close

Вход

Забыли?

вход по аккаунту

?

DESCRIPTION JP2008147806

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2008147806
The present invention provides a capacitor microphone in which an input terminal of an
impedance converter is soldered to a fixed electrode side by completely removing a cohesive flux
causing a leakage current, and a method of manufacturing the same. SOLUTION: A soldering
process of soldering the gate terminal 16 of the FET 13 as the impedance converter 12 to the
fixed pole 42 side is pretreated by covering the remaining part of the soldering part 17 with the
insulating sealing material S and curing it. The cohesion of the cohesion flux 20 is carried out
through the steps of actual soldering processing of soldering the soldering part 17 and postprocessing of removing the cohesion flux 20 adhering to the insulating sealing material S side
after soldering. It is possible to provide a capacitor microphone 11 which is completely
eliminated and the generation of noise due to leakage current is prevented. [Selected figure]
Figure 1
Condenser microphone and method of manufacturing the same
[0001]
The present invention relates to a capacitor microphone manufactured by soldering an input
terminal of an impedance converter to a fixed pole side and a technique relating to a method of
manufacturing the same.
[0002]
The condenser microphone is provided with at least an impedance converter capable of
inputting, with high impedance, the change in the converted electrical capacitance of the
capacitor unit formed by pairing the diaphragm and the fixed pole with high impedance and
outputting it at low impedance. It is formed.
18-04-2019
1
[0003]
For example, a field effect transistor (hereinafter referred to as "FET") including a gate terminal
as an input side terminal and a vacuum tube including a grid terminal as an input side terminal
are used in a capacitor microphone as an impedance converter.
[0004]
Among them, when the impedance converter is a FET, for example, as disclosed in FIG. 2 of
Patent Document 1 below, a gate terminal is connected to a relay member such as a contact
spring interposed between it and a fixed pole. There is also a system in which an electrical
connection with the fixed electrode side is secured by bringing
Also, in such an FET, the gate terminal may be soldered to the contact spring on the fixed pole
side in order to strengthen the conduction between the fixed pole side and the FET.
Unexamined-Japanese-Patent No. 2006-157332
[0005]
Furthermore, among condenser microphones that require particularly good sound quality, a
vacuum tube as disclosed in Patent Document 2 below is used as an impedance converter.
In this case, in the vacuum tube as the impedance converter, the grid terminal is soldered to the
fixed electrode side. Unexamined-Japanese-Patent No. 11-317996
[0006]
FIG. 3 is a side view showing a conventional soldering condition of the gate terminal to the fixed
pole side when an FET is used as an impedance converter. According to the figure, the FET 1
mounted on the printed circuit board 5 is drawn out from the side of the main body 2 and
18-04-2019
2
directed to the fixed electrode 7 side, the gate terminal 3 and the drain terminal and source
terminal toward the printed circuit 5 side. And at least a lead terminal 4 (the other one is hidden
in the illustrated example).
[0007]
Among them, the gate terminal 3 is pulled out from the side of the main body 2, is folded back to
the opposite side to the fixed pole 7, and is soldered to the contact spring 6 interposed between
the FET 1 and the fixed pole 7. It is attached.
[0008]
In this case, the gate terminal 3 is routed around a predetermined distance from the main body 2
in order to avoid the occurrence of a leakage current.
Therefore, a narrow gap G is generated between the side surface side of the main body 2 and the
gate terminal 3.
[0009]
In the capacitor microphone manufactured by soldering in this manner, the FET 1 is fixed by
passing through a soldering process in which the soldered portion 3 a of the gate terminal 3 is
soldered to the fixed pole 7 via the contact spring 6. It is manufactured with a structure for
inputting the signal voltage from the 7 side with high impedance.
[0010]
By the way, as shown in FIG. 3, on the peripheral side of the soldering portion 3a where the gate
terminal 3 is connected to the contact spring 6 via the solder 8, the flux 9 used to improve the
conformity of the solder 8 is obtained. The flux 9 adheres to a site including the gap G around
the soldering site 3a.
