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DESCRIPTION JP2017517952

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DESCRIPTION JP2017517952
The invention relates to a microphone (1), which comprises a substrate (8) and a spring element
(14) which is plastically stretched in one direction perpendicular to the substrate (8). A
conversion element (2) in electrical contact with the substrate (8) through the spring element
(14) and a lid (25) to which the conversion element (2) is fixed And a lid (25) disposed such that
the conversion element (2) is disposed between the lid (25) and the substrate (8). Furthermore,
the invention relates to a method of manufacturing a capacitor device. [Selected figure] Figure 1
Microphone and method for manufacturing a microphone
[0001]
The present invention relates to a microphone and a method for manufacturing the microphone.
Here, this microphone is specifically a condenser microphone.
[0002]
Such a microphone comprises one transducing element, which has to be encapsulated in one
package. In order to enable good recording quality with such a microphone, the largest possible
back cavity is required. This is because the large back cavity improves the sensitivity of this
microphone for the recording of pressure fluctuations. Furthermore, with this microphone, the
cost of the internal circuitry must be reduced and the transducer element must be protected
against mechanical stress.
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1
[0003]
Patent Document 1 discloses one microphone chip encapsulated using one lid and one acoustic
seal. Furthermore, the microphone chip is fixed on one substrate via a rigid fixing device. In this
microphone, a large mechanical coupling occurs between the lid and the microphone chip and
also between the microphone chip and the substrate. This coupling can adversely affect the
operation of the microphone tip and can further lead to the temperature dependent
characteristics of the system.
[0004]
Patent Document 2 discloses another microphone. In this microphone, the microphone chip is
fixed on the substrate via a spring, where the spring is produced by removing the sacrificial layer
using photolithography. The deposition and subsequent removal of this sacrificial layer is very
time- and material-intensive, which means that this sacrificial layer can only be produced with a
small thickness to be industrially relevant. is there.
[0005]
German Patent No. DE 102004011148 B3 specification US Patent No. 8218794 B2 specification
[0006]
The object of the present invention is to provide an improved microphone, which overcomes at
least the above-mentioned drawbacks.
Yet another object of the invention is to provide a method for manufacturing such a microphone.
[0007]
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This task is solved by the microphone according to claim 1. The above-mentioned further
problem is solved by the method according to the second independent claim.
[0008]
The present invention provides a microphone, which comprises a substrate, a spring element
which is plastically stretched in a direction perpendicular to the substrate, and the substrate via
the spring element. And one lid to which the converter is fixed, such that the converter is
disposed between the lid and the substrate. And a lid disposed.
[0009]
Due to the flexible extension of the above-mentioned spring element, this spring is provided with
a large clearance.
This clearance provides the greatest distance between the lower surface of the spring element,
which faces the substrate, and the upper surface of the substrate, which faces the conversion
element. At this distance, an empty space exists between the lower surface of the spring element
and the upper surface of the substrate.
[0010]
Spring elements with large clearances are suitable to compensate for large manufacturing
variations. In the microphone according to the present invention, manufacturing variations occur
in various parameters. These include, for example, the height of the conversion element, the
height of the lid and the height of the spring element. Furthermore, the bending and warping of
the lid can lead to other variations. The manufacturing variances listed here add up, as a whole,
to a non-negligible uncertainty regarding the position of the above-mentioned conversion
element.
[0011]
The above-described spring element, however, is configured to compensate for this
manufacturing variation. This allows for movement of the transducer relative to the substrate
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3
described above, which can compensate for this manufacturing variation. For the relative
movement of this transducer element with respect to the above mentioned substrate, it is only
necessary to overcome the spring force of this spring element. This spring force is reduced at
small distances of this relative movement.
[0012]
Here, the conversion element is disposed between the lid and the substrate, and thus the lid, the
conversion element, and the substrate seal one space, and the space is The back cavity of this
conversion element is formed. Correspondingly, the conversion element is provided with a large
back cavity, which can ensure high sensitivity of the conversion element.
[0013]
The conversion element is electrically connected to the substrate via the spring element, and the
spring element is a mechanical fixing part of the conversion element to the substrate. However,
this fixing part is configured to have a spring property, so that almost no force is applied.
