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DESCRIPTION JP2007060661

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DESCRIPTION JP2007060661
A silicon capacitor microphone and a method of packaging a silicon capacitor microphone
capable of improving the bonding strength between a metal case and a substrate on which a
MEMS microphone chip is installed. An application specific integrated circuit (ASIC) chip 20
including a metal case 110, a micro electro mechanical system (MEMS) microphone chip 10, and
a voltage pump 22 and a buffer IC 24 is provided. And a connection pattern 121 for bonding to
the substrate 120, and a substrate 120 having a metal case and the connection pattern bonded
to each other. [Selected figure] Figure 1
Silicon capacitor microphone and packaging method for silicon capacitor microphone
[0001]
The present invention relates to a silicon capacitor microphone and a method of packaging a
silicon capacitor microphone.
[0002]
In general, condenser microphones widely used in mobile communication terminals, audio, etc.,
buffer voltage / voltage elements, diaphragm / backplate pairs forming capacitors (C) that
change corresponding to sound pressure, and output signals And a field effect transistor (JFET).
Such a traditional condenser microphone consists of an assembly in which a diaphragm, a spacer
ring, an insulating ring, a back plate, a conducting ring and a PCB are integrally assembled in one
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case.
[0003]
On the other hand, in recent years, there is a semiconductor processing technology using
micromachining as a technology used for integration of fine devices. Such technology, called
MEMS (Micro Electro Mechanical System), uses micromachining technology that applies
semiconductor processes, in particular integrated circuit technology, to create micro sensors,
actuators and electromechanical structures in μm units. It can be manufactured. A MEMS chip
microphone manufactured using such micromachining technology can be miniaturized, improved
in performance, multifunctionalized, and integrated, and improve stability and reliability by ultraprecision microfabrication. It has the advantage of being able to
[0004]
However, MEMS chip microphones fabricated using micromachining technology as described
above, along with other Application Specific Integrated Circuit (ASIC) chip devices, for electrical
driving and signal processing. It needs to be packaged.
[0005]
As a technology for packaging a conventional MEMS chip microphone, for example, “MEMS
package (MICROELECTROMECHANICAL SYSTEM PACKAGE WITH ENVIRONMENTAL AND
INTERFERENCE SHIELD)” disclosed on Patent Document 1 on August 24, 2004 is disclosed. is
there.
The package described in Patent Document 1 has a structure in which a cover made of an inner
conductive layer and an outer conductive layer is adhered using a conductive adhesive on a
multilayer substrate in which conductive layers and insulating layers are alternately
superimposed. It consists of
[0006]
U.S. Patent No. 6,781,231
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[0007]
However, the conventional packaging method as described in Patent Document 1 requires a nonconductor unlike the metal housing because the process is complicated, the manufacturing cost
is high, and the bonding property is low. However, there is a problem that it is sensitive to
external noise such as electromagnetic wave noise.
[0008]
Therefore, the present invention has been made in view of the above problems, and an object of
the present invention is to provide a novel device capable of improving the bonding strength
between a substrate on which a MEMS microphone chip is installed and a metal case. Another
object of the present invention is to provide an improved silicon capacitor microphone and a
packaging method of the silicon capacitor microphone.
[0009]
In order to solve the above problems, according to one aspect of the present invention, a metal
case, a micro electro mechanical system (MEMS) microphone chip, and an application specific
integrated circuit (ASIC) chip including a voltage pump and a buffer IC There is provided a silicon
capacitor microphone, comprising: a surface on which a connection pattern for bonding to a
metal case is formed; and a substrate in which the metal case and the connection pattern are
bonded.
[0010]
The metal case may be cylindrical or square shaped.
[0011]
The end of the metal case may be straight or bent outward to form a wing.
[0012]
The substrate may be any one of a printed circuit board (PCB) substrate, a ceramic substrate, a
flexible printed circuit board (FPCB) substrate, and a metal substrate.
[0013]
The material of the metal case may be any one of brass, aluminum and nickel alloy.
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[0014]
Joining of the metal case and the connection pattern can be performed by laser welding, electric
welding, soldering, or the use of a conductive adhesive.
[0015]
The substrate may have at least two or more and eight or more connection terminals for
connecting with an external device.
[0016]
The substrate may be formed with a rear sound inflow hole for receiving a rear sound so that the
microphone has directivity.
[0017]
In order to solve the above problems, according to another aspect of the present invention, a step
of installing a substrate on which a MEMS microphone chip and an ASIC chip are mounted and a
connection pattern is formed, and a step of installing a metal case A method of packaging a
silicon capacitor microphone comprising the steps of: aligning a metal case to a connection
pattern of a substrate; and welding the connection pattern of an end of the metal case to the
connection pattern of the substrate. Ru.
[0018]
Further, in order to solve the above-mentioned problems, according to another aspect of the
present invention, a metal case having a bottom face and an acoustic hole for inputting an
external sound are formed, and around the acoustic hole In order to prevent distortion of the
sound wave in the space between the main PCB and the microphone, a sealing terminal for
soldering and sealing the acoustic hole is formed, and includes a MEMS microphone chip, a
voltage pump and a buffer IC A silicon-on-insulator chip having a connection pattern formed on a
surface thereof for bonding to the metal case, and a substrate on which the metal case and the
connection pattern are connected by welding. A condenser microphone is provided.
[0019]
The acoustic hole of the substrate may be formed at a position where the MEMS microphone
chip is mounted.
[0020]
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The metal case may have an acoustic hole for receiving external sound, and an acoustic resistor
may be installed inside or outside of the acoustic hole to have directivity.
[0021]
In order to solve the above problems, according to another aspect of the present invention, in a
silicon capacitor microphone mounted on a main PCB in which an insertion hole into which a
microphone can be inserted and a connection pad are formed, the insertion hole in the main PCB
A metal case that can be inserted, with a closed bottom, an acoustic hole is formed, is wider than
the metal case, has a MEMS microphone chip, an ASIC chip that includes a voltage pump and a
buffer IC, and is joined to the metal case on the surface Connection patterns are formed, and
connection terminals formed on the component surface of the substrate on which the metal case
is mounted in order to connect the substrate on which the metal case and the connection pattern
are joined and the connection pads of the main PCB And a silicon condenser microphone.
