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DESCRIPTION JP2001008293

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DESCRIPTION JP2001008293
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
condenser microphone such as an electret condenser microphone.
[0002]
2. Description of the Related Art Conventionally, as a capacitor main lophone, as shown in FIGS. 4
and 5, a bottom plate portion of an aluminum casing 1 having a bottomed cylindrical shape is
used as a top plate, and the top plate 2 is used. The sound hole 3 is opened, and the diaphragm 5,
the spacer 6, the back electrode 7, the insulating spacer cylinder 8, and the terminal substrate 9
having the spacer ring 4 fixed to the periphery are sequentially stacked and accommodated
inside thereof. The IC element 11 composed of a FET (field effect transistor) is fixed to the
surface of the terminal substrate 9 by bending the portion 10 inward and caulking, and the IC
element 11 made of FET (field effect transistor) is fixed. A cylindrical contact ring 12 is
interposed between the back electrode 7 and the wiring (not shown) on the surface of the
terminal substrate 9.
[0003]
SUMMARY OF THE INVENTION In such a conventional condenser microphone, the insulating
spacer cylinder 8 receives the insulation of the back electrode 7 with respect to the casing and
the spacing for forming the back space of the back electrode. Due to this structure, a large spacer
cylinder 8 is required between the diaphragm 5 and the back electrode 7, and the back electrode
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back space must be narrowed, resulting in the problem that the sensitivity maintenance and
increase are limited. there were.
Further, the spacer 6 and the insulating spacer cylinder 8 are required as separate parts, and
there is a problem that the number of parts is increased.
[0004]
The present invention has been made in view of such conventional problems, and has been made
for the purpose of providing a condenser microphone which can have higher sensitivity than
conventional products and can reduce the number of parts.
[0005]
SUMMARY OF THE INVENTION A feature of the present invention for solving the abovementioned problems of the prior art and achieving the intended purpose is the above-mentioned
top in a casing having a sound hole in the top plate. In a capacitor microphone in which a
terminal substrate on which an IC element including a diaphragm, a back electrode, and a FET for
a microphone is fixed is accommodated in order from the surface side while maintaining a
predetermined interval, between the back surface of the back electrode and the terminal
substrate surface A spacer contact ring made of a conductive material is interposed, and the
outer circumferential surface of the contact ring and the inner circumferential surface of the
casing are insulated with an insulating film interposed.
[0006]
The insulating film is made of an insulating material integrally having an insulating cylindrical
portion along the inner peripheral surface of the casing and a spacer ring integrally projected
inside the top of the insulating cylindrical portion, the spacer ring Is preferably interposed
between the diaphragm and the back electrode, and insulating between the back electrode and
the contact ring and the casing is preferably performed by the insulating cylindrical portion. In
this case, the conventional spacer cylinder is eliminated and the spacer ring is The number of
parts can be reduced since the part and the insulating cylinder are constituted as one part.
[0007]
The insulating film may be formed of an insulating film attached to the inner surface of the
casing.
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2
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of the present invention
will be described with reference to FIG. 1 and FIG.
[0009]
In the figure, reference numeral 20 denotes an aluminum casing, which is formed into a
cylindrical shape with a bottom by drawing, the bottom wall of which is a top plate 21 and a
sound hole 22 is opened in this. .
The skirt portion 23 of the casing is bent and crimped inward to prevent removal of members
described later accommodated therein.
[0010]
A diaphragm 24 is accommodated below the top plate 21 in the casing 20 at an interval.
The diaphragm 24 is fitted to the inside of the casing 20 and fixed to a circular diaphragm ring
25 in contact with the inner surface of the top plate 21, and the diaphragm ring 25 maintains the
distance from the top plate 21.
[0011]
A back electrode 26 is accommodated below the diaphragm 24 at a distance from the diaphragm
24.
The back electrode 26 is accommodated in a cylindrical insulating material 27 inserted in contact
with the inner surface of the casing 20, and the back electrode 26 and the casing 20 are
insulated.
The insulating material 27 is composed of an insulating cylindrical portion 28 formed in a
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cylindrical shape and a circular ring-shaped spacer ring portion 29 integrally formed inside the
top thereof, and the spacer ring portion 29 is a diaphragm The gap 24 is interposed between the
back electrode 26 and the back electrode 26 to maintain the distance between the diaphragm
and the back electrode 26.
