, a two-dimensional array transducer is fabricated in the steps shown in FIGS. 6 (a)-(C).
Hithering (1) (1) The surface of a thin II electric root 1 is diced into a grid (the cut is about 93%
in the direction of 1 g). これにより■4! (Diagram (J 'side // 11 angled t1 shaped element 2 is
formed (FIG. 6 (a)). (2) From the side not to be diced, a through hole 3 is provided in the "-" of the
prismatic element 2 (FIG. 6 (b)). (3) Insulating-coated nI! Supported by the backing material 4
(the surface facing the piezoelectric plate 1 is covered with a conductive film). The 115 is
inserted into the through hole 3 and the backing material 4 is joined to the piezoelectric plate 3
to be integrated (FIG. 6 (C)). (4) The conducting wire 5 led to the side of the prismatic element 2
is soldered to the head of each element 2 (FIGS. 6 (d) and 6 (e)). (D) In the figure, 10 square
prismatic elements are soldered, and (81 is an enlarged view of the soldered portion). The head
of the element to be soldered is an individual electrode, and the conductive film to be bonded to
the surface of the non-dicing 1f conductor 1 is a common electrode. By the way, since each
element is not completely disconnected at J3 in the two-dimensional array transducer according
to the method of F, there is a cost coupling between each element. Such coupling degrades the
acoustic properties. Therefore, it is desirable that the elements of the two-dimensional array
transducer be completely separated in terms of the eight-echo characteristics. (Problems to be
Solved by the Invention) However, in the conventional manufacturing method, if the piezoelectric
plate is completely diced and struck and the cuts in the above step (1) are 100χ, each element
will be separated. It becomes difficult to connect the lead wire of the common electrode (it
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becomes difficult to pull out the ground electrode). Further, in the method for drawing out the
individual electrodes in the conventional manufacturing method, the lead wire is inserted
through the through hole provided in the piezoelectric plate corresponding to each electrode
position, so that the operation is very troublesome. .
That is, it can be said that the conventional manufacturing method is not suitable for the 4
productions, as it is difficult to falsify the 88+ characteristic. This invention is made in view of
this point, The objective is to implement | achieve the manufacturing method which can deliver
two-dimensional array transmitter ': I-sa with small gW coupling | bonding. The first method of
manufacturing a two-dimensional array transformer according to the present invention for
achieving the above object is to temporarily bond a piezoelectric plate on a pedestal, and to use
piezoelectric from the non-bonded side. The board is completely diced in a grid pattern to form a
large number of prismatic elements, and a backing material whose bonding surface is made
conductive is bonded to the non-base side of the prismatic elements, and a table P is a squareshaped niremen]- After removing from it, connect the lead wire of 1 ° 1 J to the rise of the
prismatic element, install it in the groove formed between the 11 corner elements and pull it out,
and ground the conductorized surface of backing H It is intended to connect the lead wire for
The second manufacturing method of the two-dimensional array transducer according to the
present invention is characterized in that the l-shaped rectangular column J in the base 1 of F,
the process of forming the element, the front plate with the junction surface made conductive
The step of bonding to the non-base side of the columnar element, the step of removing the base
from the prismatic element in this state, and the step of bonding and integrating the backing
material to the front plate are carried out. It is about to get into. The present invention will be
described in detail with reference to the drawings. FIG. 1 is an explanatory view of a
manufacturing method according to an embodiment of the present invention. Hereinafter, steps
from (a) to (C) will be described. (1) A pressure board 11 such as PIT is temporarily adhered on a
pedestal 12 by hot melt or the like (FIG. 1 (a)). Both surfaces of the piezoelectric plate 11 are
coated with an extremely thin film (not shown). The pedestal 12 is composed of an object that
dissolves in a solvent, an object that melts or decomposes at a predetermined temperature, such
as ebopite, or a soft object. (2) The piezoelectric plate 11 is completely diced from the nonadhesive side by a known cutter in a l-shape. As a result, a large number of prismatic elements
13 are formed on the pedestal 12 (FIG. 1 (b)). (3) Using a conductive adhesive, the non-base side
(head of the element) of the prismatic element 13 is observed on the front plate 14 (FIG. 1 (C)).
The main body of the front plate 14 is made of glass, plastic snack or the like, and the bonding
surface is attached by a thin conductive film w1 (the bonding surface is made conductive). (4)
The pedestal 12 is melted under the melting point M of the pedestal 12 and removed from the
prismatic element (FIG. 1 (d)).
(5) The front plate 14 is cut according to the shape of the assembly of the prismatic elements 13
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(the shape of the piezoelectric plate 11). (6) The backing material 15 is joined and integrated on
the non-prism element side of the front plate 14 (FIG. 1 (e)). (7) Connect the signal conductors to
the non-backing material sides (heads of the elements) of the prismatic J-rement 13 respectively,
bundle them, and install them in the grooves formed between adjacent prismatic elements and
pull them out. Connect the drawn signal wire to the cable. (8) The ground lead wire is connected
to the conductor film of the front plate 14. The lead wires installed by the step (1) have the
configurations shown in FIGS. 2 and 3. FIG. 2 is a schematic cross-sectional view of the
transducer, and FIG. 3 is a schematic plan view of the transducer (both contain part of the
transducer). The connection between the head for the bowing IQ 16 and the head of the
prismatic element 13 is made by bonding 17 (also by soldering or contact). The head of the
element after connection is covered by a matching layer 18 consisting of emboss. The lead-out
directions of the signal conductor 16 are two directions which are led in opposite directions
along the full 19 (see FIG. 3). In the two-dimensional array produced by the above-described
steps [in the columnar shape, the prismatic elements 13 are completely diced. Also, the prismatic
element 13 is accurate i! It is fixed to the conductor crotch (on the common electrode) of the
front plate 14 while holding the board 11 arrangement. Furthermore, the lead lines 16 of the
individual electrodes are bundled and securely installed in the grooves 19 formed between the
prismatic elements 13. Next, another embodiment of the present invention will be described.