[0022]
According to the present invention, the bonding strength between the metal case and the
substrate on which the MEMS microphone chip is installed can be improved.
[0023]
The present invention will now be described more fully with reference to the accompanying
drawings, in which exemplary embodiments of the invention are shown.
In the present specification and the drawings, components having substantially the same
functional configuration will be assigned the same reference numerals and redundant description
will be omitted.
[0024]
First, in the embodiment of the present invention, a plurality of modifications of the first
embodiment will be described with an example in which an acoustic hole is formed in a case as a
first embodiment, and an example in which an acoustic hole is formed in a substrate will be
described. A plurality of modifications of the second embodiment will be described as an
embodiment, and an example in which an acoustic hole is formed on a substrate and a mounting
hole is formed on a main substrate and mounted is referred to as a third embodiment. A modified
example of will be described.
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[0025]
1.
1. First Embodiment 1.1) First Modification of First Embodiment FIG. 1 is a side sectional view
showing a microphone according to a first modification of the first embodiment of the present
invention, and FIG. FIG. 3 is an exploded perspective view showing a microphone according to a
first modified example of the first embodiment, and FIG. 3 is a side sectional view showing a
structure of a MEMS chip microphone commonly applied to the respective embodiments of the
present invention. FIG. 4 is a circuit diagram of a silicon capacitor microphone commonly applied
to each embodiment of the present invention.
[0026]
In the microphone according to the first modification of the first embodiment of the present
invention, as shown in FIGS. 1 and 2, the cylindrical metal case 110 is mounted with the MEMS
chip 10 (MEMS microphone chip) and the ASIC chip 20. Are laser welded to the printed circuit
board 120.
[0027]
1 and 2, the MEMS chip 10 and the ASIC chip 20 are mounted on a printed circuit board (PCB)
substrate 120, and a circular connection pattern 121 is formed in a portion in contact with the
metal case 110. ing.
Also, although not shown in the drawings, capacitors, resistors and the like for shielding
electromagnetic waves or ESD may be mounted together as required.
[0028]
Since the PCB substrate 120 is larger than the metal case 110, connection pads and connection
terminals for connecting to an external device can be freely disposed on the surface of the wide
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PCB substrate 120.
The connection pattern 121 is formed by plating nickel (Ni) or gold (Au) after mounting a copper
foil by a general PCB manufacturing process.
At this time, various substrates such as a ceramic substrate, an FPCB (Flexible Printed Circuit
Board) substrate, a metal PCB substrate, and the like can be used as the substrate in addition to
the PCB substrate 120 described above.
[0029]
The metal case 110 has a cylindrical shape in which the connection surface with the PCB
substrate 120 is opened so that chip components can be mounted inside, and an acoustic hole
110 a is formed on the upper surface so that sound flows into the inside. It is done.
The material of the metal case 110 may be brass, copper, stainless steel, aluminum, nickel alloy
or the like, and may be used as gold or silver plating.
The shape of the metal case 110 can be various shapes such as circular and square.
[0030]
After aligning the metal case 110 with the connection pattern 121 of the PCB substrate 120, a
laser beam machine (not shown) is provided.
Laser welding the connection portion 130 to complete the microphone.
Here, the connection pattern 121 is a ground terminal (not shown).
When the metal case 110 is welded to the connection pattern 121, the inflow of external noise is
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blocked and it is easy to remove noise.
[0031]
In the microphone assembly thus completed, as shown in FIG. 1, the connection pattern 121 of
the PCB substrate 120 and the metal case 110 are strongly coupled by laser welding, and the
metal case 110 and the PCB substrate 120 are The space 150 between them acts as an acoustic
chamber.
[0032]
At least 2 to 8 connection terminals 123, 125 for connecting with an external device can be
formed on the bottom surface of the PCB substrate 120, and each connection terminal 123, 125
is electrically connected to the chip component surface through the through hole 124. It can be
conducted.
In particular, in the embodiment of the present invention, when the connection terminals 123
and 125 are formed long to the peripheral portion of the PCB substrate 120, rework operation
can be easily performed with an electric iron or the like through the exposed surface.
[0033]
The MEMS chip 10 has a structure in which the vibrating film 11 is formed via the spacer 12
after the back plate 13 is formed on the silicon wafer 14 using the MEMS technology, as shown
in FIG. There is.
Such a MEMS chip 10 is commonly applied to each embodiment of the present invention, and the
manufacturing technology of the MEMS chip 10 is already known, and thus the further
description is omitted.
[0034]
The ASIC chip 20 is connected to the MEMS chip 10 to process electrical signals, and as shown in
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FIG. 4, a voltage pump 22 that provides a voltage so that the MEMS chip 10 operates as a
condenser microphone. The buffer IC 24 amplifies or impedance-matches the electrical acoustic
signal sensed through the MEMS chip 10 and provides the signal to the outside through the
connection terminal.
Here, the voltage pump 22 is, for example, a DC-DC converter, and the buffer IC 24 can use, for
example, an analog amplifier or an analog-to-digital converter (ADC).
In the circuit diagram of FIG. 4, the capacitor symbol “C0” indicates an electrical equivalent
circuit for the MEMS chip 10, and the MEMS microphone package is connected to an external
device through three connection terminals (Vdd, GND, Output). I understand.
Such a circuit diagram of FIG. 4 can be commonly applied to the respective embodiments of the
present invention.
[0035]
In the first embodiment of the present invention, welding of the metal case 110 and the PCB
substrate 120 has been described by taking laser welding as an example, but electric welding,
soldering, bonding with a conductive adhesive, or the like is also possible.
[0036]
[Packaging Method] FIG. 5 is a flowchart showing a method of packaging a silicon capacitor
microphone according to each embodiment of the present invention.
According to an embodiment of the present invention, as shown in FIG. 5, the method of
packaging a silicon capacitor microphone comprises the steps of installing a PCB substrate 120
(step S1), mounting the MEMS chip 10 and the ASIC chip 20 on the PCB substrate 120. (Step S2),
installing the metal case 110 (step S3), aligning the metal case 110 with the connection pattern
121 of the PCB substrate 120 (step S4), the end of the metal case 110 and the PCB And welding
the connection pattern of the substrate 120 (S5).