[0011]
Since the flux 9 attached in this manner has the property of absorbing moisture with the passage
of time and increasing the electric conductivity, the insulation of the soldering site 3a is
18-04-2019
3
weakened.
For this reason, usually, the flux 9 is dissolved with a solvent, detergent or the like and then
removed by washing using a brush or the like.
[0012]
However, the FET 9 shown in FIG. 3 is difficult to remove because the flux 9 that has entered and
attached to the gap G between the main body 2 and the gate terminal 3 does not go into the gap
G because the bristles of the cleaning brush enter. As it is, it will be incorporated into a
condenser microphone as a product.
For this reason, since the insulation property of the soldering part 3a of FET1 falls and a
capacitor | condenser microphone comes to generate a leakage current, there existed a fault that
FET1 can not maintain a high input impedance and will generate noise. .
[0013]
Such a problem similarly occurs when the minute size vacuum tube is used as the impedance
converter, since the flux 9 remains at a narrow portion when the grid terminal is soldered. .
[0014]
In addition, such a defect does not occur in the initial stage of commercialization as a condenser
microphone, but occurs after a certain period of time has passed since the user started using it,
thereby deteriorating the product image. There was also a problem of that.
[0015]
SUMMARY OF THE INVENTION In view of the above problems of the prior art, the present
invention fixes an input side terminal (a gate terminal in the former case, a grid terminal in the
latter case) of a signal voltage in an FET or a vacuum tube used as an impedance converter in a
condenser microphone It is another object of the present invention to provide a capacitor
microphone and a method of manufacturing the same in which the aggregation flux causing the
leakage current is completely removed and soldered to prevent the generation of noise due to the
aggregation flux.
18-04-2019
4
[0016]
The present invention has been made to achieve the above object, and the first invention (method
of manufacturing a condenser microphone) is an input terminal of an impedance converter that
receives a signal voltage from the fixed pole side with high impedance. In the method of
manufacturing a condenser microphone including at least a soldering step of soldering on the
fixed electrode side during the manufacturing process, the soldering step includes soldering of
the input terminal drawn out toward the fixed electrode side. Pretreatment for covering and
curing the remaining part without gaps with an insulating sealing material, actual soldering
processing for soldering the soldering part, and cohesive flux adhering to the insulating sealing
material side after soldering The most important feature is to carry out through post-processing
and removing.
[0017]
In this case, it is desirable that the input side terminal be either a gate terminal in the FET or a
grid terminal in the vacuum tube.
[0018]
The second invention (condenser microphone unit) is mainly characterized in that it is
manufactured by the manufacturing method according to claim 1 or 2.
[0019]
According to the invention of claim 1, in the step of soldering the input terminal of the
impedance converter to the fixed electrode side, the remaining portion excluding the soldering
portion of the input terminal is covered with the insulating sealing material without any gap and
hardened. The process is carried out through the process, the actual soldering process of
soldering the soldering site, and the post-process of removing the cohesive flux adhering to the
insulating sealing material side after the soldering, so that the leakage current from the input
side terminal Condenser microphones can be manufactured by completely removing the
cohesion flux which is the cause and soldering the input side terminal to the fixed electrode side.
[0020]
Further, according to the invention of claim 2, it is possible to manufacture a condenser
microphone which does not generate a leakage current from the input side terminal even when
either of the FET and the vacuum tube is used as the impedance converter. .
18-04-2019
5
[0021]
Furthermore, according to the invention of claim 3, the condenser microphone manufactured by
the above manufacturing method can prevent the generation of noise due to the leakage current
from the input side terminal of the impedance converter, and it is comfortable for a long time It
can be used.
