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DESCRIPTION JPWO2016103826

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DESCRIPTION JPWO2016103826
Abstract: PROBLEM TO BE SOLVED: To provide a sound generator, a sound generator and an
electronic device with good sound quality. SOLUTION: A sound generator according to the
present invention comprises a piezoelectric element 1, a diaphragm 2 to which the piezoelectric
element 1 is attached, and a first frame member 31 and a second frame member 31 supporting
the outer peripheral portion of the diaphragm 2 Of the second main surface of the diaphragm 2,
the first adhesive 41 provided between the outer periphery of the first main surface of the
diaphragm 2 and the first frame member 31, and the second main surface of the diaphragm 2.
The second adhesive 42 provided between the outer peripheral portion and the second frame
member is provided, and the elastic modulus of the first adhesive 41 and the elastic modulus of
the second adhesive 42 are different. [Selected figure] Figure 1
Acoustic generator, acoustic generator and electronic device
[0001]
The present invention relates to a sound generator, a sound generator and an electronic device.
[0002]
There is known an acoustic generator including a diaphragm, a piezoelectric element attached to
the diaphragm, and two frames sandwiching the diaphragm (see, for example, Patent Document
1).
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The sound generator vibrates the diaphragm by applying a voltage to the piezoelectric element to
vibrate, and outputs the sound by actively utilizing the resonance of the vibration. For example,
such a sound generator is housed in a housing and used as a sound generator, and is
incorporated into a small electronic device such as a mobile computing device and used.
[0003]
International Publication No. 2011/162002
[0004]
However, in this sound generator, since the fulcrums of vibration are aligned at the top and
bottom, piezoelectric resonance tends to appear strongly, and peaks and dips tend to be large in
the audio frequency band.
Therefore, there is a need to further improve the sound quality in the audio frequency band.
[0005]
The present invention has been made in view of the above-mentioned circumstances, and an
object thereof is to provide an acoustic generator, an acoustic generator and an electronic device
capable of improving the sound quality.
[0006]
A sound generator according to the present invention comprises a piezoelectric element, a
diaphragm to which the piezoelectric element is attached, a first frame member and a second
frame member which sandwich and support an outer peripheral portion of the diaphragm, and
the vibration. A first adhesive provided between an outer peripheral portion of a first main
surface of the plate and the first frame member; an outer peripheral portion of a second main
surface of the diaphragm; and the second frame member And a second adhesive provided
between the first adhesive and the second adhesive, and the elastic modulus of the first adhesive
is different from the elastic modulus of the second adhesive.
[0007]
Moreover, the sound generator of this invention is provided with the above-mentioned sound
generator, and the housing which accommodates this sound generator.
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[0008]
An electronic device according to the present invention includes the above-described sound
generator, an electronic circuit connected to the sound generator, and a case for housing the
electronic circuit and the sound generator, and the sound generator generates sound from the
sound generator. Have a function to generate
[0009]
According to the sound generator of the present invention, the peak and dip in the frequencysound pressure characteristics become smaller, and the sound quality is improved.
[0010]
Further, according to the sound generating device and the electronic device of the present
invention, the sound generating device and the electronic device having high sound quality can
be realized because they are configured using the sound generator having improved sound
quality.
[0011]
(A) is a schematic perspective view which shows an example of the sound generator of this
embodiment, (b) is a schematic sectional drawing cut | disconnected by the AA shown to (a).
It is a schematic sectional drawing which shows the other example of the sound generator of this
embodiment.
It is a schematic plan view which shows the other example of the sound generator of this
embodiment.
It is a schematic sectional drawing which shows the other example of the sound generator of this
embodiment.
It is a schematic plan view which shows the other example of the sound generator of this
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embodiment.
It is a graph which shows an example of the frequency characteristic of the sound generator of
this embodiment.
It is a graph which shows an example of the frequency characteristic of the sound generator as a
comparative example. It is a block diagram showing composition of an example of an
embodiment of a sound generation device of the present invention. It is a block diagram which
shows an example of a structure of embodiment of the electronic device of this invention.