[0037]
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At this time, the substrate is not limited to the PCB substrate 120. For example, various
substrates such as a ceramic substrate, an FPCB substrate, a metal PCB substrate, etc. can be
used, and a connection pattern for connecting the metal case 110 to the substrate. 121 are
formed.
And although not shown in the drawings, capacitors, resistors and the like for shielding
electromagnetic waves or ESD can be mounted together, if necessary.
[0038]
Moreover, as a material of the metal case 110, brass, copper, stainless steel, aluminum, a nickel
alloy, etc. can be used, and gold or silver plating can also be used.
The shape of the metal case can be various shapes such as circular and square.
The welding in the fifth step (step S5) can use any one of laser welding, electric welding,
soldering, and conductive epoxy adhesive.
According to such a packaging method according to the embodiment of the present invention,
bonding strength (electrical connection force and sealing performance) is enhanced by laser
welding a metal case to a substrate, sound quality is improved, and the outside It is also resistant
to noise, and in particular, it has the advantage of being able to reduce process costs and
significantly reduce manufacturing costs.
[0039]
1.2) Second Modified Example of First Embodiment FIG. 6 is an exploded perspective view
showing a microphone according to a second modified example of the first embodiment of the
present invention, which is a modification of the first embodiment of the present invention. The
second modification is an example in which the rectangular cylindrical metal case 210 is laserwelded to the PCB substrate 220.
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[0040]
Referring to FIG. 6, the MEMS chip 10 and the ASIC chip are mounted on the PCB substrate 220,
and a rectangular connection pattern 221 is formed in a portion in contact with the metal case
210.
The connection pattern 221 is formed of a copper foil film by a conventional PCB pattern
technique.
[0041]
The metal case 210 is a square tube having an open surface to be connected to the PCB substrate
220, and an acoustic hole 210a is formed on the upper surface of the metal case 210 so that
sound can flow into the inside.
After aligning the metal case 210 with the connection pattern 221 of the PCB substrate 220, a
laser beam machine (not shown) is provided. ) Is used to laser weld the connection site to
complete the package. Here, the connection pattern 221 is a ground terminal (not shown). When
the metal case 210 is welded here, the inflow of external noise can be blocked and noise can be
easily removed.
[0042]
The packaging complete microphone assembly is identical to that shown in FIG. 3 and will not be
further described to avoid repetition.
[0043]
1.3) Third Modification of First Embodiment FIG. 7 is an exploded perspective view showing a
microphone according to a third modification of the first embodiment of the present invention,
which is a modification of the first embodiment of the present invention. The third modification
is an example in which a cylindrical metal case 110 ′ having an “L” -shaped projecting blade
116 formed at an end is laser-welded to the PCB substrate 120.
[0044]
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Referring to FIG. 7, the MEMS chip 10 and the ASIC chip 20 are mounted on the PCB substrate
120, and a circular connection pattern 121 is formed in a portion in contact with the metal case
110 '.
Since the PCB substrate 120 is larger than the metal case 110 ′, connection pads and
connection terminals for connecting to an external device can be freely disposed on the surface
of the wide PCB substrate 120.
The connection pattern 121 is preferably plated with nickel (Ni) or gold (Au) after copper foil is
placed thereon by a general PCB manufacturing process. In the third modification of the first
embodiment of the present invention, the connection pattern 121 is wider than the connection
pattern 121 of the first modification of the first embodiment, corresponding to the blade portion
116 formed in the metal case 110 ′. It is preferable that
[0045]
The metal case 110 'of the third modification of the first embodiment has a cylindrical shape in
which the connection surface with the PCB substrate 120 is opened, and an acoustic hole 110a is
formed on the upper surface so that sound can flow in. In the end portion of the case body 114, a
wing portion 116 projecting outward is formed.
[0046]
The blade 116 at the end of the metal case 110 'is aligned with the connection pattern 121 of
the PCB, and then the laser beam machine (not shown).
Laser welding is used to complete the packaging.
[0047]
1.4) Fourth Modification of First Embodiment FIG. 8 is an exploded perspective view showing a
microphone according to a fourth modification of the first embodiment of the present invention,
which is a modification of the first embodiment of the present invention. The fourth modified
example is an example in which a square cylindrical metal case 210 ′ having an “L” -shaped
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projecting blade portion 216 formed at an end portion is laser-welded to the PCB substrate 220.
[0048]
Referring to FIG. 8, the MEMS chip 10 and the ASIC chip 20 are mounted on the PCB substrate
220, and a square connection pattern 221 is formed in a portion in contact with the metal case
210 ′.
Since the PCB substrate 220 is larger than the metal case 210 ′, connection pads and
connection terminals for connecting to an external device can be freely disposed on the surface
of the wide PCB substrate 220. The connection pattern 221 is preferably plated with nickel (Ni)
or gold (Au) after copper foil is placed thereon by a general PCB manufacturing process. In the
fourth modification of the first embodiment of the present invention, the connection pattern 221
corresponds to the second modification of the first embodiment corresponding to the wing
portion 216 formed at the end of the case body 214 of the metal case 210 ′. The width is
preferably wider than the connection pattern 221 of the example.
[0049]
The metal case 210 ′ is a square tube having a connecting surface with the PCB substrate 220
opened, and an acoustic hole 210a is formed on the upper surface so that sound can flow in, and
an end portion of the case body 214 The wing part 216 which protrudes outside is formed in
this.
[0050]
A laser processing machine (not shown) is disposed after aligning the blade portion 216 at the
end of the metal case 210 ′ with the connection pattern 221 of the PCB substrate 220.
Laser welding is used to complete the packaging.