[0022]
FIG. 1 is an explanatory view showing a soldering process when an impedance converter is an
FET in the first invention of the present invention separately according to the processing
procedure, of which (a) indicates pretreatment and (b) indicates (C) shows an after-treatment,
respectively.
Moreover, FIG. 2 is a side view which shows the arrangement | positioning relationship between
FET and a printed circuit board before entering into the said soldering process.
[0023]
In this case, the FET 13 is pulled out from the side 14a side of the body 14 and is directed to the
fixed pole 42, as is apparent from FIG. 2 as well as the body 14 having a gate electrode, a source
electrode and a drain electrode. A gate terminal 16 as the input side terminal 15 and a lead
terminal 18 which is a pair of a source terminal and a drain terminal which are similarly drawn
out from the side surface 14 a and soldered to the printed board 22 are also provided.
In the illustrated example, only one lead terminal 18 is shown because one of the source terminal
and the drain terminal is hidden behind.
[0024]
Among them, the gate terminal 16 has a lead-out portion 16a protruding from the side surface
14a side of the main body portion 14, an upright portion 16b directly raised from the lead-out
portion 16a along the surface direction of the side surface 14a, and the upright portion 16b. 1
(b), it is formed with a folded portion 16c used as a soldering portion 17 by facing toward the
side 14b opposite to the fixed pole 42 of the main body 14 as shown in FIG. 1 (b). .
18-04-2019
6
[0025]
Therefore, the gate terminal 16 is drawn around with the narrow gap G interposed between the
upright portion 16 b and the side surface 14 a of the main body portion 14.
[0026]
Next, the soldering step of soldering the gate terminal 16 of the FET 13 in such an arrangement
relationship to the fixed pole 42 side will be described by way of example. The gate terminal 16
drawn out toward the fixed pole 42 A pretreatment in which the remaining portion excluding the
soldering portion 17 is covered with the insulating sealing material S without any gap and
hardened, and the soldering portion 17 is soldered to the contact spring 32 used as an
interposed part on the fixed electrode 42 side. It is carried out through the soldering process and
the post-process which removes the aggregation flux 20 adhering to the insulating sealing
material S side after soldering.
[0027]
Among these, in the pretreatment, the lead-out portion 16a and the upright portion which
become the remaining portion of the soldered portion 17 of the gate terminal 16 so as to close
the gap G formed between the side surface 14a of the main body portion 14 and the upright
portion 16b. 16b is covered with the insulating sealing material S, and this is done by curing.
[0028]
In this case, as the insulating sealing material S, for example, one-part room-temperature-curable
silicone rubber such as product number KE347 manufactured by Shin-Etsu Chemical Co., Ltd. can
be suitably used.
[0029]
The actual soldering process to be performed subsequently is performed between the fixed pole
42 and the EFT 13 by using the side of the folded portion 16 c which is folded back to the side
facing the fixed pole 42 in the main body 14 as the soldering site 17. It is performed by soldering
on the side of the interposed contact spring 32.
[0030]
In this case, the contact spring 32 is a base portion 33 attached to the main body portion 14 via
the facing surface 14 b side, and a spring plate portion 34 extending inward from the side edge
side of the base portion 33. The pressure plate to the fixed pole 42 side is freely formed via the
18-04-2019
7
spring plate portion 34.
[0031]
Then, the folded portion 16 c of the gate terminal 16 is integrally soldered with the solder 19 as
a soldering portion 17 to a portion located in the base portion 33 of the contact spring 32 and
located on the opposing surface 14 b side of the main portion 14. It is done.
[0032]
In this case, the flux component contained in the solder 19 itself for better conformability, and
the separately prepared flux are insulating sealings cured as the cohesive flux 20 on the
peripheral side of the soldering portion 17 at the time of soldering. It adheres to the surface side
of the material S.
[0033]
Post-treatment is performed to wash and remove such cohesive flux 20 attached to the surface of
the insulating sealing material S.