[0012]
Fig.1 (a) is a schematic perspective view which shows an example of the sound generator of this
embodiment, FIG.1 (b) is a schematic sectional drawing cut | disconnected by the AA shown to
Fig.1 (a). In FIG. 1 (a), the resin layer 5 shown in FIG. 1 (b) is omitted.
[0013]
The sound generator 10 of the present embodiment includes a piezoelectric element 1, a
diaphragm 2 to which the piezoelectric element 1 is attached, and a first frame member 31 and a
second frame that sandwich and support an outer peripheral portion of the diaphragm 2. The
member 32, the first adhesive 41 provided between the outer peripheral portion of the first main
surface of the diaphragm 2 and the first frame member 31, and the outer peripheral portion of
the second main surface of the diaphragm 2 And a second adhesive 42 provided between the
second frame member, and the elastic modulus of the first adhesive 41 and the elastic modulus
of the second adhesive 42 are different.
[0014]
The piezoelectric element 1 is used as an exciter that constitutes an acoustic generator.
The piezoelectric element 1 is provided, for example, on a laminated body in which piezoelectric
layers and internal electrode layers are alternately laminated, a surface electrode layer provided
on the upper surface and the lower surface of the laminated body, and a side surface from which
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the internal electrode layer is derived. And an external electrode.
[0015]
The piezoelectric layer forming the piezoelectric element 1 is provided by a ceramic having
piezoelectric characteristics. Examples of such ceramics include lead-free piezoelectric materials
such as lead zirconate titanate, lithium niobate, lithium tantalate, Bi-layer compounds, tungsten
bronze structure compounds, etc. Ceramics can be used. The thickness of one layer of the
piezoelectric layer is preferably set to, for example, 0.01 to 0.1 mm in order to drive at a low
voltage. Further, in order to obtain a large flexural vibration, it is preferable to have a
piezoelectric constant d31 of 200 pm / V or more.
[0016]
Further, the internal electrode layer constituting the piezoelectric element 1 is provided by cofiring with the ceramic constituting the piezoelectric layer, and comprises a first internal
electrode layer and a second internal electrode layer. The piezoelectric layer is alternately
stacked with the piezoelectric layers sandwiching the piezoelectric layers from above and below,
and by arranging the first internal electrode layer and the second internal electrode layer in the
stacking order, the piezoelectric body sandwiched between them A drive voltage is applied to the
layer. Various metal materials can be used as a material which comprises an internal electrode
layer. For example, a conductor containing silver or silver-palladium as a main component which
can be fired at a low temperature, or a conductor containing copper, platinum or the like can be
used, but these may contain a ceramic component or a glass component. When the internal
electrode layer is formed of a material containing a metal component consisting of silver and
palladium and a ceramic component forming the piezoelectric layer, the stress due to the
shrinkage difference at the time of firing between the piezoelectric layer and the internal
electrode layer As a result, it is possible to obtain a piezoelectric element free from stacking
faults.
[0017]
The piezoelectric element 1 is preferably a piezoelectric element in the form of a plate having, for
example, a polygonal shape such as a rectangular or square main surface on the upper surface
side and the lower surface side or a circular or elliptical shape By using the piezoelectric element
and the diaphragm 2 and frame 3 described later, the sound generator can be made thin.
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[0018]
The piezoelectric element 1 preferably has a bimorph structure.
That is, the piezoelectric is polarized such that the direction of polarization with respect to the
direction of the electric field applied at a certain moment is reversed on one side (the first main
surface side) and the other side (the second main surface side) in the thickness direction Devices
are preferred. Since the diaphragm can be efficiently vibrated with a small amount of energy as
well as contributing to thinning, a high-volume sound generator can be obtained.
[0019]
The piezoelectric element 1 is attached by being attached to the main surface of the diaphragm 2
or the like, and vibrates the diaphragm 2 by receiving voltage application and vibrating.
Specifically, the main surface of the piezoelectric element 1 is bonded to the main surface of the
diaphragm 2 with an adhesive such as epoxy resin. The vibrating plate 2 vibrates together with
the piezoelectric element 1 by the vibration of the piezoelectric element 1. The diaphragm 2 can
use various materials such as resin and metal. For example, the diaphragm 2 can be made of a
resin film of polyethylene, polyimide or the like having a thickness of 10 to 200 μm.