[0051]
1.5) Fifth Modification of the First Embodiment FIG. 9 is a side sectional view showing a
microphone according to a fifth modification of the first embodiment of the present invention, in
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which the silicon condenser microphone has directivity. It is an example to make
[0052]
The fifth modification of the first embodiment of the present invention is the structure of the first
modification to the fourth modification of the first embodiment, and the front sound inflows to
the portion of the metal case 110 corresponding to the position of the MEMS chip 10. The rear
sound inflow hole 120a is formed at the position of the PCB substrate 120 on which the MEMS
chip 10 is mounted while the hole 110a is formed, and then the inner side or the outer side of
the front sound inflow hole 110a Or it is an example which installed the acoustic resistor 140
outside, and was made to have directivity characteristics.
[0053]
Referring to FIG. 9, in the completed directional microphone assembly of packaging, metal case
110 is strongly coupled to connection pattern 121 by laser welding on PCB substrate 120 on
which MEMS chip 10 and ASIC chip 20 are mounted. The space 150 between the metal case 110
and the PCB substrate 120 functions as an acoustic chamber.
[0054]
A front sound inflow hole 110a for introducing a front sound is formed in a portion
corresponding to the position of the MEMS chip 10 in the metal case 110, and in a position
where the MEMS chip 10 is mounted in the PCB substrate 120, the rear A rear sound inflow hole
120a is formed for the inflow of sound.
An acoustic resistor 140 is installed inside the front sound inflow hole 110a.
Also, at least two to eight connection terminals 123 for connecting with an external device may
be formed on the bottom surface of the PCB substrate 120, and each connection terminal 123
may be formed through the through hole 124. It can be electrically conducted to the chip
component surface.
In particular, in the embodiment of the present invention, when the connection terminals 123
and 125 are formed long to the peripheral portion of the PCB substrate 120, rework operation
can be easily performed with an electric soldering iron or the like through the exposed surface.
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[0055]
In the fifth modification of the first embodiment, the acoustic resistor 140 is located inside the
front sound inlet hole 110a, but the outside of the front sound inlet hole 110a or the inner side
of the rear sound inlet hole 120a Or it can also be provided outside. In the structure of the fifth
modification of the first embodiment, the sound introduced through the front sound inflow hole
110a and the rear sound inflow hole 120a changes its phase while passing through the
corresponding acoustic resistor 140, and has directivity characteristics. It will be.
[0056]
2. Second Embodiment 2.1) First Modification of Second Embodiment FIG. 10 is a side
sectional view showing a microphone in which an acoustic hole is formed in a PCB substrate
according to a first modification of the second embodiment of the present invention. 11 is a side
sectional view showing an example in which the microphone shown in FIG. 10 is mounted on a
main PCB, and FIG. 12 shows a microphone according to a first modification of the second
embodiment of the present invention. It is an exploded perspective view.
[0057]
According to the second embodiment of the present invention, as shown in FIGS. 10 to 12, a
cylindrical metal case 110 is mounted on a PCB substrate 120 on which a MEMS chip 10 and an
ASIC chip 20 are mounted and an acoustic hole 120a is formed. This is an example of laser
welding.
[0058]
Referring to FIGS. 10 to 12, an acoustic hole 120a for introducing external sound is formed in
the central portion of the PCB substrate 120, and a MEMS chip 10 and an ASIC chip 20 are
provided around the acoustic hole 120a. A circular connection pattern 121 is formed at the
portion mounted and in contact with the metal case 110.
And although not shown in the drawings, capacitors, resistors and the like for shielding
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electromagnetic waves or ESD can be mounted together, if necessary.
[0059]
Since the PCB substrate 120 is larger than the metal case 110, connection pads and connection
terminals for connecting to an external device can be freely disposed on the wide PCB substrate
surface 120. The connection pattern 121 is formed by plating nickel (Ni) or gold (Au) after
copper foil is placed thereon by a general PCB manufacturing process. At this time, in addition to
the PCB substrate 120, various substrates such as a ceramic substrate, an FPCB substrate, and a
metal PCB substrate can be used as the substrate.
[0060]
The metal case 110 has a cylindrical shape in which the connection surface with the PCB
substrate 120 is opened so that chip components can be mounted inside, and sound can flow in
through the acoustic hole 120 a of the PCB substrate. , The bottom is closed. The material of the
metal case 110 may be brass, copper, stainless steel, aluminum, nickel alloy or the like, and may
be used as gold or silver plating. The shape of the metal case can be various shapes such as
circular and square.
[0061]
After aligning the metal case 110 with the connection pattern 121 of the PCB substrate 120, a
laser beam machine (not shown) is provided. ) And laser weld the connection portion 130 to
complete the microphone package. Here, the connection pattern 121 is a ground terminal (not
shown). When the metal case 110 is welded here, the inflow of external noise can be blocked and
noise can be easily removed.
[0062]
In the microphone assembly thus completed, as shown in FIG. 10, the connection pattern 121 of
the PCB substrate 120 and the metal case 110 are strongly coupled by laser welding, and the
metal case 110 and the PCB substrate 120 are Space 150 acts as an acoustic chamber.
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[0063]
Also, an acoustic hole 120a is formed in the PCB substrate 120 for the inflow of external sound,
and around the acoustic hole 120a on the bottom surface of the PCB substrate 120, an acoustic
In order to prevent distortion, a sealing terminal 120b is formed for sealing the acoustic hole
120a by soldering.
At this time, at least two to eight connection terminals 123, 125 for connecting with an external
device can be formed, and each connection terminal 123, 125 is electrically conducted to the
chip component surface through the through hole 124. Can. In particular, when the connection
terminals 123 and 125 are formed long to the peripheral portion of the PCB substrate 120 in the
embodiment of the present invention, rework operation can be easily performed with an electric
trowel or the like through the exposed surface.
[0064]
An example in which the microphone according to the embodiment of the present invention is
mounted on the main PCB 300 is illustrated in FIG. Referring to FIG. 11, in the main PCB 300 of
the product on which the microphone is mounted, a main acoustic hole 300a for introducing
external sound is formed, and between the main PCB 300 and the microphone around the main
acoustic hole 300a. In order to prevent the distortion of the sound wave in the space, a sealing
terminal 302 for sealing the acoustic hole 300a by soldering is formed, and a connection pad
304 is formed corresponding to the connection terminals 123 and 125 of the microphone. ing.