Therefore, this fixing part is decisively different from the rigid fixing part of the above-mentioned
conversion element to the above-mentioned lid part, making it possible to follow the movement
of this lid part, in which case a large mechanical stress Does not occur.
[0014]
Thus, the microphone according to the present invention can protect the conversion element
from mechanical stress. Mechanical stress occurs, for example, when the lid moves relative to the
substrate. To this, for example, if the substrate and the lid thermally warp different sizes, the
result of the temperature change is added. A force can also be applied to the lid during the
integration of the microphone in the external housing, but if, for example, the lid is pressed
against the sealing ring, the force deforms the lid. Bring.
[0015]
The above-mentioned spring element makes it possible to protect the above-mentioned
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conversion element from mechanical stress, as this is a degree of mechanical decoupling between
the above-mentioned conversion element and the substrate. In this case, the spring element
allows a relative movement of the conversion element relative to the substrate to some extent.
Furthermore, the above-mentioned spring element can realize the electrical connection between
the above-mentioned conversion element and the above-mentioned substrate at low cost.
[0016]
The above conversion element may be mechanically coupled to the above spring element,
wherein the fixing portion of the conversion element to the above lid portion is the above
conversion element formed by the above spring element and the above It may be stiffer than the
mechanical connection between it and its substrate.
[0017]
Thus, the force required to move the conversion element relative to the substrate is less than the
force required to move the conversion element relative to the lid by the same distance.
The force may be a pressure, a tension or a shear.
[0018]
Specifically, the fixing portion of the conversion element to the lid is 10 times more rigid than the
mechanical connection between the conversion element formed by the spring element and the
substrate. May be there. In this case, the force required to move the conversion element relative
to the lid is at least 10 times the force required to move the conversion element relative to the
substrate by the same distance. It has become.
[0019]
The fixing portion of the conversion element to the lid may be 100 times more rigid than the
mechanical connection between the conversion element formed by the spring element and the
substrate.
[0020]
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As described above, the above-described spring element is uniquely used only for the electrical
connection between the above-described conversion element and the above-described substrate,
and is not an essentially stable mechanical fixing portion. .
Rather, this mechanical connection is formed by a spring and is thus used for mechanical
decoupling of the transducer element and the substrate. As described above, manufacturing
variations can be compensated, and the force transmitted to the conversion element through the
lid can be absorbed.
[0021]
The above spring element can be provided with a clearance of at least 50 μm. A spring element
with such a clearance can sufficiently compensate for manufacturing variations that normally
occur, so that in the manufacture of the present microphone, the rate at which the manufactured
microphone deviates from the given specification range is very low. Become.
[0022]
The larger the clearance of the spring element is set, the better the above-mentioned
manufacturing variation can be compensated, and the above-mentioned conversion element can
be well decoupled mechanically from the above-mentioned substrate. On the other hand, the
overall height of the microphone should not be set too large, in order not to increase the overall
height of the microphone unnecessarily. The microphone may be used for incorporation into a
mobile communication device, wherein the predetermined overall height of the microphone must
not be exceeded. Furthermore, it should be noted that as the above-mentioned spring element
clearance increases, the variance of this spring element also naturally increases.
[0023]
The clearance of the above-mentioned spring element in the relaxed state is in the range of 30 to
250 μm, preferably in the range of 50 to 200 μm.
[0024]
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During assembly of the present microphone, the elastic preload of the above-mentioned spring
element can reduce the maximum clearance of this spring element, for example to 200 μm or
150 μm.
Correspondingly, in the completed microphone, ie in the assembled state, the clearance of the
above-mentioned spring element is in the range of 30-200 μm, preferably in the range of 50200 μm, or in the range of 30-150 μm, preferably It is in the range of 50 to 150 μm. Spring
elements having a clearance in this range are indicative of a good compromise between the
above conditions.
[0025]
The above-mentioned spring element may comprise one upper surface facing the abovementioned conversion element, wherein one spacer may be arranged between this spring
element and this conversion element, thus with this conversion element A gap is formed between
the spring element and the upper surface, and the height of the gap corresponds at least to the
height of the spacer.
[0026]
By means of this spacer, in particular, further processing of the present microphone can be
considerably simplified.