[0020]
When the piezoelectric element 1 has a bimorph structure, a lead wire is connected to the
external electrode, and an electric signal is input to the piezoelectric element 1 via the lead wire
to apply a voltage to the diaphragm 2 at a certain moment. The piezoelectric layer on the lower
surface side of the bonded piezoelectric element 1 shrinks in the in-plane direction perpendicular
to the stacking direction, and the piezoelectric layer on the upper surface side of the piezoelectric
element 1 extends in the in-plane direction perpendicular to the stacking direction And the whole
bends. Therefore, by applying an alternating current signal to the piezoelectric element 1, the
piezoelectric element 1 can be bent and vibrated, and the bending vibration can be applied to the
diaphragm 2. Note that a flexible printed circuit (FPC) can be used instead of the lead wire, which
is advantageous for thinning.
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[0021]
A frame 3 is provided to hold and support the outer peripheral portion of the diaphragm 2. In
other words, the outer peripheral portion of the diaphragm 2 is sandwiched and fixed between
the first frame member 31 and the second frame member 32 which constitute the frame 3. At
this time, as described later, a first adhesive 41 is provided between the first frame member 31
and the diaphragm 2, and between the second frame member 32 and the diaphragm 2. A second
adhesive 42 is provided. In this manner, the diaphragm 2 is supported by the frame 3 in a
stretched state within the frame 3 and the portion not sandwiched between the first frame
member 31 and the second frame member 32 is free. It is possible to vibrate.
[0022]
Here, the first frame member 31 and the second frame member 32 have substantially the same
inner peripheral shape and outer peripheral shape, and their inner peripheries substantially
coincide with each other when seen through in plan, and viewed in plan When they do, their
outer circumferences almost coincide. Further, the thickness, the material, and the like of the first
frame member 31 and the second frame member 32 constituting the frame 3 are not particularly
limited, and various materials such as metal, resin, and glass can be used. . For example, as the
first frame member 31 and the second frame member 32 constituting the frame 3, stainless steel
having a thickness of 0.1 to 5.0 mm is preferable because of excellent mechanical strength and
corrosion resistance. It can be used for Moreover, as a width | variety of the 1st frame member
31 which comprises the frame 3, and the 2nd frame member 32, the thing of 1.2-10.0 mm is
used, for example. Although FIG. 1 shows the frame 3 whose inner peripheral shape is a
substantially rectangular shape, it may be a polygon such as parallelogram, trapezoid and regular
n-gon, and it may be circular or elliptical. May be
[0023]
Further, the sound generator 10 of the present example may further include a resin layer 5
provided so as to cover the surfaces of the piezoelectric element 1 and the diaphragm 2 within
the frame 3.
[0024]
The resin layer 5 is preferably provided using, for example, an acrylic resin so that the Young's
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modulus is in the range of, for example, 1 MPa to 1 GPa.
Although the resin layer 5 may not necessarily be provided to cover the surface of the
piezoelectric element 1, the resin layer 5 may be provided to cover the surface of the
piezoelectric element 1, and the piezoelectric element 1 may be embedded in the resin layer 5.
Can induce a moderate damping effect. Therefore, the resonance phenomenon can be
suppressed, and the peak and dip in the frequency characteristic of the sound pressure can be
suppressed to a small value. Although FIG. 1 (b) shows that the resin layer 5 is provided at the
same height as the first frame member 31, the resin layer 5 is higher than the height of the first
frame member 31. It may be formed to be
[0025]
Here, a composite vibration in which the piezoelectric element 1, the diaphragm 2, the first frame
member 31 and the second frame member 32, the first adhesive 41 and the second adhesive 42
are integrated and vibrate as a whole. It can also be regarded as the body.
[0026]
In addition, although the case where the number of the piezoelectric elements 1 is one is
illustrated in this example, the number of piezoelectric elements 1 is not limited.
