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DESCRIPTION JPH04257200

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DESCRIPTION JPH04257200
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an
electret condenser microphone (hereinafter referred to as an ECM), and more particularly to an
ECM structure improved to automate assembly of the entire apparatus.
[0002]
2. Description of the Related Art A schematic configuration of a conventional ECM of this type is
shown in FIG. 7 and an outline of its assembly procedure is shown in FIG.
[0003]
In the configuration of the conventional apparatus shown in FIG. 7, reference numeral 1 denotes
a cylindrical metal case having a sound hole 1a on the top plate surface to be an exterior body,
and 2 denotes a top plate of the cylindrical metal case 1. It is a metal ring provided on the inner
side of the surface, and it is fixed in tension by attaching a vibrating film (electret material) 3
formed by applying the metal deposition film 3a on one surface corresponding to the surface on
the lower surface side It is done.
Further, 4 denotes a gap spacer, 5 denotes a fixed electrode having a damping hole 5a disposed
on the lower surface of the vibrating film 3 via the gap spacer 4, 6 denotes an insulator for
supporting the fixed electrode 5, and 7 denotes An FET for impedance conversion, provided in
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the insulator 6, the input lead 7a is electrically connected to the fixed electrode 5 by contact or
spot welding, and the output lead 7b is The corresponding electrodes on the printed circuit board
8 disposed on the lower surface of the insulator 6 are electrically connected by soldering 8 a or
the like. Incidentally, 1b is a lower end caulking portion of the cylindrical metal case 1, 9 is a face
cloth for dustproof covering the sound hole 1a, etc. Even if the face cloth 9 is not provided, the
operation is disturbed. I have never been there.
[0004]
Therefore, in the case of the conventional ECM according to the above-mentioned construction,
the air layer 10 is formed at a predetermined constant interval between the vibrating membrane
3 and the fixed electrode 5 by the gap spacer 4, and The air layer 10 exhibits a capacitor
(capacitance) of about several pF to several tens pF, and in the air layer 10, the vibrating
membrane 3 is vibrated by the arrival of an external sound wave through the sound hole 1a. The
capacitance change can be taken out of the FET 7 as an electrical output change.
[0005]
Here, in the case of the conventional device, as shown in FIG. 8, the fixed electrode 5, the
insulator 6, the FET 7 and the printed board 8 are each assembled as an amplifier block in
advance. The metal ring 2 in which the diaphragm 3 is fixed in the cylindrical metal case 1 with
the face cloth 9, and then the amplifier block is inserted through the gap spacer 4. The end
portion is crimped 1b to be assembled integrally.
[0006]
In the above-described conventional apparatus, an electret material is used as the vibrating film 3
and the fixed electrode 5 is opposed to the electret material through the gap spacer 4. However,
the electret material is directly fixed. There is also a type that is pasted to 5 by some means, and
the FET 7 may be an external type, not necessarily an internal layout type, and the same function
can be obtained.
[0007]
However, in the conventional ECM structure configured as described above, the device
configuration itself, in particular, the structure of the amplifier block is complicated, and this is
assembled in advance. In view of the configuration of the apparatus, it is not suitable for the
complete automation of the entire assembly work.
[0008]
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Further, on the other hand, fixing of each component in the cylindrical metal case 1 is performed
by caulking 1b, and as one of the components, an insulator 6 generally made of a resin molded
article is interposed as one of the components. For such a resin molded product, because it is
disadvantageous in terms of heat resistance, for example, although not touched again in the
above-mentioned conventional description, the output lead 7b of the FET 7 is taken out straight
downward and outside In the case of connecting leads to other printed circuit boards by solder
dip, etc., the insulator 6 may be deformed, melted, etc. depending on the temperature at the time
of solder dip, etc. There is a possibility that a defect may occur, and the caulking 7 part may be
loosened, which causes a quality deterioration.
