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DESCRIPTION JPS63242100

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DESCRIPTION JPS63242100
[0001]
The invention relates to a method of producing an ultrasound probe. (Prior Art) Ultrasonic
probes having ultrasonic transducers (hereinafter referred to as "vibrator") having an ultrasonic
wave transmitting / receiving function in a row arrangement are widely used in the technical
field of medical diagnosis and other various technical fields . A conventional example of a method
of manufacturing such an ultrasonic probe will be mainly described with reference to a method
of connecting a ground plate to each transducer. First, as shown in FIGS. 7 (a) and 7 (b), the
negative electrode @ 2a is provided on part of the upper surface, the side surface and the bottom,
and the positive electrode layer 2b is provided on the remaining part of the bottom. The vibrators
1 a, Ib,... Divided by the slits 3 of width are joined to the backing material 4. Next, as shown in
FIGS. 8 (a) and 8 (b), using the adhesive 5 having conductivity for the negative electrode layer 2a
on the side of each of the vibrators 1a, 1b... Directly bond the ground plate 6 to the As a result,
the ground plate 6 functions as a common ground plate for each of the image pickup actuators
1a, 1b,. However, in the ultrasonic probe manufactured by the above-described conventional
manufacturing method, as shown in FIG. 9, a minute gap is formed on the bottom side of each of
the transducers 1a, 1b,. The negative electrode 2a and the positive electrode 1! There is a
problem that the adhesive flows into between 2b and as a result, short circuit between both
electrode layers 2a and 2b occurs. (Problems to be Solved by the Invention) As described above,
the conventional method of manufacturing the ultrasonic wave 70- includes the problem that the
manufacturing yield of the ultrasonic probe is reduced due to the short circuit between the
electrode layers. Therefore, an object of the present invention is to provide a method of
manufacturing an ultrasonic probe which can avoid electrode layer short circuit in the
manufacturing stage and can improve the manufacturing yield. [Configuration of the Invention]
(Means for Solving the Problems) According to the manufacturing method of the present
invention, the end portion of the conductive plate is formed on only one of the electrode layers
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with respect to the vibrator base on which a pair of electrode layers are formed in proximity.
Bonding the vibrator base and the conductive plate at predetermined intervals to form a vibrator
group and a conductive member group corresponding thereto, and a ground plate at the other
end of each conductive member group And b. (Operation) According to the manufacturing
method of the present invention, after the conductive plate is joined only to one of the electrode
layers formed on the vibrator base, the vibrator base and the conductive plate are cut to form a
group of vibrators and the like. Since the corresponding conductive member group is formed and
the ground plate is joined to the conductive member group at the gap, the cause of short circuit
between the pair of electrode layers is eliminated, and the manufacturing yield is improved.
An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. In
each of these figures, the same reference numerals are given to those having the same functions
as those shown in FIG. First, as shown in FIG. 1 and FIG. 2, the negative electrode side electrode
layer 2a and the positive electrode side electrode layer 2b are formed in advance on the ceramic
vibrator base 1 in the same arrangement as in the prior art and One end 7 a of the conductive
plate 7 is joined only to the bottom area 2 at of the negative electrode layer 2 a formed on the
bottom end side of the base material 1. As the bonding method, in addition to the case of using
the conductive adhesive 5 as shown in FIG. 1 and FIG. 2, a method such as soldering may be
used. When bonding the conductive plate 7 to the bottom surface area 2 at, the amount of the
adhesive 5 applied is adjusted so that the adhesive 5 does not reach the positive electrode layer 2
b. Next, as shown in FIGS. 3 (a) and 3 (b), a backing material having at one end a notch 8a formed
in advance in consideration of the thickness of the conductive plate 7 and the bonding area to
the bottom region 2at. 8 is adhered and fixed to the lower surface of the positive electrode layer
2 b and the lower surface of the conductive plate 7. As shown in FIGS. 4 (a) and 4 (b), the
negative electrode side electrode layer 2a, and the vibrator base 1. The positive electrode side
electrode layer 2b is cut at predetermined intervals to form a vibrator group 10 including
vibrators 1a, 1b,... Each vibrator 1a is cut to a width equivalent to lb,. Conductive members 7a, 7b
respectively corresponding to 1b,. Forming a conductive member group 11. Next, as shown in
FIGS. 5 (a) and 5 (b), the conductive members 7a, 7b,... Are uniformly bent toward the backing
material 8, and then the conductive members 7a are bent. 7b. A ground plate 9 of a
predetermined size is joined using a conductive adhesive 5 at the end of... According to the
method of manufacturing the ultrasonic probe described above, the conductive plate 7 is bonded
in advance only to the bottom surface area 2 at of the negative electrode 82a, and then the
vibrator group 1o and the conductive member group 11 are formed. Since the step of bonding to
the conductive member group 11 is performed, the cause of the short circuit between the
negative electrode side electrode layer 2a and the positive electrode side electrode layer 2b is
eliminated, whereby the production yield of the ultrasonic probe is improved. The present
invention is not limited to the embodiments described above, and various modifications can be
made within the scope of the invention. As an application example of the present invention, as
shown in FIG. 6, the case where one ground plate 12 is used can be mentioned. That is, along the
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side 12c of the ground plate 12, a junction 12a having a size to be joined to the bottom region
2at of the negative electrode layer 2a and having a distance corresponding to each of the
transducers 1a, 1b,. , 12b,... Are formed, and the bonding portions 12a, 12b,... Are bonded to the
bottom surface regions 2at of the negative electrode layer 2a of the vibrators 1a, 1b,
respectively. The same function as that of the embodiment described above can be exhibited.
[Effects of the Invention] According to the present invention described in detail above, it is
possible to provide a method of manufacturing an ultrasonic probe which can improve the
manufacturing yield without causing a short circuit between electrode layers.
[0002]
Brief description of the drawings
[0003]
1, 3 (a), 4 (a) and 5 (a) are partial cross-sectional views showing manufacturing steps in the
embodiment of the present invention, and FIGS. 2 and 3 (b). .
4 (b) and 5 (b) are each FIG. 3 (a), 4 (a) and 5 (a), FIG. 6 is a partial perspective view showing an
application of the present invention, and FIGS. 7 (a) and 7 (a). 8 (a) is a partial sectional view
showing a conventional manufacturing process, and FIG. 7 (b). 8 (b) is a partial side view
corresponding to FIGS. 7 (a) and 8 (a>), and FIG. 9 is a partial perspective view showing the
distribution of adhesive in the conventional manufacturing process. DESCRIPTION OF SYMBOLS
1 ... Vibrator base material, 2a ... Negative electrode side electrode layer, 2b ... Positive electrode
side electrode layer, 7 ... Conductive plate, 9 ... Grounding plate, 10 ... Vibrator group, 11 ...
Conductive members. Attorney attorney General Attorney Minoru Kang-jeong Yu Hu Huo Figure
1 Figure 2 Figure 3 Figure 4
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