[0012]
The upper end of the cylindrical contact ring 30 is in contact with the lower side of the
peripheral portion of the back electrode 26, the terminal board 31 is in contact with the lower
end of the contact ring, and the casing 20 described above is formed on the lower side of the
terminal board 31. The bottom of the is crimped.
The contact ring 30 and the casing 20 are insulated by the insulating cylindrical portion 28 of
the insulating material 27.
[0013]
The inside of the contact ring 30 is a back electrode back space 32, in which an IC element 33
and a chip capacitor 34, which are fixed to the upper surface of the terminal substrate 31 and
consist of FTT (field effect transistor), are accommodated. The contact ring 30 doubles as a
spacer between the back electrode 26 and the terminal substrate 31.
[0014]
In the condenser microphone configured as described above, the diaphragm 24 and the back
electrode 26 are opposed to each other by the spacer ring portion 29, an electric condenser is
formed, and the sound transmitted through the sound hole 22 and enters the sound Vibration
causes the diaphragm 24 to vibrate, the movement of which is due to the appropriate compliance
of the diaphragm 24 itself and the slight clearance air between the diaphragm 24 and the back
electrode 26 formed by the spacer ring portion 29. Controlled by compliance with moderate
viscous resistance and the back electrode 32 of moderate size communicating with pores 34
open to the back electrode 26, and slight with the back electrode 26 due to the vibration of the
diaphragm 24. A change in distance results in a voltage change across the formed capacitor, and
this change is converted to a low impedance by the IC element 33 fixed on the terminal substrate
31. And, electrically output.
[0015]
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In the example described above, the insulating material 27 is used which integrally has the
insulating cylindrical portion 28 and the spacer ring portion 29 integrally projected inside the
top of the insulating cylindrical portion. As shown, the two are separate bodies, the spacer ring
40 is interposed between the vibrating plate 24 and the back electrode 26, and the insulating
film 41 is interposed between the back electrode 26, the contact ring 30, and the casing 20; It
may be stuck on the inner surface of
Thus, the use of the insulating film 41 facilitates the manufacture.
The same parts as in the example shown in FIG. 1 and FIG.
[0016]
As described above, in the condenser microphone according to the present invention, the spacer
ring serving as a conductive material is interposed between the back surface of the back
electrode and the surface of the terminal substrate, and By insulating the outer circumferential
surface and the inner circumferential surface of the casing with an insulating film interposed, a
spacer ring made of an insulating material used in the conventional condenser microphone of
this type is not necessary, and therefore, that amount Only the back electrode back space
becomes wider, and a sensitive product can be obtained with a casing of the same size compared
to the conventional product, and since the back electrode back space is large, the chip capacitor
electrode is soldered to the substrate And there is no accident that the solder material flows and
shorts with the contact ring, and it becomes possible to incorporate more than one chip
capacitor. Up can be achieved without increasing the outer shape.
[0017]
Also, the insulating ring is constituted by an insulating material integrally having an insulating
cylindrical portion along the inner peripheral surface of the casing and a spacer ring integrally
projected inside the top of the insulating cylindrical portion, the spacer ring Between the
diaphragm and the back electrode, and by insulating the back electrode and the contact ring
from the casing by the insulating cylindrical portion, the number of parts can be reduced and the
cost can be reduced. is there.
[0018]
Brief description of the drawings
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[0019]
1 is a longitudinal sectional view of an example of a condenser microphone according to the
present invention.
[0020]
2 is a cross-sectional view of the same.
[0021]
3 is a longitudinal sectional view of another example of the condenser microphone according to
the present invention.
[0022]
4 is a longitudinal sectional view of a conventional condenser microphone.
[0023]
5 is a cross-sectional view of the same.
[0024]
Explanation of sign
[0025]
Reference Signs List 20 casing 21 top plate 22 sound hole 23 skirt 24 diaphragm 25 diaphragm
ring 26 back electrode 27 insulating material 28 insulating cylindrical portion 29 spacer ring
portion 30 contact ring 31 terminal board 32 back electrode back space 33 IC element 34 chip
capacitor 40 Spacer ring 41 insulation film
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