For example, when the above-mentioned conversion element and the above-mentioned spring
element are connected to each other by the solder joint, the subsequent microphone of the
present microphone is soldered to the circuit board by the melting temperature of the solder
joint. It may be necessary to heat to the above temperature. In this case, the spacer acts in such a
way that the solder connection does not get pushed between the above-mentioned spring
element and the above-mentioned conversion element. This spacer thus ensures that the
temporarily melted solder joints can later be hardened again into reliable joints.
[0027]
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Specifically, the conversion element may be connected to the top surface of the spring element
by one solder joint, and the material of the spacer has a higher melting point than the solder
joint. There is. In this way, it is ensured that the above mentioned spacers are not adversely
affected at the temperature leading to the melting of this solder joint, and that also at this
temperature the above mentioned conversion element and the above mentioned spring element
are correctly aligned with one another, It is also ensured that they remain arranged at the
intervals provided here.
[0028]
The above-described spring element comprises a first region in which the spring element is
plastically stretched and a second region in which the flexible extension is substantially absent.
The term "almost not" means here that the second region is stretched at least a factor of 10
smaller than the first region, preferably at least a factor of 100 smaller. There is. For example,
the above-described spring element acts perpendicular to and outwardly from the abovedescribed substrate, and a force applied to the spring element results in the deformation of the
above-mentioned first region, and the above-mentioned first The region of 2 is configured to
remain undeformed under the action of this force.
[0029]
Preferably, said solder joints and / or said spacers are arranged in said second area. In this way,
the flexible extension of the above-mentioned spring element can ensure that the alignment
between the spring element and the conversion element is not affected. Thus, the abovementioned spring element is designed to be plastically deformed under the action of the abovementioned force just at the predetermined site.
[0030]
The spring element described above comprises one local constriction in cross section. The spring
element thereby comprises one area with this local constriction, wherein this area has a smaller
cross section than the adjacent area of the spring element. Thereby, this area is easily deformed
under the action of external force. The region of this local cross-sectional constriction can thus
be aimed and controlled how and in which region of the spring element it is plastically deformed.
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[0031]
Furthermore, the above-mentioned spring element may comprise one meander-shaped area, one
heel area or one arc-shaped area. Other non-linear areas are also possible. All these areas are
intended to be easily plastically deformed under the action of an external force. Furthermore, the
above-mentioned spring element may comprise a second region configured in a straight line.
[0032]
Furthermore, the fixing part of the conversion element to the lid part allows the fixing part to
acoustically seal the front cavity (Vordervolumen) of the conversion element to the back cavity
(Rueckvolumen) of the conversion element. It may be configured. In this case, no further sealing
element is required between the front cavity and the back cavity.
[0033]
Furthermore, the invention relates, according to another aspect, to a method for manufacturing a
microphone. The microphone manufactured by this method may be the above mentioned
microphone. Thus, the method may comprise all the functional and structural features disclosed
in the above microphone. Conversely, the above-mentioned microphone can comprise all the
functional and structural features disclosed in connection with the method.
[0034]
The method comprises the following processing steps: The steps of:-producing one spring
element on one substrate;-electrically connecting one conversion element with the spring
element-pulling the conversion element in a direction away from the substrate A step of
extending the spring element in the direction, and a step of attaching a lid on the substrate,
wherein the conversion element is fixed to the lid.
[0035]
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By pulling together the above-mentioned spring element and the above-mentioned lid part from
the above-mentioned substrate, the clearance of the above-mentioned spring element is
decisively increased, thus the method can produce a spring element having a large clearance. In
this case, the required materials for this manufacturing method are not increased. In addition, the
above-mentioned process steps of stretching can be performed quickly, so that the method
hardly increases the time of manufacture of one spring element with a large clearance.
[0036]
The spring element described above can be plastically stretched by pulling on the conversion
element described above. Thus, when the tensioning device is disconnected from the spring
element, the extension of the spring element remains maintained.
[0037]
The above-mentioned spring element can be specifically generated in the following steps.
Attaching one patterned sacrificial layer to the above substrate, attaching one patterned layer on
the sacrificial layer, and removing the sacrificial layer, thereby the patterning Forming the
formed layer on the above-mentioned spring element.
[0038]
The patterned layer described above may, for example, consist of metal. Thereby, the abovementioned spring element can be manufactured by photolithography.