Moreover, although the case where the piezoelectric element 1 is provided on the first main
surface of the diaphragm 2 is shown in this example, the piezoelectric element 1 may be
provided on both main surfaces of the diaphragm 2. The piezoelectric element 1 may be a
bimorph type piezoelectric element or a unimorph type piezoelectric element.
[0027]
The sound generator 10 of the present embodiment includes the first adhesive 41 provided
between the outer periphery of the first main surface of the diaphragm 2 and the first frame
member 31, and the diaphragm 2. The elastic modulus of the first adhesive 41 and the elastic
modulus of the second adhesive 42 are provided with the second adhesive 42 provided between
the outer peripheral portion of the second main surface and the second frame member. And are
different.
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[0028]
As the first adhesive 41 and the second adhesive 42, for example, an adhesive such as a UV
curable resin, a thermosetting resin, an anaerobic UV curable resin, or a UV thermosetting resin
is used.
Specifically, acrylic resin, epoxy resin, silicone resin, polyester resin and the like are used. The
thickness of the first adhesive 41 and the second adhesive 42 is, for example, 10 to 80 μm.
[0029]
According to such a configuration, reflected waves of different frequencies are generated on the
first main surface side and the second main surface side, or unnecessary vibration is generated in
the first frame member 31 and the second frame member 32. The amount of attenuation can be
made different, so that the resonance of the main vibration is disturbed and divided and dumped,
so that the peak and dip become smaller in the frequency-sound pressure characteristic, and the
sound quality is improved.
[0030]
Here, it is preferable that the piezoelectric element 1 be attached to the first main surface of the
diaphragm 2 and the elastic modulus of the second adhesive 42 be smaller than that of the first
adhesive 41.
[0031]
The center of gravity of the composite vibrator which is integrated and vibrated by the
piezoelectric element 1 and the diaphragm 2 is on the side of the piezoelectric element 1 (the
first main surface side) than the center in the thickness direction of the diaphragm 2.
Therefore, by making the elastic modulus of the second adhesive 42 on the side of the second
main surface smaller than that of the first adhesive 41 on the side of the first main surface, the
amplitude of the diaphragm 2 can be reduced. It can be enhanced on the second main surface
side.
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Therefore, the sound pressure can be improved in addition to the improvement of the sound
quality.
[0032]
In addition, since the center of gravity of the composite vibrator is on the side of the piezoelectric
element 1 (the first main surface side) with respect to the center of the diaphragm 2 in the
thickness direction, the second adhesive 42 is used as the first adhesive 41. The load applied to
the first adhesive 31 can be reduced by the fact that the elastic modulus of the first adhesive 41
is larger than the elastic modulus of the second adhesive 42, although the load is more likely to
be applied. Therefore, the peeling between the diaphragm 2 and the first adhesive 31 can be
suppressed, and the effect that the durability can be ensured can be also obtained.
[0033]
As a configuration in which the elastic modulus of the second adhesive 42 is smaller than the
elastic modulus of the first adhesive 41, for example, an acrylic resin having an elastic modulus
(Young's modulus) of 1 GPa to 10 GPa as the first adhesive 41. The structure using acrylic resin
which set elastic modulus (Young's modulus) to 10 Mpa-100 Mpa as 2nd adhesive agent 42 is
mentioned.
[0034]
Further, an epoxy resin having an elastic modulus (Young's modulus) of 1 GPa to 10 GPa as the
first adhesive 41 and a silicone resin having an elastic modulus (Young's modulus) of 10 MPa to
100 MPa as the second adhesive 42 You may use.
[0035]
Alternatively, a thermosetting adhesive such as an epoxy resin or an acrylic resin may be used as
the first adhesive 41, and a UV curable adhesive such as an acrylic resin may be used as the
second adhesive 42.
[0036]
In order to compare the elastic modulus of the first adhesive 41 and the elastic modulus of the
second adhesive 42, the first frame member 31 and the second frame member 32 are peeled off
from the diaphragm 2, and The adhesive 41 and the second adhesive 42 of No. 1 may be taken
out, and the elastic modulus (Young's modulus) of each taken-out adhesive (cured product) may
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be measured by the dynamic viscoelastic method.