When a microphone according to an embodiment of the present invention is connected to such a
main PCB 300 by soldering 310, external sound is introduced through the main acoustic hole
300a of the main PCB 300 and then the area sealed by the sealing terminal 302 is Then, the
sound is input to the inside of the microphone through the acoustic hole 120 a of the PCB
substrate 120.
[0065]
In the first modification of the second embodiment of the present invention, the welding of the
metal case 110 and the PCB substrate 120 has been described by taking laser welding as an
example, but electric welding, soldering, bonding by a conductive adhesive, etc. are also possible.
is there.
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[0066]
2.2) Second Modified Example of Second Embodiment FIG. 13 is an exploded perspective view
showing a microphone according to a second modified example of the second embodiment of the
present invention, which is a second modification of the second embodiment of the present
invention. The second modification is an example in which the rectangular cylindrical metal case
210 is laser-welded to the PCB substrate 220.
[0067]
Referring to FIG. 13, an acoustic hole 220 a for receiving external sound is formed in the PCB
substrate 220, and the MEMS chip 10 and the ASIC chip 20 are mounted around the acoustic
hole 220 a, and metal A rectangular connection pattern 221 is formed in a portion in contact
with the case 210.
The connection pattern 221 is formed of a copper foil film by the usual PCB pattern technology.
Although not shown in the drawing, around the acoustic hole 220a on the bottom of the PCB
substrate 220, the acoustic is to prevent distortion of the acoustic wave between the main PCB
(identical to the main PCB 300 in FIG. 11) and the microphone. A sealing terminal is formed to
seal the hole 220a by soldering.
[0068]
The metal case 210 is a square cylinder having an open surface to be connected to the PCB
substrate 220 and allows external sound to flow in through the acoustic holes 220 a of the PCB
substrate 220, so the bottom of the metal case 210 is blocked.
[0069]
After aligning the metal case 210 with the connection pattern 221 of the PCB substrate 220, a
laser beam machine (not shown) is provided.
) Is used to laser weld the connection site to complete the packaging. Here, the connection
pattern 221 is a ground terminal (not shown). When the metal case 210 is welded here, the
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inflow of external noise can be blocked and noise can be easily removed.
[0070]
The packaging complete microphone assembly is identical to that shown in FIG. 10, so further
description will be omitted to avoid repetition.
[0071]
2.3) Third Modified Example of Second Embodiment FIG. 14 is an exploded perspective view
showing a microphone according to a third modified example of the second embodiment of the
present invention, which is a second modification of the second embodiment of the present
invention. The third modification is an example in which a cylindrical metal case 110 ′ having
an “L” -shaped projecting blade 116 formed at an end is laser-welded to the PCB substrate
120.
[0072]
Referring to FIG. 14, an acoustic hole 120a for receiving external sound is formed in the PCB
substrate 120, and the MEMS chip 10 and the ASIC chip 20 are mounted, and in a portion in
contact with the metal case 110 '. , And circular connection patterns 121 are formed.
Although not shown in the drawings, around the bottom acoustic hole 120a of the PCB substrate
120, an acoustic hole is provided to prevent distortion of the sound wave between the main PCB
(identical to the main PCB 300 in FIG. 11) and the microphone. Sealing terminal (not shown) for
soldering and sealing 120a.
) Is formed. Since the PCB substrate 120 is larger than the metal case 110 ′, connection pads
and connection terminals for connecting to an external device can be freely disposed on the
surface of the wide PCB substrate 120. The connection pattern 121 is preferably plated with
nickel (Ni) or gold (Au) after copper foil is placed thereon by a general PCB manufacturing
process. In the third modification of the second embodiment of the present invention, the
connection pattern 121 is preferably wider than the connection pattern 121 of the first
modification, corresponding to the blade portion 116 formed in the metal case.
[0073]
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The metal case 110 'according to the third modification of the second embodiment has a
cylindrical shape with an open connection surface with the PCB substrate 120, and an external
sound flows in through the acoustic hole 120a of the PCB substrate 120. The bottom of 110 'is
closed, and at the end of the case body 114, an outwardly projecting wing 116 is formed.
[0074]
The blade 116 at the end of the metal case 110 'is aligned with the connection pattern 121 of
the PCB, and then the laser beam machine (not shown).
Laser welding is used to complete the packaging.
[0075]
2.4) Fourth Modification of Second Embodiment FIG. 15 is an exploded perspective view showing
a microphone according to a fourth modification of the second embodiment of the present
invention, which is a modification of the second embodiment of the present invention. The fourth
modified example is an example in which a square cylindrical metal case 210 ′ having an “L”
-shaped projecting blade portion 216 formed at an end portion is laser-welded to the PCB
substrate 220.
[0076]
Referring to FIG. 15, an acoustic hole 220a for receiving external sound is formed in the PCB
substrate 220, and the MEMS chip 10 and the ASIC chip 20 are mounted, and in a portion in
contact with the metal case 210 '. , And a rectangular connection pattern 221 is formed.
Although not shown in the drawing, around the acoustic hole 220a on the bottom of the PCB
substrate 220, the acoustic is to prevent distortion of the acoustic wave between the main PCB
(identical to the main PCB 300 in FIG. 11) and the microphone. Sealing terminals (not shown) for
sealing the holes 220a by soldering. ) Is formed. Since the PCB substrate 220 is larger than the
metal case 210 ′, connection pads and connection terminals for connecting to an external
device can be freely disposed on the surface of the wide PCB substrate 220. The connection
pattern 221 is preferably plated with nickel (Ni) or gold (Au) after copper foil is placed thereon
by a general PCB manufacturing process. In the fourth modification of the second embodiment of
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the present invention, the connection pattern 221 corresponds to the connection pattern 221 of
the second modification corresponding to the blade portion 216 formed at the end of the case
body 214 of the metal case 210 ′. A wider one is preferred.
[0077]
The metal case 210 'is a square tube having a connecting surface with the PCB substrate 220,
and an external sound flows in through the acoustic hole 220a of the PCB substrate, so the
bottom of the metal case 210' is blocked. At the end of the body 214, an outwardly projecting
wing portion 216 is formed.