[0039]
The above-mentioned spring element may be stretched such that after the above-mentioned
stretching the clearance of this spring element is at least 1.5 times the clearance of this spring
element before this stretching. The clearance of the above mentioned spring element may
preferably be at least twice the clearance of this spring element prior to this extension. The
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extension of this spring element makes it possible to significantly increase the clearance of this
spring element accordingly. The extension of this spring element is particularly advantageous for
the production of a spring element with a large clearance by means of photolithography as
described above. This is because this stretching requires only a very short processing time, and
the increase in clearance due to this stretching does not increase the required material.
[0040]
The above-mentioned converter element tensioning step comprises the following substeps.
Securing one tensioning device on the back side of the conversion element not facing the
substrate using one removable adhesive, and pulling in a direction away from the substrate with
the tensioning device And-separating the tensioning device from the conversion element
described above by removing the removable adhesive.
[0041]
The removable adhesive described above can be removed by heating and / or irradiation with UV
light. Such a tensioning step with the above-mentioned transducer element offers the advantage
that the above-mentioned tensioning device can be separated from the transducer element
without any marks. Furthermore, one single tensioning device can be used to process multiple
conversion elements simultaneously, which simplifies this manufacturing method, especially
when manufacturing multiple microphones from one wafer, and Reduce processing time.
[0042]
The transducer element may be pulled away from the substrate for a length determined based on
path measurements or force measurements. For pre-given fixed pull lengths, lengths determined
on the basis of path measurements or force measurements make it possible to better match to
different manufacturing variances and to compensate for these variances Make it possible.
[0043]
In the following the present microphone and preferred embodiments will be described in detail
with reference to the figures.
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[0044]
1 shows an example of a first embodiment of one microphone.
Fig. 3 illustrates one of the various steps of the method for manufacturing a microphone
according to the first example embodiment described above. Fig. 3 illustrates one of the various
steps of the method for manufacturing a microphone according to the first example embodiment
described above. Fig. 3 illustrates one of the various steps of the method for manufacturing a
microphone according to the first example embodiment described above. Fig. 3 illustrates one of
the various steps of the method for manufacturing a microphone according to the first example
embodiment described above. Fig. 3 illustrates one of the various steps of the method for
manufacturing a microphone according to the first example embodiment described above. Fig. 6
shows an example of a second embodiment of one microphone.
[0045]
FIG. 1 shows an example of a first embodiment of one microphone. The microphone 1 includes
one conversion element 2. This conversion element 2 comprises one membrane 3 and one fixed
back plate 4. A gap is provided between the membrane 3 and the back plate 4 so that the
membrane 3 and the back plate 4 form one capacitor. The capacitance of this capacitor may vary
depending on the sound being detected.
[0046]
The conversion element 2 forms one front cavity 5 and one back cavity 6. The front cavity 5 is
adapted to be in pressure communication with the external environment of the microphone 1.
Correspondingly, the microphone 1 is provided with an acoustic inlet opening 7 via which the
front cavity 5 can be in pressure communication with the external environment, and the acoustic
inlet opening is Can reach the membrane 3.
[0047]
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The back cavity 6 of the conversion element 2 is a single encapsulated space, here a constant and
constant pressure. This conversion element 2 is suitable for measuring the difference between
the pressure in the front cavity and the pressure in the back cavity 6.
[0048]
Further, the microphone 1 includes one substrate 8. The substrate 8 has connection terminals
(10) for electrical connection on the lower surface 9 not facing the conversion element 2. The
substrate 8 also has connection terminals 12 for electrical connection on the top surface 11
facing the conversion element 2. Furthermore, the substrate 8 is provided with the through
connection portion 13, and the connection terminal 12 on the upper surface 11 is electrically
coupled to the connection terminal 10 on the lower surface 9 through the through connection
portion. It is also possible that the conversion element 2 is internally connected only to another
chip device (not shown), for example only to one ASIC, which is coupled to the connection
terminal (s) 12.
[0049]
The microphone 1 comprises one spring element 14. The spring element 14 comprises at least
two tongues. The spring element 14 is electrically connected to the substrate 8. The first end 15
of the spring element 14 is disposed on the connection terminals 12 on the upper surface 11 of
the substrate 8.