[0037]
Here, as shown in FIG. 2, the piezoelectric element 1 is attached to the first main surface of the
diaphragm 2, and the feed member 6 to the piezoelectric element 1 is fixed to the first frame
member 31. The thickness of the adhesive 41 is preferably larger than the thickness of the
second adhesive 42.
[0038]
The feed member 6 to the piezoelectric element 1 may be fixed to the first frame member 31
joined to the first main surface of the diaphragm 2 to which the piezoelectric element 1 is joined.
At that time, noise vibration may be generated by the vibration of the piezoelectric element 1
propagating from the power supply member 6 to the diaphragm 2 via the first frame member 31.
In particular, when the elastic modulus of the first adhesive 41 is large, vibrations easily
propagate and noise noise becomes large.
On the other hand, by increasing the thickness of the first adhesive 41, the distance by which the
vibration propagates from the power supply member 6 to the diaphragm 2 via the first frame
member 31 is increased, and the first bonding is performed. It becomes easy to attenuate inside
the agent 41.
Thus, noise noise can be suppressed by the first adhesive 41 functioning as a buffer.
[0039]
Specifically, the thickness of the first adhesive 41 and the second adhesive 42 is adjusted, for
example, between 0.01 and 0.3 mm, and the first thickness relative to the thickness of the second
adhesive 42 is set. The thickness of the adhesive 41 is set to be 1.05 to 2.5 times thicker.
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Examples of the power supply member 6 include a metal plate, a lead wire, and a printed circuit
board. In the case of a metal plate or a printed circuit board, slits or the like may be provided in
the width direction in consideration of flexibility.
[0040]
Further, as shown in FIG. 3, when viewed in the direction perpendicular to the first main surface
of the diaphragm 2, the first adhesive 41 protrudes inward from the inner periphery of the first
frame member 31. It may have a site. In addition, as shown in FIG. 4, when viewed from the
direction perpendicular to the first main surface of the diaphragm 2, the second adhesive 42 is at
a position corresponding to the projecting portion of the first adhesive 41. It has a part which
projected inside rather than the inner circumference of the 2nd frame member 32, and the
amount of projection in each projected part may differ.
[0041]
Although the reflected wave on the side of the first adhesive 41 having a large elastic modulus
tends to reach earlier than the reflected wave on the side of the second adhesive 42 having a
small elastic modulus, the first adhesive 41 Since the arrival time of the reflected wave on the
side of the first adhesive 41 is further shortened by having a portion projecting inward than the
inner periphery of the frame member 31 of 1, the side on the side of the second adhesive 42 The
difference with the reflected wave becomes large, and the peak and dip become smaller in the
frequency-sound pressure characteristic, and the sound quality can be further improved.
[0042]
Furthermore, as shown in FIG. 5, when viewed in a direction perpendicular to the first main
surface of the diaphragm 2, the first adhesive 41 protrudes inward from the inner periphery of
the first frame member 31. The portion may have a shape having asperities.
When the projecting portion has a shape having unevenness, the reflected wave is scattered in
the plane, which can contribute to the further improvement of the sound quality. In the case
where the first adhesive 41 has a concavo-convex shape, a portion protruding as in the example
shown in FIG. 5 may be provided over the entire circumference of the inner periphery of the first
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frame member 31. It may be provided on a part of the inner periphery of the first frame member
31.
[0043]
Here, the difference in sound quality (frequency characteristics of sound pressure) between the
case where the elastic modulus of the first adhesive 41 and the elastic modulus of the second
adhesive 42 are different from the case where the elastic modulus is different will be described.
[0044]
6 and 7 are graphs showing an example of the frequency characteristic of sound pressure.
FIG. 6 shows the frequency characteristics of sound pressure when the elastic modulus of the
first adhesive 41 and the elastic modulus of the second adhesive 42 are different. Moreover, FIG.