[0009]
The present invention was made to ameliorate such problems in the prior art, and this type of
electret capacitor capable of automatic assembly of the entire apparatus configuration and
excellent in heat resistance is also provided. It is intended to provide a microphone, ie an ECM.
[0010]
[Means for Solving the Problems] In order to achieve the above object, the present invention
provides a cylindrical metal gate without directly interposing an insulator made of a resin molded
product inferior in heat resistance. In addition to the ring, the amplifier block consists of two
blocks: a first assembly block with a fixed electrode and a metal gate ring, and a second assembly
block with an FET and a printed circuit board. It is divided to make it possible to achieve
complete automation of assembly.
[0011]
That is, according to the present invention, a cylindrical metal case having a sound hole formed
on the top plate surface, a fixed electrode having a damping hole appropriately formed, and a
cylindrical metal gate ring electrically connected to the fixed electrode Are arranged sequentially
to provide a first assembly block centered by an insulator from the periphery, and a second
assembly block consisting of a printed circuit board and an FET mounted on and connected to
the printed circuit board; A vibrating membrane provided with a metal deposited film through a
metal ring is fixed in a tension state to the inside of the metal case, and a fixed electrode side is
formed so as to form a space with the vibrating membrane via a gap spacer. Connect the input
side of the FET to at least the cylindrical metal case of the first assembly block, and then order
the second assembly block. It is disposed, and an electret condenser microphone which is
characterized by being configured by integrally fixed by caulking or the like with the case end
portion in this state.
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[0012]
The present invention has the following effects by being configured as described above.
[0013]
That is, a cylindrical metal gate ring is used as a component of the device without directly
interposing an insulator which is inferior in heat resistance, and for the insulator, the fixed
electrode and the metal gate ring are insulated. , And because they are interposed for centering,
there is no risk that the application of heat such as solder dip will have any influence on the
overall fixation of each component, even if a portion thereof is melted, and As for the amplifier
block, it is divided into two blocks which are a simplified structure of the first assembly block of
the fixed electrode and the metal gate ring and the second assembly block of the FET and the
printed circuit board. In addition, complete automation of the assembly of the entire device can
be achieved.
[0014]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the electret
condenser microphone (ECM) according to the present invention will be described in detail with
reference to FIGS.
[0015]
FIG. 1 is a longitudinal sectional view showing a schematic configuration of an ECM to which the
first embodiment of the present invention is applied, and FIGS. 2 (a) and 2 (b) are perspective
views showing metal gate rings in the same apparatus configuration. And FIG. 3 is an explanatory
view showing an example of the processing mode of the metal gate ring, and FIG. 3 is an
explanatory view showing an outline of an assembling procedure in the above-mentioned
apparatus structure. In the apparatus structure according to the first embodiment of FIGS. The
same reference numerals as in the conventional apparatus shown in FIG. 7 denote the same or
corresponding parts.
[0016]
That is, also in the apparatus configuration according to the first embodiment of FIG. 1, 1 shows
a cylindrical metal case having a sound hole 1 a in the top plate surface to be an exterior body,
and 2 shows the cylindrical metal case 1. The metal ring is provided inside the top plate surface,
and a vibrating film (electret material) 3 formed by applying a metal vapor deposition film 3a on
one surface corresponding to the surface is attached to the lower surface side by adhesion or the
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like. I was fixed in tension.
Reference numeral 4 denotes a gap spacer, and 5 denotes a fixed electrode having a damping
hole 5a disposed on the lower surface of the vibrating membrane 3 via the gap spacer 4. Also in
this case, an air layer 10 is formed between the diaphragm and the vibrating membrane 3 It is
done.
[0017]
Reference numeral 12 denotes a cylindrical metal gate ring which supports the fixed electrode 5
and is electrically connected to the fixed electrode 5 by contact or welding, as shown in FIG. 2 (a).