[0078]
After aligning the blade portion 216 at the end of the metal case 210 ′ with the connection
pattern 221 of the PCB substrate, laser welding is performed using a laser processing machine
(not shown) to complete the packaging. .
[0079]
2.5) Fifth Modification of Second Embodiment FIG. 16 is a side sectional view showing a
microphone according to a fifth modification of the second embodiment of the present invention,
wherein the position of the MEMS chip 10 on the PCB substrate 120 is shown. The acoustic hole
120a is formed in the portion to be formed.
[0080]
Referring to FIG. 16, the packaged microphone assembly is strongly coupled to the connection
pattern 121 by laser welding the metal case 110 on the PCB substrate 120 on which the MEMS
chip 10 and the ASIC chip 20 are mounted. .
[0081]
At the position where the MEMS chip 10 is mounted on the PCB substrate 120, an acoustic hole
120a for introducing external sound into the inside is formed, and in the space between the main
PCB 300 and the microphone outside the acoustic hole 120a. In order to prevent distortion of
the sound wave, a sealing terminal 120b is formed for sealing the acoustic hole 120a by
soldering.
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At the bottom of the PCB substrate 120, at least two to eight connection terminals 123 for
connecting with an external device can be formed, and each connection terminal 123, 125 is
electrically connected to the chip component surface through the through hole 124. Can be
conducted.
In particular, in the embodiment of the present invention, when the connection terminals 123
and 125 are formed long to the peripheral portion of the PCB substrate 120, rework can be
easily performed with an electric trowel or the like through the exposed surface.
[0082]
In the structure of the fifth modification of the second embodiment, the external sound
introduced through the acoustic hole 120 a is vibrated through the sound hole formed in the
back plate 13 of the MEMS chip 10 to vibrate the diaphragm 11. Generate an electrical signal.
Here, although not shown in the drawings, in order to mount the microphone on the main PCB
300, the main PCB 300 is provided with a hole corresponding to the acoustic hole 120a, and the
outer periphery of the hole with the main PCB 300 and the microphone. In order to prevent the
distortion of the sound wave in the space between, sealing terminals are formed for sealing and
sealing the holes.
[0083]
2.6) Sixth Modification of Second Embodiment FIG. 17 is a side cross sectional view showing a
microphone according to a sixth modification of the second embodiment of the present
invention, in which the silicon condenser microphone has directivity. In the case of
In the modification of this embodiment, the sound flowing in from the PCB substrate 120 side is
defined as the front sound, and the sound flowing in from the metal case 110 side is defined as
the rear sound.
[0084]
The sixth modified example of the second embodiment of the present invention has the structure
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22
of the fifth modified example of the second embodiment, in which the front sound inflow hole
120 a is formed at the position of the PCB substrate 120 on which the MEMS chip 10 is
mounted. After the rear sound inlet hole 110a is formed at the position of the metal case 110 on
which the MEMS chip 10 is mounted, the acoustic resistor 140 is provided inside the front sound
inlet hole 120a or inside or outside the rear sound inlet hole 110a. This is an example in which a
directional characteristic is provided by adding
[0085]
Referring to FIG. 17, the packaged directional microphone assembly is strongly coupled to the
connection pattern 121 by laser welding on the PCB substrate 120 on which the MEMS chip 10
and the ASIC chip 20 are mounted. It is done.
[0086]
A front sound inlet hole 120a for introducing a front sound is formed at a position of the PCB
substrate 120 on which the MEMS chip 10 is mounted, and the case 110 is provided with a rear
sound inlet hole 110a for introducing a rear sound. Is formed.
An acoustic resistor 140 is installed inside the rear sound inflow hole 110a.
In addition, a sealing terminal 120b is formed around the outside of the front sound inflow hole
120a to seal the acoustic hole 120a by soldering in order to prevent distortion of the sound wave
in the space between the main PCB and the microphone. There is. At least two to eight
connection terminals 123 for connecting with an external device may be formed on the bottom
surface of the PCB substrate 120, and each connection terminal 123 and 125 may be a chip
through the through hole 124. It can be electrically connected to the component surface.
[0087]
In the structure of the sixth modification of the second embodiment, the sound introduced
through the front sound inflow hole 120a and the rear sound inflow hole 110a changes in phase
while passing through the corresponding acoustic resistor 140, It comes to have characteristics.
[0088]
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23
3.
Third Embodiment 3.1) First Modification of Third Embodiment FIG. 18 is a perspective view
showing a silicon capacitor microphone according to a third embodiment of the present
invention, and FIG. 19 is a third embodiment of the present invention. FIG. 20 is a conceptual
view showing an example in which a silicon capacitor microphone according to an embodiment is
mounted, and FIG. 20 is a side sectional view showing an example in which a silicon capacitor
microphone according to a third embodiment of the present invention is mounted.
[0089]
In the silicon capacitor microphone according to the present embodiment, as shown in FIG. 18A,
a cylindrical metal case 110 whose bottom is closed is coupled to a PCB substrate 120 wider
than the metal case 110, and the PCB substrate 120 is used. On the component side 120c,
connection terminals 122-1 to 122-4 for connecting to the connection pads 304-1 to 304-4 of
the main PCB 300 of the product in which the microphone is used are formed. In the
modification of this embodiment, four connection terminals are illustrated, but this is only one
example, and at least 2 to 8 can be formed. When the connection terminals 122-1 to 122-4 are
extended to the side wall portion of the substrate or to the opposite surface of the component
surface through the side wall portion, the heat transfer such as the electric iron is improved, and
the rework operation is performed. It can be easier.
[0090]
Then, as shown in FIG. 18B, the main PCB 300 of the product on which the silicon capacitor
microphone according to the present embodiment is mounted has a circular insertion hole 306
so that the metal case 110 of the silicon capacitor microphone is mounted. The connection pads
304-1 to 304-4 are formed corresponding to the connection terminals 122-1 to 122-4 formed
on the substrate 120 of the microphone.