7 shows the frequency characteristic of the sound pressure in case the elasticity modulus of the
1st adhesive agent 41 and the elasticity modulus of the 2nd adhesive agent 42 are the same. In
the graphs shown in FIG. 3 and FIG. 4, the horizontal axis represents frequency, and the vertical
axis represents sound pressure. The configurations other than the elastic modulus of the first
adhesive 41 and the elastic modulus of the second adhesive 42, that is, the dimensions and
materials of the respective members were set to be the same. The peaks and dips respectively
located in the frequency band of 700 Hz to 1.5 kHz and 4 kHz to 8 kHz in FIG. 6 and the
frequency band of 700 Hz to 1.5 kHz and 4 kHz to 8 kHz shown in FIG. When the peaks and dips
are compared, it can be seen that the peaks and dips in the graph shown in FIG. 6 are clearly
smaller than the peaks and dips in the graph shown in FIG. 7. Thus, when the elastic modulus of
the first adhesive 41 and the elastic modulus of the second adhesive 42 are different, the peak
and dip become smaller in most frequency bands compared to the same case, and the sound is
The flatness of pressure is improved and the frequency characteristic of sound pressure is
improved.
[0045]
Next, a method of manufacturing the sound generator 10 of the present embodiment will be
described.
[0046]
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First, the piezoelectric element 1 is prepared.
The piezoelectric element 1 knead | mixes a binder, a dispersing agent, a plasticizer, and a
solvent with the powder of piezoelectric material, and produces a slurry. As a piezoelectric
material, any of lead-based and non-lead-based can be used.
[0047]
Next, the obtained slurry is formed into a sheet to obtain a green sheet, and an internal electrode
paste is printed on the green sheet to form an internal electrode pattern, and the green sheet on
which the electrode pattern is formed is obtained. For example, four sheets are laminated, and
only the green sheet is laminated on the uppermost layer to prepare a laminated molded body.
Next, the laminate is degreased and fired, and cut into a predetermined size to obtain a laminate.
The laminate processes the outer peripheral portion as necessary, and the paste of the surface
electrode layer is printed on the main surface in the lamination direction of the piezoelectric
layer of the laminate, and subsequently, the external electrodes are formed on both side surfaces
in the longitudinal direction of the laminate. By printing the paste and baking the electrodes at a
predetermined temperature, it is possible to obtain a laminated piezoelectric element 1.
[0048]
Next, in order to impart piezoelectricity to the piezoelectric element 1, a DC voltage is applied
through the surface electrode layer or the external electrode to polarize the piezoelectric layer of
the piezoelectric element.
[0049]
Next, a film to be the diaphragm 2 is prepared, the outer peripheral portion of the film is
sandwiched between the first frame member 31 and the second frame member 32, and the film
is fixed in a tensioned state.
At this time, a first adhesive 41 is provided between the first frame member 31 and the
diaphragm 2, and a second adhesive 42 is provided between the second frame member 32 and
the diaphragm 2. . For example, a second adhesive 42 made of a UV curable resin is applied to
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the second main surface of the diaphragm 2 in a tensioned state in the shape of the second frame
member 32 using a method such as printing or a dispenser. After that, the second frame member
32 is pressed and irradiated with UV (ultraviolet light) to be cured. Then, a first adhesive 41
made of a thermosetting resin is applied to the first main surface of the diaphragm 2 in the shape
of the first frame member 31 using a method such as printing or dispenser, and then heated. The
elastic moduli of the first adhesive 41 and the second adhesive 42 can be made different.
[0050]
In addition, as a method of making the elastic modulus of the 1st adhesive agent 41, and the
elastic modulus of the 2nd adhesive agent 42 different, an acrylic resin adjusted to a different
Young's modulus, for example is used, for example, an epoxy resin and a silicone resin are called.
Adhesives of different materials may be used.
[0051]
Further, as a method of making the thickness of the first adhesive 41 and the thickness of the
second adhesive 42 different, the amount of application at the time of application by printing or
a dispenser may be changed, or the first frame member 31 and the first frame member 31 may
be used. The pressing pressure condition with the second frame member 32 may be changed.
[0052]
Then, the resin is poured inside the frame member, the laminated piezoelectric element is
completely embedded, and the resin layer is cured, whereby the acoustic generator 10 of the
present embodiment can be obtained.