As shown, concave portions 12a are formed at several places on the lower end face of the metal
gate ring 12. For example, as shown in FIG. Can be easily formed by means such as curl forming
or other means.
The reference numeral 11 denotes an insulator for insulating and centering the fixed electrode 5
and the metal gate ring 12 from the periphery, and the fixed electrode 5 or the metal gate ring
12 is held by press fitting or the like.
[0018]
Further, reference numeral 7 denotes an FET for impedance conversion, which is directly
disposed on the printed circuit board 8 disposed on the lower surface of the metal gate ring 12
in the metal gate ring 12 without passing through other parts and the like. The input lead 7a is
inserted between the recess 12a formed in the metal gate ring 12 and the substrate surface to be
electrically conductive, that is, connected to the fixed electrode 5 as a result. The output lead 7b
is electrically connected to the electrode on the printed board 8 by soldering 8a or the like by
dipping.
And here, each of the above components is integrally fixed by caulking the lower end portion of
the cylindrical metal case 1.
Reference numeral 9 denotes a face cloth for dustproof covering the sound hole 1a, etc. The face
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cloth 9 does not disturb the operation even if it is not provided.
[0019]
Here, even in the case of the ECM in the first embodiment according to the above configuration,
the air layer 10 forms a capacitor (capacitance) of about several pF to several tens pF, and a
sound hole from the outside is formed. The capacitance changes slightly due to the vibration of
the vibrating membrane 3 due to the sound wave passing through 1a, and this capacitance
change can be taken out from the FET 7 as an electrical output change.
[0020]
In the case of the first embodiment, for example, as shown in FIG. 3, the first assembly block is
formed of the fixed electrode 5, the metal gate ring 12 and the insulator 6 in advance. The
amplifier block is constituted by two divided blocks 20 and the second assembly block 21 of the
FET 7 and the printed circuit board 8, and the inside of the cylindrical metal case 1 with the
surface cloth 9 attached thereto, The metal ring 2 to which the vibrating membrane 3 is fixed,
and then, via the gap spacer 4, the first assembly block 20 and the second assembly block 21 are
sequentially loaded, and the cylindrical metal The end of the case 1 can be assembled by
caulking 1b.
[0021]
That is, combined with the fact that each of the divided first and second assembly blocks 20 and
21 is very simplified, the overall automatic assembly of the apparatus itself is achieved. While
there is an excellent advantage that it can be made possible, on the other hand, even if a part of
the insulator 11 is melted by the application of heat by a solder dip or the like, the fixed part by
the caulking 1b of the end part and hence The fixing of the components of the apparatus is
advantageous in terms of heat resistance without any quality deterioration such as the
occurrence of loosening between the components without any influence.
[0022]
Next, FIG. 4 is a longitudinal cross-sectional view showing a schematic configuration of an ECM
to which the second embodiment of the present invention is applied, and FIG. 5 is a perspective
view showing a metal gate ring in the same apparatus configuration.
[0023]
The second embodiment differs from the first embodiment in that the metal gate ring 12 is a
simple ring-shaped metal gate ring without the recess 12a as shown in FIG. The dual lead type
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FET 14 and the double-sided pattern type printed circuit board 15 are used.
[0024]
Therefore, in the case of the configuration of the second embodiment, the input lead 14a of the
FET 14 is connected to one internal pattern 15c by soldering or the like, and is connected to the
metal gate ring 13 via the internal pattern 15c. Similarly, output lead 14b is connected to the
other internal pattern 15d by soldering or the like, and is connected to external pattern 15e
sequentially through internal pattern 15d, through hole 15b, and soldered portion 15a. The
soldered portion 15a also serves to close the through hole 15b.
Also, the FET 14 is fixed to the printed circuit board 15 by the adhesive 16, and the through hole
15 b can be closed also by the adhesive 16.
[0025]
The second embodiment apparatus can be assembled in the same manner as the first
embodiment apparatus, and similar operations and effects can be obtained.