[0091]
In an example of mounting the silicon capacitor microphone according to the present
embodiment to such a main PCB 300, as shown in FIG. 19, an acoustic hole 120a for receiving
external sound is formed, and connection terminals 122-1 to 122- After the component surface
120c of the PCB substrate 120 of the microphone on which the metal case 110 whose bottom is
closed is formed is directed to the main PCB 300, the metal case of the microphone is inserted
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into the insertion hole 306 formed in the main PCB 300. Insert 110 to solder and connect the
connection pads 304-1 to 304-4 of the main PCB 300 and the connection terminals 122-1 to
122-4 of the microphone.
[0092]
Thus, as shown in FIG. 20, the entire structure in which the silicon capacitor microphone is
mounted on the main PCB 300 is such that the metal case 110 protruding at the central portion
of the component surface 120c of the PCB substrate 120 is inserted into the insertion hole 306
of the main PCB 300 At the same time, the connection pads 304 of the main PCB and the
connection terminals 122 of the microphone are connected by the solder ring 310.
[0093]
Therefore, according to the mounting method of the present embodiment, the metal case 110
that protrudes above the PCB substrate 120 of the microphone is inserted into the insertion hole
306 formed in the main PCB 300, so the overall height after mounting ( t) efficiently using the
component mounting space of the product, as the connection terminals are formed on the
opposite side of the component surface with the conventional microphone and lower than the
overall height when mounted on the main PCB it can.
[0094]
The MEMS chip 10 and the ASIC chip 20 are mounted on the PCB substrate 120 inside the metal
case 110 of such a silicon capacitor microphone, as shown in the sectional view of FIG. An
acoustic hole 120a for receiving sound is formed, and a circular connection pattern 121 is
formed in a portion in contact with the closed metal case 110 on the bottom surface.
[0095]
And although not shown in the drawings, capacitors, resistors and the like for shielding
electromagnetic waves or ESD can be mounted together, if necessary.
At this time, various substrates such as a ceramic substrate, an FPCB substrate, and a metal PCB
substrate can be used as the substrate in addition to the above-described PCB substrate 120.
The metal case 110 is made of brass, copper, stainless steel, aluminum, nickel alloy or the like,
18-04-2019
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and can be used as gold or silver plating.
[0096]
Then, as shown in the side cross sectional view of FIG. 20, when the connection terminal 122 is
extended to the opposite surface of the component surface through the side wall portion of the
PCB substrate 120, the heat transfer such as electric soldering is improved and the rework
operation is performed. It can be easier and, although not shown in the drawings, it is also
possible to extend the connection terminals 122 only to the side wall of the substrate.
[0097]
3.2) Second Modified Example of Third Embodiment FIG. 21 is a perspective view showing a
second modified example of the silicon capacitor microphone according to the third embodiment
of the present invention, and FIG. 21 (b) is a perspective view showing a main PCB of a product
for mounting a square cylindrical silicon condenser microphone. FIG.
[0098]
In a silicon condenser microphone according to a second modification of the third embodiment
of the present invention, as shown in FIG. 21A, a square cylindrical metal case 210 whose bottom
is closed is coupled to a substrate 120, The component surface 120c of the PCB substrate 120 is
formed with a connection terminal 122 for connecting to the connection pad 304 of the main
PCB 300 of the product in which the microphone is used.
And, although not shown in the drawings, an acoustic hole (not shown) for introducing an
external sound into the central portion of the PCB substrate 120.
) Is formed.
[0099]
In addition, as shown in FIG. 21B, a metal case 210 of a silicon condenser microphone is
mounted on a main PCB 300 of a product on which a silicon condenser microphone according to
a second modification of the third embodiment of the present invention is mounted. Thus, the
rectangular insertion holes 306 are formed, and the connection pads 304 are formed
corresponding to the connection terminals 122 formed on the substrate 120 of the microphone.
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[0100]
In the method of mounting the silicon capacitor microphone according to the present
embodiment on such a main PCB 300, the main PCB 300 on which the insertion hole 306 for
inserting the microphone and the connection pad 304 for electrically connecting to the
microphone are formed. In the preparation step, a square cylindrical metal case 210 protrudes at
the center of the component surface 120c of the PCB substrate 120, and the connection terminal
122 and the acoustic hole 120a for connecting to the connection pad 304 are on the component
surface 120c of the substrate. The steps of preparing the formed capacitor microphone, inserting
the metal case 210 of the capacitor microphone into the insertion hole 306 of the main PCB 300,
and soldering the connection pad 304 of the main PCB 300 and the connection terminal 122 of
the microphone Ru.
Such a method is substantially the same as the mounting method of the first modification of the
third embodiment except that the shape of the case is a square cylinder.
[0101]
3.3) Third Modification of Third Embodiment FIG. 22 is a side sectional view showing an example
in which a third modification of the silicon capacitor microphone according to the third
embodiment of the present invention is mounted.
Referring to FIG. 22, in the silicon capacitor microphone according to the present embodiment,
the metal case 110/210 part protruding on the PCB substrate 120 is inserted into the insertion
hole 306 formed in the main PCB 300, and the microphone PCB Connection terminals 122
located on the component surface 120 c of 120 are connected to the connection pads 304 of the
main PCB by soldering 310.
At a position where the MEMS chip 10 of the microphone substrate 120 is mounted, an acoustic
hole 120 a for introducing an external sound is formed.
[0102]
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Here, the silicon condenser microphone according to the present embodiment has the structure
of the first modified example or the second modified example of the third embodiment, and the
bottom surface is closed without forming an acoustic hole in the metal case 110/210. In the PCB
substrate 120 at the position where the chip 10 is mounted, an acoustic hole 120 a for
introducing an external sound is formed.
[0103]
In the structure shown in FIG. 22, the external sound introduced through the acoustic hole 120a
formed on the substrate 120 vibrates the diaphragm through the sound hole formed in the back
plate 13 of the MEMS chip 10, and the electricity is generated. Generate a dynamic signal.
[0104]
3.4) Fourth Modification of Third Embodiment FIG. 23 is a side sectional view showing an
example in which a fourth modification of the silicon capacitor microphone according to the third
embodiment of the present invention is mounted.
In the fourth modification of the third embodiment of the present invention, the sound flowing in
from the PCB substrate 120 side is defined as the front sound, and the sound flowing in from the
metal case 110/210 side is defined as the rear sound.