[0053]
Next, an example of the embodiment of the sound generator of the present embodiment will be
described.
[0054]
The sound generation device is a so-called speaker-like sound generation device, and as shown in
FIG. 8, the sound generation device 20 of this example includes a sound generator 10 and a
housing 30 that houses the sound generator 10.
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In addition, a part of case 30 may be diaphragm 2 which constitutes sound generator 10, and
when case 30 accommodates sound generator 10, a part of sound generator 10 (piezoelectric
element 1 ) Is meant to be included.
[0055]
The housing 30 resonates the sound emitted by the sound generator 10 internally, and radiates
the sound to the outside from an opening (not shown) provided in the housing 30.
By including such a housing 30, sound pressure in, for example, a low frequency band can be
increased.
[0056]
The sound generation device 20 can be used alone as a speaker, and can be suitably incorporated
into a portable terminal, a flat-screen television, a tablet terminal, or the like as described later.
In addition, it can be incorporated into home appliances such as refrigerators, microwave ovens,
vacuum cleaners, washing machines, etc., for which sound quality has not been emphasized
conventionally.
[0057]
Since the sound generator 20 of the present embodiment described above is configured using the
sound generator 10 with improved sound quality, it has high sound quality and excellent sound
performance.
[0058]
Next, an example of the electronic device of the present embodiment will be described.
[0059]
As shown in FIG. 9, the electronic device 50 of the present example includes an acoustic
generator 10, an electronic circuit 60 connected to the acoustic generator 10, and a case 40 that
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accommodates the electronic circuit 60 and the acoustic generator 10. And has a function of
generating sound from the sound generator 10.
[0060]
The electronic device 50 includes an electronic circuit 60.
The electronic circuit 60 includes, for example, a controller 50a, a transmitting / receiving unit
50b, a key input unit 50c, and a microphone input unit 50d.
The electronic circuit 60 is connected to the sound generator 10 and has a function of outputting
an audio signal to the sound generator 10.
The sound generator 10 generates a sound based on an audio signal input from the electronic
circuit 60.
[0061]
In addition, the electronic device 50 includes the display unit 50e, the antenna 50f, and the
sound generator 10, and the housing 70 that accommodates these devices.
Although FIG. 9 shows a state in which all the devices including the controller 50a are housed in
one housing 40, the housing form of each device is not limited. In the present embodiment, at
least the electronic circuit 60 and the sound generator 10 may be accommodated in one housing
40.
[0062]
The controller 50 a is a control unit of the electronic device 50. The transmitting and receiving
unit 50b transmits and receives data via the antenna 50f based on the control of the controller
50a. The key input unit 50c is an input device of the electronic device 50, and receives a key
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input operation by the operator. The microphone input unit 50d is also an input device of the
electronic device 50, and receives a voice input operation and the like by the operator. The
display unit 50 e is a display output device of the electronic device 50, and outputs display
information based on the control of the controller 50 a.
[0063]
The sound generator 10 then operates as a sound output device in the electronic device 50. The
sound generator 10 is connected to the controller 50a of the electronic circuit 60, and emits a
sound in response to the application of a voltage controlled by the controller 50a.
[0064]
Although the electronic device 50 has been described as a portable terminal device in FIG. 9, the
electronic device 50 does not ask the type of the electronic device 50, and may be applied to
various consumer devices having a function of emitting sound. . For example, flat-screen TVs and
car audio devices may be used for various products such as vacuum cleaners, washing machines,
refrigerators, microwave ovens and the like, as a matter of course, products having a function of
emitting sound, for example.
[0065]
Since the electronic device of the present invention described above is configured using the
sound generator 10 with improved sound quality, it has high sound quality and excellent sound
performance.
[0066]
DESCRIPTION OF SYMBOLS 1 piezoelectric element 2 diaphragm 31 1st frame member 32 2nd
frame member 41 1st adhesive agent 42 2nd adhesive agent 5 resin layer 6 electric power
feeding member 20 acoustic generator 30, 40 housing 50 electronic device 60 electronic circuit
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