[0026]
Further, FIG. 6 is a longitudinal sectional view showing a schematic configuration of an ECM to
which the third embodiment of the present invention is applied. In the device configuration
according to the third embodiment, holes 15f are formed in the printed circuit board 15. A socalled footed type ECM is configured by providing a metal pin lead 17 with an upper hook
through it and connecting the metal pin lead 17 to the external pattern 15e by soldering 15a.
The holes 15 f may be through holes, and various shapes and fixing means can be adopted for
the metal pin leads 17.
[0027]
The third embodiment apparatus can be assembled in the same manner as the first and second
embodiment apparatuses, and the same function and effect can be obtained also here. It is
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[0028]
As described above, according to the electret condenser microphone of the present invention, as
is apparent from the configuration of each embodiment, a cylindrical metal having a sound hole
formed on the top plate surface. A first assembly block in which a case, a fixed electrode having a
damping hole appropriately formed therein, and a cylindrical metal gate ring electrically
connected to the fixed electrode are sequentially arranged and centered by an insulator from the
periphery; A vibrating film in which a printed circuit board and a second assembly block
composed of FETs mounted and connected on the printed circuit board are provided respectively,
and a metal vapor deposition film is applied to the inside of a cylindrical metal case via a metal
ring. The first assembly block is then brought into contact with the fixed electrode side so as to
form a space between it and the vibrating membrane via the gap spacer, with the first assembly
block being fixed. Connect the input side of the FET to the cylindrical metal case of at least the
first assembly block to arrange the second assembly block sequentially, and further, in this state,
integrally crimp the case end part or the like. As a component of the device, a tubular metal gate
ring is used without directly interposing an insulator which is inferior in heat resistance as in the
prior art, and the insulator is , For insulation of the fixed electrode and the metal gate ring, as
well as for centering, for example, even if a part thereof is melted by the application of heat such
as solder dip, it is for the overall fixing of each component There is no risk of having any
influence, and the device configuration can always be maintained in the required assembled
state, and on the other hand, with regard to the amplifier block, this can be fixed electrode and
metal gate phosphor. Divided into two blocks, a simplified structure of the first assembly block
and the FET and the second assembly block of the printed circuit board, so that the assembly of
the entire device configuration can be fully automated The superior features of the
[0029]
Brief description of the drawings
[0030]
1 is a longitudinal sectional view showing a schematic configuration of an electret condenser
microphone (ECM) to which the first embodiment of the present invention is applied.
[0031]
FIG. 2 (a) is a perspective view showing the metal gate ring in the device configuration according
to the first embodiment of the present invention, and FIG. 2 (b) is an explanatory view showing
an example of the processing mode of the above-mentioned metal gate ring. Explanatory drawing
which shows the outline of the assembly procedure in the apparatus structure in 1 Example
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[0032]
4 is a longitudinal sectional view showing a schematic configuration of an ECM to which the
second embodiment of the present invention is applied.
[0033]
5 is a perspective view showing the metal gate ring in the device configuration in the second
embodiment of the present invention. FIG. 6 is a longitudinal sectional view showing a schematic
configuration of an ECM to which the third embodiment of the present invention is applied.
[0034]
7 is a longitudinal sectional view showing a schematic configuration of the ECM according to the
conventional example, and FIG. 8 is an explanatory diagram showing an outline of an assembling
procedure in the apparatus configuration in the conventional example.
[0035]
Explanation of sign
[0036]
DESCRIPTION OF SYMBOLS 1 cylindrical metal case 1a sound hole 2 metal ring 3 vibrating film
3a metal vapor deposition film 4 gap spacer 5 fixed electrode 5a damping hole 7, 14 FET 7a, 14a
output lead 7b, 14b input lead 8, 15 printed circuit board 8a, 15a soldering 9 face cloth 10 air
layer 11 insulator 12, 13 metal gate ring 12a recess 20 first assembly block 21 second assembly
block
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