[0050]
Furthermore, the spring element 14 is electrically connected to the conversion element 2. The
second end 16 of the spring element 14 is here electrically connected to the conversion element
2. In the embodiment shown in FIG. 1, the spring element 14 is electrically connected to the
conversion element 2 through one solder joint 17, and the solder joint is the second of the spring
element 14. Attached to the end 16 of the In one alternative embodiment, this spring element 14
is electrically connected to the transducing element 2, for example via stud bumps or via a
conductive adhesive.
[0051]
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Specifically, the conversion element 2 includes connection surface (s) 24 on the lower surface 23
facing the substrate 8, and these connection surfaces are electrically connected to the spring
element 14.
[0052]
Furthermore, one spacer 18 is disposed between the second end 16 of the spring element 14 and
the conversion element 2.
The spacer 18 and the solder joint 17 are mounted on the top surface 19 of the spring element
14 facing the transducer element 2. A gap 20 is formed between the top surface 19 of the spring
element 14 and the conversion element 2. The gap 20 has a height corresponding to at least the
spacer 18 described above. Thus, the spacer 18 is used to keep the top surface 19 of the spring
element 14 and the conversion element 2 always separated from each other by at least the
height of the spacer 18.
[0053]
After this, when the microphone 1 is soldered on one wiring substrate (not shown), for example,
to be incorporated in one mobile telephone, this microphone is exposed to high temperature, this
temperature being the above soldered connection This may result in melting of part 17. The
spacer 18 is again used in this case so that the conversion element 2 and the spring element 14
are held at one fixed distance from one another, and so that the liquid solder at this point is not
damaged. . Specifically, the spacer 18 is disposed in the vicinity of the solder bonding portion 17.
Thus, the spacer 18 prevents the spring element 14 from overstressing the solder joint 17 during
melting of the solder joint 17 when the spring element 14 is resiliently pressurized. .
[0054]
This spacer 18 may be compatible and be a patterned element of metal or plastic, for example an
injected or jetted polymer pattern. The spacer 18 can also be generated directly during the
patterning process of the spring element 14 and can thereby be formed integrally with the spring
element 14.
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[0055]
The conversion element 2 is electrically connected to the substrate 8 via the spring element 14.
Correspondingly, this spring element 14 comprises a conductive material. The spring element 14
may be formed, for example, of one patterned metal layer. The spring element 14 comprises first
regions 21a, 21b in which it is plastically deformed. In the embodiment shown in FIG. 1, this
spring element 14 comprises a first part 21a of the first area and a second part 21b of the first
area. The first part 21a of this first region comprises one local cross-sectional constriction. Here,
accordingly, this spring element 14 has a cross section which is reduced relative to the cross
section in its adjacent region. Furthermore, this spring element 14 comprises a second part 21b
of a first area, which second part is constituted by one step of this spring element. This step is
arranged in the vicinity of the first end 15 of the spring element 14, which rises up in this region
so as to be vertically separated from the substrate 8.
[0056]
The spring element 14 comprises a second area 22 in which it is not plastically deformed.
Specifically, this spring element 14 comprises a plurality of second regions 22. The spacer 18
and the solder joint 17 are disposed in one of the second regions 22. The second region 22 in
which the spacer 18 and the solder joint 17 are disposed is disposed parallel to the substrate 8
and disposed parallel to the connection surface 24 of the conversion element 2. ing. The solder
does not flow out of the second region 22 even when the solder joint 17 is melted.
[0057]
The microphone 1 further includes one lid 25. The conversion element 2 is fixed to the lid 25.
The conversion element 2 is disposed between the lid 25 and the substrate 8. Furthermore, the
microphone 1 comprises one acoustic seal 26 through which the transducer element 2 is coupled
to the lid 25, and the acoustic interrupter is provided on the front of the transducer element 2.
The cavity 5 is acoustically separated from the back cavity 6 of the transducer element 2. The
back cavity 6 of the conversion element 2 is confined by the lid 25, the acoustic sealing portion
26, the conversion element 2, and the substrate 8.
[0058]
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Furthermore, the lid 25 comprises an opening through which the front cavity 5 of the transducer
element 2 can be in pressure communication with the external environment, and this opening is
An acoustic inlet opening 7 is formed.
[0059]
The lid 25 is conductive in whole or at least in the sublayers.
The lid 25 is configured to be connected to the shielding portion of the substrate 8. Thus, the lid
25 is suitable for isolating the conversion element 2 from electromagnetic radiation from the
outside. For this purpose, the lid 25 is fixed to the substrate 8 by means of one fixing means 27,
for example by means of solder, an adhesive or a combination of these. The adhesive may be
conductive.