Another feature of the present invention is that a prismatic element, which is diced on a backing
material whose junction surface is made conductive, is directly installed without using a front
plate. Immediately, the following steps are provided. (The piezoelectric plate of (11P i I ′, t;) is
temporarily attached to the pedestal by hot melt or the like. Both sides of the piezoelectric plate
are coated with a very thin film. The pedestal is composed of an object which dissolves in a
solvent, or an object which melts or decomposes at a predetermined temperature, for example, a
somewhat soft object such as J-polyite. (2) If the lightning temporary from the non-adhesion side
is completely diced into ES grid-like by a known cutter. This creates a large number of corners (lshaped elements on the pedestal. (3) Bond the non-base side (Dfi of the element) of the prismatic
element to the backing material using a conductive adhesive. The bonding surface of the backing
material is plated with copper or silver.
(4) Melt temperature of the pedestal Melt the pedestal with the hand and remove it from the
prismatic element. (5) Connect the non-backing material side (head of the element) of each
prismatic r-remen 1 to each of the fi \ j Jl conducting wires, bundle them and place them in the
groove formed between adjacent prismatic prisms] Pull out. Connect the drawn signal wire to the
cable. (6) Connect the ground lead wire to the conductor of the backing material. As in the case
of the previous step, the prismatic element 13 is completely diced, as in the case of such a T 稈.
Also, prismatic elements are accurate L! s [+ is held on the backing material conductor (on the
common electrode) to hold the array. Furthermore, the lead lines of the individual electrodes are
bundled and securely placed in the space formed between the prismatic elements. The present
invention does not limit the construction of the connection to the fli-dedicated lead wire
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columnar element to the above embodiment, but may be, for example, the construction shown in
FIG. 4 or FIG. Same as Fig. 2). In the example of FIG. 4, the signal conductor 16 is a conductor
such that the horizontal direction including the ridges of the head of the prismatic element 13 is
not exceeded (the unevenness is not formed in the horizontal plane including the head of the
lens). It is bonded to the end face of the layer (film) 20. Further, in the example of FIG. 5, a part of
the conductor layer 21 is made to be a single layer on the conductor layer (film) 20 with a part
thereof protruding to the side of the full 19 and the signal wire 16 is a projection of the
conductor layer 21. It is connected to the. In each of these figures, a two-layered structure
consisting of glass 22, triacetylcellulose 23, etc. with a matching layer of glass 22 and
triacetylcellulose 23 is easily formed so that the water P surface is flat and the head of the
prismatic element 133 is flat. It is C to be realized. In the history, Jlf-1 of the prismatic element
and the backing material in the step (3) of the second embodiment may be performed with a thin
sheet in which flux and 2r III are laminated. In this case, the sheet is interposed between the
nilemen 1 and the bat V, and Jll J, t holds the state, and the solder melting temperature (about
200 to 220 ° C.) is −LJ, ¥. Return to normal temperature after warming. Thereby, the prismatic
element can be adhered to the backing material. In this method, it is necessary to use a pedestal
and a backing material that withstands thermal cycling. For example, as a backing material, Evo
V-Si, polyimide, etc. is used as a base material and ferrite rJ) powder, etc. is absorbed. '+ JM
mixed is not a problem. In history, it is easy to apply the manufacturing method of the present
invention to the manufacturing method of a one-dimensional array transducer.
For example, if a base and a pedestal are made to have a convex curved surface, for example, a
base for producing an array transfer number of a concave curved surface array, it is possible to
obtain a desired array of 7-ray curved surfaces. . As described above, the two-dimensional array
of the present invention! -According to the manufacturing method of non-ducers, is the common
arrangement of prismatic elements formed by complete dicing? Since the temporary attachment
to the C pedestal is completed after the process of fixing to the i pole is completed, the twodimensional arrangement can be accurately maintained. In addition, since the lead lines of the
individual electrodes are interrogated in the grooves formed between the respective elements, it
is simpler than the operation of inserting the through holes. Therefore, according to the
manufacturing Ij method of the present invention, it is possible to produce four two-dimensional
array transducers with small acoustic coupling.
[0002]
Brief description of the drawings
[0003]
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1 (a) to 1 (e) are explanatory views of a manufacturing process according to an embodiment of
the present invention, and FIGS. 2 and 3 are configuration diagrams of lead lines of individual
electrodes in an embodiment of the present invention, FIG. 4 is a block diagram of the lead wire
of the individual electrode in another embodiment of the present invention, FIG. 5 is a block
diagram of the lead wire of the individual electrode in another embodiment of the present
invention, and FIG. FIG. 18 is an explanatory drawing of the manufacturing process of the array
transducer 4;
11: Piezoelectric body, 12: pedestal, 13: prismatic element, 14: front plate, 15: backing material,
16: conductor for signal, 17: bonding, 18 ... Matching layer, 19 ... groove.
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