[0105]
Referring to FIG. 23, in the directional silicon capacitor microphone according to the fourth
modification of the third embodiment of the present invention, an insertion hole in which the
metal case 110/210 part protruding on the PCB substrate 120 is formed in the main PCB 300
Connection terminals 122 inserted in 306 and located on the component surface 120 c of the
microphone PCB 300 are connected to the connection pads 304 of the main PCB 300 by solder
rings 310.
A front sound inlet hole 120a for introducing a front sound is formed in a portion of the
microphone substrate 120 at a position where the MEMS chip 10 is mounted, and a rear for
introducing a rear sound into the case 110/210. A sound inflow hole 110a is formed.
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[0106]
Here, in the directional silicon condenser microphone according to the third embodiment of the
present invention, the acoustic resistor 140 is installed inside or outside the front sound inflow
hole 120a or inside or outside the rear sound inflow hole 110a, It is a structure designed to have
directional characteristics.
[0107]
In the structure of FIG. 23, the external sound introduced through the front sound inflow hole
120a or the rear sound inflow hole 110a changes its phase while passing through the
corresponding acoustic resistor 140 so as to have directional characteristics. Become.
[0108]
According to the present invention, a silicon microphone chip manufactured by micromachining
technology can be packaged to improve mechanical rigidity and to increase noise inflow
prevention effect.
[0109]
Specifically, laser welding a metal case to a substrate provides high bonding strength, improves
mechanical rigidity, is resistant to external noises, and in particular reduces process costs,
significantly increasing the overall manufacturing cost. It has the advantage of being lowered.
[0110]
In addition, the conventional microphone manufacturing process omits the curling process,
which is the process of bonding the metal case and the PCB, and immediately welds the metal
case to the PCB substrate on which the capacitor microphone component is mounted. The
acoustic characteristics can also be improved by improving the electrical conductivity of the
device and sealing it so that sound pressure does not enter from the outside.
[0111]
In addition, since the form of the PCB is not limited by the case, the design of the PCB used for
the microphone can be freed, so that various forms of terminals can be formed, and the physical
force applied during curling as in the prior art Because it is possible to work without it, thinner
PCBs can be applied, and when using such thin PCBs, the height of the product can be reduced,
so that thinner microphones can also be manufactured. .
18-04-2019
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[0112]
In the silicon condenser microphone according to the present invention, an acoustic hole for
introducing external sound is formed not on the case but on the substrate, and the connection
terminal is formed on the component surface of the substrate, and the microphone is mounted on
the main PCB An insertion hole is formed.
Therefore, in the silicon capacitor microphone mounted on the main PCB according to the
present invention, since the case part protruding above the substrate is inserted into the
insertion hole formed on the main PCB by the microphone, the overall height after mounting is
conventionally It has the advantage of being able to use the component space of the product
efficiently, as it is lower than it is.
[0113]
Although the preferred embodiments of the present invention have been described above with
reference to the accompanying drawings, it goes without saying that the present invention is not
limited to such examples.
It will be apparent to those skilled in the art that various changes and modifications can be made
within the scope of the appended claims, and of course these also fall within the technical scope
of the present invention. It is understood.
[0114]
It is a sectional side view which shows the microphone concerning a 1st modification of a 1st
embodiment of the present invention.
It is an exploded perspective view showing the microphone concerning the modification.
It is a sectional side view which shows the structure of the MEMS chip of the silicon | silicone
18-04-2019
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capacitor microphone applied commonly to each embodiment of this invention.
It is a circuit diagram of a silicon condenser microphone applied commonly to each embodiment
of the present invention.
It is a flow chart which shows the packaging method of the silicon condenser microphone
concerning each embodiment of the present invention.
It is an exploded perspective view showing the microphone concerning the 2nd modification of a
1st embodiment of the present invention. It is a separation perspective view showing the
microphone concerning the 3rd modification of the embodiment. It is a separation perspective
view showing the microphone concerning the 4th modification of the embodiment. It is a
sectional side view which shows the microphone which concerns on the 5th modification of the
embodiment. It is a sectional side view which shows the microphone which concerns on the 1st
modification of 2nd Embodiment of this invention. FIG. 11 is a side sectional view showing an
example in which the microphone shown in FIG. 10 is mounted on a main PCB. It is an exploded
perspective view showing the microphone concerning the 1st modification of a 2nd embodiment
of the present invention. It is a separation perspective view showing the microphone concerning
the 2nd modification of the embodiment. It is a separation perspective view showing the
microphone concerning the 3rd modification of the embodiment. It is a separation perspective
view showing the microphone concerning the 4th modification of the embodiment. It is a
sectional side view which shows the microphone which concerns on the 5th modification of the
embodiment. It is a sectional side view which shows the microphone concerning a 6th
modification of the embodiment. It is a perspective view showing a silicon condenser microphone
concerning a 3rd embodiment concerning the present invention. It is a conceptual diagram which
shows the example in which the silicon | silicone capacitor microphone concerning the
embodiment was mounted. It is a sectional side view which shows the example in which the
silicon | silicone capacitor microphone concerning the embodiment was mounted. It is a
perspective view which shows the 2nd modification of the silicon capacitor microphone
concerning the embodiment. It is a sectional side view which shows the example in which the 3rd
modification of the silicon capacitor microphone concerning the embodiment was mounted. It is
a sectional side view which shows the example in which the 4th modification of the silicon
capacitor microphone concerning the embodiment was mounted.
Explanation of sign
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[0115]
DESCRIPTION OF SYMBOLS 10 MEMS chip 20 ASIC chip 110, 110 ', 210, 210' metal case 110a,
120a, 210a, 220a acoustic hole, back sound inflow hole, front sound inflow hole 114, 214 case
body 116, 216 blade portion 120, 220 PCB Substrate 120b Sealing terminal 121, 221
Connection pattern 122, 123, 125 Connection terminal 124 Through hole 130 Connection part
140 Acoustic resistor 150 Space 300 Main PCB 300a Main acoustic hole 302 Sealing terminal
304 Connection pad 306 Insertion hole 310 Soldering
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