[0060]
The conversion element 2 is fixed to the inner surface 28 of the lid 25 facing the substrate 8. The
conversion element 2 is directly fixed to the inner surface 28 of the lid 2 by an acoustic seal 26.
[0061]
The acoustic seal 26 includes a flexible adhesive, which fixes the conversion element 2 directly to
the lid 25. Alternatively or additionally, the acoustic seal 26 may consist of one plastic material,
which fixes the transducer element 2 directly to the lid 25. The acoustic seal 26 closely encloses
the acoustic inlet opening 7 and thus forms an acoustic seal between the front cavity 5 and the
back cavity 6.
[0062]
The conversion element 2 is also mechanically fixed to the spring element 14. However, the
mechanical fixing of the conversion element 2 to the spring element 14 is substantially free of
force. Specifically, the mechanical fixing portion of the conversion element 2 to the lid 25 is more
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rigid than the fixing portion of the conversion element 2 to the spring element 14. Thus, the
fastening of this conversion element 2 to the spring element 14 is not essentially a fastening, but
rather merely forms an electrical connection.
[0063]
2 to 6 show one manufacturing method for manufacturing the microphone 1 according to the
first embodiment example. Here, in FIGS. 2 to 6, respectively, only one single microphone 1 is
shown for different points in time of this manufacturing method. However, the method described
here makes it possible to manufacture a plurality of microphones 1 simultaneously on one wafer,
wherein each processing step can be performed simultaneously for each microphone 1.
[0064]
FIG. 2 shows the microphone 1 after the first processing step, in which a spring element 14 is
produced on the substrate 8 in a photolithographic process.
[0065]
The spring element 14 is now formed, but first one patterned sacrificial layer (not shown) is
mounted on the substrate 8.
The thickness of the patterned sacrificial layer corresponds to the clearance of the spring
element 14 to be generated later. The sacrificial layer may have a thickness in the range of 1 to
30 μm.
[0066]
Subsequently, one patterned layer, for example one patterned metal layer, is mounted on the
above-mentioned sacrificial layer. If this sacrificial layer is removed again here, this patterned
layer remains. The patterned layer here forms a spring element 14.
[0067]
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FIG. 3 shows the microphone 1 during the next processing step, in which the transducer element
2 is placed on the spring element 14.
[0068]
Before this processing step, the conversion element 2 is further provided with solder bumps,
which will later form the solder joints 17.
Alternatively, those solder bumps which will later form solder joints 17 may be mounted on the
upper surface 19 of the spring element 14. Furthermore, spacers 18 are mounted on the upper
surface 19 of this spring element 14 and these spacers are arranged in the vicinity of the solder
joint 17 in the completed microphone 1 and the conversion element 20 and the spring It is
arranged to ensure a minimum height of the gap 20 between it and the top surface 19 of the
element 14. Alternatively, the spacer 18 may be mounted on the lower surface of the conversion
element 2.
[0069]
FIG. 4 shows the microphone 1 with the transducing element 2 mounted on the spring element
14 and soldered thereto. This creates an electrical connection between the conversion element 2
and the spring element 14. Thus, the above-mentioned solder bumps form the solder joint 17.
[0070]
FIG. 5 shows the microphone 1 after the next processing step. Here, one tensioning device 29 is
coupled to the conversion element 2. The tensioning device 29 comprises one flat plate 30. The
lower surface of the flat plate 30 facing the conversion element 2 is coated with a removable
adhesive, for example, coated with a thermal release tape such as Nitto Denko (registered
trademark) REVALPHA (registered trademark).
[0071]
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The tensioning device 29 is first pressed against the microphone 1 such that the removable
adhesive 31 adheres to the top surface of the transducer element 2 not facing the substrate 8.
Subsequently, the tension device 29 is pulled in a direction away from the substrate 8 with a
predetermined tension. At this time, the tension device 29 separates the conversion element 2
from the substrate 8. The spring element 14 mechanically coupled to the conversion element 2
via the solder joint 17 is also stretched in the direction away from the substrate 8 according to
the tensile force. The spring element 14 is designed to extend plastically in this case.