[0034]
The gate terminal 15 as the input-side terminal 15 can be soldered to the base portion 33 of the
contact spring 32 by passing through a soldering process including such pretreatment, actual
soldering treatment and post-treatment. By soldering, it is possible to form a positive conduction
relationship with the fixed pole 42 side via the spring plate portion 34.
[0035]
That is, the gate terminal 16 is a gap between the gate terminal 16 and the side surface 14a
except for the folded back portion 16c (soldering portion 17) by the insulating sealing material S
having fluidity by passing through the pretreatment. It will be completely covered including G.
Moreover, since the one-part room-temperature curable silicone rubber or the like is used as the
insulating sealing material S, it can be cured after application.
[0036]
18-04-2019
8
Since the actual soldering process is carried out after such pretreatment, even if the cohesive flux
20 is generated during soldering, it adheres only to the surface of the cured insulating sealing
material S, and the gap G The adhesion to the inside can be reliably avoided.
[0037]
Therefore, the cohesive flux 20 adhering to the insulating sealing material S side after soldering
can be removed easily and completely by dissolving it with a solvent or the like and cleaning it
using a brush in a post-treatment.
[0038]
In the condenser microphone 11 whose main part is shown in FIG. 1C, impedance conversion is
performed on the fixed pole 42 side without leaving the cohesive flux 20 causing the leakage
current in the gap G in this manner. It manufactures by soldering the gate terminal 16 with
which FET13 as an apparatus 12 is equipped.
[0039]
Further, even when a vacuum tube (not shown) of a minute size is used as the impedance
converter 12 for the condenser microphone 11, the processing procedure substantially the same
as that of the FET 13 is performed, whereby the input does not cause cohesive flux to adhere to
narrow portions. Grid terminals as terminals 15 can be soldered.
[0040]
Therefore, in the capacitor microphone 11 manufactured by the above manufacturing method,
the FET 13 or the vacuum tube as the impedance converter 12 maintains the high input
impedance by securing the insulation of the soldered portion 17 of the input side terminal 15.
Also, the generation of noise due to leakage current can be reliably prevented.
[0041]
Therefore, the user can comfortably use the condenser microphone 11 manufactured by the
above manufacturing method for a long time.
[0042]
The above has described the present invention based on the illustrated examples, and the specific
18-04-2019
9
configuration thereof is not limited to this.
For example, although the FET 13 used as the impedance converter 12 has the gate terminal 16
formed by the lead portion 16a, the upright portion 16b, and the folded portion 16c, it is formed
by the lead portion 16a and the upright portion 16b. The upright portion 16 b can also be used
as the soldering portion 17.
Further, the gate terminal 16 is not limited to the one drawn out from the side surface 14 a side
of the main body 14, but can be formed by the upright part 16 b and the folded back part 16 c
drawn out from the opposing surface 14 b side with the fixed pole 42.
[0043]
It is an explanatory view showing a soldering process when an impedance converter is FET in the
1st invention of the present invention according to a processing procedure, and (a) of them is
pretreatment, (b) is actual solder. (C) shows the post-treatment, respectively.
The side view which shows the arrangement | positioning relationship between FET and a
printed circuit board.
The side view which shows the conventional soldering condition of the gate terminal with respect
to the fixed pole side at the time of using FET as an impedance converter.
Explanation of sign
[0044]
11 capacitor microphone 12 impedance converter 13 field effect transistor (FET) 14 main body
14a side surface 14b facing surface 15 input side terminal 16 gate terminal 16a lead-out portion
16b upright portion 16c folded portion 17 soldered portion 18 lead terminal 19 solder 20
aggregated flux 22 printed circuit board 32 contact spring 33 base portion 34 spring plate
portion 42 fixed pole G gap S insulating sealing material
18-04-2019
10
Документ
Категория
Без категории
Просмотров
0
Размер файла
20 Кб
Теги
description, jp2008147806
1/--страниц
Пожаловаться на содержимое документа