[0072]
The plastic extension of the above-mentioned spring element 14 increases the clearance of this
spring. Specifically, the clearance of this spring element 14 is increased to at least 30 μm. By
pulling away from the substrate, the clearance of the spring element 14 is now increased to be in
the range of 30 to 250 μm, preferably in the range of 50 to 200 μm. Specifically, this clearance
is increased by at least 1.5 times, preferably at least 2 times, the clearance before this elongation.
[0073]
In the next process step, a lid 25 is disposed over the transducer element 2 so that the spring
element 14 is now compressed and elastically deformed. This reduces the maximum clearance of
the spring element 14 to 150 μm.
[0074]
The spring element 14 is plastically deformed by pulling in a direction away from the substrate
8. This plastic deformation takes place essentially only in the first regions 21 a, 21 b of the
spring element 14. Both the first region 21 b with the above-mentioned steps and the first region
21 a with the local narrowing of the cross-section are largely deformed during the tensioning of
this spring element 14. The spring element 14 is bent at each of the step and the cross-sectional
constriction. In contrast, the second end 16 of the spring element 14, in which the solder joints
17 are arranged, remains approximately parallel to the conversion element 2.
[0075]
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The tensioning device 29 is provided with a control unit (not shown), which determines the
displacement when the spring element 14 is stretched, based on path measurements or force
measurements. The tensioning device 29 pulls the second end of the spring element 14 away
from it in the direction of the surface normal of the substrate 8, and the plastic extension of this
spring element 14 is of the required size and To be Furthermore, during adjustment of the
extension by means of the tensioning device 29, the spring element 14 in addition to this plastic
extension causes a partial elastic elongation, by which the spring rebounds after the tensioning
device 29 is released. Must be taken into consideration.
[0076]
FIG. 6 shows the microphone 1 after further processing steps. In this further processing step, the
tensioning device 29 is separated from the conversion element 2. This can be done by heating
the tensioning device 29 to a temperature above the stripping temperature mentioned above,
whereby the deposition of the removable adhesive 31 is eliminated. The stripping temperature
may be, for example, 150 °. In an alternative embodiment, the removable adhesive 31 can be
removed using UV light irradiation.
[0077]
Furthermore, a fixing means 27 is disposed on the upper surface 11 of the substrate 8 facing the
conversion element 2, and the lid 25 is later combined with the substrate 8 by using the fixing
means.
[0078]
Further, FIG. 6 shows that one sealing material is attached on the conversion element 2 and this
sealing material forms the above-mentioned acoustic sealing portion 26 in the completed
microphone 1.
Alternatively, the sealant may be disposed on the inner surface 28 of the lid 25. Finally, at the
time of the process shown in FIG. 6, since the conversion element 2 is not fixed but rather
supported only by the spring element 14, in some cases, it may be disposed on the inner surface
28 of the lid 25. Is simple.
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20
[0079]
In the last processing step, lid 25 is now attached and its edge area is joined with substrate 8.
Furthermore, at this time, an acoustic seal 26 is generated around the acoustic inlet opening 7
between the conversion element 2 and the lid 25. Thus, the microphone 1 shown in FIG. 1 is
generated.
[0080]
When the lid 25 is placed, the spring element 14 may be elastically compressed. Thereby, in the
completed microphone 1, the spring element 14 can have an elastic tension in the direction away
from the substrate 8.
[0081]
FIG. 7 shows a microphone 1 according to a second exemplary embodiment, in which the spring
element 14 comprises one first area 21 of serpentine shape, in which the spring element is
plastically stretched. The length of the spring element 14 may be configured such that its length
is at least twice that of the shortest connection between the first and second ends 15, 16 of the
spring element 14 .
[0082]
1: Microphone 2: Conversion element 3: Membrane 4: Back plate 5: Front cavity 6: Back cavity 7:
Sound inlet opening 8: Substrate 9: Bottom of substrate 10: Connection terminal 11: Top of
substrate 12: Connection terminal 13 Reference numeral 14: Spring element 15: First end 16:
Second end 17: Solder joint 18: Spacer 19: Top face of spring element 20: Gap 21, 21 a, 21 b:
First region 22 2nd area 23: lower surface 24 of conversion element: connecting surface 25: lid
26: acoustic sealing portion 27: fixing material 28: inner surface of lid 29: tension device 30:
plate 31: adhesive
17-04-2019
21
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